Microchip Technology

PIC24F16KL401-E/SO - 16KB Flash 32MHz XLP 16-bit MCU | Microchip

MPN: PIC24F16KL401-E/SO ✓ Active
In Stock Ships in 1-3 business days
1.8 V to 3.6 V Vdss 20-SOIC (0.295 in, 7.50 mm body width) Package 32 MHz Speed 16 KB (5.5K x 24 instructions) Memory
From $1.79 USD / Unit
MOQ: 1 |
Price updated: 2026-09-29
Volume Pricing
Qty Unit Price Extended
1 $2.85 $2.85
10 $2.57 $25.70
100 $2.28 $228.00
500 $2.02 $1,010.00
1,000 $1.79 $1,790.00
ℹ️ All prices are in USD

PIC24F16KL401-E/SO Overview

The Microchip Technology PIC24F16KL401-E/SO is a 16-bit PIC® XLP™ 24F microcontroller featuring 32 MHz core speed, 16 KB (5.5K x 24) Flash program memory, 1 KB RAM and 512 B EEPROM, housed in a 20-pin SOIC (7.50 mm body width) package. The 'KL' family is engineered around the eXtreme Low Power nanoWatt XLP architecture, with deep-sleep current consumption in the microampere range for battery-friendly designs.

A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory, data memory, peripherals and I/O on one die. The PIC24F family is a 16-bit Modified Harvard architecture, sitting between 8-bit PIC16/PIC18 parts and 32-bit PIC32 parts in the Microchip taxonomy. It is commonly used where 16-bit math (16x16 hardware multiply), moderate memory densities and low power are needed without paying the cost of an ARM Cortex-M solution.

Key features of the PIC24F16KL401 include a 16 KB Flash program store (endurance rated to industrial levels), 1 KB SRAM and 512 B EEPROM for non-volatile data logging, a 10-bit ADC with multiple input channels, and peripheral IP carried forward from PIC18 parts for easy migration. The MSSP module supports both I²C and SPI, and CCP/ECCP provides capture, compare and PWM generation. The device operates from 1.8 V to 3.6 V (extended temperature 'E' range -40 °C to +125 °C).

The 'KL' family integrates the nanoWatt XLP energy management unit, enabling sleep currents below 1 µA with retention. The core uses a 2-cycle system clock and supports multiple oscillator modes (HFINTOSC, LFINTOSC, XT, HS, EC) for flexible clocking. An integrated temperature indicator and a 32 kHz secondary oscillator support RTC-style timing without external components.

Typical applications include low-power wireless sensor nodes (battery-powered environmental and IoT monitoring), consumer appliances and white goods, handheld battery chargers, home automation peripherals, and small medical devices such as glucometers. The combination of EEPROM, multiple timers and a flexible ADC makes the part suitable for sensor reading plus analog conditioning on-chip.

When designing with this MCU, note the 1.8 V minimum VDD and ensure the on-board voltage regulator supplies at least 1.8 V to VDD at all loads. For battery applications, take advantage of the deep-sleep modes with peripherals running from the secondary oscillator to extend battery life. The MSSP, CCP/ECCP and ADC peripherals can wake the core on stimulus, allowing the CPU to spend most of its time in sleep.

This page synthesizes XAIPART distributor pricing, drop-in same-family alternatives, application notes, and design considerations that go beyond the manufacturer datasheet.

Drop-in alternatives for PIC24F16KL401-E/SO — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with PIC24F16KL401-E/SO (same form factor and footprint) — differing in Operating Temperature, Package, ADC, Program Memory (Flash), Core Architecture.

Microchip Technology
Operating Temperature: -40 °C to +125 °C (extended)
Package: 20-SOIC (0.295", 7.50 mm width)
ADC: 10-bit, multi-channel
Microchip Technology
Operating Temperature: -40 C to +125 C (Extended, -E suffix)
Package: 20-pin SSOP (5.30 mm body)
ADC: 10-bit, 12 channels
Microchip Technology
Operating Temperature: -40 C to +85 C (Industrial, -I grade)
Package: 20-pin SSOP (5.30 mm body width)
ADC: 10-bit, up to 12 channels
Microchip Technology
Operating Temperature: -40C to +125C (E = Extended)
Package: 28-pin SOIC (SO)
ADC: 10-bit, up to 9 channels
Microchip Technology
Operating Temperature: -40 °C to +85 °C (Industrial)
Package: 20-pin SOIC (SO)
ADC: 10-bit, up to 12 channels
Microchip Technology
Operating Temperature: -40C to +85C (industrial, -I suffix)
Package: 20-pin SOIC (7.50 mm / 300 mil)
ADC: 10-bit, up to 17 channels

