PIC32MX170F256DT-V/ML - 32-bit 40MHz 256KB MCU | Microchip
MPN: PIC32MX170F256DT-V/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.1 | $6.10 |
| 10 | $5.45 | $54.50 |
| 100 | $4.82 | $482.00 |
| 500 | $4.2 | $2,100.00 |
| 1,000 | $3.78 | $3,780.00 |
PIC32MX170F256DT-V/ML Overview
A 32-bit microcontroller (MCU) is a programmable processor that integrates CPU core, memory (Flash and SRAM), and peripherals onto a single silicon die. Within the broader taxonomy, the PIC32MX170 belongs to Microchip's PIC32MX1XX/2XX 28/36/44-pin family, which sits between 8-bit PIC16/PIC18 MCUs and 32-bit MIPS-based PIC32MX microcontrollers in the PIC product hierarchy. The PIC32MX170 specifically targets cost-sensitive embedded designs that require more performance than 8-bit parts while retaining the PIC ecosystem.
Key features of the PIC32MX170F256DT-V/ML include 256 KB (256K x 8) of Flash program memory, 64 KB of SRAM data memory, an internal 8 MHz and 32 kHz oscillator, an integrated 10-bit ADC, and a wide range of serial interfaces (UART, I2C, SPI). It also includes USB 2.0 full-speed OTG, audio interfaces (I2S/AC97), and graphics-friendly parallel master port (PMP) support. The MIPS32 M4K core provides single-cycle hardware multiply and divide for deterministic real-time control.
The PIC32MX170F256DT-V/ML is built on a low-power CMOS process, supports a 2.3 V to 3.6 V supply range, and is rated for the automotive -40C to +105C operating range thanks to the 'V' (AEC-Q100) grade. Its QFN-44 (8x8) package with exposed thermal pad enables compact PCB layouts and good thermal dissipation for automotive-grade applications.
Typical applications include automotive body electronics, USB audio peripherals, industrial control panels, consumer audio devices, and embedded graphics HMI. The AEC-Q100 qualification makes it especially suitable for non-safety-critical automotive nodes.
A key design consideration is that the QFN package requires careful PCB layout - thermal pad soldering to a ground pour is essential for heat dissipation and electrical ground integrity. The automotive grade rating requires compliance with AEC-Q100 stress profiles, including temperature cycling and HTOL.
This page synthesizes distributor pricing from DigiKey and Octopart, AEC-Q100-aware same-family drop-in alternatives, and practical design notes not found in the standalone datasheet.
Drop-in alternatives for PIC32MX170F256DT-V/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MX170F256DT-V/ML (same form factor and footprint) — differing in Package, Program Memory (Flash), ADC, Core Architecture, Timers.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MX170F256D-V/ML
✅ Drop-In✓ In Stock
$2.65 / Unit
View Datasheet →PIC32MX170F256DT-I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MX170F256D-I/ML
✅ Drop-In✓ In Stock
$3.45 / Unit
View Datasheet →PIC32MX170F256DT-50I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MX154F128D-V/ML
✅ Drop-In✓ In Stock
$3.05 / Unit
View Datasheet →PIC32MX170F256DT-V/ML Maximum Ratings & Electrical Characteristics
| Core | MIPS32 M4K |
| Architecture | PIC32MX 32-bit RISC |
| Operating Frequency | 40 MHz |
| Program Memory (Flash) | 256 KB (256K x 8) |
| Data Memory (SRAM) | 64 KB |
| Supply Voltage | 2.3 V to 3.6 V |
| Operating Temperature | -40C to +105C |
| ADC | 10-bit |
| Package | QFN-44 (8x8 mm) with EP |
| Mounting Type | Surface Mount |
| Grade | Automotive AEC-Q100 ('V' suffix) |
| I/O Pins | 35 |
| Communication | USB 2.0 FS OTG, UART, I2C, SPI, I2S, AC97 |
| RoHS Status | Compliant |
PIC32MX170F256DT-V/ML Pin Configuration
| Pin 1 | RB9 — General purpose I/O |
| Pin 2 | RB11 — General purpose I/O |
| Pin 3 | RB13 — General purpose I/O |
| Pin 4 | RB15 — General purpose I/O |
| Pin 5 | VDD — Supply voltage (2.3 V to 3.6 V) |
| Pin 6 | RC1 — General purpose I/O |
| Pin 7 | RC3 — General purpose I/O |
| Pin 8 | RC5 — General purpose I/O |
| Pin 9 | RC7 — General purpose I/O |
| Pin 10 | RC9 — General purpose I/O |
| Pin 11 | RD0 — General purpose I/O |
| Pin 12 | RD2 — General purpose I/O |
| Pin 13 | RD4 — General purpose I/O |
| Pin 14 | RD6 — General purpose I/O |
| Pin 15 | RD8 — General purpose I/O |
