Microchip Technology

PIC18F26K80-E/SO - 64KB Flash 8-bit MCU w/ECAN XLP | Microchip

MPN: PIC18F26K80-E/SO ✓ Active
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1.8 V to 5.5 V Vdss <100 nA typical Id 28-pin SOIC (SO), wide body, 7.50 mm Package 64 MHz (16 MIPS) Speed 64 KB (32K x 16) Memory
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Price updated: 2026-09-27
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Qty Unit Price Extended
1 $6.65 $6.65
10 $5.99 $59.90
100 $5.34 $534.00
500 $4.79 $2,395.00
1,000 $4.25 $4,250.00
ℹ️ All prices are in USD

PIC18F26K80-E/SO Overview

The Microchip Technology PIC18F26K80-E/SO is a high-performance 8-bit CMOS flash microcontroller belonging to the PIC18F66K80 family, featuring an integrated ECAN module and eXtreme Low Power (XLP) technology in a 28-pin SOIC (SO) wide-body package. It operates from 1.8V to 5.5V with up to 64MHz (16 MIPS) performance, integrates 64KB flash program memory, 4KB RAM, and 1KB EEPROM, and includes a 12-bit ADC with CTMU support.

A PIC18 microcontroller is an 8-bit Reduced Instruction Set Computer (RISC) device built around an enhanced PIC18 architecture that delivers deterministic execution and rich peripheral integration. Within the system hierarchy, the PIC18 family sits between baseline PIC10/12/16 parts and higher-end dsPIC/PIC24/32 devices, offering an optimal balance of memory, peripherals, and code efficiency for cost-sensitive embedded control. The integrated ECAN controller positions the PIC18F26K80 specifically for CAN-bus connected nodes in industrial and automotive systems.

Key features of the PIC18F26K80-E/SO include 64KB flash with self-programmability, 4KB SRAM, 1KB data EEPROM, an integrated 10-bit 1.5Msps ADC paired with CTMU (Charge Time Measurement Unit) for capacitive touch and time-domain sensing, and a built-in ECAN module supporting CAN 2.0B at up to 1Mbps. The XLP technology achieves sub-100 nA sleep current, with multiple power-managed modes (Run, Idle, Sleep) and nanoWatt features for battery-powered nodes. Operating voltage spans 1.8V to 5.5V across -40C to +125C (E temperature grade).

The PIC18F26K80 architecture uses a 16-bit instruction word with an 8-bit data path and 31-level hardware stack, providing 200ns minimum instruction cycle at 20MHz. On-chip peripherals include up to 5 CCP/ECCP modules, two MSSP (SPI/I2C) ports, two USART modules with LIN support, an enhanced 8/16-bit timer block, comparators, and 24 channels of 12-bit ADC. The wide VDD range allows direct connection to 3.3V or 5V rails without level translation.

Typical applications include automotive body and chassis ECUs, building automation controllers, elevator control panels, CAN-based industrial sensor nodes, smart metering, and battery-powered remote sensor modules. The integrated ECAN, 12-bit ADC, and CTMU enable single-chip implementations that previously required multiple companion ICs. The 'E' suffix indicates the extended -40C to +125C temperature grade.

When designing with the PIC18F26K80-E/SO, ensure proper decoupling (100nF + 10uF bulk) within 5mm of the VDD pins, and reserve a dedicated MCLR pull-up for in-circuit serial programming (ICSP). The wide-body 28-SOIC footprint is compatible with the PIC18F25K80 (32KB flash) and other PIC18FxxK80 family variants, allowing easy migration across memory tiers without PCB changes.

Drop-in alternatives for PIC18F26K80-E/SO — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with PIC18F26K80-E/SO (same form factor and footprint) — differing in Package, ADC, Program Memory (Flash), Mounting Type, Core Architecture.

