PIC32MX274F256BT-V/MM - 32-bit MCU 256KB Flash 72MHz | Microchip
MPN: PIC32MX274F256BT-V/MM ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.42 | $4.42 |
| 10 | $3.98 | $39.80 |
| 100 | $3.51 | $351.00 |
| 500 | $3.1 | $1,550.00 |
| 1,000 | $2.78 | $2,780.00 |
PIC32MX274F256BT-V/MM Overview
A 32-bit microcontroller (MCU) is a single-chip computer that integrates a 32-bit CPU core, Flash program memory, SRAM data memory, and configurable peripherals. The PIC32MX27x family brings lower power run, sleep, and deep-sleep currents to the PIC32MX lineage while raising the maximum frequency of 28- and 44-pin devices to 72MHz, making it well suited for battery-powered and space-constrained designs.
Key features of this part include 256KB Flash (256K x 8) plus 64KB RAM, a USB 2.0 Full-Speed device/host/OTG transceiver on-chip, a 10-bit 1.1Msps ADC with up to 13 analog inputs, five 16-bit timers/counters, two comparators, and a Peripheral Pin Select (PPS) subsystem that maps digital peripherals to any GPIO. PIC XLP technology delivers typical deep-sleep currents in the sub-microamp range and run currents around 20 mA/MIPS, allowing years of operation from a single coin cell.
The device is built on a 5-stage pipeline MIPS32 M4K core with hardware multiply/divide and a single-cycle Flash read path, giving 1.62 DMIPS/MHz. An integrated 8 MHz internal FRC oscillator and a 96 MHz PLL reduce the need for external crystals, while the 28-VQFN with exposed pad enables PCB thermal dissipation at 72 MHz full load in compact industrial layouts.
Typical applications include USB audio devices, automotive body and infotainment subsystems (AEC-Q100 grade 1), industrial sensor hubs, consumer white goods with USB charging interfaces, and low-power IoT edge nodes. The combination of USB, ADC, and PPS makes it a flexible host or peripheral controller.
When designing, note that the -V suffix denotes the -40C to +105C automotive/industrial temperature range and that VQFN-28 (MM) is footprint-compatible with the industrial -I variant, easing design-for-cost transitions. The MM exposed pad must be soldered to the ground plane for thermal and electrical performance.
This page synthesizes distributor pricing, drop-in alternatives within the 28-VQFN footprint, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for PIC32MX274F256BT-V/MM — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MX274F256BT-V/MM (same form factor and footprint) — differing in Package, ADC, MSL Level, USB, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MX274F256B-I/MM
✅ Drop-In✓ In Stock
$3.66 / Unit
View Datasheet →PIC32MX274F256B-V/MM
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MX254F128BT-V/MM
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MX254F128BT-I/MM
✅ Drop-In✓ In Stock
$3.2 / Unit
View Datasheet →PIC32MX174F256BT-V/MM
✅ Drop-In✓ In Stock
$4.35 / Unit
View Datasheet →PIC32MX174F256B-V/MM
✅ Drop-In✓ In Stock
$3.46 / Unit
View Datasheet →PIC32MX274F256BT-V/MM Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 M4K |
| Core Frequency | 72 MHz |
| Program Memory (Flash) | 256 KB (256K x 8) |
| Data Memory (SRAM) | 64 KB |
| Operating Voltage (Vdd) | 2.3 V to 3.6 V |
| Operating Temperature | -40C to +105C (-V) |
| ADC | 10-bit, up to 13 input channels |
| USB | USB 2.0 Full-Speed Device/Host/OTG |
| Timers | 5 x 16-bit |
| Comparators | 2 |
| I2C / SPI / I2S | 4 peripherals |
| UART | Up to 6 |
| DMA Channels | 4 |
| Package | 28-QFN-S (6 x 6 mm) with exposed pad |
| Mounting Type | Surface Mount |
| MSL Level | 3 |
| RoHS Status | Compliant |
| AEC-Q100 | Qualified (Grade 1, -V suffix) |
| Low-Power Technology | PIC XLP |
| Pin Count | 28 |
PIC32MX274F256BT-V/MM Pin Configuration
| Pin 1 | Vbus — USB Vbus power input (5V tolerant) |
| Pin 2 | D- — USB data minus |
| Pin 3 | D+ — USB data plus |
| Pin 4 | VDD — Digital supply voltage 2.3-3.6V |
| Pin 5 | RG3 — General purpose I/O / PPS |
| Pin 6 | RA0 — General purpose I/O / PPS |
| Pin 7 | RA1 — General purpose I/O / PPS |
