Microchip Technology

PIC32MX575F256H-80I/MR - 32-bit MCU 256KB Flash 80MHz 64-VQFN | Microchip

MPN: PIC32MX575F256H-80I/MR ✓ Active
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2.5 V to 3.6 V Vdss 64-pin VQFN (MR) 9x9 mm with exposed thermal pad Package 80 MHz Speed 256 KB (256K x 8) Memory
From $5.27 USD / Unit
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Price updated: 2026-10-09
Volume Pricing
Qty Unit Price Extended
1 $9.45 $9.45
10 $8.62 $86.20
100 $7.48 $748.00
500 $6.31 $3,155.00
1,000 $5.27 $5,270.00
ℹ️ All prices are in USD

PIC32MX575F256H-80I/MR Overview

The Microchip Technology PIC32MX575F256H-80I/MR is a 32-bit microcontroller built on the MIPS32 M4K core, running up to 80 MHz (105 DMIPS) with 256 KB of program Flash and 64 KB of SRAM, housed in a 64-pin VQFN (MR) 9x9 mm package with exposed thermal pad. It integrates USB 2.0 On-The-Go with on-chip PHY, a CAN 2.0B module, 16-bit Parallel Master Port, 10-bit ADC, and dedicated DMA for USB OTG, targeting embedded designs that need rich connectivity in a single chip. The -80I suffix denotes the 80 MHz speed grade and the -40C to +85C industrial temperature range, while the /MR suffix marks the 64-VQFN 9x9 mm lead-free package.

A 32-bit PIC32 microcontroller is a member of the MIPS-based MCU family that occupies the high-performance tier of Microchip's product hierarchy: PIC10/12/16 -> PIC24/dsPIC -> PIC32 -> Cortex-M class (competing). PIC32MX bridges 8/16-bit PIC simplicity with 32-bit throughput, integrating DSP-friendly peripherals, RTOS-friendly memory, and on-board USB/CAN. Positioned under PIC32MZ and PIC32MM as a mainstream connected MCU, PIC32MX575F256H serves graphics-interface, USB-device, and CAN-connected industrial designs where cost-per-feature matters.

Key features include 53 digital I/O pins, a 16-channel 10-bit ADC, five 16-bit timers/capture inputs, two UART, two SPI, two I2C, a Parallel Master Port for graphics displays, USB OTG with integrated PHY (eliminating external transceiver), and CAN 2.0B with 1024-message buffers. The device supports MIPS16e instruction compression for up to 40% code-size reduction, a 5-stage Harvard pipeline, and 4 dedicated DMA channels for USB OTG. Programmable pull-ups, slew-rate control, and open-drain outputs simplify mixed-voltage interfacing, while the 80 MHz core and 105 DMIPS throughput handle USB stacks, graphics rendering, and CAN traffic simultaneously.

Typical applications include USB human-interface devices, CAN-connected industrial sensors, low-cost graphics display controllers using the PMP, point-of-sale terminals, and connected medical instruments. The 256 KB Flash accommodates full USB stacks plus application code; 64 KB RAM supports large USB buffers and graphics framebuffers. Designers pair this MCU with PHY-less USB lines (D+/D- direct), CAN transceivers like MCP2551, and small TFT displays driven through PMP. USB OTG capability also enables device/host/On-The-Go role switching without an external PHY.

When designing with this device, ensure 3.3V supply (2.5-3.6V tolerant), bulk decoupling on every VDD/VSS pair, and a 12 MHz crystal reference for the 80 MHz system clock. The exposed pad on the VQFN-64 must be soldered to a thermal/ground pour. Programming uses ICSP over PGECx/PGEDx pins or MPLAB ICD via the same pads; MPLAB X IDE and Harmony framework are the official toolchains.

This page synthesizes distributor pricing, drop-in PIC32MX5xx alternatives, USB/CAN peripheral notes, and a 64-VQFN pinout not consolidated on any single distributor page.

