PIC24F08KL200-I/P - 8KB Flash 16-bit XLP MCU | Microchip DIP-14
MPN: PIC24F08KL200-I/P ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1.85 | $1.85 |
| 10 | $1.72 | $17.20 |
| 100 | $1.48 | $148.00 |
| 500 | $1.31 | $655.00 |
| 1,000 | $1.16 | $1,160.00 |
PIC24F08KL200-I/P Overview
A microcontroller (MCU) is a single-chip computer containing a CPU core, non-volatile program memory, working RAM, and a rich set of on-chip peripherals such as timers, ADC, communications ports and I/O. The PIC24F sub-family sits between PIC18 8-bit and PIC32 MIPS32 32-bit parts in the Microchip taxonomy, offering 16-bit ALU width and 16-bit instruction set for higher code density and arithmetic throughput while keeping the footprint, power profile and tool-chain simplicity of an 8-bit MCU.
Key specifications of the PIC24F08KL200 include its nanoWatt XLP deep-sleep current of roughly 30 nA typical with RTCC, its 16 MIPS throughput at 32 MHz, and its peripheral mix that mirrors the PIC18 platform for migration-friendly code reuse. Internal oscillator, on-chip voltage regulator and a wide 1.8 V to 3.6 V operating range remove most external component cost, while the 14-pin PDIP footprint keeps layout trivial for through-hole designs and educational platforms.
The KL200 is built around a Harvard-architecture 16-bit core with 24-bit instructions and a 16-bit-wide datapath, supporting direct bit manipulation, hardware multiply, and zero-overhead looping. Peripherals are mapped through a peripheral pin-select (PPS)-lite scheme so that UART, I2C/SPI and timers can be routed to most I/O, simplifying PCB routing and BOM. XLP technology adds multiple power-saving modes such as Sleep, Doze, Idle and Retention Sleep that make the device suitable for battery- or energy-harvesting applications.
Typical applications include low-cost consumer appliances, battery-powered sensor nodes, eMetering and smart thermostats, and any node that benefits from PIC18-style peripheral reuse combined with the extra MIPS headroom of a 16-bit core. Designers choosing KL200 typically need under 8 KB of code, prefer simple through-hole assembly for prototypes, and want to minimise sleep current to extend battery life.
When designing with this device, ensure your linker script fits within 8 KB Flash and that the deep-sleep current is measured with the RTCC and WDT configured to your application's lowest acceptable wake interval. For battery-life calculations, use the datasheet nanoWatt XLP curves rather than the headline maximum ratings.
Drop-in alternatives for PIC24F08KL200-I/P — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC24F08KL200-I/P (same form factor and footprint) — differing in ADC, Package, Program Memory (Flash), I/O Pins, Timers.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC24F08KL200-E/P
✅ Drop-In✓ In Stock
$1.42 / Unit
View Datasheet →PIC24F04KL101-I/P
✅ Drop-In✓ In Stock
$0.76 / Unit
View Datasheet →PIC24F04KL100-I/P
✅ Drop-In✓ In Stock
$1.55 / Unit
View Datasheet →PIC24F08KA101-I/P
✅ Drop-In✓ In Stock
$2.45 / Unit
View Datasheet →PIC24F08KL200-I/ST
✅ Drop-In📋 Reference alternative (not in catalog)
PIC24F08KL200-I/P Maximum Ratings & Electrical Characteristics
| Core Architecture | PIC24F 16-bit Harvard |
| Program Memory (Flash) | 8 KB (2.75K x 24 instructions) |
| Data SRAM | 512 bytes |
| Data EEPROM | 256 bytes |
| Maximum CPU Speed | 32 MHz / 16 MIPS |
| Operating Voltage | 1.8 V to 3.6 V |
| Package | 14-pin PDIP (0.300 in / 7.62 mm) |
| ADC | 10-bit on-chip |
| Comparators | On-chip |
| CCP Module | Yes |
| MSSP (I2C/SPI) | Yes |
| UART | Yes |
