PIC18F26K22T-I/ML - 64MHz 8-bit MCU 64KB Flash | Microchip
MPN: PIC18F26K22T-I/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3.45 | $3.45 |
| 10 | $3.18 | $31.80 |
| 100 | $2.79 | $279.00 |
| 500 | $2.49 | $1,245.00 |
| 1,000 | $2.2 | $2,200.00 |
| 3,000 | $1.95 | $5,850.00 |
PIC18F26K22T-I/ML Overview
An 8-bit microcontroller (MCU) is a single-chip computer that integrates an 8-bit CPU, RAM, non-volatile program memory, timers, communication peripherals and I/O pins in one package. 8-bit MCUs sit in the hierarchy: microcontroller -> embedded processor -> semiconductor IC, and remain the optimal choice for cost-sensitive, low-power, deterministic control tasks such as sensor interfacing, user I/O handling, motor control and battery-powered edge nodes where 32-bit performance is not required.
Key features of the PIC18F26K22 family include nanoWatt XLP sleep currents as low as 20 nA, flexible oscillator modes (HFINTOSC, LFINTOSC, EC, HS, XT, LP), a charge time measurement unit (CTMU) for capacitive touch sensing, an enhanced capture/compare/PWM module, and on-chip programmable high/low-voltage detect (PLVD) for robust brown-out behavior. The 28-QFN (6x6) package is the same land pattern as the related PIC18F25K22 and PIC18LF26K22, simplifying PCB reuse across variants.
Architecturally, the device uses a Harvard-style modified RISC core with a 16-bit instruction word, a hardware multiplier for 8x8 signed/unsigned operations, and a wide operating voltage range of 1.8 V to 5.5 V (F variant). The "T" suffix denotes tape-and-reel packaging for high-volume SMT assembly, and the "I" temperature grade specifies -40C to +85C industrial operation.
Typical applications include low-power IoT sensor nodes, portable medical and consumer devices, capacitive touch interfaces (buttons, sliders, proximity), USB device firmware via the MSSP, industrial control modules, and battery-powered metering equipment. The wide VDD range and nanoWatt XLP make the part particularly attractive for energy-harvesting and always-on designs.
When designing with this device, place the 28-QFN exposed pad (EP) on a continuous ground copper pour with at least 4 thermal vias to maximize heat dissipation and provide the lowest-impedance ground reference. Decouple VDD with a 100 nF ceramic capacitor placed within 2 mm of the supply pin and pair it with a bulk 1 uF to 10 uF capacitor on the same net. Always configure the CONFIG registers in code and lock them with the appropriate MCLRE and BOR settings to ensure robust operation.
This page synthesizes distributor pricing, drop-in alternatives and practical design notes that go beyond the manufacturer datasheet, helping engineers evaluate the PIC18F26K22T-I/ML for embedded control, low-power wireless and touch-interface designs.
Drop-in alternatives for PIC18F26K22T-I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC18F26K22T-I/ML (same form factor and footprint) — differing in Core, Package, ADC, Mounting Type, Communication.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC18F25K22-I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC18F26K22-I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC18LF26K22-I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC18F25K22-I/SS
✅ Drop-In✓ In Stock
$1.92 / Unit
View Datasheet →PIC18F26K22-E/SP
✅ Drop-In✓ In Stock
$3.32 / Unit
View Datasheet →PIC18F26K22T-I/ML Maximum Ratings & Electrical Characteristics
| Product Family | PIC18F K-series (PIC18F26K22) |
| Core | 8-bit PIC RISC (Harvard) |
| Max CPU Frequency | 64 MHz (16 MIPS) |
| Program Memory (Flash) | 64 KB (32K x 16) |
| Data Memory (SRAM) | 3,896 bytes |
| Data EEPROM | 1 KB |
| Operating Voltage (VDD) | 1.8 V to 5.5 V |
| Operating Temperature | -40 C to +85 C (Industrial) |
| I/O Pins | 24 |
| ADC | 2x 10-bit, up to 17 channels |
| Comparators | 2x rail-to-rail analog comparators |
| Communication | 2x USART, 2x MSSP (I2C/SPI), 1x EUSART |
| Timers/PWM | ECCP + CCP, 8/16-bit timers |
| Special Features | nanoWatt XLP, CTMU, PLVD, programmable VREF |
| Package | 28-pin QFN (6x6 mm, ML) with exposed pad |
| Mounting Type | Surface Mount (Tape & Reel, T suffix) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
PIC18F26K22T-I/ML Pin Configuration
| Pin 1 | RA2 — Bidirectional I/O / analog input AN2 / CVREF |