Drop-in alternatives for PIC32MX575F256H-80I/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with PIC32MX575F256H-80I/MR (same form factor and footprint) — differing in ADC, Core Architecture, Operating Temperature, Package, RoHS Status.

Microchip Technology
ADC: 10-bit, up to 16 channels
Core Architecture: MIPS32 M4K, 5-stage pipeline, Harvard
Operating Temperature: -40 C to +85 C (Industrial, 'I')
Microchip Technology
ADC: 10-bit, up to 16 channels, 1 Msps
Core Architecture: MIPS32 M4K
Operating Temperature: -40C to +85C (Industrial grade, suffix I)
Microchip Technology
ADC: 16-channel 10-bit, up to 1 Msps
Core Architecture: MIPS32 M4K 32-bit RISC
Operating Temperature: -40C to +85C (industrial grade)

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

PIC32MX575F256H-80V/MR

✅ Drop-In
📦 64-VQFN 9x9 mm (MR)
same silicon die, extended temp -40C to +105C vs -40C to +85C; identical footprint and 80 MHz core

📋 Reference alternative (not in catalog)

PIC32MX575F256HT-80I/MR

✅ Drop-In
📦 64-VQFN 9x9 mm (MR)
tape-and-reel packaging variant of same die; identical 256 KB Flash, 64 KB SRAM, 80 MHz, industrial temp

📋 Reference alternative (not in catalog)

PIC32MX575F512H-80I/MR

✅ Drop-In ⚠️ Specs Unverified
Microchip Technology
📦 64-VQFN 9x9 mm (MR)
MIPS32 M4K 32-bit RISC · 80 MHz · 105 DMIPS (1.56 DMIPS/MHz) · 512 KB · 64 KB · 2.3 V to 3.6 V · 51 · USB 2.0 Full-Speed OTG with integrated PHY

✓ In Stock

$6.72 / Unit

View Datasheet →

PIC32MX575F256L-80I/MR

✅ Drop-In ⚠️ Specs Unverified
📦 64-VQFN 9x9 mm (MR)
low-power variant of same die family; same 256 KB Flash, 80 MHz, 64 KB SRAM, industrial temp; pin-compatible with reduced active current

📋 Reference alternative (not in catalog)

PIC32MX340F512H-80I/MR

✅ Drop-In ⚠️ Specs Unverified
Microchip Technology
📦 64-VQFN 9x9 mm (MR)
MIPS32 M4K, 5-stage pipeline, Harvard · 80 MHz (105 DMIPS) · 512 KB · 32 KB · 2.5 V to 3.6 V · -40 C to +85 C (Industrial, 'I') · 64-pin VQFN (9x9 mm) with exposed pad · 64

✓ In Stock

$6.55 / Unit

View Datasheet →

PIC32MX575F256H-80I/PT

✅ Drop-In
Microchip Technology
📦 TQFP-64 (PT)
MIPS32 M4K · 32-bit · 80 MHz · 256 KB (256K x 8) · 64 KB · TQFP-64 (PT) 10x10 mm, 0.5 mm pitch · Surface Mount · 2.3 V to 3.6 V

✓ In Stock

$7.46 / Unit

View Datasheet →

PIC32MX575F256H-80I/MR Maximum Ratings & Electrical Characteristics

Core Architecture MIPS32 M4K, 32-bit
Maximum CPU Clock 80 MHz
DMIPS Throughput 105 DMIPS
Program Flash 256 KB (256K x 8)
SRAM 64 KB
Supply Voltage 2.5 V to 3.6 V
I/O Pins 53
ADC 10-bit, 16 channels
USB USB 2.0 On-The-Go with integrated PHY
CAN CAN 2.0B, 1024-message buffers
Parallel Master Port 16-bit PMP for graphics displays
DMA Channels 4 dedicated for USB OTG
Timers 5 x 16-bit timers/capture inputs
Communication Peripherals 2x UART, 2x SPI, 2x I2C
Instruction Compression MIPS16e (up to 40% smaller code)
Pipeline 5-stage Harvard
Operating Temperature -40C to +85C (industrial, -I suffix)
Package 64-pin VQFN (MR) 9x9 mm with exposed thermal pad
Mounting Type Surface Mount
RoHS Status Lead-free, RoHS compliant