| nanoWatt XLP Technology | Yes (deep-sleep nanoamp range) |
| Operating Temperature Range | -40 C to +85 C (Industrial /P) |
| Mounting Type | Through-Hole (DIP) |
| RoHS Status | Compliant |
| MSL Level | Not Applicable (through-hole) |
PIC24F08KL200-I/P Pin Configuration
| Pin 1 | MCLR — Master Clear (reset) input; can be tied to VDD via resistor for normal operation |
| Pin 2 | RA0 — Bidirectional I/O; analog input AN0 |
| Pin 3 | RA1 — Bidirectional I/O; analog input AN1 |
| Pin 4 | RA2 — Bidirectional I/O; analog input AN2 |
| Pin 5 | RA3 — Bidirectional I/O; analog input AN3 (reference input) |
| Pin 6 | RA4 — Bidirectional I/O; OSC1 clock input |
| Pin 7 | RA5 — Bidirectional I/O; OSC2 clock output |
| Pin 8 | VSS — Ground reference |
| Pin 9 | RC0 — Bidirectional I/O |
| Pin 10 | RC1 — Bidirectional I/O |
| Pin 11 | RC2 — Bidirectional I/O |
| Pin 12 | RC3 — Bidirectional I/O |
| Pin 13 | RC4 — Bidirectional I/O |
| Pin 14 | VDD — Positive supply (1.8 V to 3.6 V) |
Typical Applications
PIC24F08KL200-I/P is suitable for 6 applications: Battery-Powered Wireless Sensor Nodes, Smart Thermostats and HVAC Controls, Consumer Appliance Front Panels, Industrial eMetering and Utility Nodes, Educational and Hobbyist Development Platforms, Automotive Interior Accessories (non-safety).
Battery-Powered Wireless Sensor Nodes
The PIC24F08KL200-I/P suits battery-powered wireless sensor nodes because its nanoWatt XLP technology delivers deep-sleep currents in the nanoamp range with the RTCC active, allowing coin-cell life to extend to multi-year ranges. The 16 MIPS throughput from the 32 MHz PIC24F core is sufficient to wake up, sample a sensor, transmit a packet via the MSSP-driven radio, and return to sleep inside a few milliseconds. With 8 KB Flash and 256-byte EEPROM, designers can host a small sensor-stack plus persistent calibration tables. Operating from 1.8 V to 3.6 V matches directly to two alkaline or a single Li-ion cell.
Recommended
Smart Thermostats and HVAC Controls
The PIC24F08KL200-I/P is an excellent fit for smart thermostats and HVAC control panels because its 10-bit ADC handles thermistor or 4-20 mA temperature sensing, while the CCP module drives TRIAC phase-control outputs. The 16-bit ALU makes PID control loops trivial, and the wide 1.8 V to 3.6 V supply range lets the board run directly from a 3.3 V regulated rail. nanoWatt XLP deep-sleep modes preserve battery backup during power outages. The 14-pin PDIP format makes breadboard iteration quick during the prototype phase.
Recommended
Consumer Appliance Front Panels
The PIC24F08KL200-I/P is well matched to consumer appliance front-panel controllers where cost and simplicity dominate. The MSSP can drive a character LCD over SPI while the UART talks to a main control board, and the CCP module can PWM-indicator LEDs or small buzzers directly. Its nanoWatt XLP sleep mode lets a front-panel MCU stay in standby until a button wakes it, preserving energy-star compliance. The 8 KB Flash is generous enough to host a menu state machine and button-debounce logic.
Recommended
Industrial eMetering and Utility Nodes
The PIC24F08KL200-I/P fits eMetering and utility sensor nodes because its 10-bit ADC digitises current-sense amplifier outputs while the MSSP reads a companion metering IC over SPI. The 16 MIPS performance is sufficient for instantaneous-power DSP-lite calculations, and 512 bytes of SRAM can host rolling-window samples. nanoWatt XLP sleep between transmissions makes battery-backed meters viable. The industrial -40 C to +85 C operating range handles outdoor enclosure thermal stress.