Microchip Technology
Package: 28-pin SOIC (7.50 mm)
Program Memory (Flash): 32 KB (16K x 16 words)
Microchip Technology
Package: 28-SOIC (7.50 mm width)
ADC: 10-bit ADC2 with Computation Accelerator
Program Memory (Flash): 64 KB (32K x 16 words)
Microchip Technology
Package: 28-pin SOIC (SO)
ADC: 12-bit ADC2 with Computation, up to 35 channels
Core Architecture: 8-bit PIC18 enhanced Harvard
Microchip Technology
Package: 28-pin SPDIP (SP)
Mounting Type: Through-hole
Microchip Technology
Package: 28-pin SOIC (SO)
ADC: 12-bit, up to 11 channels, 100 ksps
Program Memory (Flash): 64 KB (32K x 16 words)

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

PIC18F26K80-I/SO

✅ Drop-In
Microchip Technology
📦 28-SOIC (SO) wide-body
PIC18 (8-bit Harvard) · 64 KB (32K x 16 words) · 3.6 KB · 1 KB · 64 MHz (16 MIPS) · 200 ns (4-clock multiplication) · 1.8 V to 5.5 V · 12-bit, up to 11 channels, 100 ksps

✓ In Stock

$2.87 / Unit

View Datasheet →

PIC18F25K80-I/SO

✅ Drop-In
Microchip Technology
📦 28-SOIC (SO) wide-body
PIC18 8-bit enhanced RISC · 32 KB (16K x 16 words) · 4 KB · 1 KB · 64 MHz · 16 MIPS · 1.8 V to 5.5 V · 12-bit, up to 11 channels

✓ In Stock

$2.71 / Unit

View Datasheet →

PIC18F25K80-E/SO

✅ Drop-In
📦 28-SOIC (SO) wide-body
32 KB flash (-50%) and 2 KB RAM (-50%), same E temp grade -40 to +125 C, pin-to-pin compatible

📋 Reference alternative (not in catalog)

PIC18F26K42-E/SO

✅ Drop-In
Microchip Technology
📦 28-SOIC (SO)
8-bit PIC18 enhanced Harvard · 64 KB (32K x 16) · 4 KB · 1 KB · 64 MHz · 2.3 V to 5.5 V · -40 C to +125 C (E suffix) · 28-pin SOIC (SO)

✓ In Stock

$2.54 / Unit

View Datasheet →

PIC18F26K40-E/SO

✅ Drop-In
Microchip Technology
📦 28-SOIC (SO)
PIC18 8-bit RISC · 64 KB (32K x 16 words) · 4 KB · 256 bytes · 64 MHz · 2.3 V to 5.5 V · 25 · 10-bit ADC2 with Computation Accelerator

✓ In Stock

$1.52 / Unit

View Datasheet →

PIC18F26K22-I/SO

✅ Drop-In
📦 28-SOIC (SO)
no ECAN module (vs integrated ECAN on K80), 10-bit ADC, 64 KB flash, same 28-SOIC footprint

📋 Reference alternative (not in catalog)

PIC18F26K80-E/SO Maximum Ratings & Electrical Characteristics

Core Architecture PIC18 (8-bit RISC, enhanced)
Family PIC18F66K80 / PIC18FxxK80
Program Memory (Flash) 64 KB (32K x 16)
Data SRAM 4 KB
Data EEPROM 1 KB
Maximum CPU Speed 64 MHz (16 MIPS)
Operating Voltage (VDD) 1.8 V to 5.5 V
ADC 12-bit, up to 11 channels
CTMU Yes (Charge Time Measurement Unit)
CAN Module ECAN 2.0B, up to 1 Mbps
UART/USART 2x with LIN support
SPI/I2C (MSSP) 2x
Timers (8/16-bit) Yes (multiple, includes CCP/ECCP)
Temperature Grade (E suffix) -40 C to +125 C (extended)
Package 28-pin SOIC (SO), wide body, 7.50 mm
Mounting Type Surface Mount
XLP Sleep Current <100 nA typical
RoHS Status Compliant

