PIC32MX330F064HT-V/RG - 80MHz 32-bit MCU 64KB Flash | Microchip
MPN: PIC32MX330F064HT-V/RG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.62 | $4.62 |
| 10 | $4.21 | $42.10 |
| 100 | $3.75 | $375.00 |
| 500 | $3.4 | $1,700.00 |
| 1,000 | $3.05 | $3,050.00 |
PIC32MX330F064HT-V/RG Overview
A 32-bit microcontroller (MCU) is a single-chip processor with on-chip Flash program memory, SRAM data memory, and integrated peripherals such as timers, UARTs, SPIs, I2C, ADC, and PWM. The PIC32MX3/4 family occupies the performance mid-tier of the Microchip PIC32 line: ARM Cortex-M-class alternatives such as STM32F1 or NXP LPC1768 typically use Harvard M-architecture for similar DMIPS/$M. The PIC32MX M4K core delivers up to 150 DMIPS at 120MHz and uses a five-stage pipeline with hardware multiply/divide, supporting 32-bit MIPS instructions.
Key features of the PIC32MX330F064HT include: 64KB Flash program memory, 16KB SRAM, two SPI/I2S, two I2C, two UART, USB 2.0 full-speed OTG, 10-bit ADC with up to 16 channels, five 16-bit timers/counters, and parallel master port (PMP). The 64-pin VQFN (RG) package with exposed pad provides a thermal resistance suitable for industrial -40C to +105C operation. The 'H' suffix denotes 64KB Flash with USB; the 'T' suffix denotes Tape and Reel.
Architecture depth: PIC32MX uses a 5-stage pipeline, single-cycle multiply, hardware divide, and bit-banding for atomic bit manipulation. The M4K core supports MIPS16e code compression, reducing Flash footprint by ~30%. USB OTG enables host or device mode with integrated PHY; PMP can interface to external parallel buses, graphics LCDs, or FPGA.
Typical applications include industrial control (USB HMI, sensor hubs), low-cost audio devices (USB speakers, MIDI), home automation (HA-BUS bridges, smart thermostats), USB peripherals (barcode scanners, custom HID), and more. The wide operating range and rich peripherals suit automotive aftermarket and harsh-environment designs.
Design consideration: route the exposed pad (EP) to a solid ground copper pour with at least 8 thermal vias for heat dissipation. Decouple VDD/VUSB with 100nF ceramic as close to the IC pins as possible; for USB use a 10uF bulk plus ESD array (such as USBLC6-2SC6A).
This page synthesizes distributor pricing (as of 2026-10-02), drop-in alternatives within the same 64-pin VQFN footprint, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for PIC32MX330F064HT-V/RG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MX330F064HT-V/RG (same form factor and footprint) — differing in ADC, Package, USB, Core Architecture, I2C.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MX330F064HT-I/RG
✅ Drop-In✓ In Stock
$3.65 / Unit
View Datasheet →PIC32MX330F064H-V/RG
✅ Drop-In✓ In Stock
$3.65 / Unit
View Datasheet →PIC32MX350F256HT-V/RG
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MX370F512HT-V/RG
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MX330F064HT-V/MR
✅ Drop-In✓ In Stock
$4.12 / Unit
View Datasheet →PIC32MX330F064HT-V/RG Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 M4K |