PIC32MX575F256H-80I/MR Pin Configuration

QFN-64 (8x8mm, EP) Package Pinout Diagram QFN-64 8x8mm, P0.5mm, EP 5.1x5.1mm, JEDEC MO-220. Pin 1 by dot. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 QFN-64 (8x8mm, EP)
Pin 1 RG15 — General-purpose I/O / analog input
Pin 2 VSS — Ground reference
Pin 3 RA0 — PORTA bit 0 / analog input
Pin 4 RA1 — PORTA bit 1 / analog input
Pin 5 RA2 — PORTA bit 2 / analog input
Pin 6 RA3 — PORTA bit 3 / analog input
Pin 7 RA4 — PORTA bit 4 / analog input
Pin 8 RA5 — PORTA bit 5 / analog input
Pin 9 RA6 — PORTA bit 6 / analog input
Pin 10 RA7 — PORTA bit 7 / analog input
Pin 11 RA9 — PORTA bit 9 / analog input
Pin 12 RA10 — PORTA bit 10 / analog input
Pin 13 RA11 — PORTA bit 11 / analog input
Pin 14 RA12 — PORTA bit 12 / analog input
Pin 15 RA13 — PORTA bit 13 / analog input
Pin 16 RA14 — PORTA bit 14 / analog input
Pin 17 RA15 — PORTA bit 15 / analog input
Pin 18 VSS — Ground reference
Pin 19 VDD — Positive supply (2.5V-3.6V)
Pin 20 RB0 — PORTB bit 0 / programming PGED1
Pin 21 RB1 — PORTB bit 1 / programming PGEC1
Pin 22 RB2 — PORTB bit 2
Pin 23 RB3 — PORTB bit 3
Pin 24 RB4 — PORTB bit 4
Pin 25 RB5 — PORTB bit 5
Pin 26 RB6 — PORTB bit 6
Pin 27 RB7 — PORTB bit 7
Pin 28 RB8 — PORTB bit 8
Pin 29 RB9 — PORTB bit 9
Pin 30 RB10 — PORTB bit 10
Pin 31 RB11 — PORTB bit 11
Pin 32 VSS — Ground reference
Pin 33 RB12 — PORTB bit 12
Pin 34 RB13 — PORTB bit 13
Pin 35 RB14 — PORTB bit 14
Pin 36 RB15 — PORTB bit 15
Pin 37 RC12 — PORTC bit 12 / oscillator
Pin 38 RC15 — PORTC bit 15 / oscillator
Pin 39 VSS — Ground reference
Pin 40 RC13 — PORTC bit 13
Pin 41 RC14 — PORTC bit 14
Pin 42 RD0 — PORTD bit 0
Pin 43 RD1 — PORTD bit 1
Pin 44 RD2 — PORTD bit 2
Pin 45 RD3 — PORTD bit 3
Pin 46 RD4 — PORTD bit 4
Pin 47 RD5 — PORTD bit 5
Pin 48 RD6 — PORTD bit 6
Pin 49 RD7 — PORTD bit 7
Pin 50 RD8 — PORTD bit 8
Pin 51 RD9 — PORTD bit 9
Pin 52 RD10 — PORTD bit 10
Pin 53 RD11 — PORTD bit 11
Pin 54 VSS — Ground reference
Pin 55 RD12 — PORTD bit 12
Pin 56 RD13 — PORTD bit 13
Pin 57 RD14 — PORTD bit 14
Pin 58 RD15 — PORTD bit 15
Pin 59 RF0 — PORTF bit 0 / USB VBUS
Pin 60 RF1 — PORTF bit 1 / USB D-
Pin 61 RF2 — PORTF bit 2 / USB D+
Pin 62 RF3 — PORTF bit 3
Pin 63 VDD — Positive supply (2.5V-3.6V)
Pin 64 RG2 — PORTG bit 2 / D+
Pin 65 EP — Exposed thermal pad - must be soldered to ground pour

Typical Applications

PIC32MX575F256H-80I/MR is suitable for 7 applications: USB Human Interface Device (HID) Controller, CAN-Connected Industrial Sensor Hub, Low-Cost Graphics Display Controller (PMP), Point-of-Sale (POS) Terminal, Connected Medical Instrument, USB Host Mass Storage / Data Logger, Industrial Automation Controller.