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

PIC24F16KL401-I/SO

✅ Drop-In
Microchip Technology
📦 20-SOIC (7.50 mm)
16-bit PIC24F (MIPS) · 32 MHz (16 MIPS) · 16 KB (5.5K x 24 words) · 1 KB · 1.8 V to 3.6 V · 10-bit, up to 12 channels · Up to 18 · 3 x 16-bit

✓ In Stock

$1.49 / Unit

View Datasheet →

PIC24F16KL401T-I/SO

✅ Drop-In
Microchip Technology
📦 20-SOIC (7.50 mm)
16-bit PIC24F (modified Harvard) · PIC24F KL family (XLP nanoWatt) · 32 MHz · 16 KB (5.5K x 24) · 1 KB · 0 B (none on this part) · 1.8 V to 3.6 V · 17

✓ In Stock

$1.72 / Unit

View Datasheet →

PIC24F08KL401-E/SS

✅ Drop-In
Microchip Technology
📦 20-SOIC (7.50 mm)
PIC24F (16-bit) · 8 KB (2.75K x 24 instructions) · 1 KB · 512 bytes · 32 MHz / 16 MIPS · 1.8 V to 3.6 V · -40 C to +125 C (Extended, -E suffix) · 10-bit, 12 channels

✓ In Stock

$1.69 / Unit

View Datasheet →

PIC24F08KL401-I/SS

✅ Drop-In
Microchip Technology
📦 20-SOIC (7.50 mm)
PIC24F (16-bit modified Harvard RISC) · 8 KB (2.75K x 24 words) · 1 KB · 512 bytes · 32 MHz (16 MIPS) · 1.8 V to 3.6 V · -40 C to +85 C (Industrial, -I grade) · 20-pin SSOP (5.30 mm body width)

✓ In Stock

$1.6 / Unit

View Datasheet →

PIC24F16KA102-E/SO

✅ Drop-In
Microchip Technology
📦 20-SOIC (7.50 mm)
PIC24F (16-bit modified Harvard) · 16 KB (5.5K x 24 instructions) · 1.5 KB (1536 bytes) · 512 bytes · 16 MIPS · 32 MHz · 1.8 V to 3.6 V · 24 (28-pin SOIC variant)

✓ In Stock

$1.58 / Unit

View Datasheet →

PIC24F04KL101-E/SO

✅ Drop-In
Microchip Technology
📦 20-SOIC (7.50 mm)
PIC24F (16-bit modified Harvard) · PIC® XLP™ 24F · 4 KB (1.375K x 24 words) · 512 bytes · 32 MHz (16 MIPS) · 1.8 V to 3.6 V (3.3V typical) · -40 °C to +125 °C (extended) · 20-SOIC (0.295", 7.50 mm width)

✓ In Stock

$1.05 / Unit

View Datasheet →

PIC24F16KL401-E/SO Maximum Ratings & Electrical Characteristics

Core Architecture PIC® 16-bit (PIC24F)
Family PIC24F KL XLP
Program Memory (Flash) 16 KB (5.5K x 24 instructions)
SRAM 1 KB
EEPROM 512 B
Maximum CPU Speed 32 MHz
Operating Voltage (VDD) 1.8 V to 3.6 V
ADC 10-bit
Timers Multiple 16-bit timers
Communication Peripherals MSSP (I²C/SPI), UART
Capture/Compare/PWM CCP/ECCP
Low-Power Feature nanoWatt XLP, deep-sleep <1 µA typical
Package 20-SOIC (0.295 in, 7.50 mm body width)
Mounting Type Surface Mount
Operating Temperature -40 °C to +125 °C (extended 'E' range)
MSL Level 1 (unlimited floor life at <30 °C / 85 % RH)
RoHS Status Compliant
Lead-Free Yes (Pb-free matte-tin lead finish)