| CPU Bit Width | 32-bit |
| Maximum CPU Frequency | 80 MHz (Mouser lists 100 MHz marketing rating; others fade to 80 MHz VICE rating) |
| DMIPS | Up to 150 DMIPS at 120 MHz (family limit) |
| Program Flash Memory | 64 KB (64K x 8) |
| SRAM | 16 KB |
| Operating Voltage | 2.5 V / 3.3 V |
| USB | USB 2.0 Full-Speed OTG with integrated PHY |
| ADC | 10-bit, up to 16 channels |
| Timers | 5 x 16-bit timers/counters |
| Communication Interfaces | 2x SPI/I2S, 2x I2C, 2x UART, 1x USB OTG |
| PMP (Parallel Master Port) | Yes |
| Operating Temperature Range | -40 C to +105 C (V grade) |
| Package | 64-VQFN EP (RG) 9x9 mm |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
PIC32MX330F064HT-V/RG Pin Configuration
| Pin 1 | RA0 — PORTA0 / analog input AN0 |
| Pin 2 | RA1 — PORTA1 / analog input AN1 |
| Pin 3 | RA2 — PORTA2 / analog input AN2 |
| Pin 4 | RA3 — PORTA3 / analog input AN3 |
| Pin 5 | RA4 — PORTA4 / analog input AN4 |
| Pin 6 | RA5 — PORTA5 / analog input AN5 |
| Pin 7 | RA6 — PORTA6 |
| Pin 8 | RA7 — PORTA7 |
| Pin 9 | RB0 — PORTB0 / programming pin PGC |
| Pin 10 | RB1 — PORTB1 / programming pin PGD |
| Pin 11 | RB2 — PORTB2 |
| Pin 12 | RB3 — PORTB3 |
| Pin 13 | RB4 — PORTB4 |
| Pin 14 | RB5 — PORTB5 |
| Pin 15 | RB6 — PORTB6 |
| Pin 16 | RB7 — PORTB7 |
| Pin 17 | RC0 — PORTC0 |
| Pin 18 | RC1 — PORTC1 |
| Pin 19 | RC2 — PORTC2 |
| Pin 20 | VSS — Ground |
| Pin 21 | RC3 — PORTC3 |
| Pin 22 | RC4 — PORTC4 |
| Pin 23 | RC5 — PORTC5 |
| Pin 24 | RC6 — PORTC6 |
| Pin 25 | RC7 — PORTC7 |
| Pin 26 | RC8 — PORTC8 |
| Pin 27 | RC9 — PORTC9 |
| Pin 28 | VDD — Positive supply (2.5V/3.3V) |
| Pin 29 | RD0 — PORTD0 |
| Pin 30 | RD1 — PORTD1 |
| Pin 31 | RD2 — PORTD2 |
| Pin 32 | RD3 — PORTD3 |
| Pin 33 | RD4 — PORTD4 |
| Pin 34 | RD5 — PORTD5 |
| Pin 35 | RD6 — PORTD6 |
| Pin 36 | RD7 — PORTD7 |
| Pin 37 | RD8 — PORTD8 |
| Pin 38 | RD9 — PORTD9 |
| Pin 39 | RD10 — PORTD10 |
| Pin 40 | RD11 — PORTD11 |
| Pin 41 | VSS — Ground |
| Pin 42 | VDD — Positive supply (2.5V/3.3V) |
| Pin 43 | RD12 — PORTD12 |
| Pin 44 | RD13 — PORTD13 |
| Pin 45 | RD14 — PORTD14 |
| Pin 46 | RD15 — PORTD15 |
| Pin 47 | RE0 — PORTE0 / PMD0 |
| Pin 48 | RE1 — PORTE1 / PMD1 |
| Pin 49 | RE2 — PORTE2 / PMD2 |
| Pin 50 | RE3 — PORTE3 / PMD3 |
| Pin 51 | RE4 — PORTE4 / PMD4 |
| Pin 52 | RE5 — PORTE5 / PMD5 |
| Pin 53 | RE6 — PORTE6 / PMD6 |
| Pin 54 | RE7 — PORTE7 / PMD7 |
| Pin 55 | RF0 — PORTF0 |
| Pin 56 | RF1 — PORTF1 |
| Pin 57 | RF2 — PORTF2 |
| Pin 58 | RF3 — PORTF3 |
| Pin 59 | RF4 — PORTF4 |
| Pin 60 | RF5 — PORTF5 |
| Pin 61 | RF6 — PORTF6 / USBID |
| Pin 62 | RG0 — PORTG0 |
| Pin 63 | RG1 — PORTG1 |
| Pin 64 | RG2 — PORTG2 |
| Pin 65 | EP — Exposed pad - thermal/ground, must be soldered to PCB ground plane |
Typical Applications
PIC32MX330F064HT-V/RG is suitable for 6 applications: USB Human Interface Devices (HID), Industrial Sensor Hub / Data Logger, USB Audio Class Device (Speaker / Headset), Home Automation Gateway Bridge, Automotive Aftermarket Display Module, Custom USB Test and Measurement Instrument.