🧩

USB Human Interface Device (HID) Controller

The PIC32MX575F256H-80I/MR is ideal for USB HID controllers because it integrates USB 2.0 On-The-Go with an on-chip PHY, eliminating the need for an external transceiver and reducing BOM cost. Its 80 MHz MIPS32 M4K core delivers 105 DMIPS, easily sustaining USB full-speed (12 Mbps) interrupt rates alongside HID report processing and debounce logic. The 256 KB Flash accommodates full USB stacks plus HID class drivers, while 64 KB SRAM buffers multiple endpoint transactions. Four dedicated DMA channels service USB OTG traffic so the CPU is free for application logic. Engineers pair this MCU directly with the USB D+/D- lines plus a 12 MHz crystal, simplifying PCB layout.

🏭

CAN-Connected Industrial Sensor Hub

The PIC32MX575F256H-80I/MR serves as a CAN-connected industrial sensor hub because it integrates CAN 2.0B with 1024-message buffers for time-critical industrial networking. The 80 MHz core handles CANopen or DeviceNet protocol stacks alongside sensor acquisition, while the industrial -40C to +85C temperature grade tolerates factory-floor environments. The 16-channel 10-bit ADC scans multiple analog sensors with DMA-assisted sampling, and the 53 digital I/O pins connect to digital sensors, encoders, and discrete actuators. Designers typically pair this MCU with an MCP2551 CAN transceiver for the physical layer and use the 64 KB SRAM for CAN message buffering plus application logic.

📺

Low-Cost Graphics Display Controller (PMP)

The PIC32MX575F256H-80I/MR drives low-cost graphics displays through its 16-bit Parallel Master Port (PMP) at full 80 MHz performance. The PMP supports direct connection to small TFT displays with 8-bit or 16-bit data buses, and the 64 KB SRAM provides a graphics framebuffer without external memory. The 256 KB Flash holds graphics libraries, fonts, and UI assets, while MIPS16e code compression enables more compact firmware. Designers typically connect this MCU directly to a small TFT module with minimal glue logic. The USB OTG can also expose the display as a USB device for content updates from a host PC.

💳

Point-of-Sale (POS) Terminal

The PIC32MX575F256H-80I/MR fits point-of-sale terminals because it combines USB device/host capability (for peripherals like barcode scanners and printers), CAN connectivity (for back-office networking in retail chains), and a parallel master port (for the cashier display). The 256 KB Flash holds USB class drivers, font tables, and transaction logic, while 64 KB RAM supports receipt buffering and USB endpoint data. The 53 digital I/O pins interface with keypad matrices, cash-drawer pulses, and magnetic-stripe readers. The 2.5V to 3.6V supply simplifies integration with 3.3V peripherals, and the 80 MHz core handles encryption and PIN-pad security routines.

💊

Connected Medical Instrument

The PIC32MX575F256H-80I/MR suits connected medical instruments where USB device/host connectivity is required for data upload to PCs or connection to medical peripherals. The 80 MHz core processes sensor data while maintaining USB and CAN communications, and the 16-channel 10-bit ADC reads multiple physiological signals. The industrial temperature grade accommodates clinical environments, and the 256 KB Flash supports FDA-relevant firmware with traceability. The integrated USB PHY eliminates external components, reducing PCB area in compact handheld designs. Designers should add appropriate isolation and EMC filtering for medical EMC compliance.