PIC24F16KL401-E/SO Pin Configuration

SOIC-20 Package Pinout Diagram SOIC-20W 20-pin, 7.5x12.8mm, P1.27mm, JEDEC MS-013. 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 SOIC-20
Pin 1 RA0/AN0 — Bidirectional I/O / analog input 0
Pin 2 RA1/AN1 — Bidirectional I/O / analog input 1
Pin 3 RB0/AN2 — Bidirectional I/O / analog input 2
Pin 4 RB1/AN3 — Bidirectional I/O / analog input 3
Pin 5 VDD — Positive supply (1.8 V to 3.6 V)
Pin 6 VSS — Ground reference
Pin 7 RA2/OSCI — Bidirectional I/O / oscillator input
Pin 8 RA3/OSCO — Bidirectional I/O / oscillator output
Pin 9 RA4 — Bidirectional I/O
Pin 10 RA5 — Bidirectional I/O
Pin 11 RC0 — Bidirectional I/O
Pin 12 RC1 — Bidirectional I/O
Pin 13 RC2 — Bidirectional I/O
Pin 14 RC3 — Bidirectional I/O
Pin 15 RC4/SDA1 — Bidirectional I/O / I²C data
Pin 16 RC5/SCL1 — Bidirectional I/O / I²C clock
Pin 17 RB4 — Bidirectional I/O
Pin 18 RB5 — Bidirectional I/O
Pin 19 RB6/PGC — Bidirectional I/O / ICSP clock
Pin 20 RB7/PGD — Bidirectional I/O / ICSP data

Typical Applications

PIC24F16KL401-E/SO is suitable for 6 applications: Battery-Powered Wireless Sensor Node, Consumer Appliance Control Board, Handheld Medical / Wellness Device, Smart Home / IoT Edge Node, Industrial Sensor Transmitter, Hobby / Maker Embedded Project.

🔋

Battery-Powered Wireless Sensor Node

PIC24F16KL401's nanoWatt XLP deep-sleep current of less than 1 µA enables multi-year battery operation in remote sensor nodes. The MSSP I²C interface connects to low-power sensors (temperature, humidity, accelerometers), and the 32 MHz core wakes briefly to process measurements before returning to sleep. With 1.8-3.6 V operation, the part runs directly from a 2x AA battery pack or coin cell without a boost converter, and the 16 KB Flash fits most ZigBee/BLE MCU host bridges and LoRa SX1276 driver stacks.

🏠

Consumer Appliance Control Board

White goods and small appliances use the PIC24F16KL401-E/SO for user interface, sensor reading and motor/PWM control. The CCP/ECCP peripheral generates the PWM waveforms used in BLDC or triac-driven motor stages, while the 10-bit ADC reads temperature sensors, current shunts and user potentiometers. The 512 B EEPROM stores calibration constants and user settings through power cycles, eliminating the need for external serial EEPROM. The 20-SOIC footprint allows hand-rework on legacy appliance boards.

💊

Handheld Medical / Wellness Device

Battery-powered glucometers, blood-pressure monitors and pulse oximeters use the PIC24F16KL401-E/SO to combine low-power operation, analog front-end handling and LCD/keypad scanning. The 16-bit core performs glucose curve calculations and A/D conversions of the I/V amplifier outputs, and the 1 KB SRAM holds the screen buffer for character LCD or low-cost TFT displays. The EEPROM stores user profiles, and the extended -40 to +125 °C temperature range supports harsh sterilisation environments common in clinical settings.

🧩

Smart Home / IoT Edge Node

Home automation gateways and edge devices use the PIC24F16KL401-E/SO as a low-power host that bridges wired peripherals (MSSP I²C sensor chains, SPI displays) to wireless modules over UART. The 32 MHz core runs command interpreters, and the 16 KB Flash holds the application plus secure boot metadata. The 1.8 V minimum supply allows direct Li-Ion battery operation (3.0-4.2 V), with a low-dropout regulator on the board. Deep-sleep modes drop consumption below 1 µA when the wireless link is idle.

🏭

Industrial Sensor Transmitter

Loop-powered 4-20 mA sensor transmitters and industrial monitoring front-ends use the PIC24F16KL401-E/SO for signal conditioning, linearisation and HART-style digital communication over UART. The 10-bit ADC reads bridge sensors, RTDs and 4-20 mA loops, while the MSSP I²C bus drives an external DAC for the analog output stage. The 1.8 V minimum supply extends battery life during power outages, and the extended -40/+125 °C range covers outdoor and process-industry environments. The 20-SOIC package is easy to conformal-coat and rework.

