PIC32MX570F512LT-V/GJX - 50MHz 32-bit MCU, 512KB Flash, TFBGA-100 | Microchip
MPN: PIC32MX570F512LT-V/GJX ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $9.12 | $9.12 |
| 10 | $8.21 | $82.10 |
| 100 | $7.34 | $734.00 |
| 500 | $6.58 | $3,290.00 |
| 1,000 | $5.92 | $5,920.00 |
PIC32MX570F512LT-V/GJX Overview
A 32-bit microcontroller (MCU) is a single-chip processor that integrates a CPU core, program and data memory, and a rich set of peripherals on a single die, forming the compute backbone of embedded systems. The PIC32MX570 belongs to the broader taxonomy: 32-bit MCU -> embedded microcontroller -> microprocessor IC -> integrated circuit -> semiconductor. It uses a RISC load-store architecture and is typically paired with a real-time operating system (RTCC, FreeRTOS, Micrium) or runs bare-metal firmware in C.
Key features of the PIC32MX570F512LT include Peripheral Pin Select (PPS), a Parallel Master Port (PMP) for graphics interfaces, a Charge Time Measurement Unit (CTMU) for capacitive touch and precise time measurement, three analog comparators, and a real-time clock/calendar (RTCC). The PIC32MX5xx family is optimized for cost-sensitive connectivity and HMI designs, combining a high-performance MIPS core with industrial-grade connectivity in a small BGA footprint that suits compact layouts.
The MIPS32 M4K core implements a five-stage pipeline, hardware multiply/divide, and a single-cycle shadow register set for fast interrupt response, which together with the 83 DMIPS performance make it suitable for protocol stacks (USB, CAN, TCP/IP) running concurrently with application code. The 512 KB Flash supports self-programming via ICSP, and the 64 KB RAM accommodates large TCP/IP or USB buffers. Integrated DMA on the USB, CAN, and SPI/I²S peripherals offloads the CPU and enables deterministic throughput for streaming data such as audio or sensor telemetry.
Typical applications for PIC32MX570F512LT-V/GJX include USB peripherals (HID, CDC, MSD, audio class), CAN-connected automotive body and gateway ECUs, industrial HMI with PMP-driven TFT displays, IoT edge nodes, and audio streaming devices using the I²S ports with an external CODEC. The combination of 50 MHz, USB, CAN, and 512 KB Flash targets cost-optimized designs that previously required a separate MCU plus external controller ICs.
When designing with this part, ensure the BGA PCB land pattern follows IPC-7351 recommendations and that the exposed die-attach paddle (if applicable to the TFBGA substrate) is thermally connected for heat spreading. Firmware development is supported by MPLAB X IDE, MPLAB Harmony, and the XC32 compiler; programmers include PICkit 4, ICD 4, and MPLAB Snap. Engineers migrating from PIC32MX4 to PIC32MX5 benefit from binary-compatible peripherals while gaining USB and CAN.
Drop-in alternatives for PIC32MX570F512LT-V/GJX — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MX570F512LT-V/GJX (same form factor and footprint) — differing in ADC, Package, Program Memory (Flash), RTCC, CTMU.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MX570F512LT-I/GJX
✅ Drop-In✓ In Stock
$4.78 / Unit
View Datasheet →PIC32MX570F512LT-50I/GJX
✅ Drop-In✓ In Stock
$5.47 / Unit
View Datasheet →PIC32MX270F512LT-V/GJX
✅ Drop-In✓ In Stock
$4.36 / Unit
View Datasheet →PIC32MX564F128LT-V/BG
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$4.97 / Unit
View Datasheet →PIC32MX570F512LT-V/GJX Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 M4K |
| Maximum CPU Speed | 50 MHz |
| DMIPS Performance | 83 DMIPS |
| Program Memory (Flash) | 512 KB |
| Data Memory (SRAM) | 64 KB |
| Operating Voltage | 2.3 V to 3.6 V (typical 2.5 V / 3.3 V) |
| Temperature Grade | Automotive V (-40°C to +105°C) |
| Package | 100-pin TFBGA (GJX), 7x7 mm |
| USB Module | USB 2.0 Full-Speed Device/Host/OTG |
| CAN Module | CAN 2.0B |
| SPI Modules | 4 |
| UART Modules | 4 |
| I²C Modules | 5 |
| I²S Modules | 2 |
| ADC | 10-bit, 1 Msps, up to 16 channels |
| Comparators | 3 |
| CTMU | Yes (Charge Time Measurement Unit) |
| RTCC | Yes (Real-Time Clock/Calendar) |
| PMP | Yes (Parallel Master Port with dual buffers) |
| PPS | Yes (Peripheral Pin Select) |
| DMA Channels | Yes |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Programming Interface | ICSP / JTAG (4-wire) |
PIC32MX570F512LT-V/GJX 100-pin tfbga (gjx), 7x7 mm Pin Configuration Guide
Pin configuration for PIC32MX570F512LT-V/GJX (100-pin tfbga (gjx), 7x7 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for PIC32MX570F512LT-V/GJX.
