PIC18F25K22T-I/ML - 8-bit 64MHz MCU, 32KB Flash, 28-QFN | Microchip
MPN: PIC18F25K22T-I/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3.78 | $3.78 |
| 10 | $3.4 | $34.00 |
| 100 | $2.84 | $284.00 |
| 500 | $2.5 | $1,250.00 |
| 1,000 | $2.18 | $2,180.00 |
| 3,000 | $1.95 | $5,850.00 |
PIC18F25K22T-I/ML Overview
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash/ROM), working memory (RAM), and peripheral interfaces (ADC, timers, communication ports) into one package. The PIC18 family is Microchip's 8-bit enhanced RISC architecture with 16-bit instructions, positioned between baseline PIC10/12/16 and 16-bit dsPIC/PIC24 families. The "K" series adds nanoWatt XLP extreme-low-power technology, making this MCU a logical choice for many high-performance, power-sensitive applications such as battery-powered sensor nodes, wearables, and IoT endpoints.
Key features include 64MHz internal oscillator (16 MIPS performance), 17 analog input channels (10-bit ADC), two analog comparators with rail-to-rail inputs, a programmable on-chip voltage reference (CVREF), programmable High/Low Voltage Detection (PLVD), and mTouch capacitive-touch sensing up to 28 channels. Communication peripherals include one Enhanced USART, two MSSP (SPI/I2C) modules, and up to 19 general-purpose I/O pins. The XLP technology enables sleep currents as low as 20 nA with active mode down to 50 uA/MIPS, dramatically extending battery life in always-on applications.
Typical applications include industrial control panels, low-power sensor nodes, capacitive touch interfaces, battery management, automotive accessory modules, USB-to-UART bridges (via MSSP + USART), and consumer white goods. The wide 1.8V to 5.5V VDD range supports both 3.3V and 5V system designs, while the rich peripheral set allows replacement of external ADCs, references, and comparators with on-chip equivalents.
When designing with this MCU, ensure the exposed thermal pad is soldered to a sufficient copper pour for thermal dissipation. Decoupling capacitors (100nF + 10uF) must be placed within 5mm of the VDD pins. Use MPLAB X IDE and MPLAB XC8 compiler for firmware development; debugging/programming is supported via MPLAB Snap, PICkit 4, or ICD 4.
This page synthesizes distributor pricing, drop-in package-compatible alternatives, and practical design notes not found in the manufacturer datasheet, helping procurement and engineering teams evaluate the PIC18F25K22T-I/ML for production use.
Drop-in alternatives for PIC18F25K22T-I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC18F25K22T-I/ML (same form factor and footprint) — differing in Package, Timers, ADC, Program Memory (Flash), Comparators.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC18F25K22-I/ML
✅ Drop-In✓ In Stock
$2.74 / Unit
View Datasheet →PIC18F25K22-E/ML
✅ Drop-In✓ In Stock
$2.34 / Unit
View Datasheet →PIC18LF25K22-I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC18F26K22-E/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC18F24K22T-I/ML
✅ Drop-In✓ In Stock
$2.1 / Unit
View Datasheet →PIC18F25K22T-I/ML Maximum Ratings & Electrical Characteristics
| Core Architecture | PIC18 8-bit RISC (16-bit instructions) |
| Maximum CPU Frequency | 64 MHz (16 MIPS) |
| Program Memory (Flash) | 32 KB (16K x 16) |
| Data SRAM | 1536 bytes |
| Data EEPROM | 256 bytes |
| Supply Voltage (VDD) | 1.8 V to 5.5 V |
| Operating Temperature | -40 C to +85 C (Industrial) |
| Package | 28-pin QFN (6x6) with Exposed Pad |
| Mounting Type | Surface Mount (Tape & Reel) |