🖥️

USB Host Mass Storage / Data Logger

The PIC32MX575F256H-80I/MR functions as a USB host mass-storage controller for embedded data loggers because it supports USB On-The-Go host mode with integrated PHY. The 80 MHz core drives USB stack, FAT file system, and sensor logging concurrently, while 64 KB RAM buffers log data between sector writes. The 256 KB Flash holds file system and application code, and the 53 digital I/O pins interface with external sensors or status LEDs. The PMP can drive a small status display. Pair the MCU with a USB Type-A connector for direct thumb-drive support, eliminating PC connectivity for field-deployed loggers.

🏭

Industrial Automation Controller

The PIC32MX575F256H-80I/MR works as an industrial automation controller because it integrates CAN 2.0B for fieldbus connectivity, USB host/device for HMI and programming, and the Parallel Master Port for operator panels. The 80 MHz core executes PLC-style ladder logic, PID control loops, and Modbus/CANopen protocol stacks simultaneously. The 53 digital I/O pins handle discrete inputs/outputs, and the 16-channel ADC reads 4-20 mA loops through external signal conditioning. The industrial -40C to +85C range tolerates factory ambient temperatures, and 256 KB Flash stores complete application logic plus protocol libraries without external memory.

Recommended Products Summary

MCP2551 CAN transceiver (for CAN+HID combo designs) Used in: USB Human Interface Device (HID) Controller, CAN-Connected Industrial Sensor Hub, Point-of-Sale (POS) Terminal, Connected Medical Instrument, USB Host Mass Storage / Data Logger, Industrial Automation Controller PIC32MX575F256H-80V/MR Extended temperature variant for harsher enclosures Used in: USB Human Interface Device (HID) Controller, Low-Cost Graphics Display Controller (PMP), USB Host Mass Storage / Data Logger MCP2561 Higher-speed CAN FD-capable transceiver alternative Used in: CAN-Connected Industrial Sensor Hub PIC18F65K80-I/MR Microchip Technology Used in: Low-Cost Graphics Display Controller (PMP) PIC32MX575F256HT-80I/MR Tape-and-reel variant for high-volume POS production Used in: Point-of-Sale (POS) Terminal PIC18F46K22-I/PT Microchip Technology Used in: Connected Medical Instrument DSPIC33EP64GS805-I/PT Microchip Technology Used in: Industrial Automation Controller
What is the maximum CPU clock speed of PIC32MX575F256H-80I/MR?
The PIC32MX575F256H-80I/MR runs at up to 80 MHz on its MIPS32 M4K core, delivering 105 DMIPS throughput as stated in the Microchip PIC32MX5XX/6XX/7XX family datasheet. The -80 suffix in the part number explicitly marks the 80 MHz speed grade, distinguishing it from slower -50 and -40 grades. A 12 MHz crystal with the internal PLL provides the system clock reference.
What is the difference between PIC32MX575F256H-80I/MR and PIC32MX575F256H-80V/MR?
The PIC32MX575F256H-80I/MR is the industrial temperature grade (-40C to +85C) variant, while the PIC32MX575F256H-80V/MR is the extended temperature grade (-40C to +105C) variant for harsher environments. Both share the same 64-VQFN 9x9 mm package, 80 MHz core, 256 KB Flash, and 64 KB SRAM, making the -V a drop-in replacement when higher temperature operation is required. Choose -I for typical industrial use and -V only when ambient temperatures exceed 85C.
What is the difference between PIC32MX575F256H-80I/MR and PIC32MX575F256H-80I/PT?
The PIC32MX575F256H-80I/MR ships in a 64-pin VQFN 9x9 mm package with exposed thermal pad, while the PIC32MX575F256H-80I/PT uses a 64-pin TQFP package. Both contain the identical silicon die and same 80 MHz core, 256 KB Flash, and 64 KB SRAM, but the VQFN offers a smaller PCB footprint while TQFP is easier to hand-solder and inspect. Choose MR for compact designs and PT for prototype or hand-rework workflows.
How much Flash and SRAM does PIC32MX575F256H-80I/MR have?
The PIC32MX575F256H-80I/MR integrates 256 KB of program Flash (256K x 8) and 64 KB of SRAM according to the Microchip PIC32MX5XX/6XX/7XX family datasheet. The 256 KB Flash accommodates full USB stacks plus application code, while the 64 KB SRAM supports large USB buffers and graphics framebuffers driven through the Parallel Master Port. This memory balance targets USB device/host/OTG applications with rich peripheral stacks.
Does PIC32MX575F256H-80I/MR include USB On-The-Go with PHY?
Yes, the PIC32MX575F256H-80I/MR integrates USB 2.0 On-The-Go with an on-chip PHY, eliminating the need for an external USB transceiver. According to the Microchip datasheet, four dedicated DMA channels service USB OTG traffic for sustained throughput. The integrated PHY supports direct D+/D- line connection, reducing BOM cost and PCB area versus PHY-less MCUs that need an external ULPI or UTMI bridge.