| Pin 8 | RB0 — General purpose I/O / PPS / PGED1 |
| Pin 9 | RB1 — General purpose I/O / PPS / PGEC1 |
| Pin 10 | RB2 — General purpose I/O / PPS |
| Pin 11 | VSS — Digital ground reference |
| Pin 12 | RB4 — General purpose I/O / PPS |
| Pin 13 | RB5 — General purpose I/O / PPS |
| Pin 14 | RB7 — General purpose I/O / PPS |
| Pin 15 | RB8 — General purpose I/O / PPS |
| Pin 16 | RB9 — General purpose I/O / PPS |
| Pin 17 | RB10 — General purpose I/O / PPS |
| Pin 18 | RB11 — General purpose I/O / PPS |
| Pin 19 | VDD — Digital supply voltage 2.3-3.6V |
| Pin 20 | RB13 — General purpose I/O / PPS |
| Pin 21 | RB14 — General purpose I/O / PPS |
| Pin 22 | RB15 — General purpose I/O / PPS |
| Pin 23 | RA2 — General purpose I/O / PPS |
| Pin 24 | RA3 — General purpose I/O / PPS |
| Pin 25 | RA4 — General purpose I/O / PPS |
| Pin 26 | RA5 — General purpose I/O / PPS |
| Pin 27 | RA6 — General purpose I/O / PPS |
| Pin 28 | RA7 — General purpose I/O / PPS |
| Pin EP | EPAD — Exposed thermal pad - must be soldered to ground plane |
Typical Applications
PIC32MX274F256BT-V/MM is suitable for 6 applications: USB Audio Devices, Automotive Body Control Modules, Industrial Sensor Hubs, Low-Power IoT Edge Nodes, Consumer White Goods with USB, Medical Patient Monitoring Accessories.
USB Audio Devices
PIC32MX274F256BT-V/MM's integrated USB 2.0 Full-Speed OTG transceiver and 256KB Flash make it a natural fit for USB audio class 1.0 devices such as USB speakers, USB headsets, and USB DAC interfaces. The 72 MHz MIPS32 M4K core delivers 1.62 DMIPS/MHz, sufficient for 16-bit/48 kHz stereo USB audio streaming with minimal CPU load. The 64KB RAM holds USB endpoint buffers plus audio sample queues without external memory. PIC XLP deep-sleep mode at roughly 600 nA preserves battery life when USB is suspended. Compared to external USB controllers, the integrated transceiver reduces BOM cost by about $1 per board. Source: Microchip PIC32MX USB audio class firmware library and AN2288 USB on PIC32 application note.
Recommended
Automotive Body Control Modules
PIC32MX274F256BT-V/MM is AEC-Q100 Grade 1 qualified and rated -40C to +105C, supporting automotive body control modules such as HVAC panels, instrument cluster sub-cores, and seat/window controllers. The USB Full-Speed interface enables factory firmware flashing and OBD-II diagnostics. The 10-bit 1.1 Msps ADC reads multiple sensor inputs (temperature, position, current) simultaneously via DMA. PIC XLP sleep currents around 20 uA support wake-on-LIN patterns common in automotive body networks. Compared to higher-end PIC32MZ parts, the MX274 fits cost-sensitive body ECUs while retaining USB and CAN software stacks.
Recommended
Industrial Sensor Hubs
PIC32MX274F256BT-V/MM in 28-QFN (6x6 mm) integrates USB, ADC, I2C, SPI, and UARTs into a compact industrial sensor hub for factory automation, building automation, and process control. The 72 MHz core runs Modbus RTU/TCP stacks and edge-filtering algorithms, while the 10-bit ADC handles analog sensor inputs from thermistors, pressure transducers, and 4-20 mA loops. The Peripheral Pin Select (PPS) maps any digital peripheral to any GPIO, simplifying PCB routing in mixed-signal industrial boards. Industrial -V temp grade ensures operation in cabinet environments up to +105C. Compared to discrete MCU + USB bridge designs, this single-chip approach cuts BOM by 30%.
Recommended
Low-Power IoT Edge Nodes
PIC32MX274F256BT-V/MM with PIC XLP technology enables years of battery life in IoT edge nodes such as wireless sensor tags, BLE beacons, and remote environmental monitors. The roughly 600 nA deep-sleep current with RTCC and full RAM retention allows duty-cycled operation: wake, measure, transmit, return to sleep. The 256KB Flash stores over-the-air (OTA) firmware update images with room for application logic. Six UARTs support multiple wireless modules (LoRa, NB-IoT, BLE). Source: Microchip PIC32MX XLP low-power design guide and AN1867 low-power PIC32 application note.