| ADC | 10-bit, up to 17 channels |
| Analog Comparators | 2 (rail-to-rail inputs) |
| Programmable Voltage Reference (CVREF) | Yes (% of VDD) |
| Programmable LVD/HLVD | Yes |
| mTouch Capacitive Touch Channels | Up to 28 |
| Communication Peripherals | 1x EUSART, 2x MSSP (SPI/I2C) |
| I/O Pins | Up to 19 |
| Timers | Multiple 8/16-bit timers |
| RoHS Status | Compliant |
| MSL Level | 1 |
| Lead-Free | Yes |
PIC18F25K22T-I/ML Pin Configuration
| Pin 1 | RA3/AN3/VREF+/C1IN+/C2IN+ — GPIO RA3 / Analog input 3 / CVREF+ / Comparator 1+ input |
| Pin 2 | RA4/T0CKI/C1OUT — GPIO RA4 / Timer0 clock input / Comparator 1 output |
| Pin 3 | RA5/AN4/C2IN+/HLVDIN — GPIO RA5 / Analog input 4 / Comparator 2+ input / HLVD input |
| Pin 4 | RA6/OSC2/CLKR — GPIO RA6 / Oscillator output / Clock output |
| Pin 5 | RA7/OSC1/CLKIN — GPIO RA7 / Oscillator input / External clock input |
| Pin 6 | RC0/SOSCO — GPIO RC0 / Secondary oscillator output |
| Pin 7 | RC1/SOSCI — GPIO RC1 / Secondary oscillator input |
| Pin 8 | RC2/CCP1 — GPIO RC2 / CCP1 PWM/Capture/Compare |
| Pin 9 | RC3/SCK1/SCL1 — GPIO RC3 / MSSP1 SPI clock / I2C1 clock |
| Pin 10 | RC4/SDI1/SDA1 — GPIO RC4 / MSSP1 SPI data in / I2C1 data |
| Pin 11 | RC5/SDO1 — GPIO RC5 / MSSP1 SPI data out |
| Pin 12 | RC6/TX1/CK1 — GPIO RC6 / EUSART1 TX / EUSART1 clock |
| Pin 13 | RC7/RX1/DT1 — GPIO RC7 / EUSART1 RX / EUSART1 data |
| Pin 14 | RB0/AN12/INT0 — GPIO RB0 / Analog input 12 / External interrupt 0 |
| Pin 15 | RB1/AN10/INT1 — GPIO RB1 / Analog input 10 / External interrupt 1 |
| Pin 16 | RB2/AN8 — GPIO RB2 / Analog input 8 |
| Pin 17 | RB3/AN9/CPP2 — GPIO RB3 / Analog input 9 / CCP2 |
| Pin 18 | RB4/AN11 — GPIO RB4 / Analog input 11 |
| Pin 19 | RB5/AN13 — GPIO RB5 / Analog input 13 |
| Pin 20 | RB6/PGC — GPIO RB6 / ICD programming clock |
| Pin 21 | RB7/PGD — GPIO RB7 / ICD programming data |
| Pin 22 | VDD — Positive supply voltage (1.8V-5.5V) |
| Pin 23 | VSS — Ground reference |
| Pin 24 | RA0/AN0/C1IN0-/C2IN0- — GPIO RA0 / Analog input 0 / Comparator 1- input / Comparator 2- input |
| Pin 25 | RA1/AN1/C1IN1-/C2IN1- — GPIO RA1 / Analog input 1 / Comparator inputs |
| Pin 26 | RA2/AN2/VREF-/C1IN+/C2IN+ — GPIO RA2 / Analog input 2 / CVREF- / Comparator inputs |
| Pin 27 | VDD — Positive supply voltage (second pin for power) |
| Pin 28 | VSS — Ground reference (second pin for power) |
Typical Applications
PIC18F25K22T-I/ML is suitable for 6 applications: Low-Power IoT Sensor Node, Capacitive Touch HMI Panel, Industrial Control & Monitoring, USB-to-UART Bridge / Protocol Converter, Consumer Appliance White Goods, Automotive Accessory Module.
Low-Power IoT Sensor Node
The PIC18F25K22T-I/ML is purpose-built for battery-powered IoT sensor nodes thanks to its nanoWatt XLP technology, which delivers sleep currents in the nanoampere range and active currents around 50 uA/MIPS. The 32KB Flash accommodates Over-The-Air (OTA) bootloaders plus application firmware, while 1536 bytes of SRAM handles sensor buffers and protocol stacks. The 10-bit ADC with up to 17 channels directly digitizes analog sensors (temperature, light, pressure) without external signal conditioning. Programmable HLVD provides brown-out and battery-low detection for safe shutdown. Pair the MCU with a low-power UART radio (LoRa, Sub-GHz) or I2C sensor cluster; the integrated MSSP peripherals handle both, eliminating external bus controllers. The 1.8V-5.3V VDD range lets the design accept a wide variety of primary cells (CR2032, AA alkaline) without boost regulators.
