PIC32MX254F128DT-I/ML - 72MHz 128KB Flash 32-bit MCU | Microchip
MPN: PIC32MX254F128DT-I/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.28 | $4.28 |
| 10 | $3.82 | $38.20 |
| 100 | $3.4 | $340.00 |
| 500 | $2.99 | $1,495.00 |
| 1,000 | $2.62 | $2,620.00 |
PIC32MX254F128DT-I/ML Overview
A PIC microcontroller (MCU) is a single-chip microprocessor with integrated Flash program memory, SRAM, peripherals, and I/O. The PIC32MX family extends Microchip's legacy PIC16/PIC24 architecture to the MIPS32 M4K core, enabling 32-bit register operations, single-cycle multiply, and full C compilers while preserving the deterministic interrupt model. PIC32MX254F128D parts sit in the lower-power XLP tier, optimized for battery and USB-powered embedded designs that require USB, graphics, or audio interfaces.
Key features include 16 KB I/O memory, a 10-bit 1 Msps ADC, five 16-bit timers, four DMA channels, two I2C, two SPI, and four UART (one with IrDA), plus PPS (Peripheral Pin Select) for flexible signal routing. Internal 8 MHz and 32 kHz oscillators are supported, and the 8 MHz RC can be multiplied via PLL to reach the 72 MHz top frequency. The XLP technology deep-sleep current is in the microamp range, enabling years of operation from a coin cell.
Typical applications include USB peripherals (HID, CDC, audio class), low-cost graphics terminals with PMP, sensor hubs, home automation nodes, and battery-backed IoT endpoints. The USB PHY, 3 comparators, and CTMU enable capacitive-touch user interfaces without external ICs, while the RTCC plus XLP sleep keep standby power under 1 microamp.
When designing with this part, keep in mind the 44-QFN requires a 0.4 mm pitch PCB land pattern and an exposed pad that must be soldered to a sufficient copper area for thermal relief and ground return. USB DP/DM traces must be 90 ohm differential and length-matched. Always reference Microchip MPLAB X IDE and Harmony framework configuration for clock, USB stack, and RTCC initialization.
Drop-in alternatives for PIC32MX254F128DT-I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MX254F128DT-I/ML (same form factor and footprint) — differing in Package, ADC, Operating Temperature, Timers, MSL Level.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MX254F128D-I/ML
✅ Drop-In✓ In Stock
$2.65 / Unit
View Datasheet →PIC32MX254F128D-I/PT
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →PIC32MX250F128DT-I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MX174F256DT-I/ML
✅ Drop-In✓ In Stock
$2.55 / Unit
View Datasheet →PIC32MX230F256DT-I/ML
✅ Drop-In✓ In Stock
$3.31 / Unit
View Datasheet →PIC32MX154F128DT-I/ML
✅ Drop-In✓ In Stock
$1.4 / Unit
View Datasheet →PIC32MX254F128DT-I/ML Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 M4K 32-bit |
| Maximum Core Frequency | 72 MHz |
| Performance | 1.56 DMIPS/MHz |
| Program Flash Memory | 128 KB (128K x 8) |
| Data SRAM | 32 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| Operating Temperature Range | -40 C to +85 C (Industrial) |
| Package | 44-pin QFN (8x8 mm) Exposed Pad |
| USB Interface | USB 2.0 Full-Speed Device |
| ADC | 10-bit, up to 1 Msps |
| Analog Comparators | 3 |
| CTMU | Yes (charge time measurement unit) |
| RTCC | Real-Time Clock Calendar |
| Timers | 5 x 16-bit |
| DMA Channels | 4 |
| I2C / SPI / UART | 2 / 2 / 4 (1 with IrDA) |
| Peripheral Pin Select | Yes |
| Mounting Type | Surface Mount |
| MSL Level | 1 |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| PIC Series | PIC32MX1XX/2XX 44-pin |
PIC32MX254F128DT-I/ML 44-pin qfn (8x8 mm) exposed pad Pin Configuration Guide
Pin configuration for PIC32MX254F128DT-I/ML (44-pin qfn (8x8 mm) exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for PIC32MX254F128DT-I/ML.
Refer to the datasheet for full pin configuration.
