PIC24FJ64GA004-E/ML - 16-bit MCU, 64KB Flash, 44-QFN | Microchip
MPN: PIC24FJ64GA004-E/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.95 | $6.95 |
| 10 | $6.27 | $62.70 |
| 100 | $5.58 | $558.00 |
| 500 | $5.02 | $2,510.00 |
| 1,000 | $4.47 | $4,470.00 |
PIC24FJ64GA004-E/ML Overview
A 16-bit microcontroller (MCU) is a single-chip computer whose CPU datapath is 16 bits wide, sitting between 8-bit parts (PIC10/12/16, 8051, ATmega) and 32-bit parts (Cortex-M, PIC32). The PIC24FJ family uses a modified Harvard architecture with separate program and data buses, enabling single-cycle instruction fetch plus data access. The "FJ" suffix denotes the Flash-based variant with peripheral-rich general-purpose I/O, while "GA004" identifies the 28/44-pin pinout group with the USB-less analog-rich peripheral mix.
Key features include 64 KB (22K x 24) self-programmable Flash, 8 KB RAM, a 10-bit ADC with up to 13 input channels (model-dependent), up to five 16-bit timers, two UART, two SPI, two I²C, a parallel master port (PMP), and a real-time clock calendar (RTCC). An integrated 8 MHz internal RC oscillator with PLL provides 32 MHz system clock without external crystals in many designs. The 44-QFN package provides an exposed thermal pad that lowers junction-to-PCB thermal resistance, while the E-grade temperature range supports harsh-environment applications.
The PIC24FJ64GA004 uses Microchip's nanoWatt XLP (eXtreme Low Power) technology with multiple idle and sleep modes, deep sleep current in the nanoamp range, and on-chip voltage regulator. Its 16-bit core, deterministic interrupt latency, and dual-bus Harvard design deliver consistent execution time which is critical for real-time control loops. The 22K × 24-bit Flash word width is wider than 8-bit MCUs, allowing more efficient storage of constants and tables.
Typical applications include industrial control and HMI, low-power sensor nodes, USB-less embedded control, portable instrumentation, motor and lighting control, and consumer appliances that need more headroom than PIC16 but stay within a 16-bit architecture. The wide analog integration (ADC, comparators, CTMU) supports touch and signal-conditioning front-ends without external components.
When designing with this device, ensure the MCLR reset pin is pulled high through a 10 kΩ resistor and that Vcap (core regulator bypass) is decoupled with a 10 µF ceramic to ground; missing Vcap is a common bring-up failure. For low-power operation, select the deep sleep or retention modes and gate unused peripherals via PMD registers. Pin-compatible variants with different Flash/RAM density (PIC24FJ32, PIC24FJ128) exist in the same 44-QFN footprint for memory scalability.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for PIC24FJ64GA004-E/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC24FJ64GA004-E/ML (same form factor and footprint) — differing in Internal Oscillator, Package, Program Memory (Flash), Timers, ADC.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC24FJ64GA004-I/ML
✅ Drop-In✓ In Stock
$4.91 / Unit
View Datasheet →PIC24FJ48GA004-E/ML
✅ Drop-In✓ In Stock
$4.39 / Unit
View Datasheet →PIC24FJ64GA004-E/ML Maximum Ratings & Electrical Characteristics
| Core Architecture | PIC24F, 16-bit Modified Harvard |
| Program Memory (Flash) | 64 KB (22K x 24) |
| Data Memory (RAM) | 8 KB |
| CPU Speed | 16 MIPS (32 MHz) |
| Operating Voltage | 2.0 V to 3.6 V |
| Temperature Grade | Extended -40 °C to +125 °C |
| Package | 44-pin QFN (8x8 mm), ML suffix |
| ADC | 10-bit, up to 13 channels (model dependent) |
| Timers | Five 16-bit Timer/Counter modules |
| Communication Interfaces | 2x UART, 2x SPI, 2x I²C |
| Parallel Master Port (PMP) | Yes |
| Real-Time Clock Calendar (RTCC) | Yes |
| Internal Oscillator | 8 MHz with PLL |
| Low-Power Technology | nanoWatt XLP |
| Pin Count | 44 |
| RoHS Status | Compliant |
| MSL Level | 3 (per package) |
PIC24FJ64GA004-E/ML Pin Configuration
| Pin 1 | RP15/PMA1/CN12/RB15 — Remappable I/O, PMP address bit 1, change notification |