| Pin 2 | RA3 — Bidirectional I/O / analog input AN3 / VREF+ |
| Pin 3 | RA4 — Bidirectional I/O / analog input AN4 / C1OUT |
| Pin 4 | RA5 — Bidirectional I/O / analog input AN5 / C2OUT / HLVDIN |
| Pin 5 | RA6 — Bidirectional I/O / oscillator output OSC2 / CLKOUT |
| Pin 6 | RA7 — Bidirectional I/O / oscillator input OSC1 / CLKIN |
| Pin 7 | VDD — Positive supply voltage |
| Pin 8 | VSS — Ground reference |
| Pin 9 | RB0 — Bidirectional I/O / interrupt-on-change / AN12 |
| Pin 10 | RB1 — Bidirectional I/O / interrupt-on-change / AN10 |
| Pin 11 | RB2 — Bidirectional I/O / interrupt-on-change / AN8 |
| Pin 12 | RB3 — Bidirectional I/O / interrupt-on-change / AN9 / CCP2 |
| Pin 13 | RB4 — Bidirectional I/O / interrupt-on-change / AN11 |
| Pin 14 | RB5 — Bidirectional I/O / interrupt-on-change / AN13 / CCP3 |
| Pin 15 | RB6 — Bidirectional I/O / interrupt-on-change / PGC (ICSP clock) |
| Pin 16 | RB7 — Bidirectional I/O / interrupt-on-change / PGD (ICSP data) |
| Pin 17 | RC0 — Bidirectional I/O / SOSCO / AN16 |
| Pin 18 | RC1 — Bidirectional I/O / SOSCI / AN17 |
| Pin 19 | RC2 — Bidirectional I/O / CCP1 / AN14 |
| Pin 20 | RC3 — Bidirectional I/O / SCL1 / SCK1 / AN15 |
| Pin 21 | RC4 — Bidirectional I/O / SDA1 / SDI1 |
| Pin 22 | RC5 — Bidirectional I/O / SDO1 |
| Pin 23 | RC6 — Bidirectional I/O / TX1 / CK1 |
| Pin 24 | RC7 — Bidirectional I/O / RX1 / DT1 |
| Pin 25 | RE3 — MCLR input / programming voltage (also digital input on newer devices) |
| Pin 26 | RA0 — Bidirectional I/O / analog input AN0 / ULPWU |
| Pin 27 | RA1 — Bidirectional I/O / analog input AN1 / C1IN- |
| Pin 28 | VSS — Ground reference (alternate VSS tie) |
| Pin 29 | EP — Exposed pad - must be soldered to ground pour for thermal dissipation |
Typical Applications
PIC18F26K22T-I/ML is suitable for 6 applications: Low-Power IoT Sensor Nodes, Capacitive Touch User Interface, Industrial Control Modules, Portable Consumer Medical Devices, USB Device Firmware Hosts, Battery-Powered Metering and Data Loggers.
Low-Power IoT Sensor Nodes
The PIC18F26K22T-I/ML's nanoWatt XLP technology with ~20 nA sleep current and 64 KB Flash is ideal for battery-powered IoT nodes that spend most of their life in sleep, waking on a timer or external interrupt to read sensors and transmit data. The 1.8-5.5 V VDD range lets the same PCB run from a CR2032 coin cell, two AA batteries, or a regulated 3.3 V rail. Place the QFN exposed pad on a continuous ground pour and add a 4.7 uF bulk capacitor to ride out radio TX bursts without MCU brown-out.
Recommended
Capacitive Touch User Interface
The on-chip Charge Time Measurement Unit (CTMU) plus the 17-channel 10-bit ADC and 24 I/O pins let the PIC18F26K22T-I/ML drive a complete capacitive-touch panel - buttons, sliders, wheels and proximity sensors - without an external touch controller. The 64 KB Flash fits mTouch libraries plus a USB CDC or I2C host stack, while the 1.8-5.5 V supply matches single-cell Li-ion or 5 V USB-powered appliances. Decouple VDD with a 100 nF X7R within 2 mm of the supply pin and route CTMU traces as guarded 0.2 mm traces for stable touch baseline.
Recommended
Industrial Control Modules
The 16 MIPS performance, two EUSARTs (RS-232/RS-485), 2 MSSP (SPI/I2C) and 17 ADC channels give the PIC18F26K22T-I/ML enough headroom to act as a 24 V industrial sensor hub that aggregates analog inputs, drives opto-isolated outputs and talks Modbus over RS-485. The -40 C to +85 C industrial grade plus the Programmable High/Low-Voltage Detect (PLVD) module handle harsh factory-floor brown-out events. Use the QFN's exposed pad soldered to a 1 cm² copper pour to keep the junction temperature below 100 C at full 64 MHz.
Recommended
Portable Consumer Medical Devices
Battery-powered medical peripherals - glucometers, pulse oximeters, peak-flow meters - benefit from the PIC18F26K22T-I/ML's 64 MHz core for fast ADC sweeps, 3,896 B SRAM for sample buffers, and nanoWatt XLP sleep to extend coin-cell life beyond 12 months. The 10-bit ADC at 100 ksps is sufficient for photoplethysmography and electrochemical sensor front-ends, while the MSSP ports drive OLED or segment LCDs. Keep the analog AGND/AVSS trace separated from noisy digital GND and tied at a single point under the exposed pad.