USB Human Interface Devices (HID)
The PIC32MX330F064HT-V/RG is well suited for USB HID devices such as custom keyboards, mice, game controllers, and barcode readers thanks to its integrated USB 2.0 full-speed OTG controller with on-chip PHY that eliminates external USB transceivers. The 80 MHz MIPS32 M4K core delivers ample processing headroom for HID report parsing, debouncing, and LED animation, while 16 KB SRAM handles HID buffers and USB endpoint descriptors. The 64 KB Flash is sufficient for Microchip's USB stack, HID class driver, and application logic with MIPS16e code compression. Reference the Microchip MLA (Microchip Libraries for Applications) USB device stack for production-ready HID firmware.
Recommended
Industrial Sensor Hub / Data Logger
The PIC32MX330F064HT-V/RG serves as a multi-sensor aggregation node in industrial sensor hubs: two I2C buses interface up to 30 sensors each (temperature, pressure, humidity), two SPI buses connect high-speed ADCs or accelerometers, and the 10-bit ADC with 16 channels reads analog sensors directly. The wide -40C to +105C operating range suits factory floor and process-control environments. The 16 KB SRAM can buffer several minutes of timestamped sensor data before forwarding to a host via UART or USB. Pair the MCU with an external FRAM or SPI Flash for non-volatile log storage when 64 KB internal Flash is exhausted.
Recommended
USB Audio Class Device (Speaker / Headset)
The PIC32MX330F064HT-V/RG powers USB speakers, USB headsets, and USB microphone designs using its USB 2.0 FS OTG plus dual I2S/PCM interfaces. The MCU streams 16-bit 48 kHz stereo audio from USB isochronous endpoints to an external DAC or codec over I2S, with DMA ensuring glitch-free playback without CPU intervention. Microchip's USB Audio Class 1.0 firmware library supports speaker, headphone, and microphone topologies. The 64 KB Flash holds the USB stack plus audio class driver; 16 KB SRAM buffers USB packets and audio samples. The exposed pad provides thermal dissipation for sustained audio streaming.
Recommended
Home Automation Gateway Bridge
The PIC32MX330F064HT-V/RG operates as a bridge between low-speed home automation buses (Zigbee, Z-Wave, BLE) and a Wi-Fi/Ethernet host. Two UARTs connect to wireless modules transceivers, two SPI/I2S channels interface to RF transceivers or displays, and USB OTG links to the host processor for configuration. The 80 MHz core handles protocol conversion, message queuing, and OTA update verification. The -40C to +105C range covers outdoor enclosures and uncontrolled indoor environments. Wide 2.5V/3.3V operation supports direct battery or USB-powered operation.
Recommended
Automotive Aftermarket Display Module
The PIC32MX330F064HT-V/RG drives automotive aftermarket accessories such as OBD-II dongles, HUD projectors, and gauge clusters. USB OTG interfaces the device to a phone or head unit, the PMP (parallel master port) drives small TFT LCD displays without an external graphics controller, and two SPI buses link to accelerometers for tilt compensation. The -40C to +105C V-grade temperature rating handles under-dash thermal conditions. The wide input voltage tolerance supports 12V automotive supply rails with external regulation.
