PIC32MX250F256L-V/PF - 32-bit 256KB Flash MCU 100-pin | Microchip
MPN: PIC32MX250F256L-V/PF ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7.32 | $7.32 |
| 10 | $6.59 | $65.90 |
| 100 | $5.85 | $585.00 |
| 500 | $5.12 | $2,560.00 |
| 1,000 | $4.51 | $4,510.00 |
| 3,000 | $3.4 | $10,200.00 |
PIC32MX250F256L-V/PF Overview
A 32-bit microcontroller (MCU) is an integrated circuit that combines a 32-bit processor core, program memory (typically Flash), data memory (SRAM), and a rich set of peripherals (ADC, timers, communication interfaces, I/O) on a single die. Within the broader taxonomy, the PIC32MX belongs to the MIPS32 M4K architecture family, which sits under microcontrollers -> embedded processors -> semiconductors. PIC32MX devices target applications that need more compute headroom than 8/16-bit MCUs while staying within the friendly MPLAB X IDE and Harmony ecosystem.
Key features of the PIC32MX250F256L-V/PF include the Peripheral Pin Select (PPS) engine that remaps digital peripheral functions onto a wide range of GPIO pins, an on-chip USB 2.0 Full-Speed OTG controller (with internal transceiver and dedicated DMA), a 16-channel 10-bit 1 Msps ADC, four UART modules, two I2C modules, five 16-bit timers/counters, an RTCC, and a CTMU (Charge Time Measurement Unit) for touch and capacitive sensing.
Architecturally, the M4K core is a 5-stage pipeline Harvard implementation with hardware multiply/divide, single-cycle multiplication, and a Prefetch Cache module to hide Flash latency. The 256 KB Flash is organized as 256K x 8 with ECC, and the 32 KB SRAM supports DMA access for high-throughput peripherals such as USB and PMP. The integrated 3.3V LDO allows single-rail operation from 2.3V to 3.6V.
Typical applications include USB peripherals (HID, CDC, MSD, vendor-class devices), low-cost graphics HMI using PMP to drive LCD controllers, automotive body and infotainment modules (V-temp / AEC-Q100 grade), audio codecs over I2S, and capacitive touch user interfaces using CTMU. The combination of USB, graphics PMP, and ample Flash/RAM makes it a strong fit for connected embedded products that previously required an external MCU plus USB controller.
When designing with this part, pay close attention to the V-temp grade (suffix -V/PF means -40C to +105C operation). Ensure the VBUS/USB traces follow the USB 2.0 impedance guideline (90 ohms differential) and that the USB pull-up (D+ or D-) is enabled in software only after the regulator is stable. Decouple VDD/VSS pairs with a 0.1uF ceramic per pin pair plus a bulk 4.7-10uF near the regulator.
This page synthesizes distributor pricing, AEC-Q100 grade information, drop-in same-family alternatives, and application guidance not found in a single distributor listing, giving engineers a faster path from selection to PCB bring-up.
Drop-in alternatives for PIC32MX250F256L-V/PF — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MX250F256L-V/PF (same form factor and footprint) — differing in ADC, Package, Parallel Master Port (PMP), USB, Timers.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MX250F256L-I/PF
✅ Drop-In✓ In Stock
$4.1 / Unit
View Datasheet →PIC32MX170F512L-V/PF
✅ Drop-In✓ In Stock
$5.85 / Unit
View Datasheet →PIC32MX170F512L-I/PF
✅ Drop-In✓ In Stock
$6.45 / Unit
View Datasheet →PIC32MX230F256B-V/SP
✅ Drop-In✓ In Stock
$4.1 / Unit
View Datasheet →PIC32MX150F256LT-V/PF
✅ Drop-In✓ In Stock
$5.1 / Unit
View Datasheet →PIC32MX250F256L-V/PF Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 M4K 32-bit |
| Maximum CPU Frequency | 50 MHz (83 DMIPS) |
| Program Memory (Flash) | 256 KB (256K x 8) |
| Data Memory (SRAM) | 32 KB |
| Pin Count | 100 |
| Package | TQFP-100 (14x14 mm, PF suffix) |
| Supply Voltage (VDD) | 2.3 V to 3.6 V (2.5V/3.3V typical) |
| Operating Temperature | -40C to +105C (V-temp grade) |
| USB | USB 2.0 Full-Speed OTG, on-chip transceiver |
| SPI Modules | 4 |
| I2S Modules | 2 |
| UART Modules | 4 |
| I2C Modules | 2 |
| ADC | 10-bit, up to 1 Msps, 16 channels |
| Timers | 5 x 16-bit Timer/Counter |
| PMP (Parallel Master Port) | Yes, with dual read/write buffers |
| PPS (Peripheral Pin Select) | Yes |
| CTMU | Yes (Charge Time Measurement Unit) |
| DMA Channels | 8 (4 dedicated + 4 configurable) |
| AEC-Q100 | Qualified |
| RoHS | Compliant |
PIC32MX250F256L-V/PF tqfp-100 (14x14 mm, pf suffix) Pin Configuration Guide
Pin configuration for PIC32MX250F256L-V/PF (tqfp-100 (14x14 mm, pf suffix) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for PIC32MX250F256L-V/PF.