Recommended
USB Device Firmware Hosts
The PIC18F26K22T-I/ML's 64 KB Flash comfortably fits a USB CDC/HID stack plus application code, and the two MSSP ports can bit-bang low/full-speed USB on the D+/D- lines when paired with an external 3.3 V LDO. The 1.8-5.5 V supply lets a single board run natively on USB VBUS (5 V) while the same MCU continues to handle user I/O. Add a 100 nF decoupling cap within 2 mm of the VDD pin and route the D+/D- pair as a 90 ohm differential with matched length to stay within USB 2.0 spec.
Recommended
Battery-Powered Metering and Data Loggers
For gas, water and electricity metering or remote environmental loggers, the PIC18F26K22T-I/ML's 64 KB Flash stores weeks of timestamped logs while the 1 KB EEPROM holds calibration constants. nanoWatt XLP sleep extends CR2032 coin-cell life to multi-year deployments, and the 24 I/O lines let the MCU read multiple pulse meters, drive LCD segments via the MSSP, and stream data over UART. Place the QFN exposed pad on a 4-via thermal pattern and ground copper pour so the part stays within spec across -40 C to +85 C.
Recommended
Recommended Products Summary
Engineering reference data for PIC18F26K22T-I/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC18F25K22-I/ML | PIC18F26K22-I/ML | PIC18LF26K22-I/ML | PIC18F25K22-I/SS | PIC18F26K22-E/SP |
|---|---|---|---|---|---|---|
| Package | 28-QFN (6x6 mm, ML) | 28-QFN (6x6 mm, ML) - same | 28-QFN (6x6 mm, ML) - same | 28-QFN (6x6 mm, ML) - same | 28-SSOP (5.30 mm) - different package | 28-SPDIP (7.50 mm) - different package |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Max CPU Frequency | 64 MHz (16 MIPS) | 64 MHz | 64 MHz | 32 MHz (-50%) | 64 MHz | 64 MHz |
| Flash Program Memory | 64 KB | 32 KB (-50%) | 64 KB | 64 KB | 32 KB (-50%) | 64 KB |
| SRAM | 3,896 bytes | 3,896 bytes | 3,896 bytes | 3,896 bytes | 3,896 bytes | 3,896 bytes |
| Operating Voltage (VDD) | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 3.6 V (-35%) | 1.8 V to 5.5 V | 1.8 V to 5.5 V |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +125 C (Extended) |
| Packaging | Tape & Reel (T suffix) | Tray | Tray | Tray | Tray | Tube |
| Approx Unit Price (qty 1) | $3.45 | ~$3.00 | ~$3.10 | ~$3.20 | ~$2.95 | ~$3.50 |
Key Differentiators
- Pin-to-pin drop-in for 32 KB Flash designs without code changes (vs PIC18F25K22-I/ML)
- Same package for both F and LF voltage grades (vs PIC18LF26K22-I/ML)
- Tape-and-reel variant of identical die (vs PIC18F26K22-I/ML)
- Extended-temperature sibling available in DIP package (vs PIC18F26K22-E/SP)
Design Notes
The 28-QFN (6x6 mm, ML) package exposes a thermal pad (pin 29) on the underside that must be soldered to a continuous ground copper pour with at least four thermal vias to the inner ground plane. This pad provides the lowest-impedance ground reference for the ADC and serves as the primary heat dissipation path; without it the part can overheat at 64 MHz full-load. Place a 100 nF X7R 0402 ceramic bypass capacitor within 2 mm of the VDD pin (pin 7), and pair it with a 1-10 uF bulk capacitor on the same VDD net to suppress switching transients.
The PIC18F26K22T-I/ML is the 'F' (Flash) variant - its 64 MHz maximum CPU frequency is only valid for VDD >= 2.7 V. Below 2.7 V the max clock derates to 4 MHz; below 1.8 V operation is undefined. Always configure the OSCCON register and CONFIG1H before switching to the 64 MHz HFINTOSC and verify your firmware does not exceed the voltage-frequency relationship. The VDD core POR threshold and the Brown-out Reset (BOR) must be enabled in CONFIG2L for reliable industrial operation.
When using the MSSP ports for SPI or I2C, route the SCL/SDA traces as a 90 ohm differential-style pair with matching length and keep them shorter than 50 mm to avoid ringing. Place a 4.7 k-10 k pull-up on SDA/SCL within 50 mm of the MCU. For analog inputs, dedicate a separate AGND trace from the exposed pad to the analog reference capacitor and avoid running ADC traces parallel to high-speed digital signals - this preserves the 10-bit ADC linearity and keeps noise below 1 LSB.
Estimated: at 64 MHz active mode, VDD = 5 V, ambient 25 C, the PIC18F26K22T-I/ML draws about 8-10 mA core current (50 mW). With theta_JA around 35 C/W on a 1 cm² ground pour, the junction rises only 2-3 C above ambient. At higher ambient (85 C) and full peripheral activity (ADC + EUSART + MSSP active simultaneously), the part still stays well below 125 C, so no external heatsink is required. Industrial operation is thermally safe on the standard QFN footprint with a proper ground pour.
Compliance Information
RoHS compliant per Microchip product page. Not AEC-Q100 qualified (standard industrial grade); choose AEC-Q100 automotive PIC variants for vehicle applications.
