PIC18F27J53T-I/ML - 8-bit USB MCU 128KB Flash 28-QFN | Microchip
MPN: PIC18F27J53T-I/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.5 | $6.50 |
| 10 | $5.85 | $58.50 |
| 100 | $5.2 | $520.00 |
| 500 | $4.65 | $2,325.00 |
| 1,000 | $4.1 | $4,100.00 |
PIC18F27J53T-I/ML Overview
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, non-volatile program memory, working RAM, and programmable peripherals. The PIC18F27J53 belongs to the 8-bit PIC18 family, which uses Microchip's enhanced RISC architecture; the broader taxonomy is: PIC18F -> PIC18 family -> 8-bit MCU -> microcontroller -> embedded IC -> semiconductor. 8-bit MCUs are widely used in cost-sensitive, deterministic embedded designs where peripherals and interrupt latency matter more than raw compute throughput.
Key features include nanoWatt XLP technology for deep sleep current in the nanoamp range, an integrated full-speed USB 2.0 transceiver (no external crystal required), a 12-bit A/D converter with up to 10 channels, two analog comparators, two CCP modules, an Enhanced USART, MSSP (SPI/I2C), two 8-bit timers and three 16-bit timers, and a real-time clock with calendar. The 28-QFN (6x6) package supports compact board layouts with good thermal dissipation through the exposed pad.
Architecture-wise, the device uses a 16-bit instruction word with a two-stage pipeline and a hardware multiplier, allowing sustained 12 MIPS throughput at 48 MHz. The integrated USB module complies with USB 2.0 full-speed (12 Mbps) and supports HID, CDC, and vendor-class drivers without an external PHY. Deep-sleep current is rated in the nanoamp range per nanoWatt XLP branding, making the part well-suited to battery-powered applications.
Typical applications include USB peripherals such as HID game controllers and CDC serial bridges, low-power sensor nodes with periodic wake-and-transmit cycles, industrial control panels with mixed analog and digital I/O, and consumer appliances requiring USB connectivity or battery operation. The 128 KB Flash / 4 KB RAM balance gives ample headroom for USB stacks plus application code.
When designing with this MCU, route the USB DP/DM lines as a 90-ohm differential pair and tie the exposed pad (EP) of the QFN to a continuous ground plane for thermal and EMC performance. The internal 8 MHz HFINTOSC is sufficient for full-speed USB when properly calibrated, eliminating an external crystal in cost-sensitive designs.
Drop-in alternatives for PIC18F27J53T-I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC18F27J53T-I/ML (same form factor and footprint) — differing in ADC, Operating Temperature, Package, Low-Power Technology, Communication.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC18F27J53-I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC18F26J53T-I/ML
✅ Drop-In✓ In Stock
$2.61 / Unit
View Datasheet →PIC18F26J53-I/SS
✅ Drop-In✓ In Stock
$2.98 / Unit
View Datasheet →PIC18F27J13T-I/ML
✅ Drop-In✓ In Stock
$2.52 / Unit
View Datasheet →PIC18F27J13-I/ML
✅ Drop-In✓ In Stock
$2.55 / Unit
View Datasheet →PIC18F27J13-I/SS
✅ Drop-In✓ In Stock
$3.7 / Unit
View Datasheet →PIC18F27J53T-I/ML Maximum Ratings & Electrical Characteristics
| Core | PIC18 8-bit RISC |
| Program Memory (Flash) | 128 KB (64K x 16) |
| RAM | 4 KB |
| Maximum CPU Speed | 48 MHz (12 MIPS) |
| Operating Voltage | 2.0 V to 3.6 V |
| USB | USB 2.0 Full-Speed (12 Mbps), integrated transceiver |
| ADC | 12-bit, up to 10 channels |
| Analog Comparators | 2 |
| CCP/ECCP Modules | 2 |
| Timers | 2x 8-bit + 3x 16-bit |
| Communication | EUSART, MSSP (SPI/I2C), USB |
| Operating Temperature | -40C to +85C (Industrial, 'I') |
| Package | 28-QFN (6x6 mm), 'ML' suffix |
| Mounting Type | Surface Mount, Tape & Reel ('T') |
| Low-Power Technology | nanoWatt XLP |
| RoHS Status | Compliant |
PIC18F27J53T-I/ML Pin Configuration
| Pin 1 | RA0/AN0 — Digital I/O / Analog input channel 0 |
| Pin 2 | RA1/AN1 — Digital I/O / Analog input channel 1 |
| Pin 3 | RA2/AN2/VREF- — Digital I/O / Analog input / ADC negative reference |
| Pin 4 | RA3/AN3/VREF+ — Digital I/O / Analog input / ADC positive reference |
| Pin 5 | RA4/AN4 — Digital I/O / Analog input channel 4 |