PIC18F26K80-E/SO Pin Configuration

SOIC-28 Package Pinout Diagram SOIC-28W 28-pin, 7.5x17.9mm, P1.27mm, JEDEC MS-013. 1 28 2 27 3 26 4 25 5 24 6 23 7 22 8 21 9 20 10 19 11 18 12 17 13 16 14 15 SOIC-28
Pin 1 MCLR/RE3 — Master Clear (reset) input / digital I/O
Pin 2 RA0/AN0 — PORTA bit 0 / analog input 0
Pin 3 RA1/AN1 — PORTA bit 1 / analog input 1
Pin 4 RA2/AN2/VREF- — PORTA bit 2 / analog input 2 / ADC Vref-
Pin 5 RA3/AN3/VREF+ — PORTA bit 3 / analog input 3 / ADC Vref+
Pin 6 RA4/AN4/C1OUT — PORTA bit 4 / analog input 4 / comparator 1 output
Pin 7 RA5/AN5/C2OUT — PORTA bit 5 / analog input 5 / comparator 2 output
Pin 8 VSS — Ground reference
Pin 9 RA7/OSC1/CLKI — PORTA bit 7 / oscillator input / external clock in
Pin 10 RA6/OSC2/CLKO — PORTA bit 6 / oscillator output / clock out
Pin 11 RC0/SOSCO — PORTC bit 0 / secondary oscillator output
Pin 12 RC1/SOSCI — PORTC bit 1 / secondary oscillator input
Pin 13 RC2/CCP1 — PORTC bit 2 / CCP1 PWM/capture
Pin 14 RC3/SCK1/SCL1 — PORTC bit 3 / SPI1 clock / I2C1 clock
Pin 15 RC4/SDI1/SDA1 — PORTC bit 4 / SPI1 data in / I2C1 data
Pin 16 RC5/SDO1 — PORTC bit 5 / SPI1 data out
Pin 17 RC6/TX1/CK1 — PORTC bit 6 / USART1 TX / clock
Pin 18 RC7/RX1/DT1 — PORTC bit 7 / USART1 RX / data
Pin 19 VSS — Ground reference
Pin 20 VDD — Positive supply voltage
Pin 21 RB0/AN12/INT0 — PORTB bit 0 / analog input 12 / external interrupt 0
Pin 22 RB1/AN10/INT1 — PORTB bit 1 / analog input 10 / external interrupt 1
Pin 23 RB2/AN8/INT2 — PORTB bit 2 / analog input 8 / external interrupt 2
Pin 24 RB3/AN9/CCP2 — PORTB bit 3 / analog input 9 / CCP2
Pin 25 RB4/AN11 — PORTB bit 4 / analog input 11
Pin 26 RB5/AN13 — PORTB bit 5 / analog input 13
Pin 27 RB6/PGC — PORTB bit 6 / ICSP clock
Pin 28 RB7/PGD — PORTB bit 7 / ICSP data

Typical Applications

PIC18F26K80-E/SO is suitable for 7 applications: Automotive Body and Chassis ECUs, Building Automation Controllers, Elevator Control Panels, Industrial CAN-Based Sensor Nodes, Smart Metering and Energy Monitoring, Battery-Powered Remote Sensor Modules, Capacitive Touch Human-Machine Interfaces.

🚗

Automotive Body and Chassis ECUs

The PIC18F26K80-E/SO is well-matched to automotive body and chassis ECUs because it integrates an ECAN 2.0B controller (up to 1 Mbps) alongside 64 KB flash for J1939/CANopen protocol stacks and 4 KB RAM for message buffering. The -40 C to +125 C extended temperature grade (E suffix) supports under-hood and cabin environments without derating. Its 12-bit ADC with CTMU enables capacitive touch interfaces for door handles and overhead consoles, while two USART modules with LIN support handle LIN-bus slave nodes. Pair the MCU with an MCP2562 CAN transceiver for the physical layer.

🏭

Building Automation Controllers

For HVAC, lighting, and access control panels, the PIC18F26K80-E/SO delivers 16 MIPS performance, 64 KB flash for BACnet or Modbus stacks, and the wide 1.8 V to 5.5 V supply that simplifies 24 V industrial rail regulation. The integrated 12-bit ADC accurately reads temperature, humidity, and pressure sensors, while two MSSP ports support SPI sensor clusters and I2C EEPROM/FRAM parameter storage. XLP nanoWatt technology keeps sleep current below 100 nA for battery-backed occupancy sensors and wireless thermostats.

