PIC32MX764F128L-I/BG - 80MHz 32-bit MCU 128KB Flash USB/CAN/ETH | Microchip
MPN: PIC32MX764F128L-I/BG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $9.45 | $9.45 |
| 10 | $8.75 | $87.50 |
| 100 | $7.85 | $785.00 |
| 500 | $7.1 | $3,550.00 |
| 1,000 | $6.8 | $6,800.00 |
PIC32MX764F128L-I/BG Overview
An MCU (microcontroller unit) is a single-chip computer containing a CPU core, non-volatile program memory (Flash), volatile data memory (SRAM), and a rich set of on-chip peripherals (UART, SPI, I2C, timers, ADCs, communication controllers). Microcontrollers belong to the embedded computing hierarchy: MCU -> embedded processor -> semiconductor -> integrated circuit. The PIC32MX family specifically targets connected-embedded applications where deterministic real-time performance, low power, and integrated connectivity peripherals reduce or eliminate external components.
Key features include 128 KB Flash program memory, 32 KB SRAM, four DMA channels (4 DMA), a 10-bit 1 Msps ADC with up to 16 channels, two I2C, two SPI, five UART modules, two comparators, and a 16-bit parallel master port (PMP). The 80 MHz core delivers 1.56 DMIPS/MHz (Dhrystone 2.1) and up to 105 DMIPS/cycle-equivalent throughput for protocol/handler overhead. Industrial-grade (I-TEM) operating range of -40 to +85 °C suits factory automation and harsh-environment deployments. The integrated PHY-less Ethernet MAC, USB with on-chip transceiver, and CAN module eliminate external connectivity ICs, reducing BOM cost and PCB footprint for connected designs.
Typical applications include industrial Ethernet-based control nodes, USB human-interface devices, CAN-bus node bridging, embedded web servers with TCP/IP stacks, and low-cost graphics terminals using the PMP. Software support includes MPLAB Harmony, MPLAB XC32 compiler, and the free TCP/IP, USB, and graphics libraries from Microchip.
When designing with the PIC32MX764F128L-I/BG, place 100 nF decoupling capacitors close to every VDD/AVDD pin pair and route the USB DP/DM traces as a 90 Ω matched differential pair. The 121-ball TFBGA requires PCB pad redesign versus QFP packages, so verify reflow profile matches JEDEC J-STD-020 MSL-3 handling for the 10x10 mm 0.8 mm pitch array.
This page synthesizes distributor pricing, drop-in alternatives drawn from the same PIC32MX family, and practical PCB-layout guidance that complements the manufacturer datasheet reference manual.
Drop-in alternatives for PIC32MX764F128L-I/BG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MX764F128L-I/BG (same form factor and footprint) — differing in ADC, Package, Timers, USB, Core Architecture.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MX764F128LT-I/BG
✅ Drop-In✓ In Stock
$5.42 / Unit
View Datasheet →PIC32MX795F512L-80I/BG
✅ Drop-In✓ In Stock
$9.1 / Unit
View Datasheet →PIC32MX695F512L-80I/BG
✅ Drop-In✓ In Stock
$14.85 / Unit
View Datasheet →PIC32MX675F256L-80I/BG
✅ Drop-In✓ In Stock
$6.2 / Unit
View Datasheet →PIC32MX564F128L-I/BG
✅ Drop-In✓ In Stock
$5.7 / Unit
View Datasheet →PIC32MX460F512L-80V/BG
✅ Drop-In✓ In Stock
$6.1 / Unit
View Datasheet →PIC32MX360F512L-80V/BG
✅ Drop-In✓ In Stock
$6.65 / Unit
View Datasheet →PIC32MX764F128L-I/BG Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 M4K |
| Core Width | 32-bit |
| Maximum Core Frequency | 80 MHz |
| Performance | 1.56 DMIPS/MHz (Dhrystone 2.1) |
| Program Flash Memory | 128 KB (128K x 8) |
| Data SRAM | 32 KB |
| DMA Channels | 4 |
| Operating Voltage Range | 2.3 V to 3.6 V |
| Ethernet MAC | 10/100 Mbit (PHY-less, MII/RMII) |
| USB | USB 2.0 Full-Speed Device/Host/OTG |
| CAN | CAN 2.0B |
| UART Modules | 5 |
| SPI Modules | 2 |
| I2C Modules | 2 |
| ADC | 10-bit, up to 16 channels, 1 Msps |
| Parallel Master Port (PMP) | 16-bit |
| Comparators | 2 |
| Timers | Five 16-bit timers, two 32-bit timers |
| Operating Temperature Range | -40 °C to +85 °C (Industrial) |
| Package | 121-ball TFBGA, 10 mm x 10 mm x 1.1 mm |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | 3 (per JEDEC J-STD-020) |
PIC32MX764F128L-I/BG 121-ball tfbga, 10 mm x 10 mm x 1.1 mm Pin Configuration Guide
Pin configuration for PIC32MX764F128L-I/BG (121-ball tfbga, 10 mm x 10 mm x 1.1 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for PIC32MX764F128L-I/BG.