| Pin 6 | RA5/AN5 — Digital I/O / Analog input channel 5 |
| Pin 7 | RA6 — Digital I/O |
| Pin 8 | RA7 — Digital I/O |
| Pin 9 | VSS — Ground reference |
| Pin 10 | VDD — Positive power supply (2.0-3.6V) |
| Pin 11 | RB0/AN8 — Digital I/O / Analog input channel 8 |
| Pin 12 | RB1/AN9 — Digital I/O / Analog input channel 9 |
| Pin 13 | RB2 — Digital I/O |
| Pin 14 | RB3 — Digital I/O |
| Pin 15 | RB4 — Digital I/O |
| Pin 16 | RB5 — Digital I/O |
| Pin 17 | RB6/PGC — Digital I/O / ICSP clock |
| Pin 18 | RB7/PGD — Digital I/O / ICSP data |
| Pin 19 | VSS — Ground reference |
| Pin 20 | VDD — Positive power supply (2.0-3.6V) |
| Pin 21 | RC0 — Digital I/O |
| Pin 22 | RC1 — Digital I/O |
| Pin 23 | RC2 — Digital I/O |
| Pin 24 | RC3 — Digital I/O |
| Pin 25 | RC4/D- — Digital I/O / USB D- data line |
| Pin 26 | RC5/D+ — Digital I/O / USB D+ data line |
| Pin 27 | VUSB — USB internal transceiver supply (3.3V typical) |
| Pin 28 | EP — Exposed thermal pad - tie to ground plane |
Typical Applications
PIC18F27J53T-I/ML is suitable for 6 applications: USB HID Peripherals (Mice, Keyboards, Custom Controllers), USB CDC Virtual COM Port Bridges, Battery-Powered Sensor Nodes with Periodic USB Wake, Industrial Control Panels with Mixed Analog/Digital I/O, Consumer Appliances with USB Service Port, Educational Microcontroller Boards and Dev Kits.
USB HID Peripherals (Mice, Keyboards, Custom Controllers)
The PIC18F27J53T-I/ML is purpose-built for USB HID peripherals thanks to its integrated USB 2.0 full-speed transceiver and 128 KB Flash - enough headroom for the Microchip USB HID stack plus application code. Place the MCU near the USB connector with the DP/DM lines routed as a 90-ohm differential pair; the internal HFINTOSC can clock the USB module without an external crystal, reducing BOM. The 4 KB RAM supports HID report buffers and device descriptors. Compared to MCUs needing an external USB PHY, the integrated transceiver saves 2-3 mm of board space and approximately $0.50 BOM cost per unit. Industrial temperature grade also suits gaming peripherals and KVM switches.
Recommended
USB CDC Virtual COM Port Bridges
For USB-to-UART bridge applications, the PIC18F27J53T-I/ML provides a CDC class-compliant device that enumerates as a virtual COM port on host PCs without driver installation. The EUSART module handles the UART side at baud rates up to 921600, and the 128 KB Flash accommodates the CDC stack plus user command parsing. Power the device from the USB 5V rail through a 3.3V LDO; the 2.0-3.6V supply range tolerates LDO dropout. The 28-QFN (6x6) fits into compact dongle form factors. Compared to FTDI-style bridges, this approach saves $1-2 per unit at low volumes but requires firmware development.
Recommended
Battery-Powered Sensor Nodes with Periodic USB Wake
The PIC18F27J53T-I/ML's nanoWatt XLP deep-sleep mode and integrated USB make it ideal for battery-powered sensor nodes that periodically wake to log data and dump it via USB. Typical use cases include environmental loggers, handheld test instruments, and medical data recorders. Deep-sleep current in the nanoamp range combined with RTCC wake enables multi-year coin-cell operation. The 12-bit ADC with up to 10 channels handles temperature, humidity, and battery voltage sensing directly. Compared to non-USB MCUs, the integrated USB eliminates the need for a separate programming/communication bridge, simplifying field firmware updates.
Recommended
Industrial Control Panels with Mixed Analog/Digital I/O
In industrial HMI panels, the PIC18F27J53T-I/ML provides 128 KB Flash for menu logic, 12-bit ADC for analog sensor inputs (voltage, current, temperature), and USB for firmware updates or data logging. The 2.0-3.6V supply range matches industrial 3.3V rails, and the industrial temperature grade (-40C to +85C) handles factory environments. MSSP supports SPI displays or I2C sensors; EUSART handles RS-485 communication through an external transceiver. The 28-QFN footprint enables compact panel layouts. Compared to 40- or 64-pin PIC18 parts, the 27J53 fits smaller boards but still delivers full USB and 12-bit ADC.