🏭

Elevator Control Panels

The PIC18F26K80-E/SO suits elevator floor-selector and door-controller nodes by combining the ECAN bus interface for inter-car communication, the 12-bit ADC for position encoder and load-cell readings, and CTMU for capacitive button matrices. The 28-SOIC wide-body footprint withstands the mechanical vibration typical of elevator machinery rooms. XLP sleep modes permit backup-battery operation during power outages, holding door-open logic for the safe evacuation cycle.

🏭

Industrial CAN-Based Sensor Nodes

The PIC18F26K80-E/SO is an excellent fit for distributed industrial sensor nodes (CANopen, DeviceNet) where 64 KB flash accommodates the CANopen stack plus application firmware, 4 KB RAM buffers process data objects, and the 12-bit ADC delivers 0.1% precision for pressure/flow transmitters. Its 1.8 V to 5.5 V operating range allows direct connection to 3.3 V sensors or 5 V industrial rails, while the E temperature grade supports outdoor cabinets and factory-floor ambient.

⚡

Smart Metering and Energy Monitoring

For electricity, water, or gas smart meters, the PIC18F26K80-E/SO provides 64 KB flash for DLMS/COSEM or proprietary meter stacks, 1 KB EEPROM for tariff and log retention, and the ECAN interface for AMR concentrators. The 12-bit ADC with PGA gain stages meets 0.5S accuracy class requirements when paired with current shunts or CTs. nanoWatt XLP sleep below 100 nA preserves battery life during power-quality events and outage reporting.

🔋

Battery-Powered Remote Sensor Modules

The PIC18F26K80-E/SO is ideal for remote, battery-powered sensor modules thanks to its XLP technology with sub-100 nA sleep current and 1.8 V minimum supply supporting single-cell lithium primaries. The 12-bit ADC with CTMU measures environmental parameters while consuming minimal active current, and the integrated ECAN enables low-traffic CAN-FD-style reporting when mains power returns. The E temperature grade supports outdoor enclosures from arctic to desert conditions.

🧩

Capacitive Touch Human-Machine Interfaces

The PIC18F26K80-E/SO's integrated CTMU (Charge Time Measurement Unit) paired with the 12-bit ADC creates a high-resolution capacitive touch sensing front-end without dedicated touch ICs. This supports buttons, sliders, and proximity sensors in appliances, industrial panels, and automotive interiors. 64 KB flash holds Microchip's mTouch libraries, while ECAN carries touch events to a central body controller. The 28-SOIC footprint is compatible with the touch-sensing reference designs published in Microchip application notes.

