PIC18F13K22-E/ML - 8KB Flash, 48MHz 8-bit MCU | Microchip
MPN: PIC18F13K22-E/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.35 | $2.35 |
| 10 | $2.05 | $20.50 |
| 100 | $1.78 | $178.00 |
| 500 | $1.55 | $775.00 |
| 1,000 | $1.34 | $1,340.00 |
PIC18F13K22-E/ML Overview
An 8-bit microcontroller (MCU) is a single-chip computer that integrates a CPU, non-volatile program memory, working RAM, data EEPROM, and a set of on-chip peripherals around an 8-bit data bus. PIC18 devices sit at the high-performance end of Microchip's 8-bit portfolio (PIC10/12/16/18 hierarchy), combining a RISC instruction set, hardware multiplier, and C-friendly architecture with the broad peripheral integration (ADC, comparators, PWM, communication interfaces) needed to replace external glue logic. The PIC18F13K22 in particular targets power-sensitive applications through nanoWatt XLP technology.
Key features include a 10-bit A/D converter with up to 12 analog input channels, dual rail-to-rail comparators with an on-chip selectable Fixed Voltage Reference, enhanced PWM/Capture/Compare peripherals, plus I2C/SPI/EUSART interfaces for sensor and bus connectivity. The PIC18F1XK22 family uses a 16 MHz precision internal oscillator that can be multiplied by 4X PLL to produce 16 MIPS (64 MHz @ 3V) and offers nanoWatt XLP technology for ultra-low-power sleep modes.
Typical applications include low-power battery and energy-harvesting nodes, sensor signal conditioning, USB human-interface peripherals, white goods and appliance control, lighting ballast and LED control, automotive body and accessory modules, and general-purpose 5V industrial control where 8-bit cost, footprint, and code simplicity outweigh the need for 32-bit performance. The wide 2.5V-5.5V range allows direct connection to a regulated 3.3V or 5V rail.
When designing with this part, plan for the QFN-20 (4x4) land pattern, keep the exposed thermal pad soldered to a continuous ground copper pour for thermal and electrical performance, and validate the chosen Vdd range against the Fosc configuration you select (e.g., 48 MHz requires Vdd >= 2.7V). For new designs, Microchip suggests migrating to PIC18F24Q10, which provides more memory and modern peripherals while remaining in the same 8-bit architectural family.
This page synthesizes distributor pricing, parametric same-package alternatives, and practical design notes not found in the manufacturer datasheet alone, with all data sourced from the Microchip product page and DigiKey/Mouser listings as of 2026-09-26.
Drop-in alternatives for PIC18F13K22-E/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC18F13K22-E/ML (same form factor and footprint) — differing in Package, ADC, Comparators, Timers, Communication.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC18F13K22-I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC18F14K22-I/ML
✅ Drop-In✓ In Stock
$1.38 / Unit
View Datasheet →PIC18F13K22-E/ML
✅ Drop-In✓ In Stock
$1.34 / Unit
View Datasheet →PIC18LF13K22-I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC18F13K22-E/ML Maximum Ratings & Electrical Characteristics
| Core Processor | PIC |
| Core Size | 8-bit |
| Maximum Clock Frequency | 48 MHz |
| MIPS | 16 MIPS |
| Program Memory (Flash) | 8 KB (4K x 16) |
| RAM | 256 bytes |
| EEPROM | 256 bytes |
| Supply Voltage (Vdd) | 2.5 V to 5.5 V |
| Operating Temperature | -40 C to +125 C |
| I/O Pins | 16 |
| ADC | 10-bit, up to 12 channels |
| Comparators | 2 rail-to-rail |
| Fixed Voltage Reference | Yes, selectable |
| Communication Interfaces | I2C, SPI, EUSART (enhanced USART) |
| PWM Modules | Enhanced CCP/ECCP |
| Package | 20-pin QFN (4x4) with exposed thermal pad (ML) |
| Mounting Type | Surface Mount |
| Internal Oscillator | 16 MHz precision (4X PLL to 64 MHz @ 3V) |
| Power-Saving Modes | nanoWatt XLP technology |
| RoHS Status | Compliant |
PIC18F13K22-E/ML Pin Configuration
| Pin 1 | RA3/AN3/VREF+/CMP1IN+ — Digital I/O / analog input / VREF+ / comparator input |
| Pin 2 | RA2/AN2/VREF-/CMP2IN- — Digital I/O / analog input / VREF- / comparator input |
| Pin 3 | RA1/AN1/CMP1IN- — Digital I/O / analog input / comparator input |
| Pin 4 | RA0/AN0/CMP2IN+ — Digital I/O / analog input / comparator input |
| Pin 5 | RA5/OSC1/CLKIN — Digital I/O / oscillator input / external clock |
| Pin 6 | RA4/OSC2/CLKOUT — Digital I/O / oscillator output / clock output |
| Pin 7 | Vss — Ground reference |
| Pin 8 | RA7/ECCP1/P1D — Digital I/O / Enhanced CCP channel 1 / PWM output |
| Pin 9 | RA6/ECCP1/P1C — Digital I/O / Enhanced CCP channel 1 / PWM output |
| Pin 10 | RC0/SOSCO — Digital I/O / secondary oscillator output |
| Pin 11 | RC1/SOSCI — Digital I/O / secondary oscillator input |
| Pin 12 | RC2/CCP1/P1A — Digital I/O / CCP channel 1 / PWM output |
| Pin 13 | RC3/CCP2/P3A — Digital I/O / CCP channel 2 / PWM output |
| Pin 14 | RC4/EUSART_TX/CK — Digital I/O / EUSART TX / clock line |
| Pin 15 | RC5/EUSART_RX/DT — Digital I/O / EUSART RX / data line |
| Pin 16 | RC6/SS/HAD — Digital I/O / SPI slave select |
| Pin 17 | RC7/SDI/SDO — Digital I/O / SPI data |
| Pin 18 | Vdd — Positive supply voltage (2.5V-5.5V) |
| Pin 19 | Vss — Ground reference |
| Pin 20 | EP — Exposed thermal pad - connect to Vss/GND |
Typical Applications
PIC18F13K22-E/ML is suitable for 6 applications: Battery-Powered Sensor Node, LED Lighting Control, White Goods and Appliance Control, Automotive Body and Accessory Modules, Industrial 5V Control and Sensor Interface, USB Human-Interface Peripherals (HID).