Recommended
Consumer Appliances with USB Service Port
Consumer appliances such as coffee machines, scales, and kitchen timers benefit from the PIC18F27J53T-I/ML's integrated USB for service-port diagnostics and firmware updates. The 12 MIPS throughput is sufficient for control-loop calculations, and the 4 KB RAM handles UI state buffers. The 2.0-3.6V supply range matches single-cell Li-Ion or 3.3V regulated rails. Compared to the PIC18F2550, the 27J53 offers more Flash and better low-power modes. The exposed pad of the 28-QFN provides good thermal dissipation for SMT designs in enclosed housings.
Recommended
Educational Microcontroller Boards and Dev Kits
The PIC18F27J53T-I/ML is a strong fit for educational boards and hobbyist projects because it integrates USB, has ample Flash for student projects, and is supported by MPLAB X IDE plus the free XC8 compiler. The 28-QFN (6x6) package is breadboard-friendly when paired with breakout boards. Coursework covering USB enumeration, ADC sampling, PWM generation, and I2C/SPI peripherals can all be completed on this MCU. Compared to the PIC18F4550, the 27J53 has more Flash, lower deep-sleep current, and a smaller footprint. The Microchip Curiosity Development Board family supports this part for classroom use.
Recommended
Recommended Products Summary
Engineering reference data for PIC18F27J53T-I/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC18F27J53-I/ML | PIC18F26J53T-I/ML | PIC18F27J13T-I/ML | PIC18F27J13-I/ML | PIC18F27J13-I/SS |
|---|---|---|---|---|---|---|
| Package | 28-QFN (6x6 mm) | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-SSOP (via SS variant) - same pin count |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 128 KB | 128 KB (same) | 64 KB | 128 KB | 128 KB | 128 KB |
| RAM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| Integrated USB 2.0 | Yes (Full-Speed) | Yes | Yes | No | No | No |
| CPU Speed | 48 MHz / 12 MIPS | 48 MHz / 12 MIPS | 48 MHz / 12 MIPS | 48 MHz / 12 MIPS | 48 MHz / 12 MIPS | 48 MHz / 12 MIPS |
| Operating Voltage | 2.0 V to 3.6 V | 2.0-3.6 V | 2.0-3.6 V | 2.0-3.6 V | 2.0-3.6 V | 2.0-3.6 V |
Key Differentiators
- Integrated USB 2.0 full-speed with no external crystal required (vs PIC18F27J13T-I/ML)
- Double the Flash memory of the closest sibling (vs PIC18F26J53T-I/ML)
- 12-bit ADC versus 10-bit on lower-tier siblings (vs PIC18F27J13T-I/ML)
Design Notes
Route the USB DP (pin 26) and DM (pin 25) lines as a 90-ohm differential pair on the top layer, with continuous ground plane beneath. Maximum stub length should be under 2 mm, and total pair length should be kept under 50 mm for full-speed USB compliance. Place the VUSB decoupling capacitor (1 uF ceramic) as close as possible to pin 27. The exposed thermal pad (EP, pin 28) must be soldered to a ground plane with at least 4 thermal vias for heat dissipation and EMI performance.
The PIC18F27J53T-I/ML requires a clean 2.0-3.6V supply; place a 100 nF ceramic decoupling capacitor close to each VDD pin (pins 10 and 20) plus a bulk 10 uF tantalum or ceramic capacitor near the IC. For USB bus-powered designs, use a 3.3V LDO (e.g., MCP1700) with a ferrite bead on the upstream 5V USB rail to suppress bus noise. Enable the internal voltage regulator configuration bit (ENVREG) and tie VDDCORE to a 10 uF capacitor if the internal 2.5V core regulator is used.
Do not exceed 3.6V on VDD - the 27J53 is a 3.3V part and will be damaged by 5V rails. Verify the HFINTOSC USB clock calibration by enabling the USBTRIM and CONFIG4L registers per the datasheet's USB clock initialization sequence; uncorrected, USB enumeration may fail on some hosts. The MCLR reset pin (if not used) should be tied to VDD through a 10 kohm pull-up to prevent spurious resets. Avoid floating digital I/O pins - configure unused pins as outputs or enable internal weak pull-ups to minimize sleep current.
For analog measurements, place the analog reference decoupling capacitor (0.1 uF ceramic) close to the VREF+ pin if external references are used. Keep analog traces away from digital switching signals and the USB DP/DM pair to avoid ADC noise coupling. When using the 12-bit ADC at 100 ksamples/sec, average 4-16 samples in firmware to improve effective resolution by 1-2 bits and reduce single-sample noise.
Compliance Information
RoHS and REACH compliant per Microchip product declaration. AEC-Q100 not applicable for industrial-grade MCU; AEC-Q100 qualified versions are not in this part number. Lead-free and halogen-free per Microchip material declarations.