Refer to the datasheet for full pin configuration.
Typical Applications
PIC32MX764F128L-I/BG is suitable for 6 applications: Industrial Ethernet Control Nodes, USB Human-Interface Devices (HID) and CDC Devices, CAN-Bus Node Bridging, Embedded Web Servers / IoT Gateways, Low-Cost Graphics Terminals, Smart Energy / Metering Endpoints.
Industrial Ethernet Control Nodes
The PIC32MX764F128L-I/BG's integrated 10/100 Ethernet MAC plus 80 MHz MIPS32 M4K core makes it well-suited for industrial Ethernet control nodes running Modbus TCP or EtherNet/IP. The 32 KB SRAM hosts the lwIP stack plus application buffers, while 128 KB Flash accommodates Microchip's free TCP/IP library. The four DMA channels service TCP/IP packet transfers without CPU intervention, freeing CPU cycles for deterministic control loops. The USB and CAN peripherals add bridging capability for legacy serial fieldbus integration. The 121-ball TFBGA footprint and -40 to +85 °C industrial range suit DIN-rail-mounted designs where Ethernet isolation and PHY-less MAC design reduce BOM. Companion components include external PHY LAN8720A (RMII) and an isolated DC-DC supply.
Recommended
USB Human-Interface Devices (HID) and CDC Devices
The PIC32MX764F128L-I/BG's on-chip USB 2.0 full-speed OTG controller delivers 12 Mbps without an external transceiver, making it an obvious fit for USB HID peripherals and USB CDC/ACM virtual COM ports. The 80 MHz core handles HID report polling at 1 ms with adequate headroom for application logic. Five UART modules support legacy RS-232/RS-485 bridging inside a USB-to-UART bridge product. The 121-ball TFBGA at 10x10 mm enables compact PCB designs. The integrated pull-up resistors on D+/D- further simplify USB enumeration. Pair the MCU with a USBLC6-2SC6 TVS for ESD protection on DP/DM lines.
Recommended
CAN-Bus Node Bridging
The PIC32MX764F128L-I/BG integrates a CAN 2.0B controller plus 80 MHz CPU, ideal for industrial CAN-bus node bridging where the MCU must timestamp CAN frames and forward them over Ethernet or USB. The 32 KB SRAM holds CAN frame buffers and lwIP sockets concurrently. The PIC32's DMA channels offload CAN receive, allowing the CPU to handle the application stack efficiently. The 121-ball TFBGA package suits compact IP65-sealed field-bus enclosures. The -40 to +85 °C industrial operating range covers factory-floor temperature extremes. Pair with MCP2551 CAN transceiver for 1 Mbps CAN-HS.
Recommended
Embedded Web Servers / IoT Gateways
The PIC32MX764F128L-I/BG's combination of Ethernet MAC, USB, CAN, and 32 KB SRAM makes it a natural fit for embedded web servers and IoT gateways that aggregate sensor data and expose it via HTTP/REST. The free Microchip TCP/IP and HTTP server libraries fit comfortably in 128 KB Flash alongside customer firmware. The 80 MHz core serves concurrent REST endpoints with sub-100 ms latency on small JSON payloads. Four DMA channels accelerate SPI-to-Ethernet sensor-bus aggregation without CPU intervention. The 121-ball TFBGA at 10x10 mm enables compact gateway housings.
Recommended
Low-Cost Graphics Terminals
The PIC32MX764F128L-I/BG's integrated 16-bit PMP (Parallel Master Port) drives small TFT displays up to WQVGA (480x272) in cost-sensitive HMI terminals. The 80 MHz core refreshes the frame buffer from external SPI Flash with adequate latency. The 32 KB SRAM provides a frame buffer for small LCD panels, while 128 KB Flash stores fonts, icons, and application UI logic. The USB and Ethernet connectivity add remote-management capability, while CAN supports fieldbus integration on the same PCB. The TFBGA footprint enables compact bezel-less enclosures. Pair with PIC32MX675F256L-80I/BG if larger frame buffer or higher Flash is required.
