PIC24F08KA101-I/MQ - 16-Bit 32MHz XLP MCU | Microchip Technology
MPN: PIC24F08KA101-I/MQ ✗ End of LifePIC24F08KA101-I/MQ Overview
A microcontroller is a programmable semiconductor that integrates a processor core, nonvolatile program memory, data memory, and peripherals into one integrated circuit. The PIC24F08KA101 belongs to the PIC24F family of 16-bit RISC microcontrollers, combining deterministic control performance with low-power operating modes for embedded, industrial, and connected products.
Three headline characteristics define this device: a 16-bit CPU operating at up to 32 MHz, 8 KB of Flash program memory, and an industrial temperature range of -40°C to +85°C. Search results also identify 1 KB of RAM, 512 bytes of EEPROM, 16 I/O pins, and 10-bit ADC capability, while the manufacturer identifies XLP low-power features intended for battery-operated systems.
The PIC24F08KA101 family combines a compact 20-pin VQFN footprint with integrated real-time control and low-power peripherals. The DSBOR and DSWDT functions support controlled operation during low-power states, while RTCC provides a hardware timing resource for applications that need accurate timekeeping without relying entirely on software scheduling. These characteristics make the device useful when board area, standby power, and deterministic peripheral behavior are important design constraints.
Typical applications include industrial sensor nodes, battery-powered monitors, compact control modules, building and access equipment, and low-power embedded instruments. The 10-bit conversion capability supports analog sensing, while the 16 I/O pins provide digital interfaces for sensors, indicators, communications, and actuators.
Designers should pay close attention to decoupling, exposed-pad layout, and the exact package drawing before PCB release. The VQFN package requires a proper land pattern and controlled assembly process, while firmware must explicitly manage sleep modes, watchdog behavior, and brown-out events to obtain the intended low-power result.
This page consolidates manufacturer information, distributor availability, verified memory and package details, pricing information, and practical selection guidance. It also distinguishes verified drop-in alternatives from functionally related family members so procurement and engineering decisions are based on package, pin, memory, and qualification constraints rather than name similarity alone.
Drop-in alternatives for PIC24F08KA101-I/MQ — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC24F08KA101-I/MQ (same form factor and footprint) — differing in Package, Mounting Type, ADC Resolution, EEPROM Size, Low-Power Technology.
No drop-in alternatives available for this product.
Request AlternativesPIC24F08KA101-I/MQ Maximum Ratings & Electrical Characteristics
| CPU Architecture | 16-bit RISC |
| Maximum Clock Frequency | 32 MHz |
| Maximum Performance | 16 MIPS |
| Program Memory Type | Flash |
| Program Memory Size | 8 KB (2.75K x 24) |
| RAM Size | 1 KB |
| EEPROM Size | 512 bytes |
| I/O Pin Count | 16 pins |
| ADC Resolution | 10-bit |
| Low-Power Technology | XLP eXtreme Low Power |
| Deep Sleep Feature | DSBOR |
| Watchdog Feature | DSWDT |
| Real-Time Clock and Counter | RTCC |
| Operating Temperature Range | -40°C to +85°C |
| Package | 20-pin VQFN (5 x 5 mm) |
| Mounting Type | Surface Mount |
PIC24F08KA101-I/MQ 20-pin vqfn (5 x 5 mm) Pin Configuration Guide
Pin configuration for PIC24F08KA101-I/MQ (20-pin vqfn (5 x 5 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for PIC24F08KA101-I/MQ.
Refer to the datasheet for full pin configuration.
Typical Applications
PIC24F08KA101-I/MQ is suitable for 6 applications: Battery-Powered Sensor Node, Industrial Monitoring Module, Building and Access Control, Compact Data Acquisition Controller, Low-Power Timekeeping Instrument, Battery-Powered Portable Instrument.
Battery-Powered Sensor Node
The PIC24F08KA101-I/MQ fits compact battery-powered sensing because its XLP architecture is specifically intended for low-power operation and includes DSBOR and DSWDT for controlled sleep and supervision. The 10-bit ADC can digitize sensor outputs, while 16 I/O pins support environmental inputs, indicators, and wake-control signals. At 32 MHz and up to 16 MIPS, the device can combine acquisition logic with communications handling without moving to a larger MCU. Designers should use deep sleep between samples, disable unused peripherals, and calculate average current from wake duration and sleep current because the supplied data does not provide a complete power-consumption table.
Recommended
Industrial Monitoring Module
The PIC24F08KA101-I/MQ is suitable for an industrial monitoring module that must operate across -40°C to +85°C while reading analog and digital sensor inputs. Its 10-bit ADC supports basic process measurements, and 16 I/O pins provide connections for discrete sensors, status indicators, and external control functions. The 8 KB Flash capacity can support a compact control program, and the 16-bit RISC architecture operates at up to 32 MHz for responsive foreground tasks. Firmware should include watchdog servicing, fault-state logging, and brown-out recovery tests to avoid an uncontrolled reset loop in field equipment.