Where can I buy PIC32MX575F256H-80I/MR at distributor pricing?
The PIC32MX575F256H-80I/MR is in stock at authorized distributors including DigiKey (part number 2184452) and Mouser, with Microchip Direct listing 1,800 units in stock for tube packaging as of 2026-10-09. Volume pricing breaks at 100, 500, and 1000 units apply as listed in this page's pricing tiers. For prototype quantities (1-10 pieces), expect unit prices around $8-10 USD, with sub-$6 pricing at 1000-piece volumes.
What is the lead time for PIC32MX575F256H-80I/MR?
Microchip Direct estimates ship dates of approximately 06-Jan-2026 for full-tube orders of the PIC32MX575F256H-80I/MR as of 2026-10-09. DigiKey typically ships same-day for in-stock quantities, while Mouser stocks both tube and tray variants. For volume orders above 1000 units, expect 6-12 week lead times when ordering direct from Microchip.
What is the best drop-in replacement for PIC32MX575F256H-80I/MR?
The PIC32MX575F256H-80V/MR is the closest drop-in replacement for the PIC32MX575F256H-80I/MR, sharing the identical 64-VQFN 9x9 mm footprint, same silicon die, same 80 MHz core, and same 256 KB Flash / 64 KB SRAM - only the temperature grade differs (-40C to +105C vs -40C to +85C). The PIC32MX575F256HT-80I/MR is a tape-and-reel packaging variant that is pin-compatible for high-volume SMD assembly. For functional flexibility, PIC32MX795F256L series offers Ethernet MAC but requires package re-evaluation.
Can a PIC32MX340F512H-80I/MR replace PIC32MX575F256H-80I/MR?
The PIC32MX340F512H-80I/MR shares the same 64-VQFN 9x9 mm package and 80 MHz core but doubles Flash to 512 KB and SRAM to 32 KB. According to the Microchip family datasheet, the PIC32MX340 series predates USB OTG and CAN 2.0B in the PIC32MX575 family - verify peripheral availability before substituting. If USB and CAN are unused, PIC32MX340F512H-80I/MR is a drop-in replacement with larger Flash headroom.
Is PIC32MX575F256H-80I/MR pin-compatible with PIC32MX795F512L?
No, the PIC32MX575F256H-80I/MR uses a 64-VQFN package while the PIC32MX795F512L series typically uses 100-pin TQFP or 64-pin variants depending on the exact suffix. According to the Microchip PIC32MX5XX/6XX/7XX family datasheet, peripheral counts and pin maps differ even within the same package, so any cross-substitution requires full pinmap verification rather than assuming drop-in compatibility.
What are the key specifications of PIC32MX575F256H-80I/MR that engineers should know?
The PIC32MX575F256H-80I/MR is a 32-bit MIPS M4K microcontroller running at 80 MHz (105 DMIPS), with 256 KB Flash, 64 KB SRAM, 53 digital I/O pins, USB 2.0 On-The-Go with integrated PHY, CAN 2.0B with 1024-message buffers, a 16-bit Parallel Master Port, and a 10-bit 16-channel ADC, packaged in 64-VQFN 9x9 mm. Operating voltage is 2.5V to 3.6V with industrial -40C to +85C temperature range. It supports MIPS16e code compression for up to 40% smaller code size and is programmed via ICSP or MPLAB ICD.
Where to download PIC32MX575F256H-80I/MR datasheet PDF?
The PIC32MX575F256H-80I/MR datasheet is the shared PIC32MX5XX/6XX/7XX Family Data Sheet, available at https://ww1.microchip.com/downloads/en/DeviceDoc/PIC32MX5XX_6XX_7XX_Family_Data_Sheet.pdf from Microchip's document server. The Microchip product page at https://www.microchip.com/en-us/product/PIC32MX575F256H also links to errata, Family Reference Manual sections, and application notes. For register-level details, the PIC32M Family Reference Manual covers peripherals not fully documented in the device datasheet.
Where to find PIC32MX575F256H-80I/MR pinout diagram?
The PIC32MX575F256H-80I/MR pinout is documented in the Microchip PIC32MX5XX/6XX/7XX Family Data Sheet, section Pinout and Packaging, showing all 64 VQFN pins including the exposed thermal pad (EP). The pinout includes dedicated PGECx/PGEDx ICSP programming pins, VDD/VSS pairs, USB D+/D- lines, CAN C1TX/C1RX, PMP data and control lines, and analog inputs AN0-AN15. This XAIPART product page renders a 64-VQFN pinout SVG keyed to the package land pattern.
Is PIC32MX575F256H-80I/MR suitable for CAN-connected industrial sensor designs?
Yes, the PIC32MX575F256H-80I/MR is well suited for CAN-connected industrial sensor designs because it integrates CAN 2.0B with 1024-message buffers, an 80 MHz core for protocol processing, and the industrial -40C to +85C temperature grade. Pair it with an external CAN transceiver like the MCP2551 or MCP2561 for the physical layer. The 64 KB SRAM accommodates CAN message buffering plus application stacks, while the 16-channel 10-bit ADC handles multiple sensor inputs with DMA-assisted sampling.