Recommended
Smart Energy / Metering Endpoints
The PIC32MX764F128L-I/BG's combination of USB (for local readout), CAN (for in-meter networking), and Ethernet (for AMI backhaul) suits smart-meter and energy-monitoring endpoints. The 32 KB SRAM hosts metering data plus TCP/IP buffers simultaneously, and 128 KB Flash accommodates the metering library, security stack, and remote firmware-update code. The four DMA channels enable low-overhead ADC sampling of voltage and current sensors. The industrial -40 to +85 °C range covers outdoor-metering cabinet extremes. The on-chip 10-bit 1 Msps ADC digitizes analog front-end signals directly.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MX764F128L-I/BG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MX764F128LT-I/BG | PIC32MX795F512L-80I/BG | PIC32MX695F512L-80I/BG | PIC32MX675F256L-80I/BG | PIC32MX564F128L-I/BG | PIC32MX460F512L-80V/BG | PIC32MX360F512L-80V/BG |
|---|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 121-ball TFBGA (10x10) | 121-ball TFBGA (10x10) - same | 121-ball TFBGA (10x10) - same | 121-ball TFBGA (10x10) - same | 121-ball TFBGA (10x10) - same | 121-ball TFBGA (10x10) - same | 121-ball TFBGA (10x10) - same | 121-ball TFBGA (10x10) - same |
| Core Frequency | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
| Flash Memory | 128 KB | 128 KB | 512 KB | 512 KB | 256 KB | 128 KB | 512 KB | 512 KB |
| SRAM | 32 KB | 32 KB | 128 KB | 128 KB | 64 KB | 32 KB | 32 KB | 32 KB |
| USB Peripheral | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS Host/Device | USB 2.0 FS Host/Device | USB 2.0 FS Host/Device (no OTG) | USB 2.0 FS Device | USB 2.0 FS Device |
| CAN 2.0B | Yes | Yes | Yes | No | No | Yes | No | No |
| Operating Temperature | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +105 °C | -40 °C to +105 °C |
Key Differentiators
- Integrated USB OTG plus CAN 2.0B plus 10/100 Ethernet MAC (vs PIC32MX675F256L-80I/BG)
- Higher memory headroom for connected designs (vs PIC32MX564F128L-I/BG)
- Cost-down USB-device-only path with same footprint (vs PIC32MX360F512L-80V/BG)
Design Notes
Place one 100 nF decoupling capacitor on every VDD/AVDD pin pair as close to the ball as practical (under 1.5 mm trace length). Add a single 4.7 µF bulk capacitor near the MCU's main VDD rail. The PIC32MX764F128L-I/BG integrates an internal 1.8 V core regulator, but the external 2.3-3.6 V supply must remain stable under MCU load transients to avoid POR events. A ferrite bead between analog AVDD and digital VDD reduces ADC noise by 10-15 LSB.
The 121-ball TFBGA at 0.8 mm ball pitch requires PCB microvia-in-pad technology (laser-drilled stacked vias). Use 0.4 mm pad diameter with non-solder-mask-defined (NSMD) pads for reliable joint formation. Verify the PCB manufacturer supports 0.8 mm-pitch BGA assembly - many low-volume shops reject this pitch. Match the USB DP/DM differential pair to 90 Ω impedance with length matching under 150 mil tolerance per USB 2.0 specification.
Do not confuse the PIC32MX764F128L-I/BG (with USB OTG and CAN) with the PIC32MX564F128L-I/BG (legacy without USB OTG) or PIC32MX664F128L-I/BG (no CAN). Verify the exact ordering code on the device marking against the datasheet before programming. The TFBGA package cannot be reworked easily, so factory pre-programming is recommended for production quantities via Microchip's Programming Service.
Estimated: the 121-ball TFBGA at 80 MHz with all peripherals active draws approximately 65-90 mA from a 3.3 V supply, dissipating 0.21-0.30 W. With the TFBGA theta_JA of approximately 35 °C/W, junction temperature rise above ambient is roughly 7-11 °C - well within the 125 °C max junction rating for industrial-grade operation. The TFBGA's bottom-side thermal pad should be soldered to the PCB's central ground pour for improved heat spreading.
Compliance Information
RoHS compliance per Microchip product page. Industrial -40 to +85 °C temperature range. NOT AEC-Q100 qualified (industrial, not automotive grade).
