PIC24FJ32GP202-E/MV - 32KB Flash, 16-bit XLP MCU | Microchip
MPN: PIC24FJ32GP202-E/MV ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.12 | $4.12 |
| 10 | $3.71 | $37.10 |
| 100 | $3.32 | $332.00 |
| 500 | $2.95 | $1,475.00 |
| 1,000 | $2.62 | $2,620.00 |
PIC24FJ32GP202-E/MV Overview
What is a PIC24F microcontroller? The PIC24F is Microchip's 16-bit microcontroller family using a modified Harvard RISC architecture with 16 MIPS performance at 32 MHz. It sits above the 8-bit PIC16/PIC18 families in performance and below the dsPIC/PIC32 families. It is widely used in ultra-low-power (XLP) battery applications, mixed-signal designs, and USB-enabled embedded products where 32-bit performance is overkill but 8-bit MCUs lack the throughput or peripherals.
Key features include hardware ECC on Flash for greater data integrity, 4 channels of DMA, up to 22 channels of 10/12-bit ADC at 500 ksps, 5 16-bit timers, configurable logic cells (CLC), and multiple serial interfaces (UART, SPI, I2C). The integrated USB 2.0 FS OTG controller with on-chip transceiver eliminates the need for external PHY chips, significantly shrinking the BOM for low-power USB devices.
Architecturally, the PIC24FJ32GP202 uses a 16-bit modified Harvard core with a 24-bit instruction word for compact code density. The CIPs (configurable logic cells, comparators, PWM, RTCC, etc.) operate independently of the CPU, allowing events such as ADC-triggered conversions and PWM-shutdown on comparator faults without CPU wake-up - a key reason the XLP sleep current stays in the nanoamp range.
Typical applications include USB HID peripherals, IoT sensor nodes, e-metering, low-power medical wearables, consumer battery chargers, and industrial control with USB diagnostic interfaces. The extended -40C to +125C temperature range (the 'E' suffix) makes it suitable for automotive under-hood and outdoor industrial deployments.
When designing, ensure VDD decoupling uses a 100 nF ceramic placed within 2 mm of the VDD pin and a 10 uF bulk on the main rail. The UQFN-28 exposed pad must be soldered to the PCB ground plane for proper thermal dissipation and electrical ground reference - missing this connection causes erratic USB operation.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet alone, with a focus on USB-enabled low-power embedded applications.
Drop-in alternatives for PIC24FJ32GP202-E/MV — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC24FJ32GP202-E/MV (same form factor and footprint) — differing in Package, Core Architecture, Operating Temperature, Program Flash, Sleep Current.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC24FJ32GP202-I/MV
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$2.13 / Unit
View Datasheet →PIC24FJ64GP202-E/MV
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
PIC24FJ32GP202-E/SP
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
PIC24FJ32GP204-E/MV
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
PIC24FJ32GA102-E/SO
✅ Drop-In📋 Reference alternative (not in catalog)
PIC24FJ32GB002-I/SS
✅ Drop-In✓ In Stock
$2.21 / Unit
View Datasheet →PIC24FJ32GP202-E/MV Maximum Ratings & Electrical Characteristics
| Core Architecture | PIC24F 16-bit RISC (modified Harvard) |
| Maximum CPU Speed | 32 MHz (16 MIPS) |
| Program Flash | 32 KB (11K x 24) with ECC |
| RAM | 8 KB |
| Package | 28-pin UQFN (4x4 mm) - MV |
| Operating Voltage | 2.0 V to 3.6 V |
| USB | USB 2.0 Full-Speed Host/Device/OTG with on-chip transceiver |
| Operating Temperature | -40C to +125C (E-temp) |
| Sleep Current | Hundreds of nA (XLP) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lead-Free | Yes |
PIC24FJ32GP202-E/MV Pin Configuration
| Pin 1 | RB8 — GPIO/ICD pin |
| Pin 2 | RB9 — GPIO |
| Pin 3 | VDD — Positive supply voltage (2.0V-3.6V) |
| Pin 4 | VSS — Ground reference |
| Pin 5 | RA0 — Analog input / GPIO |
| Pin 6 | RA1 — Analog input / GPIO |
| Pin 7 | RB0 — GPIO / PGED1 programming |
| Pin 8 | RB1 — GPIO / PGEC1 programming |
| Pin 9 | RB2 — GPIO |
| Pin 10 | RB3 — GPIO |
| Pin 11 | RC0 — GPIO |
| Pin 12 | RC1 — GPIO |
| Pin 13 | RC2 — GPIO |
| Pin 14 | OSC1 — Crystal oscillator input |
| Pin 15 | OSC2 — Crystal oscillator output |
| Pin 16 | VSS — Ground reference |
| Pin 17 | VDD — Positive supply voltage |
| Pin 18 | D+ — USB D+ line |
| Pin 19 | D- — USB D- line |
| Pin 20 | VBUS — USB VBUS detect |
| Pin 21 | RC3 — GPIO |
| Pin 22 | RB4 — GPIO / SDA1 |
| Pin 23 | RB5 — GPIO / SCL1 |
| Pin 24 | RA2 — Analog input / GPIO |
| Pin 25 | RA3 — Analog input / GPIO |
| Pin 26 | RB6 — GPIO |
| Pin 27 | RB7 — GPIO |
| Pin 28 | RA4 — Analog input / GPIO |
Typical Applications
PIC24FJ32GP202-E/MV is suitable for 7 applications: USB HID Peripheral Devices, IoT Battery Sensor Nodes, Wearable Medical Devices, USB Charging and Power Bank Controllers, Industrial Control with USB Diagnostics, Automotive Interior Accessories, Consumer Remote Controls and Toys.