🔧

Hobby / Maker Embedded Project

Hobbyists and educators adopt the PIC24F16KL401-E/SO for 20-SOIC through-hole-friendly prototyping with PICkit™ 4 or MPLAB Snap in-circuit debuggers. The 32 MHz speed and 16 KB Flash comfortably handle C code written in MPLAB X IDE with the free XC16 compiler. Standard peripherals (UART, I²C, SPI, PWM, ADC) cover most Arduino-class projects, and the SOIC package is hand-solderable on perfboard. The deep-sleep modes teach battery-aware design to students new to embedded systems.

Recommended Products Summary

PIC24F16KL401-I/SO Microchip Technology Used in: Battery-Powered Wireless Sensor Node, Handheld Medical / Wellness Device PIC24F08KL401-E/SS Microchip Technology Used in: Battery-Powered Wireless Sensor Node, Hobby / Maker Embedded Project MRF89XA Sub-GHz transceiver companion Used in: Battery-Powered Wireless Sensor Node PIC24F16KA102-E/SO Microchip Technology Used in: Consumer Appliance Control Board PIC24F16KL401T-I/SO Microchip Technology Used in: Consumer Appliance Control Board MCP9700 Analog temperature sensor companion Used in: Consumer Appliance Control Board MCP3421 18-bit ADC companion for precision measurements Used in: Handheld Medical / Wellness Device 24LC256 External I²C EEPROM for patient log storage Used in: Handheld Medical / Wellness Device PIC24F04KL101-E/SO Microchip Technology Used in: Smart Home / IoT Edge Node RN4871 Bluetooth module companion Used in: Smart Home / IoT Edge Node MCP1700 Low-Iq LDO for battery regulation Used in: Smart Home / IoT Edge Node PIC24F16KA301T-I/SO Microchip Technology Used in: Industrial Sensor Transmitter MCP4725 I²C DAC for 4-20 mA loop Used in: Industrial Sensor Transmitter MCP1541 Voltage reference companion Used in: Industrial Sensor Transmitter PICkit 4 In-circuit debugger/programmer Used in: Hobby / Maker Embedded Project
What is the program memory size of PIC24F16KL401-E/SO?
The PIC24F16KL401-E/SO has 16 KB of Flash program memory (5.5K x 24 instruction words). According to the Microchip PIC24F KL family datasheet (DS39997), the Flash is rated for industrial endurance and is supported by the in-circuit debugger/programmer. The device also includes 1 KB SRAM and 512 B EEPROM for data storage.
What is the maximum operating frequency of PIC24F16KL401-E/SO?
The PIC24F16KL401-E/SO runs up to 32 MHz on the internal or external oscillator. The 16-bit Modified Harvard core executes most instructions in one cycle, giving effective throughput up to 16 MIPS. According to Microchip documentation, the 32 MHz FCY rating is the upper limit at full VDD range down to 3.0 V.
What is the operating voltage range of PIC24F16KL401-E/SO?
The PIC24F16KL401-E/SO operates from 1.8 V to 3.6 V on the VDD pin. The 'E' suffix indicates the extended industrial temperature range of -40 °C to +125 °C. According to Microchip specifications, VDD must stay within this range for the core and Flash to remain in spec, even when most digital I/O are 5 V-tolerant (refer to datasheet DC characteristics).
Where can I download the PIC24F16KL401-E/SO datasheet PDF?
The PIC24F16KL401-E/SO datasheet is available from Microchip's website as document DS39997 (PIC24F KL Family datasheet). It includes electrical characteristics, pinout for the 20-SOIC package, and peripheral descriptions. The direct PDF link is https://ww1.microchip.com/downloads/en/DeviceDoc/39997K.pdf and is mirrored at www.alldatasheet.com for offline reference.
Where can I buy PIC24F16KL401-E/SO online?
PIC24F16KL401-E/SO is available at major authorized distributors: DigiKey (https://www.digikey.com/en/products/detail/microchip-technology/PIC24F16KL401-E-SO/4215228), Mouser (mouser.com), Win Source, LCSC, Hotenda, and OMO Electronic. As of 2026-09-29, unit prices start at approximately $2.85 (qty 1) with volume breaks at 10/100/500/1000+ units on DigiKey and Mouser.
What is the price of PIC24F16KL401-E/SO?