Recommended
Capacitive Touch HMI Panel
The PIC18F25K22T-I/ML supports up to 28 mTouch capacitive touch channels via the on-chip CTMU peripheral, replacing dedicated capacitive-touch controllers in cost-sensitive designs. With 32KB Flash and 16 MIPS, the core can run both touch scanning and application logic (button debouncing, slider reconstruction, LED control, and UART reporting) without an external MCU. The two rail-to-rail analog comparators with programmable voltage reference (CVREF) enable threshold-based wake-on-touch from sleep, reducing average current in always-on appliances. The 28-QFN (6x6) package allows the touch panel PCB to remain compact, while the 1.8V-5.5V VDD range accepts either 3.3V regulated supplies or direct 5V USB power. Programming uses MPLAB X IDE with the CTMU library for production-ready touch firmware.
Recommended
Industrial Control & Monitoring
The PIC18F25K22T-I/ML delivers the determinism and peripheral richness required for industrial control loops. With 16 MIPS performance, 32KB Flash, and 1536 bytes SRAM, it can handle PID control for motor or heater regulation alongside Modbus RTU communication over the EUSART. The 10-bit ADC with 17 channels reads multiple sensor inputs (4-20 mA transducers, thermistors, potentiometers) without external muxes; the two analog comparators drive fast overcurrent or overtemperature shutdowns. The wide -40C to +85C industrial temperature range suits factory-floor deployments, while the 28-QFN (6x6) footprint supports compact DIN-rail mounted modules. The programmable HLVD provides brown-out recovery for unattended equipment, and the MSSP peripherals enable SPI display and I2C EEPROM logging. Programming/debug uses PICkit 4, MPLAB Snap, or ICD 4 with MPLAB X IDE.
Recommended
USB-to-UART Bridge / Protocol Converter
The PIC18F25K22T-I/ML implements a low-cost USB-to-UART bridge by combining the MSSP peripherals (SPI/I2C) with the EUSART, optionally paired with an external USB-serial transceiver such as the MCP2200 or MCP2221. With 32KB Flash and 1536 bytes SRAM, the core handles command parsing, flow control (RTS/CTS), and protocol translation (UART-to-SPI bridge for legacy serial devices). The 64 MHz oscillator supports high baud rates (up to 1 Mbps UART) without timing constraints. Programmable CVREF generates reference voltages for RS-485 transceivers in industrial-bus applications. The 28-QFN (6x6) package fits in slim cable dongles, and the wide 1.8V-5.5V VDD accommodates both 3.3V logic and 5V RS-232 systems. Industrial temperature range -40C to +85C supports factory and outdoor installations.
Recommended
Consumer Appliance White Goods
The PIC18F25K22T-I/ML is a strong fit for consumer white-goods control boards (washing machines, dishwashers, microwaves, coffee machines) thanks to its mTouch capacitive sensing, robust analog peripherals, and low BOM cost. The 10-bit ADC digitizes motor currents and temperature sensors directly, while the two comparators monitor safety limits (door-latch position, water level). The 32KB Flash stores UI state machines, fault logs, and communication stacks; 1536 bytes SRAM handles dynamic variables. nanoWalt XLP technology cuts standby power below 100 nA, helping appliances meet ENERGY STAR limits. The 28-QFN package is robust to vibration and supports conformal-coated boards. Industrial -40C to +85C operation tolerates kitchen- and garage-appliance temperature swings without derating.
Recommended
Automotive Accessory Module
The PIC18F25K22T-I/ML is used in non-safety automotive accessory modules such as interior LED controllers, seat-position memories, ambient-light sensors, and HVAC trim controls. With 32KB Flash and 1536 bytes SRAM, the MCU can host LIN (Local Interconnect Network) slave stacks via the EUSART plus capacitive touch via CTMU for backlit switches. The 17-channel ADC reads multiple trim-position potentiometers and thermistors, while the two comparators provide window-comparator overcurrent protection for LED strings. The 1.8V-5.5V VDD accepts automotive 12V battery rails after pre-regulation. For harsher under-hood or AEC-Q100 qualified designs, the PIC18F25K22-E/ML extended-temperature variant (-40C to +125C) is a drop-in upgrade on the same 28-QFN footprint, providing identical pinout and register map for seamless migration.