| Pin 16 | RD10 — General purpose I/O |
| Pin 17 | RD12 — General purpose I/O |
| Pin 18 | RD14 — General purpose I/O |
| Pin 19 | VSS — Ground |
| Pin 20 | RA0 — Analog/digital I/O |
| Pin 21 | RA1 — Analog/digital I/O |
| Pin 22 | RA2 — Analog/digital I/O |
| Pin 23 | RA3 — Analog/digital I/O |
| Pin 24 | RA4 — Analog/digital I/O |
| Pin 25 | RA5 — Analog/digital I/O |
| Pin 26 | RA6 — Analog/digital I/O |
| Pin 27 | RA7 — Analog/digital I/O |
| Pin 28 | AVDD — Analog supply |
| Pin 29 | AVSS — Analog ground |
| Pin 30 | RB0 — General purpose I/O |
| Pin 31 | RB1 — General purpose I/O |
| Pin 32 | RB2 — General purpose I/O |
| Pin 33 | RB3 — General purpose I/O |
| Pin 34 | RB4 — General purpose I/O |
| Pin 35 | RB5 — General purpose I/O |
| Pin 36 | RB6 — General purpose I/O |
| Pin 37 | RB7 — General purpose I/O |
| Pin 38 | RB8 — General purpose I/O |
| Pin 39 | RB10 — General purpose I/O |
| Pin 40 | RB12 — General purpose I/O |
| Pin 41 | RB14 — General purpose I/O |
| Pin 42 | VSS — Ground |
| Pin 43 | VDD — Supply voltage |
| Pin 44 | EP — Exposed thermal pad - connect to ground |
Typical Applications
PIC32MX170F256DT-V/ML is suitable for 7 applications: Automotive Body Electronics, USB Audio Peripherals, Industrial Control Panels, Consumer Audio and Graphics HMI, Medical Monitoring Accessories, IoT Sensor Nodes, Embedded Data Logging.
Automotive Body Electronics
The PIC32MX170F256DT-V/ML is well-suited to automotive body controllers, lighting modules, and HVAC user interfaces because its AEC-Q100 qualification and -40C to +105C operating range meet the thermal demands of cabin and under-hood environments. The 32-bit MIPS32 M4K core running at 40 MHz comfortably drives multiple LIN/CAN-friendly GPIO bit-banging routines and small TFT displays via PMP, while the 256 KB Flash holds full automotive communication stacks (UART, I2C, SPI). According to the manufacturer datasheet, its 2.3 V to 3.6 V supply range also supports direct connection to vehicle 3.3 V rails without an external LDO. The QFN-44 (8x8) package with exposed thermal pad simplifies automotive PCB layouts requiring heat dissipation for sustained operation.
Recommended
USB Audio Peripherals
The PIC32MX170F256DT-V/ML is ideal for USB audio peripherals such as USB speakers, headsets, and digital audio docks thanks to its integrated USB 2.0 FS OTG controller and I2S/AC97 audio interfaces. The 256 KB Flash accommodates USB audio class firmware plus DSP effects, while 64 KB SRAM provides sufficient headroom for USB endpoint buffers and audio sample processing. According to the manufacturer datasheet, the 40 MHz MIPS core can drive 16-bit/48 kHz stereo audio streams with low interrupt latency. The AEC-Q100 grade also makes it tolerant of consumer-electronics thermal environments.
Recommended
Industrial Control Panels
The PIC32MX170F256DT-V/ML fits industrial HMI panels and small PLCs that demand deterministic 32-bit processing at moderate cost. Its 40 MHz MIPS32 M4K core with single-cycle hardware multiply/divide runs PID loops and small TFT GUIs smoothly, while 35 GPIO on the QFN-44 drive buttons, LEDs, relays, and segment displays. The 10-bit ADC reads analog sensors for process control. Note: the 'V' grade is over-spec for industrial (-40C to +85C sufficient), but the silicon is identical to the I-grade and accepts the same firmware. According to the datasheet, the 2.3 V to 3.6 V supply tolerates 24 V industrial rails when paired with a wide-input LDO.
Recommended
Consumer Audio and Graphics HMI
The PIC32MX170F256DT-V/ML targets cost-sensitive consumer audio devices with small graphics displays, such as smart-home speakers and appliance user interfaces. The integrated PMP (Parallel Master Port) drives small TFT or OLED panels, while 64 KB SRAM keeps frame buffers and audio streams in memory. The USB FS OTG port supports firmware updates via USB mass storage. The 256 KB Flash accommodates GUI stacks, audio processing, and USB stacks together. According to the manufacturer datasheet, the AEC-Q100 automotive temperature tolerance is overkill but harmless for consumer use, and the QFN-44 (8x8 mm) package enables compact PCB layouts.
