PIC32MX430F064L-V/PF - 32-bit MCU 64KB Flash 100-Pin TQFP | Microchip
MPN: PIC32MX430F064L-V/PF ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7.45 | $7.45 |
| 10 | $6.71 | $67.10 |
| 100 | $5.96 | $596.00 |
| 500 | $5.32 | $2,660.00 |
| 1,000 | $4.75 | $4,750.00 |
PIC32MX430F064L-V/PF Overview
A 32-bit MCU is a microprocessor that executes instructions on 32-bit data paths, enabling higher computational throughput than 8- or 16-bit devices. The PIC32MX3/4 family belongs to the broader PIC32 MIPS-based microcontroller hierarchy, which sits within Microchip's MCU product tree: MCU -> 32-bit MCU -> PIC32 -> PIC32MX3/4. These devices pair high core performance with rich peripherals targeted at HMI, USB, and mixed-signal embedded designs.
Key features include a USB 2.0 Full-Speed OTG controller, two I²S/SPI modules for codec connectivity, Peripheral Pin Select (PPS) for flexible signal routing, a Parallel Master Port (PMP) for graphics interfaces, and a Charge Time Measurement Unit (CTMU) for touch sensing. Analog blocks deliver two comparators, a 10-bit 1 MSPS ADC with up to 28 channels, and a Real-Time Clock/Calendar (RTCC). The USB OTG plus 2.5 V/3.3 V tolerance make this part suitable for tethered consumer and industrial peripherals.
The architecture combines a 5-stage pipeline M4K core with tightly-coupled SRAM and a multi-channel DMA engine that offloads data movement between peripherals and memory. The 16 KB SRAM is partitioned to allow simultaneous USB, PMP, and ADC buffering without CPU intervention in typical HMI use cases.
Typical applications include USB peripherals (HID/keyboard/mouse/CDC), audio playback devices with I²S codecs, low-cost graphical HMI panels using PMP and TFT displays, capacitive touch user interfaces using CTMU, and industrial control/automation nodes requiring CAN-equivalent robustness via UART/SPI bridging.
When designing, observe USB bus-powered load limits (<100 mA before enumeration, <500 mA after), provide a stable 3.3 V rail with bulk + ceramic decoupling near VDDCORE/VDDIO pins, and respect the 0.5 mm TQFP pitch by using ENIG surface finish and 0.25 mm via stitching under the exposed die attach pad for thermal dissipation.
This page combines distributor pricing, parametric comparisons, and practical design notes compiled from the Microchip datasheet, offering information beyond the bare datasheet content.
Drop-in alternatives for PIC32MX430F064L-V/PF — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MX430F064L-V/PF (same form factor and footprint) — differing in ADC, Package, Parallel Master Port (PMP), USB Interface, Core Architecture.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MX430F064L-I/PF
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MX430F064LT-V/PF
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MX450F128L-V/PF
✅ Drop-In✓ In Stock
$5.31 / Unit
View Datasheet →PIC32MX370F512L-V/PF
✅ Drop-In✓ In Stock
$5.85 / Unit
View Datasheet →PIC32MX470F512L-V/PF
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MX430F064L-V/PF Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 M4K, 32-bit RISC |
| Maximum CPU Speed | 80 MHz (120 MHz in higher-speed variants) |
| DMIPS | 131 (at 100 MHz); up to 150 DMIPS family rating |
| Program Flash | 64 KB |
| Data SRAM | 16 KB |
| Operating Voltage | 2.3 V to 3.6 V |
| Temperature Range | -40 °C to +105 °C (V grade) |
| USB | USB 2.0 Full-Speed OTG controller |
| I²S/SPI Modules | 2 |
| UART Modules | Multiple hardware UARTs |
| I²C Modules | Multiple hardware I²C |
| ADC | 10-bit, up to 28 channels, 1 MSPS |
| Comparators | 2 |
| CTMU (Touch/Charge-Time) | Yes |
| Parallel Master Port (PMP) | Yes (graphics support) |
| RTCC (Real-Time Clock/Calendar) | Yes |
| DMA Channels | Yes (multi-channel) |
| Peripheral Pin Select (PPS) | Yes |
| Pin Count | 100 |
| Package | TQFP-100 (PF), 14 × 14 × 1 mm body, 0.5 mm pitch |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
PIC32MX430F064L-V/PF tqfp-100 (pf), 14 × 14 × 1 mm body, 0.5 mm pitch Pin Configuration Guide
Pin configuration for PIC32MX430F064L-V/PF (tqfp-100 (pf), 14 × 14 × 1 mm body, 0.5 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for PIC32MX430F064L-V/PF.