Refer to the datasheet for full pin configuration.
Typical Applications
PIC32MX250F256L-V/PF is suitable for 6 applications: USB Human Interface Devices (HID), Low-Cost Graphics HMI with PMP, Automotive Body and HVAC Modules, Audio Codec Control via I2S, Capacitive Touch User Interface, Industrial Sensor Hub with USB Logging.
USB Human Interface Devices (HID)
The PIC32MX250F256L-V/PF is a strong fit for USB HID peripherals such as keyboards, mice, game controllers, and custom input devices. The integrated USB 2.0 Full-Speed OTG controller with internal transceiver and dedicated DMA removes the need for an external bridge IC, while the 50 MHz MIPS32 M4K core (83 DMIPS) easily handles HID class drivers plus housekeeping. The 256 KB Flash leaves headroom for vendor-specific extensions (bootloader, macros, profiles) and the 32 KB SRAM can sustain HID report buffers plus a USB stack. Pair the part with the Microchip Harmony USB device stack to ship a HID device in a 100-pin TQFP-only BOM.
Recommended
Low-Cost Graphics HMI with PMP
The Parallel Master Port (PMP) with dual read/write buffers makes the PIC32MX250F256L-V/PF a natural choice for low-cost graphics HMI driving small TFT panels through 8080/6800 controllers. The 100-pin TQFP exposes a wide data bus plus control signals on PORTD/RE/RG and the PPS module lets designers remap peripherals to optimize PCB routing. Combined with the 32 KB SRAM for tile decompression and the 83 DMIPS of compute for GUI composition, this part fits appliance dashboards, POS terminals, and home-automation panels. Microchip's MPLAB Harmony Graphics suite shortens GUI development.
Recommended
Automotive Body and HVAC Modules
The PIC32MX250F256L-V/PF is AEC-Q100 qualified and rated -40C to +105C, making it suitable for automotive body controllers, HVAC control panels, mirror modules, lighting controllers, and infotainment auxiliary boards. The 100-pin TQFP provides enough GPIO to drive relay drivers, LIN/MCP2515 CAN bridges, and LED matrices, while the 256 KB Flash covers AUTOSAR-lite or OEM-specific firmware. The PPS engine is invaluable for routing 4 UARTs (LIN stacks), 2 I2C (sensor hubs), and CTMU touch buttons without pin-bleed. AEC-Q100 PPAP packages are available from Microchip on request for OEM programs.
Recommended
Audio Codec Control via I2S
With two I2S modules plus DMA, the PIC32MX250F256L-V/PF can act as a digital audio bridge or codec controller in low-cost audio products. Typical roles include USB audio class 1.0/2.0 playback, S/PDIF bridging, or signal-processing front-ends. The 50 MHz core runs DSP-style volume, EQ, and limiter code in real time at 48 kHz, while the 32 KB SRAM buffers small I2S bursts. Pair with an external I2S DAC and the USB host stack to build a USB-to-I2S dongle without an external audio controller.
Recommended
Capacitive Touch User Interface
The on-chip CTMU (Charge Time Measurement Unit) turns the PIC32MX250F256L-V/PF into a low-cost capacitive-touch controller for sliders, wheels, and discrete button panels. CTMU works with any GPIO so designers can route touch sensors across the 100-pin TQFP, and the 32 KB SRAM holds debounce and gesture state machines. Combined with the USB OTG controller the same part can deliver a USB-touch interface to a host PC. The 83 DMIPS throughput supports real-time gesture recognition without an external touch IC.