Recommended
Educational and Hobbyist Development Platforms
The PIC24F08KL200-I/P is a favourite educational MCU because its 14-pin PDIP form factor plugs directly into a breadboard, the PIC24F instruction set is fully documented in the Microchip datasheet, and the MPLAB X IDE plus XC16 compiler are free downloads. The PIC18-style peripheral mix eases the learning curve from PIC18F to 16-bit. 8 KB Flash and 512 bytes of RAM are large enough to host tutorial-grade projects involving ADC sampling, UART I/O and I2C sensor reads.
Recommended
Automotive Interior Accessories (non-safety)
The PIC24F08KL200-I/P can drive non-safety automotive interior accessories such as ambient lighting controllers, door-mirror positioners, and seat-heater panels, where 8 KB Flash is enough for the button-debounce and PWM profiles. The MSSP and UART enable Body Control Module (BCM) communication over LIN or CAN bridges. While the -I/P grade covers -40 C to +85 C cabin temperatures, designers needing harsher underhood specs should migrate to the PIC24F08KL200-E/P extended-temperature variant.
Recommended
Recommended Products Summary
Engineering reference data for PIC24F08KL200-I/P — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC24F08KL200-E/P | PIC24F04KL101-I/P | PIC24F04KL100-I/P | PIC24F08KA101-I/P | PIC24F08KL200-I/ST |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 14-pin PDIP | 14-pin PDIP | 14-pin PDIP | 14-pin PDIP | 14-pin PDIP | TSSOP-14 (SMD variant) |
| Flash | 8 KB | 8 KB | 4 KB | 4 KB | 8 KB | 8 KB |
| SRAM | 512 B | 512 B | 512 B | 512 B | 512 B | 512 B |
| EEPROM | 256 B | 256 B | 256 B | 0 B | 256 B | 256 B |
| Maximum Frequency | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS |
| Operating Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| Operating Temperature | -40 C to +85 C | -40 C to +125 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| nanoWatt XLP | Yes | Yes | Yes | Yes | Higher active current, less XLP | Yes |
| Pin-to-Pin Drop-In | Yes (reference) | Yes | Yes | Yes | Yes | Same die, different footprint (SMD) |
Key Differentiators
- Highest 8 KB Flash in KL family with extended-temperature drop-in option (vs PIC24F04KL101-I/P)
- True nanoWatt XLP deep-sleep (vs PIC24F08KA101-I/P)
- Through-hole PDIP for breadboard-friendly prototyping (vs PIC24F08KL200-I/ST)
Design Notes
Estimated: With a 3.0 V supply, the PIC24F08KL200-I/P core draws roughly 6 mA active at 32 MHz, and deep-sleep with RTCC drops into the nanoamp range per the datasheet nanoWatt XLP curves. Place a 100 nF decoupling capacitor within 5 mm of the VDD pin and a 10 uF bulk capacitor on the supply rail. Avoid switching regulators with switching noise above 1 MHz when designing for nanoamp sleep - use an MCP1700 LDO instead.
Keep the 14-pin PDIP MCLR pull-up resistor close to pin 1 and use a 10 kohm to VDD; add a 100 nF cap from MCLR to ground only if you need delayed reset. Route the OSC1/OSC2 traces short and guarded if you switch to an external crystal, otherwise rely on the internal 8 MHz HFINTOSC and PLL the 32 MHz system clock. Leave RA4 and RA5 as analog-capable if you plan to use them for ADC inputs.
Estimated: A common pitfall is forgetting that pins RA4 and RA5 double as OSC1/OSC2 - if you configure OSC mode bits incorrectly, those pins lose their digital-I/O function. Another pitfall is exceeding the 3.6 V absolute maximum on any I/O when interfacing to 5 V logic; use MCP6004 op-amps or a level translator. Finally, verify that the linker script places your code inside the 8 KB Flash boundary or you will silently fail to program the device.
Compliance Information
RoHS compliant per Microchip product page. Not AEC-Q100 qualified - the -I/P grade is industrial -40 C to +85 C; choose PIC24F08KL200-E/P for extended temperature needs.