Refer to the datasheet for full pin configuration.
Typical Applications
PIC32MX570F512LT-V/GJX is suitable for 6 applications: USB-to-CAN Automotive Gateway, Industrial HMI with PMP-Driven TFT Display, USB Audio Streaming Device, IoT Edge Sensor Node, Automotive Body Control Module, Medical Data Logger.
USB-to-CAN Automotive Gateway
The PIC32MX570F512LT-V/GJX fits automotive gateways because it integrates USB 2.0 Full-Speed and CAN 2.0B controllers with dedicated DMA on a single die, eliminating the external USB-CAN bridge chip and BOM cost. The 50 MHz MIPS32 M4K core and 64 KB SRAM comfortably run a CANopen or J1939 stack concurrently with a USB CDC/HID interface, while the V temperature grade (-40°C to +105°C) supports body and chassis ECUs. Compared to dual-chip solutions, this part saves board area and reduces firmware synchronization risk by handling both protocols inside one MCU with deterministic DMA arbitration.
Recommended
Industrial HMI with PMP-Driven TFT Display
The PIC32MX570F512LT-V/GJX's Parallel Master Port (PMP) with dual read/write buffers streams pixel data directly to small TFT LCDs up to 480x272 resolution without an external graphics controller. The 50 MHz core and 83 DMIPS provide enough throughput to render menus and widgets while still servicing USB, CAN, and UART peripherals. CTMU enables capacitive touch keys, while the 16-channel 10-bit ADC reads backlight current and supply rails. This integration replaces a separate graphics controller, reducing BOM cost and board area for HMI panels in industrial equipment.
Recommended
USB Audio Streaming Device
The PIC32MX570F512LT-V/GJX supports USB Audio Class 1.0/2.0 streaming while driving an external 24-bit CODEC over one of its two I²S interfaces, with the second I²S available for S/PDIF output. The 512 KB Flash stores USB descriptors and audio effect DSP, and 64 KB RAM buffers multiple audio packets at 48 kHz / 24-bit without dropouts. DMA offloads the audio sample transfer so the CPU handles control transfers and HID volume buttons concurrently, yielding glitch-free playback at low BOM cost versus dedicated USB audio bridges.
Recommended
IoT Edge Sensor Node
The PIC32MX570F512LT-V/GJX combines 50 MHz compute, 16-channel 10-bit ADC at 1 Msps, and CTMU for precise time-of-flight or temperature measurements, making it a strong fit for IoT edge nodes that aggregate sensor data over USB or CAN. Its 512 KB Flash holds TLS or LoRaWAN stacks, and 64 KB RAM accommodates network buffers. PPS remaps peripherals so designers can route UART, SPI, and I²C to any GPIO, simplifying PCB layout in compact sensor enclosures where pin conflicts are common.
Recommended
Automotive Body Control Module
The PIC32MX570F512LT-V/GJX is rated for the V automotive temperature grade (-40°C to +105°C) and integrates CAN 2.0B plus LIN-capable UARTs, targeting body control modules that drive lights, mirrors, and door locks. PMP plus PPS gives flexible pin mapping for matrix-LED drivers and switch scanners. CTMU supports capacitive touch door handles, while the 1 Msps ADC reads multi-channel analog sensors. The integrated USB adds diagnostic connectivity for service tooling, eliminating a separate diagnostic MCU in mid-range BCM designs.