Typical Applications
PIC32MX254F128DT-I/ML is suitable for 6 applications: USB HID / CDC Peripherals, Capacitive Touch User Interfaces, Battery-Backed IoT Sensor Hubs, Low-Cost Graphics Terminals (PMP), Audio Class USB Devices, Industrial Sensor Conditioning & Control.
USB HID / CDC Peripherals
The PIC32MX254F128DT-I/ML is ideal for USB HID and CDC peripherals because it integrates a USB 2.0 Full-Speed device controller with on-chip transceiver, eliminating external PHY parts. The 72 MHz MIPS32 M4K core delivers 1.56 DMIPS/MHz, easily handling USB polling at 1 kHz with headroom for HID report generation and command processing. The 128 KB Flash and 32 KB SRAM fit HID descriptors, CDC class buffers, and application state. Placed on a USB DP/DM pair with 90 ohm differential routing and ESD protection (e.g., USBLC6-2SC6), the part enumerates as a USB device without external pull-up resistors - the internal D+ pull-up is firmware-enabled. Designers should add a 10 microfarad bulk capacitor on VBUS and route VUSB to the dedicated VUSB pin.
Recommended
Capacitive Touch User Interfaces
The PIC32MX254F128DT-I/ML suits capacitive touch UI panels thanks to its integrated CTMU (Charge Time Measurement Unit) and three analog comparators. The CTMU produces a calibrated current source and measures charge time on a sensor pad via ADC or comparator, enabling robust self- and mutual-capacitance sensing. The 32 KB SRAM holds a debounce/multi-touch state machine, while 128 KB Flash stores the mTouch Harmony middleware. The XLP technology keeps sleep current below 1 microamp, enabling battery-powered remote controls and appliance panels with months of standby life. With 72 MHz MIPS32 performance the part also drives a small TFT via PMP, allowing touch-and-display designs in a single IC. Reference designs are available in Microchip AN1375.
Recommended
Battery-Backed IoT Sensor Hubs
The PIC32MX254F128DT-I/ML fits battery-backed IoT sensor hubs because of its XLP low-power architecture and integrated RTCC. Deep-sleep current is in the microamp range, so a 3V coin cell (CR2032) can supply the part for years while it periodically wakes to read sensors over I2C/SPI. The RTCC schedules wake events down to 1-second resolution, and the 4 DMA channels offload I2C sensor reads without CPU intervention. The 72 MHz core handles on-board signal conditioning before reporting over BLE, LoRa, or Wi-Fi co-processor UART. USB is available for firmware update and battery charging via a dedicated charger IC. The 44-QFN exposed pad provides adequate thermal dissipation for typical sub-100 mA peak loads in IoT hubs.
Recommended
Low-Cost Graphics Terminals (PMP)
The PIC32MX254F128DT-I/ML drives low-cost graphics terminals through its Parallel Master Port (PMP) interface, which directly addresses external SRAM and connects to small TFTs. At 72 MHz with 32 KB internal SRAM and 128 KB Flash, the part supports Microchip's Graphics Library rendering text and simple widgets on QVGA panels. The DMA channels free the CPU for incremental screen updates, while CTMU plus comparators enable touch overlays. Industrial -40C to +85C operation allows factory-floor HMI deployment. The 44-QFN keeps the footprint compact (8x8 mm), and USB enables firmware updates in the field. Designers should add a 16 MB SPI Flash for full-screen bitmaps.
Recommended
Audio Class USB Devices
The PIC32MX254F128DT-I/ML serves as a USB Audio Class 1.0 device (speaker or microphone) because the USB device controller and 72 MHz core handle isochronous USB transfers at 1 ms frame rate. The 10-bit ADC (with DMA) captures microphone audio at 16 kHz, and PWM plus DMA outputs audio to a class-D amplifier stage. The 32 KB SRAM doubles as audio sample buffer, and the DMA chains move samples without CPU load. The XLP deep-sleep mode supports headphone detection and standby. USB bus-powered designs are simplified by the internal 3.3V regulator option on selected variants. Reference design AN1427 documents a USB speaker implementation.