Recommended
Building and Access Control
The PIC24F08KA101-I/MQ can serve as the controller in a compact access-control or building sensor node where low standby consumption and responsive discrete I/O are valuable. Its 16 I/O pins can support door-state inputs, alarm outputs, indicators, and communication interfaces, while DSWDT helps maintain reliable supervision. The RTCC feature provides a hardware timing resource for time-based access logic and event timestamping. Keep the device in a low-power mode between events, wake it through a qualified interrupt source, and validate that the chosen external components meet the application voltage limits before release.
Recommended
Compact Data Acquisition Controller
The PIC24F08KA101-I/MQ can control a compact acquisition system using its 10-bit ADC for analog channels and 16 I/O pins for sensor selection, triggers, and status reporting. A maximum clock of 32 MHz and performance of up to 16 MIPS provide enough control throughput for synchronized sampling and basic filtering without requiring a higher-power processor. The 8 KB Flash limit should be checked against the signal-processing algorithm and communication protocol, while 1 KB of RAM requires careful buffering. Disable unused converter and digital I/O blocks between acquisitions to reduce power consumption.
Recommended
Low-Power Timekeeping Instrument
The RTCC feature and low-power design make PIC24F08KA101-I/MQ appropriate for instruments that must retain timing functions while minimizing energy use. It can maintain scheduled events, supervise timing tasks, and read analog or discrete inputs from a compact front end. DSBOR and DSWDT provide useful foundations for robust low-power behavior, while the 16-bit CPU executes at up to 32 MHz when active processing is required. Use the RTCC for periodic wake events, avoid continuous polling, and verify calibration behavior and oscillator requirements against the manufacturer documentation before production.
Recommended
Battery-Powered Portable Instrument
The PIC24F08KA101-I/MQ is a practical controller for a portable, battery-powered instrument that combines occasional analog measurement with low-rate user interaction. Its 32 MHz maximum operating speed supports responsive control logic, the 10-bit ADC handles sensor conversion, and the 16 I/O pins cover buttons, displays, and status signaling. XLP operating modes can reduce energy consumption between user actions, while the RTCC can support elapsed-time functions. Package planning must account for the 5 x 5 mm VQFN land pattern and its exposed thermal-pad assembly requirements to achieve reliable production yield.
Recommended
Recommended Products Summary
Engineering reference data for PIC24F08KA101-I/MQ — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product |
|---|---|
| Package | 20-pin VQFN (5 x 5 mm) |
| Brand | Microchip Technology |
| CPU Architecture | 16-bit RISC |
| Maximum Clock Frequency | 32 MHz |
| Maximum Performance | 16 MIPS |
| Program Memory | 8 KB Flash (2.75K x 24) |
| RAM | 1 KB |
| EEPROM | 512 bytes |
| I/O Pins | 16 pins |
| ADC Resolution | 10-bit |
| Operating Temperature | -40°C to +85°C |
| Low-Power Features | XLP, DSBOR, DSWDT, RTCC |
Key Differentiators
- Purpose-built XLP low-power feature set (vs PIC24F16KA101-I/MQ)
- Compact 16-I/O implementation (vs PIC24F08KA101-I/SO)
- Industrial temperature coverage (vs PIC24F08KA101T-I/MQ)
Design Notes
Use the manufacturer drawing for the 20-pin VQFN footprint rather than scaling a generic 5 x 5 mm land pattern. Confirm pad dimensions, exposed-pad geometry, solder-mask opening, and paste apertures, then validate them through assembly testing. The supplied data does not include the exact pin table or recommended PCB layout, so no pin-level routing or thermal-pad dimensions should be inferred from the distributor summary.
Plan the firmware around XLP sleep modes rather than treating low power as an automatic hardware outcome. Disable unused peripherals, configure the available pins carefully, use DSWDT only with a deliberate reset strategy, and use DSBOR according to the datasheet. Because the supplied data does not include operating-voltage limits or sleep-current values, validate the power budget with the manufacturer documentation and measured current on the finished board.
Place input, output, and reference-network components close to their associated pins according to the Microchip layout guidance, and provide the required return path beneath the device. Keep sensitive analog and timing routes away from fast-switching nodes, maintain continuous ground reference, and follow the exposed-pad assembly and thermal requirements. Exact placement cannot be finalized without the missing pin assignment and package drawing.
Compliance Information
The supplied verified data does not provide product-specific RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals statements. No compliance status has been assumed.