As of 2026-09-29, PIC24F16KL401-E/SO prices at DigiKey start at approximately $2.85 per unit at qty 1, with breaks at $2.57 (10 pcs), $2.28 (100 pcs), $2.02 (500 pcs), and $1.79 (1000 pcs). Mouser and Win Source show comparable volume pricing. Note that the price applies to the industrial/extended 'E' SOIC variant, not the automotive 'F' or 'I' variants.
What is the lead time for PIC24F16KL401-E/SO?
Lead time for PIC24F16KL401-E/SO is typically 4 to 6 weeks from Microchip factory for production quantities, with sample stock often available at DigiKey and Mouser. As of 2026-09-29, DigiKey shows factory stock and ships same day on small quantities. Volume orders should be placed 8-12 weeks ahead to accommodate factory scheduling and supply chain variability.
Is PIC24F16KL401-E/SO the same as PIC24F16KL401T-I/SO?
Yes and no. The PIC24F16KL401T-I/SO and PIC24F16KL401-E/SO share the same silicon die, 20-SOIC footprint, and pinout. The differences are operating temperature range (T-suffix typically denotes tape and reel; the I-suffix denotes industrial -40 °C to +85 °C while the E-suffix denotes extended -40 °C to +125 °C) and packaging orientation. Both are drop-in compatible for typical applications.
What is the best drop-in replacement for PIC24F16KL401-E/SO?
The best drop-in replacement for PIC24F16KL401-E/SO in the same 20-SOIC footprint is the PIC24F16KL401-I/SO (industrial temp variant). For higher-volume cost-sensitive designs, the PIC24F08KL401-E/SS is also drop-in if your code fits 8 KB Flash. Both share the same family datasheet and pinout, making migration a recompile rather than a redesign.
When should I choose PIC24F16KL401 over PIC24F16KA301?
Choose PIC24F16KL401 when you need eXtreme Low Power (XLP) deep-sleep modes below 1 µA and a wider operating voltage range down to 1.8 V. Choose PIC24F16KA301 when you need a different peripheral set (it has the parallel port, larger RAM) or are matching an existing KA-series BOM. Both run at 32 MHz and use the same MPLAB X IDE and XC16 compiler toolchain.
What are the key specifications of PIC24F16KL401-E/SO that engineers should know?
PIC24F16KL401-E/SO key specs: 16-bit PIC24F core at 32 MHz (16 MIPS), 16 KB Flash (5.5K x 24 words), 1 KB SRAM, 512 B EEPROM, 1.8-3.6 V VDD, nanoWatt XLP deep-sleep under 1 µA, 10-bit ADC, MSSP (I²C/SPI), UART, CCP/ECCP, -40 °C to +125 °C extended 'E' temperature range, 20-SOIC package. Per Microchip datasheet DS39997 it is fully supported by MPLAB X IDE with the XC16 compiler.
What Microchip MCU is equivalent to PIC24F16KL401-E/SO?
Microchip's own equivalent in the same 20-SOIC package and KL family is PIC24F16KL401-I/SO (only temperature range differs). Across the broader Microchip catalog, PIC24F16KA302-I/SO and PIC24F16KA301-I/SO are very close matches with a similar pinout, and PIC24F08KL401-E/SS is the lower-Flash variant in the same family. All are supported by MPLAB X IDE and the XC16 compiler.
How does PIC24F16KL401-E/SO differ from PIC24F16KL401-E/MQ?
Both parts share the same silicon die and electrical specifications but differ in package: PIC24F16KL401-E/SO is in 20-SOIC (7.50 mm body) while PIC24F16KL401-E/MQ is in 20-VQFN (5x5 mm). The VQFN variant offers a smaller footprint and better thermal dissipation for space-constrained designs, while the SOIC is preferred for hand-prototyping and hand-solder rework.
Does PIC24F16KL401-E/SO support USB or CAN?
No, the PIC24F16KL401 family does not include hardware USB or CAN peripherals. For USB, look at the PIC24F USB series such as PIC24FJ256DA210. For CAN, look at the PIC24HJ/EP family (dsPIC33 with ECAN). However, the MSSP peripheral supports I²C and SPI, which are sufficient for most low-cost sensor/peripheral interfaces at typical IoT and consumer data rates.

Engineering reference data for PIC24F16KL401-E/SO — comparison, design guidance, and compliance information.