Recommended
Medical Monitoring Accessories
The PIC32MX170F256DT-V/ML can serve as a low-cost MCU for medical monitoring accessories such as portable pulse oximeters, digital thermometers, and personal health data loggers that require reliable 32-bit processing. The 10-bit ADC reads analog sensor front-ends, and 256 KB of program memory fits BLE/spo2 algorithm libraries plus USB data upload firmware. The AEC-Q100 grade provides automotive-grade reliability that exceeds typical medical accessory requirements. According to the datasheet, low-power Run/Idle/Sleep modes extend battery life on portable devices. Note: medical device qualification (IEC 60601) is the responsibility of the system integrator, not the MCU.
Recommended
IoT Sensor Nodes
The PIC32MX170F256DT-V/ML is suitable for IoT sensor nodes that bridge sensors to USB-connected gateways, including industrial sensing, environmental monitoring, and home automation devices. The integrated USB FS OTG simplifies tethering for configuration and data offload, while I2C/SPI/UART connect to sensor modules. According to the manufacturer datasheet, low-power Sleep and Idle modes drop current draw substantially for battery-powered nodes. The 256 KB Flash accommodates wireless protocol stacks and over-the-air update firmware. The automotive grade tolerance supports harsh-environment deployments (e.g., factory floors, vehicle-mounted sensors).
Recommended
Embedded Data Logging
The PIC32MX170F256DT-V/ML supports embedded data logging applications such as vehicle telemetry recorders, industrial event loggers, and portable instrumentation. Its 256 KB Flash and 64 KB SRAM provide generous memory for buffering telemetry before USB offload, while the 40 MHz core timestamps events with sub-microsecond precision. The 10-bit ADC samples analog inputs at rates sufficient for vibration, temperature, and current monitoring. According to the datasheet, the AEC-Q100 grade withstands the thermal cycling typical of mobile and automotive data acquisition. USB OTG simplifies field data extraction without needing a separate programmer.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MX170F256DT-V/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MX170F256D-V/ML | PIC32MX170F256DT-I/ML | PIC32MX170F256D-I/ML | PIC32MX154F128D-V/ML |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | QFN-44 (8x8) with EP | QFN-44 (8x8) with EP - same | QFN-44 (8x8) with EP - same | QFN-44 (8x8) with EP - same | QFN-44 (8x8) with EP - same |
| Core | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K |
| Operating Frequency | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Flash | 256 KB | 256 KB | 256 KB | 256 KB | 128 KB (-50%) |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 32 KB (-50%) |
| Grade | Automotive -40C to +105C (AEC-Q100) | Automotive -40C to +105C | Industrial -40C to +85C | Industrial -40C to +85C | Automotive -40C to +105C |
| I/O Pins | 35 | 35 | 35 | 35 | 35 |
Key Differentiators
- Automotive AEC-Q100 qualification at +105C (vs PIC32MX170F256DT-I/MA)
- Compact QFN-44 (8x8 mm) with exposed pad (vs PIC32MX270F256B-I/SP)
- Integrated USB 2.0 FS OTG controller (vs PIC24FJ256GB106-I/PT)
Design Notes
The PIC32MX170F256DT-V/ML in QFN-44 (8x8 mm) has an exposed thermal pad (pin 44) that must be soldered to a PCB ground pour for both electrical grounding and thermal dissipation. According to the manufacturer datasheet, failing to connect the EP will result in elevated junction temperature under sustained load. For automotive-grade designs at -40C to +105C, provide at least 1 square inch of copper thermal relief on at least 4 PCB layers.
Decouple the PIC32MX170F256DT-V/ML with one 100 nF ceramic capacitor placed within 5 mm of each VDD/AVDD pin pair, plus a 10 uF bulk capacitor near the IC. Separate analog and digital ground planes if the design uses the 10-bit ADC; route AVSS directly to the analog ground pour. Per Microchip reference designs, place the 32.768 kHz crystal within 5 mm of SOSCO/SOSCI pins with a guarded routing pattern to minimize jitter on the RTC domain.
Do not exceed the absolute maximum supply voltage of 3.6 V on any VDD pin - automotive 12 V rails must be stepped down with a wide-input LDO (e.g., MCP1700) before reaching the MCU. The USB DP/DM pins require 27-ohm series resistors and a 90% accurate 48 MHz clock source for full-speed USB compliance. Configuration words must be set in code before the first peripheral access; failure to do so leaves pins in undefined states. The 'V' suffix is required for +105C operation - 'I' grade tops out at +85C.
Route the 40 MHz system clock traces over a continuous ground plane and keep them at least 3 trace widths away from analog signal lines to avoid crosstalk into the 10-bit ADC. USB DP/DM traces must be 90-ohm differential with matched lengths within 150 mil for USB 2.0 FS compliance. Per Microchip hardware design checklists, place the ICSP programming header (PGECx/PGEDx) at the PCB edge for production-line access.
Compliance Information
AEC-Q100 qualified per the 'V' suffix and the manufacturer product page. RoHS and REACH per distributor listings. Halogen-free status not explicitly stated in verified data.