Recommended Products Summary

MCP2562-E/SN CAN 2.0B physical-layer transceiver, complementary to on-chip ECAN controller Used in: Automotive Body and Chassis ECUs, Elevator Control Panels PIC18F26K80-I/SO Microchip Technology Used in: Automotive Body and Chassis ECUs, Industrial CAN-Based Sensor Nodes MCP9808 High-accuracy I2C temperature sensor, 12-bit compatible Used in: Building Automation Controllers PIC18F25K80-E/SO Lower-memory sibling for cost-optimized room controllers Used in: Building Automation Controllers, Capacitive Touch Human-Machine Interfaces PIC18F25K80-I/SO Microchip Technology Used in: Smart Metering and Energy Monitoring PIC18F26K42-E/SO Microchip Technology Used in: Battery-Powered Remote Sensor Modules
What is the flash program memory size of the PIC18F26K80-E/SO?
The PIC18F26K80-E/SO integrates 64 KB (32K x 16 words) of flash program memory with self-programmability. According to the manufacturer datasheet, this allows firmware upgrades in the field via ICSP, with 4 KB of SRAM for variables and 1 KB of data EEPROM for non-volatile parameter storage. This memory configuration sits in the upper tier of the PIC18 family.
What is the operating voltage range of the PIC18F26K80-E/SO?
The PIC18F26K80-E/SO operates from 1.8 V to 5.5 V across the extended -40 C to +125 C temperature range, allowing direct connection to both 3.3 V and 5 V rails. This wide VDD window is enabled by the XLP nanoWatt technology and makes the part suitable for battery-powered and industrial 24V-derived supply systems.
Does the PIC18F26K80-E/SO include a CAN controller?
Yes. The PIC18F26K80-E/SO integrates a hardware ECAN module supporting CAN 2.0B active/passive at bit rates up to 1 Mbps. This eliminates the need for an external CAN transceiver controller (the external transceiver IC for the physical layer is still required), enabling single-chip CAN nodes for automotive and industrial CANopen/DeviceNet implementations.
What is the difference between PIC18F26K80-E/SO and PIC18F26K80-I/SO?
The PIC18F26K80-E/SO uses the 'E' (extended) temperature grade rated -40 C to +125 C, while the PIC18F26K80-I/SO uses the 'I' (industrial) grade rated -40 C to +85 C. Both share identical silicon, the same 28-SOIC wide-body footprint, 64 KB flash, 4 KB RAM, and 12-bit ADC, making them pin-to-pin compatible drop-in replacements when only the operating temperature window changes.
Where can I buy the PIC18F26K80-E/SO at the best price?
The PIC18F26K80-E/SO is available from DigiKey, Mouser, LCSC Electronics, and AB Sunshine, with pricing starting at approximately $6.65 per unit at qty 1, as of 2026-09-27. LCSC Electronics lists $6.6568 unit price with immediate shipping; for volume quotes beyond 1000 pieces, contact Microchip authorized distributors directly for tiered pricing.
What is the lead time for PIC18F26K80-E/SO orders?
Lead time for the PIC18F26K80-E/SO is typically 8-12 weeks from Microchip factory, with distributor stock readily available at LCSC, DigiKey, and Mouser as of 2026-09-27. For automotive or industrial programs requiring long-term supply commitments, request Microchip's Product Change Notification (PCN) registration and lifecycle forecast before design-in.
Is the PIC18F26K80-E/SO in stock at distributors?
Yes, the PIC18F26K80-E/SO is listed as 'In Stock' at LCSC Electronics with immediate shipping at $6.6568 per unit, as of 2026-09-27. DigiKey and Mouser also stock the part with parametric filters confirming active availability for development and low-volume production. Always confirm real-time stock before placing large orders.
What is the best drop-in replacement for PIC18F26K80-E/SO?