USB HID Peripheral Devices
The PIC24FJ32GP202-E/MV is well-suited for USB Human Interface Devices such as keyboards, mice, game controllers, and custom HID peripherals thanks to its integrated USB 2.0 FS OTG controller with on-chip transceiver. The 32 KB ECC Flash comfortably stores USB stacks plus application firmware, while the 16 MIPS core handles HID polling and debouncing without CPU strain. Nanoamp XLP sleep current allows battery-powered wireless HID dongles to last months on a single cell. Place a 100 nF decoupling cap within 2 mm of VDD and ensure the UQFN exposed pad is soldered to ground for stable USB signalling.
Recommended
IoT Battery Sensor Nodes
The PIC24FJ32GP202-E/MV excels in IoT sensor nodes that sleep most of their life and wake briefly to read sensors and transmit. Its hundreds-of-nA sleep current with full RAM retention enables multi-year coin-cell operation. The 4 DMA channels and CIPs allow ADC sampling, threshold comparisons, and packet assembly without waking the CPU, drawing microamps during active windows. The extended -40C to +125C temperature range supports outdoor and industrial deployments. Use the CLCs to wire sensor triggers to the ADC and timer directly, bypassing CPU intervention and further reducing average current.
Recommended
Wearable Medical Devices
The PIC24FJ32GP202-E/MV is appropriate for battery-powered wearable medical devices such as pulse oximeters, continuous glucose monitor patches, and drug delivery pumps where sleep current and extended temperature range matter most. The ECC Flash protects patient data integrity against bit-flips, while the XLP architecture draws nanoamps in sleep between measurement intervals. The 32 KB Flash is sufficient for RTOS-lite or polled firmware storing sensor calibration tables. Designers should validate IEC 60601 EMI margins and use the UQFN-28 MV footprint to keep total PCB area under 10x10 mm for wrist-worn form factors.
Recommended
USB Charging and Power Bank Controllers
The PIC24FJ32GP202-E/MV operates well as a USB charging controller for power banks and battery chargers because its integrated USB OTG enables BC1.2 negotiation and proprietary charging protocols without external PHY. The 8 KB RAM supports charging state machines and voltage/current lookup tables, and the extended temperature range handles the thermal rise of fast-charge scenarios. Compared to discrete USB charger ICs, this MCU provides firmware-updatable charging profiles that can be tuned for new battery chemistries in the field.
Recommended
Industrial Control with USB Diagnostics
The PIC24FJ32GP202-E/MV suits industrial control boards that expose USB diagnostics or firmware-update ports on the factory floor. The extended -40C to +125C temperature range handles under-cabinet and outdoor control panel environments, while ECC Flash maintains code integrity against industrial EMI and bit-flip events. The 16 MIPS core runs control loops at millisecond periods while still servicing USB CDC for HMI or configuration. Connect the USB DP/DN lines through 27 ohm series resistors and an ESD array rated to 15 kV HBM for rugged industrial ports.
Recommended
Automotive Interior Accessories
The PIC24FJ32GP202-E/MV's extended -40C to +125C temperature range enables deployment in automotive interior accessories such as USB hubs, dashboard diagnostic dongles, and seat-control modules. Although not AEC-Q100 qualified itself, the temperature margin supports cabin environments where ambient can swing rapidly. The USB OTG controller simplifies OBD-II pass-through designs and Apple CarPlay auxiliary ports. For under-hood or AEC-Q100 mandates, designers should migrate to a Q-qualified PIC24F variant.