Recommended
Medical Data Logger
The PIC32MX570F512LT-V/GJX provides the storage (512 KB Flash, 64 KB SRAM) and connectivity (USB device, SPI for external Flash, UART for telemetry) required for portable medical data loggers such as continuous glucose monitors or Holter recorders. The RTCC timestamps samples, while the 10-bit ADC with CTMU measures sensor outputs at 1 Msps for high-fidelity signal capture. USB Full-Speed allows convenient charging-cable data transfer, and the -40°C to +105°C V grade supports home and clinical environments.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MX570F512LT-V/GJX — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MX570F512LT-I/GJX | PIC32MX570F512LT-50I/GJX | PIC32MX270F512LT-V/GJX | PIC32MX564F128LT-V/BG |
|---|---|---|---|---|---|
| Package | 100-pin TFBGA (GJX), 7x7 mm | 100-pin TFBGA (GJX) - same | 100-pin TFBGA (GJX) - same | 100-pin TFBGA (GJX) - same | 100-pin TFBGA (BG) - same footprint family |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same |
| Core Speed | 50 MHz / 83 DMIPS | 50 MHz / 83 DMIPS | 50 MHz / 83 DMIPS | 40 MHz / 66 DMIPS (-20%) | 80 MHz / 124 DMIPS (+60%) |
| Flash Memory | 512 KB | 512 KB | 512 KB | 512 KB | 128 KB (-75%) |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 32 KB (-50%) |
| USB Module | USB 2.0 Full-Speed | USB 2.0 Full-Speed | USB 2.0 Full-Speed | USB 2.0 Full-Speed | USB 2.0 Full-Speed |
| CAN Module | CAN 2.0B | CAN 2.0B | CAN 2.0B | None (CAN absent) | CAN 2.0B |
| Temperature Grade | Automotive V (-40C to +105C) | Industrial I (-40C to +85C) | Industrial I (-40C to +85C) | Automotive V (-40C to +105C) | Automotive V (-40C to +105C) |
Key Differentiators
- Higher CPU speed than PIC32MX270 series (vs PIC32MX270F512LT-V/GJX)
- Integrated CAN 2.0B vs no CAN (vs PIC32MX270F512LT-V/GJX)
- More Flash than PIC32MX564 series (vs PIC32MX564F128LT-V/BG)
Design Notes
The 100-TFBGA (GJX, 7x7 mm) package requires a 0.65 mm ball pitch and microvia PCB stack-up per IPC-7351. Use NSMD (non-solder mask defined) pads with a 0.4 mm diameter and an ENIG or OSP finish for reliable assembly. Route all power and ground signals through the inner layers to escape the dense ball grid; place 0.1 µF + 10 µF + 1 µF decoupling capacitors directly under or adjacent to each VDDCORE/VDD ball pair to suppress switching transients during USB Full-Speed activity.
Estimated: at 50 MHz with full USB traffic and CAN transmission, core current is approximately 70 mA at 3.3 V (230 mW). The TFBGA-100 thermal pad should be soldered to a copper pour (at least 100 mm² of 1 oz copper on top layer) connected to multiple ground vias for heat spreading. Without this, junction temperature can rise 30-40°C above ambient at full load, which is acceptable in -40°C to +105°C designs but limits margin in enclosed, high-ambient enclosures. Place a thermistor near the BGA for in-situ thermal monitoring.
Do not confuse the PIC32MX570F512LT-V/GJX (V automotive grade, -40°C to +105°C) with the I industrial grade; both share the GJX package but the temperature rating differs. When migrating firmware between PIC32MX270 and PIC32MX570 families, verify CAN peripheral initialization because PIC32MX270 lacks the CAN module entirely - migrating CAN code requires re-targeting to alternate pins. The RTCC requires an external 32.768 kHz crystal with load capacitance per the datasheet, otherwise timekeeping drifts and the calibration register must compensate in firmware.
USB DP/DM lines require 90 Ω differential impedance matching and a 1.5 kΩ pull-up on DP for Full-Speed detection. Place the USB series ferrite and ESD protection (such as USBLC6-2) within 5 mm of the connector, and route the DP/DM pair with continuous reference plane on layer 2. For CAN bus, use an external MCP2551 or MCP2561 transceiver; the MCU pins are not 5 V tolerant on CAN TX/RX and require level shifting or a 3.3 V transceiver for reliable bus arbitration.
Compliance Information
Automotive V temperature grade, AEC-Q100 qualified per Microchip product page. RoHS and REACH compliant, lead-free and halogen-free. Conflict-minerals declaration available on Microchip compliance portal.