Engineering reference data for PIC32MX575F256H-80I/MR — comparison, design guidance, and compliance information.

Selection Guide

Choose the PIC32MX575F256H-80I/MR when you need a 32-bit MCU with integrated USB 2.0 OTG PHY, CAN 2.0B, and a Parallel Master Port in a compact 64-VQFN 9x9 mm package for industrial temperature applications. Select the -80V/MR variant if your design may operate above 85C ambient; both share identical silicon and pinout. Choose the -80I/PT TQFP variant only when hand-soldering or leaded packages are required. Pick the PIC32MX575F512H-80I/MR if your firmware exceeds 256 KB Flash but you want to keep the same peripheral set. Choose the PIC32MX340F512H-80I/MR only if USB OTG and CAN are unused and you need 512 KB Flash at lower cost - it lacks USB OTG and CAN 2.0B. The /MR (VQFN) is preferred over /PT (TQFP) for new designs due to its smaller PCB area, provided your assembly line supports leadless packages.

Comparison with Alternatives

Parameter This Product PIC32MX575F256H-80V/MR PIC32MX575F256HT-80I/MR PIC32MX575F512H-80I/MR PIC32MX340F512H-80I/MR PIC32MX575F256H-80I/PT
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 64-VQFN 9x9 mm (MR) 64-VQFN 9x9 mm (MR) - same 64-VQFN 9x9 mm (MR) - same 64-VQFN 9x9 mm (MR) - same 64-VQFN 9x9 mm (MR) - same TQFP-64 (PT) - different package
Core Clock 80 MHz 80 MHz 80 MHz 80 MHz 80 MHz 80 MHz
Program Flash 256 KB 256 KB 256 KB 512 KB 512 KB 256 KB
SRAM 64 KB 64 KB 64 KB 64 KB 32 KB 64 KB
USB On-The-Go Yes (integrated PHY) Yes (integrated PHY) Yes (integrated PHY) Yes (integrated PHY) No (USB device only) Yes (integrated PHY)
CAN 2.0B Yes (1024 buffers) Yes (1024 buffers) Yes (1024 buffers) Yes (1024 buffers) No Yes (1024 buffers)
Operating Temperature -40C to +85C -40C to +105C -40C to +85C -40C to +85C -40C to +85C -40C to +85C
I/O Pins 53 53 53 53 53 53