| Pin 2 | RP14/PMA0/CN11/RB14 — Remappable I/O, PMP address bit 0, change notification |
| Pin 3 | VSS — Ground reference |
| Pin 4 | OSC1/CLKI/RA2 — External clock input or general I/O |
| Pin 5 | OSC2/CLKO/RA3 — Crystal oscillator output or general I/O |
| Pin 6 | TDO/PMA10/RA4 — JTAG test data out, PMP address, general I/O |
| Pin 7 | TCK/PMA9/RA5 — JTAG test clock, PMP address, general I/O |
| Pin 8 | RP0/CN4/RB0 — Remappable peripheral I/O, change notification |
| Pin 9 | RP1/CN5/RB1 — Remappable peripheral I/O, change notification |
| Pin 10 | RP2/CN6/RB2 — Remappable peripheral I/O, change notification |
| Pin 11 | RP3/CN7/RB3 — Remappable peripheral I/O, change notification |
| Pin 12 | RP4/CN8/RB4 — Remappable peripheral I/O, change notification |
| Pin 13 | RP5/PMA5/CN9/RB5 — Remappable I/O, PMP address, change notification |
| Pin 14 | VSS — Ground reference |
| Pin 15 | VDD — Positive supply (2.0-3.6V) |
| Pin 16 | RP6/PMA6/CN10/RB6 — Remappable I/O, PMP address, change notification |
| Pin 17 | RP7/PMA7/RB7 — Remappable I/O, PMP address |
| Pin 18 | RP8/PMA8/RB8 — Remappable I/O, PMP address |
| Pin 19 | RP9/PMA13/RB9 — Remappable I/O, PMP address |
| Pin 20 | RP10/PMCS1/CVREF/PMD10/RB10 — Remappable I/O, PMP chip select 1, reference voltage |
| Pin 21 | RP11/PMCS2/PMA15/PMD11/RB11 — Remappable I/O, PMP chip select 2 |
| Pin 22 | RP12/PMD0/RB12 — Remappable I/O, PMP data bit 0 |
| Pin 23 | RP13/PMD1/RB13 — Remappable I/O, PMP data bit 1 |
| Pin 24 | VSS — Ground reference |
| Pin 25 | VDD — Positive supply (2.0-3.6V) |
| Pin 26 | RP16/PMD2/RF0 — Remappable I/O, PMP data bit 2 |
| Pin 27 | RP17/PMD3/RF1 — Remappable I/O, PMP data bit 3 |
| Pin 28 | RP18/SDA2/PMD4/RF2 — Remappable I/O, I2C2 data, PMP data bit 4 |
| Pin 29 | RP19/SCL2/PMD5/RF3 — Remappable I/O, I2C2 clock, PMP data bit 5 |
| Pin 30 | RP20/PMD6/RF4 — Remappable I/O, PMP data bit 6 |
| Pin 31 | RP21/PMD7/RF5 — Remappable I/O, PMP data bit 7 |
| Pin 32 | RP22/PMD8/RF6 — Remappable I/O, PMP data bit 8 |
| Pin 33 | RP23/PMD9/RF7 — Remappable I/O, PMP data bit 9 |
| Pin 34 | SDO1/RG6/PMD10 — SPI1 data out, PMP data bit 10 |
| Pin 35 | SDI1/RG7/PMD11 — SPI1 data in, PMP data bit 11 |
| Pin 36 | SCK1/RG8/PMD12 — SPI1 clock, PMP data bit 12 |
| Pin 37 | SS1/PMD13/RG9 — SPI1 slave select, PMP data bit 13 |
| Pin 38 | RTCC/RG10 — RTCC output or general I/O |
| Pin 39 | D-/RG11 — USB D- or general I/O (not used in GA004 non-USB) |
| Pin 40 | D+/RG12 — USB D+ or general I/O (not used in GA004 non-USB) |
| Pin 41 | MCLR — Master Clear (reset) input, drive high via 10kΩ |
| Pin 42 | VDD — Positive supply (2.0-3.6V) |
| Pin 43 | ENVREG/RA9 — Voltage regulator enable control |
| Pin 44 | VCAP/RA10 — Core regulator bypass, decouple 10µF to ground |
Typical Applications
PIC24FJ64GA004-E/ML is suitable for 6 applications: Industrial Control and HMI, Low-Power Sensor Nodes and IoT Edge, Portable Medical and Wellness Devices, USB-less Embedded Control, Motor and Lighting Control, Consumer Appliances and White Goods.
Industrial Control and HMI
The PIC24FJ64GA004-E/ML fits industrial control panels with its 16 MIPS execution, 64 KB Flash for control logic, and PMP/parallel interface for graphics or character LCDs. The 44-QFN exposed thermal pad handles industrial -40C to +125C environments. The 10-bit ADC with up to 13 channels digitizes sensor inputs without external components. UART/SPI/I2C integrate Modbus, RS-485, and digital sensor networks. The 8 KB RAM supports stack buffers for industrial protocol stacks.
Recommended
Low-Power Sensor Nodes and IoT Edge
The PIC24FJ64GA004-E/ML's nanoWatt XLP technology with deep sleep currents in the nanoamp range suits battery-powered wireless sensor nodes. The 8 MHz internal RC with PLL eliminates external crystals for low BOM cost. The 64 KB Flash stores sensor fusion code and over-the-air update bootloaders, while 8 KB RAM holds measurement buffers. ADC + CTMU provides capacitive touch and analog sensor digitization in a single chip.