The best drop-in replacement for PIC18F26K80-E/SO is the PIC18F26K80-I/SO - same die, same 28-SOIC wide-body package, identical 64 KB flash / 4 KB RAM / ECAN / 12-bit ADC, only the temperature grade differs (I: -40 to +85 C vs E: -40 to +125 C). For lower-memory designs, the PIC18F25K80-E/SO offers 32 KB flash in the same 28-SOIC package, enabling PCB reuse.
PIC18F26K80-E/SO vs PIC18F25K80-E/SO - which is better for cost-sensitive designs?
The PIC18F25K80-E/SO is the better choice for cost-sensitive designs where 32 KB flash is sufficient: same 28-SOIC wide-body package, same ECAN and 12-bit ADC, half the flash (32 KB vs 64 KB) and half the RAM (2 KB vs 4 KB). The PIC18F26K80-E/SO is preferable when larger firmware images or more RAM-intensive buffers (e.g., CAN message queues) are required.
When should I choose the PIC18F26K80-E/SO over the PIC18F26K22-E/SO?
Choose the PIC18F26K80-E/SO when your design requires an integrated CAN 2.0B controller, 64 KB flash, 12-bit ADC, or XLP nanoWatt sleep modes below 100 nA. Choose the PIC18F26K22-E/SO only for simpler designs without CAN where cost is paramount, as the K22 family lacks the ECAN module and offers a 10-bit ADC. Both share the same 28-SOIC footprint.
Can the PIC18F46K80-E/SO be used as a drop-in replacement for PIC18F26K80-E/SO?
No - the PIC18F46K80-E/SO is in a 40-pin DIP package with additional I/O pins, not the 28-SOIC footprint of the PIC18F26K80-E/SO. While both share the K80 family peripherals (ECAN, 12-bit ADC), the package mismatch requires PCB rework. For a true drop-in alternative within the K80 family at the 28-pin footprint, use the PIC18F25K80-E/SO (32 KB) or PIC18F26K80-I/SO (industrial temp).
Where can I download the PIC18F26K80 datasheet PDF?
The official PIC18F26K80 datasheet (document number 39977F) is available as a free PDF download from Microchip Technology's website at https://ww1.microchip.com/downloads/aemDocuments/documents/MCU08/ProductDocuments/DataSheets/39977f.pdf. Third-party mirrored copies are also available on alldatasheet.com and findic.us for convenience.
Where can I find the pinout for PIC18F26K80-E/SO?
The complete pinout for the PIC18F26K80-E/SO (28-SOIC wide-body package) is published in the manufacturer datasheet on page 4 (Pin Diagrams section). Pin 1 is located at the bottom-left when the notch is oriented upward, with VDD on pins 7 and 20, VSS on pins 8 and 19, and MCLR/RA5 on pin 1. The datasheet also provides pin function tables for each I/O port.
What are the key specifications of PIC18F26K80-E/SO that engineers should know?
Key specifications of the PIC18F26K80-E/SO are: 8-bit PIC18 RISC core at up to 64 MHz (16 MIPS), 64 KB flash, 4 KB SRAM, 1 KB EEPROM, 1.8 V to 5.5 V VDD, -40 C to +125 C extended temperature, integrated ECAN 2.0B controller up to 1 Mbps, 12-bit ADC with CTMU, two MSSP (SPI/I2C) ports, two USART with LIN support, and XLP sleep current below 100 nA. Package is 28-pin SOIC wide body (7.50 mm).
What is a good Microchip alternative to PIC18F26K80-E/SO?
Within the Microchip portfolio, the closest drop-in alternative to the PIC18F26K80-E/SO is the PIC18F26K80-I/SO (same package, same memory, only temperature grade changes from -40 to +125 C to -40 to +85 C). For lower flash requirements, the PIC18F25K80-E/SO (32 KB flash, same 28-SOIC) is fully pin-compatible. For migration to newer architectures, the PIC18F26K42-E/SO family offers upgraded peripherals and Core Independent Peripherals.
Is the PIC18F26K80-E/SO suitable for automotive CAN bus applications?
Yes, the PIC18F26K80-E/SO is well-suited for automotive CAN bus body and chassis ECUs. Its integrated ECAN 2.0B controller (1 Mbps), -40 C to +125 C extended temperature grade, 64 KB flash for J1939/CANopen stacks, and 12-bit ADC for sensor interfaces cover the typical requirements of body control modules, climate controls, and instrument cluster peripherals. Pair with a TLE7259-3 or MCP2562 CAN transceiver for the physical layer.