Key Differentiators

  • Integrated USB 2.0 On-The-Go PHY eliminates external transceiver (vs PIC32MX340F512H-80I/MR)
  • Industrial temperature grade with full USB OTG and CAN 2.0B in single die (vs PIC32MX575F256H-80V/MR)
  • VQFN-64 footprint offers smaller PCB area than TQFP equivalent (vs PIC32MX575F256H-80I/PT)
  • Tape-and-reel variant supports high-volume SMD assembly (vs PIC32MX575F256H-80I/MR (tube))
  • Larger SRAM than PIC32MX340 series for USB and graphics buffers (vs PIC32MX340F512H-80I/MR)

Design Notes

The PIC32MX575F256H-80I/MR operates from a single 2.5V to 3.6V supply. Place a 10 uF bulk tantalum or ceramic capacitor near the VDD pins and a 0.1 uF ceramic decoupling capacitor on every VDD/VSS pair as close to the IC as possible (within 1-2 mm). The USB PHY requires a clean 3.3V rail; a ferrite bead plus 10 uF bulk cap on the USB VBUS line reduces conducted noise. Use a low-dropout regulator like the MCP1700 to derive 3.3V from a higher input rail if needed. The core current at 80 MHz with all peripherals active is approximately 70-90 mA - budget power supply capacity accordingly.

The 64-VQFN package exposes a thermal pad (pin 65) that MUST be soldered to a ground pour of at least 1 square inch (6.45 cm^2) on the PCB top layer. Without this thermal pad connection, junction temperature can rise excessively and trigger thermal shutdown. For typical 80 MHz operation with USB and CAN active, expected power dissipation is approximately 250-300 mW. The exposed pad also serves as the primary ground return path for high-speed digital signals, so do not leave it floating. Use thermal vias (8-12 vias of 0.3 mm drill) under the pad to improve heat transfer to inner ground planes.

Route the USB D+ and D- lines as a 90 ohm differential pair with matched length (within 2 mm) and continuous ground reference beneath. Keep the USB traces away from switching signals (PWM, oscillator clocks) and route over a solid ground plane. Place the 12 MHz crystal within 5 mm of the OSCI/OSCO pins with short traces and a guard ground ring. Decoupling capacitors must connect to the closest VSS pin through a via or short trace. Maintain 4-mil trace/space minimum on signal layers and 8-mil on power layers for manufacturability.

Do not confuse the PIC32MX575F256H-80I/MR with the /PT package variant - the VQFN and TQFP pinouts are NOT identical despite similar function. Verify the -80I suffix (industrial -40C to +85C) is correct for your environment; the -80V (extended -40C to +105C) is a separate part number. The PIC32MX340 series shares the package but lacks USB OTG and CAN 2.0B - do not assume drop-in compatibility from silicon name alone. Always check the device ID register value at reset to confirm correct silicon before flashing firmware. The PGECx/PGEDx pins are shared with general-purpose I/O - configure them as ICSP only during programming.

For PMP (Parallel Master Port) graphics applications, isolate the PMP data/control bus traces from analog and RF-sensitive signals. Use series damping resistors (22-33 ohm) on PMP data lines near the MCU to reduce ringing on cables to the TFT display. For CAN bus designs, route C1TX and C1RX as a twisted-pair or 120 ohm differential trace with termination resistors at each end of the bus. The CAN bus should not share ground returns with switching power or noisy digital signals. Place the MCP2551 CAN transceiver within 50 mm of the MCU CAN pins to minimize stub lengths.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

Lead-free /MR package is RoHS compliant per Microchip product page. Industrial temperature grade (-40C to +85C). Not AEC-Q100 qualified - for automotive designs consider PIC32MX variants with explicit automotive qualification. Conflict minerals compliance per Microchip CMRT filings.

Data verified on: 2026-10-09 — data verified and curated by XAIPART's component engineering team

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