Refer to the datasheet for full pin configuration.
Typical Applications
PIC32MX430F064L-V/PF is suitable for 6 applications: USB Human Interface Devices (HID), Audio Playback Devices with I²S Codecs, Low-Cost Graphical HMI Panels (PMP + TFT), Capacitive Touch User Interfaces (CTMU), Industrial Control / Sensor Aggregation Nodes, USB Audio Class / USB Headset Devices.
USB Human Interface Devices (HID)
The PIC32MX430F064L-V/PF is well suited for USB HID peripherals such as keyboards, mice, gamepads, and custom input devices. Its on-chip USB 2.0 Full-Speed OTG controller eliminates the need for an external PHY, reducing BOM cost and PCB area. The 80 MHz MIPS32 M4K core delivers ample throughput to run HID class drivers plus polling loops with sub-millisecond latency. The 16 KB SRAM comfortably fits HID report buffers and USB descriptor stacks, while the 64 KB Flash holds bootloader plus application firmware. Compared with a discrete USB-serial bridge, the integrated OTG controller removes a chip and a USB enumeration step from the supply chain.
Recommended
Audio Playback Devices with I²S Codecs
The PIC32MX430F064L-V/PF integrates two I²S/SPI modules that interface directly with external audio codecs for stereo playback and recording. The 80 MHz core provides the headroom needed for software-based sample-rate conversion and simple audio effects without offloading to a DSP. Its DMA engine moves audio samples between the I²S peripheral and SRAM buffers without CPU intervention, freeing cycles for user-interface tasks. The 16 KB SRAM is sufficient for ping-pong audio buffers at CD-quality (44.1 kHz, 16-bit stereo), keeping latency below 10 ms. Designers should bias the codec MCLK on a PPS-mapped output pin and isolate the analog codec ground from the digital MCU ground with a ferrite bead.
Recommended
Low-Cost Graphical HMI Panels (PMP + TFT)
The PIC32MX430F064L-V/PF features a Parallel Master Port (PMP) for direct connection to small TFT LCD panels (up to 8-bit parallel), enabling low-cost graphical user interfaces without an external graphics controller. The Peripheral Pin Select (PPS) feature reassigns PMP data lines to avoid contention with other peripherals, simplifying PCB routing. The 80 MHz core and DMA engine drive panels up to 320x240 at 30 fps when coupled with careful buffer management in the 16 KB SRAM. The 64 KB Flash is large enough to hold font tables, splash screens, and a small RTOS. Designers should add series resistors on PMP data lines and a ground pour under the panel connector to limit EMI.
Recommended
Capacitive Touch User Interfaces (CTMU)
The PIC32MX430F064L-V/PF integrates a Charge Time Measurement Unit (CTMU) that measures capacitance changes on touch electrodes, enabling up to 28 capacitive touch channels without dedicated touch hardware. Combined with the 10-bit ADC and two comparators, the CTMU supports buttons, sliders, and proximity sensors at very low BOM cost. The 80 MHz core runs Microchip's mTouch firmware libraries with sub-10 ms scan latency across the channel array. The V temperature grade is essential for outdoor kiosks and appliances where ambient temperature swings affect touch baseline. Designers should guard each touch trace with a ground pour and add ESD protection diodes at the panel connector.
Recommended
Industrial Control / Sensor Aggregation Nodes
The PIC32MX430F064L-V/PF's V temperature grade (-40 °C to +105 °C), 2.3-3.6 V supply, and multiple hardware UART/SPI/I²C peripherals make it a solid choice for industrial sensor hubs that aggregate Modbus RTU, SPI sensor, and I²C actuator data. Its RTCC timestamps sensor logs in real time without an external RTC chip, reducing BOM. The 10-bit ADC with up to 28 channels covers analog transducer inputs at 1 MSPS, while DMA offloads continuous conversions to free the CPU for protocol parsing. The 64 KB Flash holds bootloader plus a deterministic RTOS such as FreeRTOS or Micrium. For harsh EMI environments, isolate digital and analog grounds and add common-mode chokes on communication lines.