Engineering reference data for PIC18F26K80-E/SO — comparison, design guidance, and compliance information.

Selection Guide

Choose the PIC18F26K80-E/SO when your design requires integrated CAN 2.0B communication, 64 KB flash, 12-bit ADC, and -40 C to +125 C extended temperature in a single 28-SOIC package. Choose the PIC18F26K80-I/SO for the same feature set at industrial -40 C to +85 C temperatures with cost savings. Choose the PIC18F25K80-E/SO when 32 KB flash and 2 KB RAM are sufficient - same footprint, same peripherals. Avoid the PIC18F26K22-I/SO if you need CAN, ADC above 10-bit, or CTMU; avoid the PIC18F46K80-E/SO because its 40-pin DIP package requires PCB rework vs the 28-SOIC target. For new designs with no legacy code, consider the PIC18F26K42-E/SO family which adds Core Independent Peripherals but loses CAN and CTMU.

Comparison with Alternatives

Parameter This Product PIC18F26K80-I/SO PIC18F25K80-I/SO PIC18F25K80-E/SO PIC18F26K42-E/SO PIC18F26K40-E/SO PIC18F26K22-I/SO
Package 28-SOIC (SO) wide-body 28-SOIC (SO) wide-body - same 28-SOIC (SO) wide-body - same 28-SOIC (SO) wide-body - same 28-SOIC (SO) - same 28-SOIC (SO) - same 28-SOIC (SO) - same
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Flash Memory 64 KB 64 KB 32 KB 32 KB 64 KB 64 KB 64 KB
SRAM 4 KB 4 KB 2 KB 2 KB 4 KB 4 KB 3.8 KB
ECAN Module Yes (2.0B) Yes (2.0B) Yes (2.0B) Yes (2.0B) No No No
ADC Resolution 12-bit 12-bit 12-bit 12-bit 12-bit 10-bit 10-bit
Temperature Grade -40 C to +125 C (E) -40 C to +85 C (I) -40 C to +85 C (I) -40 C to +125 C (E) -40 C to +125 C (E) -40 C to +125 C (E) -40 C to +85 C (I)
Operating Voltage 1.8 V to 5.5 V 1.8 V to 5.5 V 1.8 V to 5.5 V 1.8 V to 5.5 V 2.3 V to 5.5 V 2.3 V to 5.5 V 1.8 V to 5.5 V
CTMU Yes Yes Yes Yes No (CIPS-based touch) No (CIPS-based touch) No

Key Differentiators

  • Integrated ECAN 2.0B controller eliminates external CAN ASIC (vs PIC18F26K22-I/SO)
  • 12-bit ADC vs 10-bit on K22/K40 predecessors (vs PIC18F26K22-I/SO)
  • CTMU enables capacitive touch without external touch IC (vs PIC18F26K42-E/SO)
  • Extended -40 to +125 C operation vs -40 to +85 C industrial (vs PIC18F26K80-I/SO)

Design Notes

Place a 100 nF decoupling capacitor within 5 mm of each VDD pin (pins 20 and the analog AVdd if used), plus a 10 uF bulk capacitor at the board entry point. The PIC18F26K80-E/SO draws up to 15 mA active at 64 MHz / 5 V; ensure the regulator has at least 25% headroom for transient loads. For battery-powered designs, route all unused I/O as outputs to avoid floating inputs that increase sleep current.

Route the ICSP pins RB6 (PGC) and RB7 (PGD) to a 6-pin header with a 10 kohm pull-up on MCLR (pin 1) for in-circuit programming. Keep clock traces (OSC1/OSC2) short and surrounded by ground pour to limit EMI. If using an external crystal, place load capacitors within 5 mm of the OSC pins with short, symmetric traces to avoid duty-cycle distortion.

Do not enable the ECAN module without first configuring the CANTRL register and verifying oscillator stability - CAN errors at startup are typically traced to incorrect baud-rate prescaler values. When migrating from PIC18F26K22 to PIC18F26K80, note the ADC is upgraded from 10-bit to 12-bit, which changes result alignment and requires code updates to ADCON2. The 'E' suffix mandates -40 C to +125 C operation; use the 'I' suffix only when temperature stays below +85 C.

For CAN bus designs, add a 120 ohm termination resistor at each end of the bus and keep CANH/CANL traces matched within 5 mm to avoid reflections. The on-chip ECAN does not include the physical layer; pair with an MCP2562 or TLE7259-3 transceiver. For long cable runs (>10 m) add common-mode chokes on CANH/CANL to suppress radiated emissions.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS and REACH compliant per Microchip product page. AEC-Q100 qualification not specifically listed for this part - confirm automotive qualification status with Microchip for AEC-Q100/Q104 requirements. Lead-free matte-tin plating.

Data verified on: 2026-09-27 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Microchip Technology PIC18F26K80 PIC18F26K80-E/SO PIC18F26K80-I/SO PIC18F25K80 PIC18F26K42 PIC18F26K22 PIC18 (8-bit RISC microcontroller) PIC microcontroller family ECAN CAN 2.0B nanoWatt XLP CTMU 12-bit ADC MSSP USART LIN bus 28-SOIC SOIC-28 wide body ICSP RoHS REACH AEC-Q100 automotive ECU building automation elevator control
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