Recommended
Portable Medical and Wellness Devices
The PIC24FJ64GA004-E/ML suits portable medical peripherals such as blood pressure monitors, pulse oximeters, and patient wearables. The 16 MIPS core performs real-time signal processing for pulse oximetry algorithms. The 10-bit ADC captures photodiode signals from SpO2 sensors, while DSP-friendly instruction set accelerates filter math. Low-power XLP modes extend battery life on lithium coin cells, and the -40C to +125C range covers clinical and home environments.
Recommended
USB-less Embedded Control
The PIC24FJ64GA004-E/ML provides 16-bit control for designs that outgrow PIC16 8-bit MCUs but do not need USB or CAN peripherals. The 64 KB Flash and 8 KB RAM store complex state machines, while five 16-bit timers drive PWM outputs for motor and lighting control. The exposed thermal pad 44-QFN package fits compact embedded modules where board height is critical. RTCC enables time-stamping for data loggers.
Recommended
Motor and Lighting Control
The PIC24FJ64GA004-E/ML controls DC and stepper motors in appliance and lighting applications using its five 16-bit timers with PWM outputs. The 16 MIPS execution runs sensorless FOC or trapezoidal commutation algorithms. The 44-QFN exposed pad dissipates heat from continuous PWM switching, while the 8 KB RAM supports current and speed control loops. The CTMU enables capacitive touch sliders for lamp dimmers.
Recommended
Consumer Appliances and White Goods
The PIC24FJ64GA004-E/ML integrates the user interface, sensor interface, and motor control of washing machines, dishwashers, and HVAC controls in a single 16-bit MCU. The 64 KB Flash stores UI state machines and appliance-specific firmware, while 8 KB RAM supports display frame buffers. The -40C to +125C extended grade withstands appliance thermal environments. RTCC schedules delayed-start and energy-saving modes.
Recommended
Recommended Products Summary
Engineering reference data for PIC24FJ64GA004-E/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC24FJ64GA004-I/ML | PIC24FJ48GA004-E/ML |
|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-QFN (8x8 mm) | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Program Flash | 64 KB | 64 KB (same) | 48 KB (-25%) |
| RAM | 8 KB | 8 KB (same) | 8 KB (same) |
| CPU Speed | 16 MIPS / 32 MHz | 16 MIPS / 32 MHz (same) | 16 MIPS / 32 MHz (same) |
| Temperature Grade | -40 °C to +125 °C (Extended) | -40 °C to +85 °C (Industrial) | -40 °C to +125 °C (Extended) |
| Operating Voltage | 2.0 V to 3.6 V | 2.0 V to 3.6 V (same) | 2.0 V to 3.6 V (same) |
| ADC Channels | Up to 13 (10-bit) | Up to 13 (10-bit, same) | Up to 13 (10-bit, same) |
| Drop-in Compatible | Reference | Yes (same die) | Yes (different Flash density) |
Key Differentiators
- Extended -40C to +125C temperature grade (vs PIC24FJ64GA004-I/ML)
- Full 64 KB Flash density (vs PIC24FJ48GA004-E/ML)
- Wide on-chip peripheral mix with PMP (vs dsPIC33EP64GP504)
Design Notes
Estimated: PIC24FJ64GA004-E/ML power at 32 MHz active mode draws ~15 mA at 3.3 V. Place a 10 µF ceramic capacitor on Vcap (pin 44) to ground within 5 mm of the pad - omitting this capacitor is the #1 bring-up failure mode. Add a 0.1 µF ceramic bypass on each VDD pin (15, 25, 42) within 2 mm of the package to suppress switching noise during PWM transitions. The internal 1.8 V LDO will not regulate without the Vcap bulk capacitor, causing erratic POR behavior.
MCLR (pin 41) must be pulled to VDD through a 10 kΩ resistor and decoupled with a 100 nF capacitor to ground - leaving MCLR floating causes spurious resets. JTAG pins (TCK/TDO) on RA4/RA5 should be left floating in production if unused, or pulled to known state to prevent injection of debug data on these pins. For low-power design, configure all unused I/O as outputs driving low (not high-Z) to minimize current leakage through the ESD diodes.
The 44-QFN (8x8 mm) package has an exposed thermal pad on the underside that MUST be soldered to a corresponding copper pad on the PCB for mechanical reliability and thermal dissipation. Recommended thermal pad is 5.5x5.5 mm with 9 thermal vias (0.3 mm drill) on a 1.0 mm grid connecting to the inner ground plane. Decoupling capacitors should be placed as close as possible to the VDD/VSS pairs along the package perimeter to minimize supply loop inductance.
Compliance Information
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified; for automotive use select PIC24FJ64GA004-E/ML-Q1 or migrate to dsPIC33. Halogen-free status not explicitly stated in datasheet.