Recommended
Recommended Products Summary
Engineering reference data for PIC18F25K22T-I/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC18F25K22-I/ML | PIC18F25K22-E/ML | PIC18LF25K22-I/ML | PIC18F26K22-E/ML | PIC18F24K22T-I/ML |
|---|---|---|---|---|---|---|
| Package | 28-QFN (6x6) | 28-QFN (6x6) - same | 28-QFN (6x6) - same | 28-QFN (6x6) - same | 28-QFN (6x6) - same | 28-QFN (6x6) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 32 KB | 32 KB | 32 KB | 32 KB | 64 KB | 16 KB |
| SRAM | 1536 bytes | 1536 bytes | 1536 bytes | 1536 bytes | 3892 bytes | 512 bytes |
| Operating Voltage | 1.8V to 5.5V | 1.8V to 5.5V | 1.8V to 5.5V | 1.8V to 3.6V | 1.8V to 5.5V | 1.8V to 5.5V |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +125C | -40C to +85C | -40C to +125C | -40C to +85C |
| Max CPU Frequency | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) | 32 MHz (8 MIPS) | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) |
| Packaging | Tape & Reel | Tube | Tube | Tube | Tube | Tape & Reel |
Key Differentiators
- 32KB Flash + 1536B SRAM at low BOM cost (vs PIC18F24K22T-I/ML)
- Wide 1.8V to 5.5V VDD operation (vs PIC18LF25K22-I/ML)
- Industrial temperature grade with high-volume 28-QFN packaging (vs PIC18F25K22-E/ML)
Design Notes
Estimated: At 64 MHz active, the PIC18F25K22T-I/ML typically draws around 6-10 mA at 5V VDD, falling to sub-100 nA in XLP sleep mode. To maximize battery life in always-on designs, use Sleep mode aggressively - the nanoWalt XLP technology supports wake-on-touch via CTMU, wake-on-UART, or wake-on-ADC thresholds. Place a 100nF ceramic decoupling capacitor within 5 mm of each VDD pin (pins 11 and 28 on the 28-QFN), plus a bulk 10 uF tantalum or ceramic at the regulator output.
The 28-QFN (6x6) package relies on the exposed thermal pad (EP) for heat dissipation. Solder the EP to a copper pour of at least 100 mm^2 connected to VSS to keep junction temperature within ratings. For high-temperature environments (above +70 C ambient), choose the PIC18F25K22-E/ML extended-temperature variant. Estimated: Without the EP properly soldered, theta_JA can exceed 60 C/W, so always follow Microchip's PCB layout guidelines in the datasheet section on thermal management.
The 28-QFN (6x6) footprint requires a 0.4 mm pitch land pattern with a 3.2 x 3.2 mm center EP pad. Use NSMD (Non-Solder Mask Defined) pads for the perimeter I/O and SMD pads for the EP for reliable solder joint formation. Keep trace lengths on the analog inputs (AN0-AN13) under 50 mm to minimize ADC noise pickup, and route AVSS separately from digital ground back to a star point at the regulator. Per Microchip AN1258 "PCB Design Guidelines for QFN Packages", avoid placing vias in the EP pad - use thermal vias in the surrounding copper pour instead.
Common pitfalls when migrating from PIC18F25K20 to PIC18F25K22: (1) The 25K22 adds CTMU and mTouch peripherals that are NOT present on the 25K20 - do not enable them on the older die. (2) Register addresses differ in some peripheral modules - verify all SFR addresses when porting code. (3) The HLVD module replaces the LVD on the 25K22, with different trip-point programming. (4) Configuration bit settings for WDT, BOR, and oscillator differ - always recompile configuration pragmas from the new header files. Always revalidate timing-critical code on the target hardware after migration.
Route the ICSP pins (RB6/PGC, RB7/PGD) as short, noise-free traces to a 2x3 0.1-inch header for production programming. Series 4.7 kohm resistors between the MCU and the ICSP header prevent contention with the application circuit during debug. Place the ICSP connector at the board edge for easy access. For production programming via the MPLAB Snap, PICkit 4, or ICD 4, ensure the VDD sense line on pin 2 of the ICSP header is connected to the board VDD rail to power the debugger target correctly.
Compliance Information
RoHS compliant per Microchip product page. Not AEC-Q100 qualified; for AEC-Q100 derived applications select the -E/ML extended temperature variant or contact Microchip for Q100-graded SPC parts.