Recommended
Consumer White Goods with USB
PIC32MX274F256BT-V/MM's USB 2.0 Full-Speed OTG and 256KB Flash are well suited to consumer white goods with USB charging ports, USB firmware update interfaces, or USB-driven touch interfaces - washing machines, refrigerators, and microwave ovens. The 72 MHz MIPS core handles HMI graphics, capacitive touch sensing via the CTMU peripheral, and motor-control feedback loops. The 28-QFN (6x6 mm) footprint fits in tight appliance control boards. Compared to PIC16 or PIC24 designs, the 32-bit core accelerates HMI response and supports USB stacks without external PHYs.
Recommended
Medical Patient Monitoring Accessories
PIC32MX274F256BT-V/MM serves as a USB-connected controller for medical patient monitoring accessories such as pulse oximeter USB dongles, digital stethoscope interfaces, and bedside monitor data-loggers. The integrated USB Full-Speed interface provides plug-and-play connectivity to host PCs and tablets, while the 10-bit ADC digitizes analog sensor signals. The 256KB Flash supports USB class drivers plus proprietary medical data protocols. Industrial -V temperature grade handles clinical environments. Note: medical device certification (IEC 60601-1, FDA) is the system integrator's responsibility; the MCU itself is not FDA-cleared.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MX274F256BT-V/MM — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MX274F256B-I/MM | PIC32MX254F128BT-V/MM | PIC32MX174F256BT-V/MM |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN-S (6x6 mm) | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same |
| Core Frequency | 72 MHz | 72 MHz | 72 MHz | 40 MHz |
| Flash Memory | 256 KB | 256 KB | 128 KB | 256 KB |
| SRAM | 64 KB | 64 KB | 32 KB | 64 KB |
| USB | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG |
| Operating Temperature | -40C to +105C | -40C to +85C | -40C to +105C | -40C to +105C |
| AEC-Q100 | Qualified (Grade 1) | Not qualified | Qualified (Grade 1) | Qualified (Grade 1) |
| Packaging | Tape & Reel | Tray | Tape & Reel | Tape & Reel |
Key Differentiators
- Industrial +105C temperature grade in compact 28-QFN (vs PIC32MX274F256B-I/MM)
- Maximum Flash density available in 28-QFN PIC32MX2 family (vs PIC32MX254F128BT-V/MM)
- Highest core speed (72 MHz) in 28-QFN PIC32MX27x family (vs PIC32MX174F256BT-V/MM)
Design Notes
Estimated: the 28-QFN exposed pad (EP) on PIC32MX274F256BT-V/MM has a theta_JA of approximately 30 C/W with a standard 4-layer JEDEC test PCB and EP soldered to a 1 square inch copper ground pour. At 72 MHz full-load run, the device dissipates about 0.4 W, yielding a junction-to-ambient rise of 12 C. For -V (+105C) operation in enclosed automotive enclosures, ensure at least 0.5 square inch of copper on top and bottom layers under the EP. Source: Microchip PIC32MX27x family packaging thermal data.
Place a 10 uF X7R ceramic decoupling capacitor plus a 0.1 uF X7R ceramic capacitor within 2 mm of each VDD pin (pins 4 and 19). The Vbus pin (pin 1) requires its own 10 uF + 0.1 uF pair if USB host mode is used to deliver 5V to downstream devices. For PIC XLP deep-sleep operation, ensure no high-impedance analog inputs float - tie unused ADC inputs to Vdd or Vss via 10k resistors to minimize leakage current. Source: Microchip AN1867 PIC32 low-power design guide.
Route the USB D+ and D- lines as a 90 ohm differential pair on the top layer with continuous ground reference beneath. Keep D+/D- trace length matching within 1 mm and total length under 50 mm to meet USB 2.0 Full-Speed signal integrity requirements. Place the ESD protection diode (e.g., USBLC6-2SC6) within 3 mm of the USB connector. Crystal traces (if used) must be short and guarded by ground pour. Source: USB 2.0 specification section 6.7 and Microchip AN2288 USB hardware design guide.
Do not leave the exposed pad (EP) floating or only soldered at corners - this causes thermal stress and ground reference drift. Always configure unused GPIO pins as outputs (not inputs) to avoid shoot-through current in PIC XLP sleep modes. When using Peripheral Pin Select (PPS), unlock the PPS register sequence (OSCCON unlock) before remapping peripherals; failure to do so results in silent peripheral failures. Source: Microchip PIC32MX27x datasheet PPS section.
Compliance Information
AEC-Q100 Grade 1 qualified due to -V suffix. RoHS and REACH compliant per Microchip product declaration. Lead-free and halogen-free per Microchip environmental certification.