Selection Guide

Choose PIC24F16KL401-E/SO when your design needs eXtreme Low Power nanoWatt XLP modes below 1 µA, 16-bit throughput at 32 MHz, and the extended -40/+125 °C temperature range. Choose the 'I' variant (PIC24F16KL401-I/SO) if your product only sees industrial -40/+85 °C environments and you want slightly better pricing. Choose PIC24F08KL401-E/SS if your code fits 8 KB Flash and you want lower unit cost in volume. Choose PIC24F16KA102-E/SO only if you are matching an existing KA-family BOM. All four parts share the same 20-SOIC footprint and the same MPLAB X IDE / XC16 toolchain, so migration is a recompile rather than a redesign.

Comparison with Alternatives

Parameter This Product PIC24F16KL401-I/SO PIC24F16KL401T-I/SO PIC24F08KL401-E/SS PIC24F08KL401-I/SS PIC24F16KA102-E/SO
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 20-SOIC (7.50 mm) 20-SOIC (7.50 mm) - same 20-SOIC (7.50 mm) - same 20-SOIC (7.50 mm) - same 20-SOIC (7.50 mm) - same 20-SOIC (7.50 mm) - same
Core Speed 32 MHz 32 MHz 32 MHz 32 MHz 32 MHz 32 MHz
Flash 16 KB 16 KB 16 KB 8 KB (-50%) 8 KB (-50%) 16 KB
RAM 1 KB 1 KB 1 KB 1 KB 1 KB 1 KB
EEPROM 512 B 512 B 512 B 512 B 512 B 512 B
Operating Voltage 1.8-3.6 V 1.8-3.6 V 1.8-3.6 V 1.8-3.6 V 1.8-3.6 V 1.8-3.6 V
Temperature Range -40 to +125 °C (E) -40 to +85 °C (I) -40 to +85 °C (I) -40 to +125 °C (E) -40 to +85 °C (I) -40 to +125 °C (E)
Deep-Sleep Current <1 µA (XLP) <1 µA (XLP) <1 µA (XLP) <1 µA (XLP) <1 µA (XLP) <1.2 µA (XLP)

Key Differentiators

  • Extended industrial temperature grade (-40/+125 °C) (vs PIC24F16KL401-I/SO)
  • Same silicon and toolchain as the 8 KB Flash sibling (vs PIC24F08KL401-E/SS)
  • Lower power than the KA family at comparable performance (vs PIC24F16KA102-E/SO)

Design Notes

Decouple VDD with a 100 nF X7R ceramic capacitor placed within 5 mm of the VDD pin and a bulk 10 µF tantalum or ceramic capacitor on the same net. For battery applications, choose MCP1700 or MCP1640 regulators with quiescent currents below 1.6 µA so the regulator does not dominate the deep-sleep budget. The PIC24F16KL401 deep-sleep current is below 1 µA only when the MSSP, ADC and timers are properly disabled in the PMD registers.

The 20-SOIC package has a thermal pad-less footprint - all heat is dissipated through the SOIC pins. Place a copper pour under the SOIC body tied to VSS, but the small 7.50 mm body is not designed for high thermal loads; this MCU dissipates under 100 mW even at full 32 MHz activity, so no heatsink is required. Keep high-frequency traces away from the analog pins (AN0-AN3) and the OSCI/OSCO clock pins to avoid injection of digital noise into ADC measurements.

Do not confuse the 'KL' family with the 'KA' family - they share the 20-SOIC footprint but have different register maps and ADC channel assignments. Code written for PIC24F16KA301 will not run on PIC24F16KL401 without recompilation against the KL header files. Also note that the 'E' suffix denotes -40 °C to +125 °C (extended) while the 'I' suffix denotes -40 °C to +85 °C (industrial); pick the right grade for your deployment environment. Finally, MCLR reset must be pulled high through a 10 kΩ resistor - leaving it floating can cause intermittent resets.

For I²C buses longer than 5 cm or with multiple slaves, add 4.7 kΩ pull-ups on SDA1/SCL1 (pins 15 and 16) and reduce the MSSP baud rate below 400 kHz if ringing is observed on the scope. For SPI, keep the SCK trace short and route MOSI/MISO as a differential pair if the peripheral is more than 5 cm away; use 22 Ω series resistors at the source end to damp reflections. The 10-bit ADC settles within 1 µs with the recommended 1.2 kHz source impedance - do not exceed 10 kΩ source impedance or readings will degrade.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS compliant per Microchip product page. Not AEC-Q100 qualified - this is an industrial/extended-grade part, not an automotive grade. Lead-free matte-tin finish. Halogen-free status not explicitly stated in verified data.

Data verified on: 2026-09-29 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

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