Recommended
Industrial Sensor Hub with USB Logging
The PIC32MX250F256L-V/PF is well-suited to industrial sensor hubs that aggregate UART/I2C/SPI sensor data and stream it over USB to a host or store it on USB mass storage. The four UART, two I2C, and four SPI modules cover almost any sensor tree, and the USB 2.0 Full-Speed OTG controller plus Microchip USB MSD host stack allow direct USB-stick logging without an external bridge. PPS enables flexible routing so designers can break out the pinout without bus contention, and the 256 KB Flash holds USB stacks plus sensor protocol libraries. AEC-Q100 plus V-temp also covers non-condensing industrial environments.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MX250F256L-V/PF — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MX250F256L-I/PF | PIC32MX170F512L-V/PF | PIC32MX170F512L-I/PF | PIC32MX230F256B-V/SP | PIC32MX150F256LT-V/PF |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | TQFP-100 (14x14, PF) | TQFP-100 (14x14, PF) - same | TQFP-100 (14x14, PF) - same | TQFP-100 (14x14, PF) - same | TQFP-100-equivalent family | TQFP-100 (14x14, PF) - same |
| Core | MIPS32 M4K 50 MHz (83 DMIPS) | MIPS32 M4K 50 MHz | MIPS32 M4K 50 MHz | MIPS32 M4K 50 MHz | MIPS32 M4K 50 MHz | MIPS32 M4K 50 MHz |
| Flash | 256 KB | 256 KB (same) | 512 KB (+100%) | 512 KB (+100%) | 256 KB (same) | 256 KB (same) |
| SRAM | 32 KB | 32 KB (same) | 64 KB (+100%) | 64 KB (+100%) | 32 KB (same) | 32 KB (same) |
| Operating Temperature | -40C to +105C (V-temp) | -40C to +85C (I-temp) | -40C to +105C (V-temp) | -40C to +85C (I-temp) | -40C to +105C (V-temp) | -40C to +105C (V-temp) |
| USB | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG |
| AEC-Q100 | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified |
Key Differentiators
- Higher Flash headroom with identical pinout (vs PIC32MX170F512L-V/PF)
- Wider V-temp operating range for automotive (vs PIC32MX250F256L-I/PF)
- More SRAM for graphics buffers (vs PIC32MX230F256B-V/SP)
Design Notes
Power the PIC32MX250F256L-V/PF from a single 2.3 V to 3.6 V rail on VDD; the on-chip 3.3 V LDO supplies the core. Place one 0.1 uF ceramic decoupling capacitor on each VDD/VSS pair as close as physically possible to the pin pairs, plus a single 4.7 uF to 10 uF bulk tantalum or ceramic near the part. The VBUS pin for USB requires 5 V input per USB spec; use a low-dropout LDO (such as MCP1825) or a power switch to derive VBUS from the system rail while allowing host negotiation.
Route the USB D+ and D- differential pair as a 90 ohm differential impedance match with ground reference, keeping the trace length under 50 mm and avoiding splits in the reference plane. Place the 15 kohm pull-down on D- (device mode) or the 1.5 kohm pull-up on D+ (host/device) per the USB spec, and ensure the ESD protection (such as USBLC6-2SC6) is placed within 3 mm of the USB connector. Place the 12 MHz crystal within 8 mm of the OSC1/OSC2 pins and guard the traces with a grounded keep-out region.
Do not confuse the -V (V-temp, -40C to +105C) and -I (I-temp, -40C to +85C) suffixes; -V is required for automotive or industrial-thermal designs. Always enable the Prefetch Cache and use the FLASH_WAIT states recommended in the datasheet for the chosen CPU clock. The PPS function must be unlocked by writing the PPS unlock sequence before peripheral remapping; calling PPS before the unlock is a common bring-up bug. Configure the JTAG/ICSP pins as analog or digital inputs with the on-chip pull-ups disabled when not using a debugger, to avoid leakage.
The 100-pin TQFP (14x14 mm, 0.5 mm pitch) requires fine-pitch SMT assembly. Use a 4-layer stack-up with continuous ground plane under the part, and provide a copper pad with thermal vias beneath the exposed pad (if present on the specific package variant) tied to ground. Keep high-current switching nodes (relay drivers, MOSFET gates) away from the analog AVdd/AVss pins and route them on a separate layer. Provide a 4.7 kohm pull-up on SDA and SCL lines, and place a 1 kohm pull-up on MCLR tied to a low-leakage reference; long MCLR traces can pick up noise and trigger false resets.
Compliance Information
AEC-Q100 qualified per Microchip PIC32MX automotive grade documentation. RoHS and REACH compliant per Microchip product page. Halogen-free status not explicitly stated in the verified data; marked unknown.