Recommended
Consumer Remote Controls and Toys
The PIC24FJ32GP202-E/MV is appropriate for consumer remote controls, RC toys, and educational electronics that need USB charging plus low sleep current for months of standby. The 32 KB Flash holds BLE-passthrough or proprietary RF stacks plus voice/audio cue playback routines. XLP nanoamp sleep extends shelf life on alkaline cells, and the UQFN-28 4x4 mm footprint fits the slim form factor of handheld remote enclosures. Use the DMA to drive PWM audio or LED indicators without CPU wake-up to further conserve battery.
Recommended
Recommended Products Summary
Engineering reference data for PIC24FJ32GP202-E/MV — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC24FJ32GP202-I/MV | PIC24FJ64GP202-E/MV | PIC24FJ32GP202-E/SP | PIC24FJ32GA102-E/SO |
|---|---|---|---|---|---|
| Package | UQFN-28 (MV) 4x4 mm | UQFN-28 (MV) - same | UQFN-28 (MV) - same | SPDIP-28 - same pinout, through-hole | SOIC-28 - same pin count |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Flash | 32 KB ECC | 32 KB ECC | 64 KB ECC (+100%) | 32 KB | 32 KB |
| RAM | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB |
| USB | USB 2.0 FS OTG with on-chip transceiver | USB 2.0 FS OTG - same | USB 2.0 FS OTG - same | No USB | USB 2.0 FS OTG - same |
| Sleep Current (XLP) | Hundreds of nA | Hundreds of nA - same | Hundreds of nA - same | Higher uA-level sleep | Slightly higher than GP202 |
| Operating Voltage | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V |
| Temperature Range | -40C to +125C (E-temp) | -40C to +85C (I-temp) | -40C to +125C | -40C to +125C | -40C to +85C |
| Maximum CPU Speed | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS |
| Approx Unit Price @ qty 100 | USD 3.32 | USD 3.30 (similar) | USD 3.85 (higher Flash) | USD 2.95 (no USB) | USD 3.20 (similar) |
Key Differentiators
- Lower sleep current than GA102 family siblings (vs PIC24FJ32GA102-E/SO)
- ECC Flash for stronger data integrity (vs PIC24FJ32GB002-I/SS)
- Drop-in upgrade path within same package (vs PIC24FJ64GP202-E/MV)
- Higher temperature grade than -I variants (vs PIC24FJ32GP202-I/MV)
Design Notes
Place a 100 nF X7R ceramic decoupling capacitor within 2 mm of each VDD pin and a shared 10 uF bulk capacitor on the main 3V3 rail. For USB bus-powered designs, add a 4.7 uF capacitor on VBUS to handle inrush transients. The PIC24FJ32GP202-E/MV's nanoamp sleep current means even small leakage paths (10 Mohm contamination) can dwarf the device's own draw, so clean the PCB after assembly if unexpected battery drain appears.
The UQFN-28 (MV) exposed thermal pad on the underside must be soldered to a continuous ground plane for both thermal dissipation and electrical ground reference. Missing or insufficient solder on the EP causes erratic USB operation and ADC offset errors. Use at least 4 thermal vias in the EP land pattern (Owen/Via = 0.3 mm drill, 0.5 mm pad) stitched to the inner ground plane. Route USB D+ and D- as a 90 ohm differential pair with length matching within 2 mm.
Do not exceed 3.6 V on VDD or the USB VBUS pin - the PIC24FJ32GP202-E/MV is a 3V3 part, not 5V tolerant on these pins. Programming/debugging via ICD requires PGED1 (RB0) and PGEC1 (RB1) - do not repurpose these pins without an alternate programming path. Firmware must clear the USB interrupt flags before re-enabling USB interrupts to avoid lockup on VBUS unplug events. ECC Flash cannot be reprogrammed in flight without a row erase; design firmware upgrade flows around row-aligned 512-byte Flash pages.
Estimated: at full 32 MHz active with USB active and all peripherals enabled, active current is roughly 10 to 15 mA at 3.3 V, yielding approximately 33 to 50 mW dissipation. With the UQFN-28 MV package theta_JA around 40 C/W (typical 4-layer board), junction temperature rise above ambient is only 1 to 2 C. Sleep mode drops dissipation to single-digit microwatts, so thermal management is generally not a concern for this MCU.
Compliance Information
RoHS and lead-free per Microchip product page. The -E (extended) temperature suffix is not equivalent to AEC-Q100 qualification; for AEC-Q100 applications, choose an explicitly Q-qualified PIC24F variant.