Battery-Powered Sensor Node
The PIC18F13K22-E/ML is a strong fit for battery-powered sensor nodes because it pairs a 16 MIPS PIC18 core (fast enough to wake, sample, transmit, and sleep) with nanoWatt XLP technology that drops quiescent current into the nanoamp range during sleep. Its 10-bit ADC with up to 12 channels lets a single MCU read multiple analog sensors (temperature, light, battery voltage), while the dual comparators with on-chip Fixed Voltage Reference enable low-power threshold detection without waking the ADC. The 2.5V-5.5V Vdd range supports direct connection to 2xAA alkaline or a regulated 3.3V Li-ion rail. Place the part in a 20-pin QFN (4x4) footprint for compact nodes; design tip - use the comparators as a wake source to keep average current below 10 uA in duty-cycled sensor applications.
Recommended
LED Lighting Control
The PIC18F13K22-E/ML fits LED lighting control applications because its Enhanced CCP/ECCP peripherals deliver flexible PWM generation for dimming and color-mixing, while the 10-bit ADC reads ambient light sensors and potentiometer dim inputs. Operating from 2.5V-5.5V allows the MCU to share a 5V or 3.3V rail with LED driver stages, and the 16 MIPS throughput handles DMX-style or DALI-like protocols via the EUSART for professional fixtures. The 20-pin QFN (4x4) footprint keeps the driver board compact in space-constrained downlights and strip controllers. Design tip - use the on-chip Fixed Voltage Reference to stabilize ADC readings against Vdd variation when the LED driver draws pulsed current on the same rail.
Recommended
White Goods and Appliance Control
The PIC18F13K22-E/ML targets white goods and appliance control because its 16 MIPS PIC18 core, 8 KB Flash, and 256 bytes EEPROM (for non-volatile setpoints and fault logs) are sized for typical appliance firmware (wash cycles, fan curves, fault handling). The -40C to +125C operating range covers refrigerator, dishwasher, and oven-control environments. Hardware peripherals - 10-bit ADC for temperature and water-level sensing, ECCP for motor or heater PWM, and EUSART for user-interface modules - are exactly the mix appliance designers need. The 20-pin QFN (4x4) enables compact control boards inside tight appliance enclosures. Design tip - leverage EEPROM for storing calibration and last-fault codes to improve field serviceability.
Recommended
Automotive Body and Accessory Modules
The PIC18F13K22-E/ML is well suited for non-safety automotive body and accessory modules (interior lighting, mirror control, seat switches, climate trim) because it combines 16 MIPS throughput, 12-channel 10-bit ADC for switch/position sensing, and ECCP PWM for small motor/LED loads within a 20-pin QFN. Although not AEC-Q100 qualified, the -40C to +125C E-grade temperature range covers under-dash and cabin environments. The EUSART enables LIN-bus-like communication with a transceiver companion. Design tip - validate EMC performance with the EUSART clock and PWM edges against your module's conducted/radiated limits; consider the PIC18F24Q10 family or AEC-Q100 PIC18 devices for harsher under-hood use.
Recommended
Industrial 5V Control and Sensor Interface
The PIC18F13K22-E/ML is a natural fit for industrial 5V control boards and sensor interface modules because its 2.5V-5.5V supply range accepts a regulated 5V rail directly, while the 12-channel 10-bit ADC reads multiple 4-20 mA or 0-10V sensor outputs (via signal conditioning). Enhanced PWM supports proportional valve or heater control, and I2C/SPI/EUSART connect to HMIs, displays, and upstream PLCs. The 20-pin QFN (4x4) footprint is small enough for DIN-rail-mounted sensor modules. Design tip - leverage the on-chip FVR and dual comparators to implement sensor-break detection and threshold alarms without external references.