Recommended
Industrial Sensor Conditioning & Control
The PIC32MX254F128DT-I/ML is well-suited to industrial 4-20 mA loop-powered sensor conditioners thanks to its industrial -40C to +85C range, 10-bit 1 Msps ADC, and three analog comparators for window detection. The 72 MHz core performs linearization, scaling, and HART-style modulation in software, while the CTMU produces a stable current source for RTD or thermistor excitation. The 5 timers drive PWM outputs for proportional valve control, and the UARTs connect to RS-485 transceivers. The 44-QFN exposes enough I/O for up to 35 GPIO plus 5 PPS-remappable peripherals, supporting multi-channel sensor boards. Galvanic isolation is recommended upstream.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MX254F128DT-I/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MX254F128D-I/ML | PIC32MX254F128D-I/PT | PIC32MX250F128DT-I/ML | PIC32MX174F256DT-I/ML | PIC32MX230F256DT-I/ML | PIC32MX154F128DT-I/ML |
|---|---|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm) | 44-QFN (8x8 mm) - same | 44-TQFP (10x10) - different | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Maximum Core Frequency | 72 MHz | 72 MHz | 72 MHz | 50 MHz | 72 MHz | 50 MHz | 50 MHz |
| Program Flash Memory | 128 KB | 128 KB | 128 KB | 128 KB | 256 KB | 256 KB | 128 KB |
| Data SRAM | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| Operating Voltage Range | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| USB Interface | USB 2.0 FS Device | USB 2.0 FS Device | USB 2.0 FS Device | USB 2.0 FS Device | USB 2.0 FS Device | USB 2.0 FS Device | USB 2.0 FS Device |
| ADC | 10-bit 1 Msps | 10-bit 1 Msps | 10-bit 1 Msps | 10-bit 1 Msps | 10-bit 1 Msps | 10-bit 1 Msps | 10-bit 1 Msps |
| CTMU | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Approx. Qty-1 Price | $4.28 | $4.40 | $4.40 | $3.95 | $4.85 | $4.55 | $3.85 |
Key Differentiators
- Highest core frequency in PIC32MX 44-pin QFN family (vs PIC32MX250F128DT-I/ML)
- QFN-44 footprint matches multiple cross-grade paths (vs PIC32MX174F256DT-I/ML)
- CTMU plus 3 comparators enable capacitive touch with no external ICs (vs PIC32MX154F128DT-I/ML)
Design Notes
Estimated: The 44-QFN (8x8 mm) has a 0.65 mm pitch land pattern. Use an NSMD (non-solder mask defined) pad with 0.30 mm copper pad and 0.45 mm solder mask opening. Stencil aperture of 0.27 mm with 0.10 mm thickness and a 4x4 dot array (each dot 0.5 mm) on the center exposed pad maximizes voiding below 10%. Per IPC-7527, the center pad thermal via array (0.3 mm drill, 0.5 mm pitch, 9 vias minimum) provides both ground return and thermal relief.
Do not leave the USB DP/DM traces unmatched or impedance-uncoupled: 90 ohm differential impedance with length matching within 150 mil is mandatory per USB 2.0 spec. Place the ESD protection diode (e.g., USBLC6-2SC6) within 3 mm of the USB connector. Always tie VUSB to VDD when USB is used, and add a 0.1 microfarad decoupling capacitor on VUSB. Skipping these steps is a top cause of USB enumeration failures in PIC32 designs.
Estimated: at 72 MHz and 3.3V the active current is about 30 mA, and the deep-sleep current is below 1 microamp. To reach XLP target deep-sleep currents, disable all unused peripherals via the PMD register, gate the system PLL during sleep, and configure the RTCC as the sole wake source. Place a 10 microfarad bulk plus 0.1 microfarad ceramic decoupling capacitor adjacent to each VDD pin; this combination typically keeps VDD ripple below 50 mV during USB suspend/resume transients.
Route the JTAG/SWD signals (TCK, TMS, TDO, TDI) away from USB DP/DM and high-current switching traces. Keep the 32 kHz crystal traces short and symmetric to within 1 mm of the SOSC pins. The exposed pad must be soldered to a continuous ground plane; any thermal relief on the EP defeats the ground return for USB and CTMU analog sections.
Compliance Information
RoHS compliant per Microchip product page; -I industrial temperature range; not AEC-Q100 qualified for automotive; choose PIC32MX254F128DT-V/ML or TBD automotive qualified variants for automotive use.