Recommended
USB Audio Class / USB Headset Devices
The PIC32MX430F064L-V/PF's USB OTG controller and dual I²S modules enable USB audio class (UAC1) implementations such as USB headsets, microphones, and USB speakers. The 80 MHz core handles USB isochronous transfers plus audio buffering, while the 16 KB SRAM absorbs USB packet jitter plus I²S sample buffering. CTMU-based button handling (play/pause/volume) is integrated without extra chips. V-grade temperature support suits automotive cabin accessories and outdoor wearables. Designers should respect USB-IF bus-powered limits (100 mA unconfigured, 500 mA configured) and use a common-mode choke on the USB DP/DN pair to pass radiated emissions.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MX430F064L-V/PF — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MX430F064L-I/PF | PIC32MX430F064LT-V/PF | PIC32MX450F128L-V/PF | PIC32MX370F512L-V/PF | PIC32MX470F512L-V/PF |
|---|---|---|---|---|---|---|
| Package | TQFP-100 (PF, 14x14 mm, 0.5 mm pitch) | TQFP-100 (PF) - same | TQFP-100 (PF) - same | TQFP-100 (PF) - same | TQFP-100 (PF) - same | TQFP-100 (PF) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Max CPU Speed | MIPS32 M4K / 80 MHz (100 MHz family) | MIPS32 M4K / 80 MHz | MIPS32 M4K / 80 MHz | MIPS32 M4K / 80 MHz | MIPS32 M4K / 120 MHz | |
| Program Flash | 64 KB | 64 KB | 128 KB (+100%) | 512 KB (+700%) | 512 KB (+700%) | |
| Data SRAM | 16 KB | 16 KB | 32 KB (+100%) | 128 KB (+700%) | 128 KB (+700%) | |
| USB 2.0 OTG | Yes (Full-Speed) | Yes | Yes | Yes | Yes | |
| PMP (Graphics) | Yes | Yes | Yes | Yes | Yes | |
| CTMU (Touch) | Yes | Yes | Yes | Yes | Yes | |
| Temperature Grade | V: -40 °C to +105 °C | I: -40 °C to +85 °C | V: -40 °C to +105 °C | V: -40 °C to +105 °C | V: -40 °C to +105 °C |
Key Differentiators
- Single-chip USB OTG + PMP + CTMU integration (vs PIC32MX230F064B-I/SP)
- V temperature grade (-40 °C to +105 °C) in TQFP-100 (vs PIC32MX430F064L-I/PF)
- Forward-compatible upgrade path within same footprint (vs PIC32MX370F512L-V/PF / PIC32MX470F512L-V/PF)
Design Notes
Place 100 nF ceramic decoupling on each VDD/VDDIO pin and a single 10 µF bulk tantalum or ceramic at the regulator output. The PIC32MX430F064L-V/PF has separate VDDCORE and VDDIO pins; both should be powered from the same 3.3 V rail. Estimated: at 80 MHz full-load core current (~50 mA typical, per Microchip datasheet DC characteristics), the bulk capacitor should be sized so its impedance is below 0.1 Ω at the fundamental clock frequency to keep ripple under 50 mV.
The TQFP-100 package has a 0.5 mm pitch and 14 × 14 mm body. Use 0.20 mm traces with 0.30 mm clearance on a 4-layer PCB with a continuous ground pour under the device. Stitch the ground pour with 0.30 mm vias on a 1.0 mm grid around the part to provide low-inductance return paths for the high-speed USB DP/DN pair. Avoid routing analog ADC traces (e.g. AN0-AN27) directly under the crystal traces to limit coupling.
Do not skip the MCLR pull-up resistor (10 kΩ to VDD); without it the part may intermittently fail to enter ICSP programming or reset unexpectedly. Also, configure the JTAGEN/ICSP pins correctly: TMS/TCK/TDO/TDI must be remapped via PPS if used as GPIO, otherwise GPIO writes silently fail. For USB, place a 100 µF bulk capacitor on VBUS at the connector to absorb inrush during host port hot-plug events, and add a 1 MΩ pull-down on the ID pin for OTG role detection.
The TQFP-100 has a typical θJA of ~50 °C/W on a 4-layer PCB with adequate copper. Estimated: at 80 MHz full-load core current ~50 mA at 3.3 V, internal dissipation is roughly 0.165 W, leading to a junction rise of only 8 °C above ambient - well within the 105 °C V-grade ceiling. For closed-enclosure designs with limited airflow, derate by reducing core frequency or add a small thermal pad bonded to a copper pour.
Compliance Information
RoHS-compliant per Microchip product page; lead-free (T) packaging suffix. V temperature grade is industrial/automotive-adjacent but not formally AEC-Q100 qualified (PIC32MX5/6 family offers AEC-Q100 parts).