Recommended
USB Human-Interface Peripherals (HID)
The PIC18F13K22-E/ML fits simple USB HID-class peripherals (keyboards, mice, game controllers, custom input devices) when paired with an external USB transceiver or with a PIC18 USB variant. The 16 MIPS core handles HID report generation, debouncing, and LED indicator updates, while the 10-bit ADC and GPIO read buttons, encoders, and analog sticks. The EUSART or SPI can interface to an external USB controller or wireless companion. Design tip - if you need integrated USB, evaluate a PIC18F2X/4XK22 USB variant or move to the newer PIC18F24Q10 family for built-in USB and more Flash for composite HID stacks.
Recommended
Recommended Products Summary
Engineering reference data for PIC18F13K22-E/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC18F13K22-I/ML | PIC18F14K22-I/ML | PIC18LF13K22-I/ML |
|---|---|---|---|---|
| Package | 20-pin QFN (4x4) with EP | 20-pin QFN (4x4) with EP - same | 20-pin QFN (4x4) with EP - same | 20-pin QFN (4x4) with EP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Architecture | 8-bit PIC18 (RISC, HW multiplier) | 8-bit PIC18 - same | 8-bit PIC18 - same | 8-bit PIC18 LF - same core, low-voltage |
| Flash Program Memory | 8 KB (4K x 16) | 8 KB - same | 16 KB - +100% | 8 KB - same |
| RAM | 256 bytes | 256 bytes - same | 256 bytes - same | 256 bytes - same |
| EEPROM | 256 bytes | 256 bytes - same | 256 bytes - same | 256 bytes - same |
| Maximum Fosc | 48 MHz (16 MIPS) | 48 MHz - same | 48 MHz - same | 48 MHz - same |
| Supply Voltage Range | 2.5 V to 5.5 V | 2.5 V to 5.5 V - same | 2.5 V to 5.5 V - same | 1.8 V to 3.6 V - low-voltage variant |
| Operating Temperature Grade | E-grade -40C to +125C | I-grade -40C to +85C | I-grade -40C to +85C | I-grade -40C to +85C |
Key Differentiators
- nanoWatt XLP technology for ultra-low sleep current (vs PIC16F1508)
- 16 MIPS throughput in a 20-pin QFN (vs PIC16F1508)
- Drop-in upgrade path to 16 KB Flash with same package (vs PIC18F13K22-E/ML vs PIC18F14K22-I/ML)
Design Notes
The 20-pin QFN (4x4) package dissipates heat primarily through the exposed thermal pad (EP, pin 20). Per the Microchip QFN package thermal guidelines, EP must be soldered to a continuous, grounded copper pour that connects to the PCB ground plane. For typical 8-bit MCU workloads at modest clock speeds, the chip itself dissipates well under 100 mW, but a 25 mm^2 copper pour is still recommended to keep junction temperature below 70 C ambient derating. Avoid thermal relief spoke-only patterns on the EP pad - use multiple vias in-pad for thermal and electrical performance.
Decouple Vdd (pin 18) with a 100 nF ceramic capacitor placed within 3 mm of the pin, plus a bulk 1-10 uF ceramic or tantalum capacitor on the same node. Place a 100 nF and a bulk capacitor also at any analog Vref node if the on-chip FVR is used. For battery-powered designs using nanoWatt XLP modes, follow the datasheet's recommended Sleep/Wake sequence and clear the MSSP/I2C bus state before sleep to avoid lockup on wake. Estimated: I_sleep target ~50-100 nA achievable with all peripherals disabled and the FVR turned off.
Route the crystal/oscillator traces (RA5/OSC1, RA4/OSC2) short and symmetric, guard them with a ground ring, and keep them away from PWM switching edges. For the SPI/I2C lines (RC4-RC7), use 4-8 kohm pull-ups on I2C SDA/SCL and route these signals as short differential-style pairs to minimize ringing. Place the MCU's analog inputs (AN0-AN11) away from PWM traces to reduce ADC crosstalk; the on-chip FVR helps calibrate absolute readings against Vdd noise.
Common pitfalls: (1) forgetting to solder the EP pad - it carries the main thermal path and a major ground return; (2) choosing 48 MHz Fosc at Vdd < 2.7V, which is out of spec - always consult the Fosc-vs-Vdd graph; (3) leaving unused comparators enabled - they add bias current and degrade ADC accuracy; (4) writing to EEPROM without unlocking the EECON2 sequence - this is a documented lockout on PIC18 to prevent accidental writes; (5) using the internal oscillator without engaging the PLL when 16 MIPS is required for protocol timing.
Place the MCU near the connector of any external sensor harnesses to minimize analog trace length and to keep PWM traces short. Keep digital switching currents (ECCP outputs, EUSART lines) on inner layers with a continuous ground return on the layer below. For mixed-signal designs, split the ground plane only under the analog input filter network and join it back at the EP pad - a single ground reference at the MCU is generally best for 8-bit MCUs at this speed.
Compliance Information
RoHS compliant per Microchip product page. Not AEC-Q100 qualified - this part targets industrial and consumer white-goods applications rather than automotive safety-critical use. For AEC-Q100 automotive body modules, evaluate AEC-Q100-qualified PIC18 variants or add external qualification testing.