Recommended
Custom USB Test and Measurement Instrument
The PIC32MX330F064HT-V/RG builds USB-connected test instruments such as USB oscilloscope probes, logic analyzers, and digital multimeters. USB OTG streams 10-bit ADC samples to a PC host at up to 1 Msps, while two UARTs handle serial protocol decode. The 16 KB SRAM buffers sample bursts before USB transmission, and 64 KB Flash stores calibration constants and USB descriptors. The exposed pad VQFN64 provides the thermal headroom needed for sustained ADC sampling. Reference Microchip's USB CDC class firmware for virtual COM port instruments.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MX330F064HT-V/RG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MX330F064HT-I/RG | PIC32MX330F064H-V/RG | PIC32MX350F256HT-V/RG | PIC32MX370F512HT-V/RG | PIC32MX330F064HT-V/MR |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-VQFN EP (RG) 9x9 mm | 64-VQFN EP (RG) 9x9 mm - same | 64-VQFN EP (RG) 9x9 mm - same | 64-VQFN EP (RG) 9x9 mm - same | 64-VQFN EP (RG) 9x9 mm - same | 64-VQFN EP (MR) 9x9 mm - same mechanical |
| Flash Memory | 64 KB | 64 KB - same | 64 KB - same | 256 KB (+300%) | 512 KB (+700%) | 64 KB - same |
| SRAM | 16 KB | 16 KB - same | 16 KB - same | 64 KB (+300%) | 128 KB (+700%) | 16 KB - same |
| CPU Frequency | 80 MHz | 80 MHz - same | 80 MHz - same | 80 MHz - same | 80 MHz - same | 80 MHz - same |
| Operating Temperature | -40C to +105C (V grade) | -40C to +85C (I grade) | -40C to +105C (V grade) - same | -40C to +105C (V grade) - same | -40C to +105C (V grade) - same | -40C to +105C (V grade) - same |
| USB | USB 2.0 FS OTG | USB 2.0 FS OTG - same | USB 2.0 FS OTG - same | USB 2.0 FS OTG - same | USB 2.0 FS OTG - same | USB 2.0 FS OTG - same |
| ADC | 10-bit, 16 channels | 10-bit, 16 channels - same | 10-bit, 16 channels - same | 10-bit, 16 channels - same | 10-bit, 16 channels - same | 10-bit, 16 channels - same |
| Packaging | Tape & Reel | Tape & Reel | Tray | Tape & Reel | Tape & Reel | Tape & Reel |
| Crypto Engine | No | No | No | No | Yes | No |
Key Differentiators
- Wider -40C to +105C V-grade temperature range vs I-grade (vs PIC32MX330F064HT-I/RG)
- Production-ready Tape & Reel packaging vs Tray (vs PIC32MX330F064H-V/RG)
- Compact 9x9 mm VQFN footprint vs 10x10 mm TQFP (vs PIC32MX274F256DT-I/PT)
Design Notes
Estimated: The 64-pin VQFN EP package dissipates heat through the exposed pad (pin 65). For continuous USB streaming or sustained ADC sampling at full 80 MHz, solder the EP to a PCB pad of at least 25 mm^2 copper area connected to ground, with 8-12 thermal vias (0.3 mm drill, 0.5 mm pitch). Without proper EP soldering, junction temperature may rise 30-40 C above ambient at 100% CPU load, exceeding the +105C maximum. Reference Microchip's 'PIC32 Family Reference Manual, Packaging and Thermal Considerations' for layout guidance.
Place a 100 nF ceramic decoupling capacitor as close as possible to each VDD pin (pins 28 and 42). Add a single 4.7 uF to 10 uF bulk capacitor near the MCU. For USB applications, the VUSB pin (when used) requires a 100 nF and 4.7 uF capacitor pair per the USB 2.0 specification. Avoid running the analog and digital supplies from the same regulator if the ADC is used; split VDD into VDD and AVDD rails with separate filtering for best ADC accuracy.
Route the 80 MHz system clock traces with controlled impedance (50 ohm microstrip or stripline) and keep them as short as possible. The USB D+/D- traces must be 90 ohm differential, routed symmetrically, and length-matched within 150 mils. Use a ground keep-out under the crystal traces and place the 12 MHz or 24 MHz crystal within 5 mm of the OSC1/OSC2 pads. Avoid routing sensitive analog signals (ADC inputs) parallel to digital switching signals.
Do not omit the MCLR pull-up resistor (typically 10 kohm to VDD); missing MCLR can prevent normal operation or cause erratic resets. Configure unused I/O pins as outputs driven low (not high-impedance inputs) to minimize supply current. The PGECx/PGEDx programming/debug pins should be left accessible for in-circuit programming; do not place them on internal-only nets. Avoid using the 'L' suffix variant (PIC32MX330F064L) if USB is required - the 'L' parts lack USB.
Compliance Information
RoHS compliant per Microchip product page. Not AEC-Q100 qualified - choose automotive-grade PIC32MX variants for vehicle applications. V-grade temperature range suits industrial and aftermarket automotive designs.
