PIC32MZ2025DAA288T-I/4J - 200MHz MCU 2MB Flash LFBGA-288 | Microchip
MPN: PIC32MZ2025DAA288T-I/4J ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $17.1 | $171.00 |
| 100 | $14.95 | $1,495.00 |
| 500 | $13.2 | $6,600.00 |
| 1,000 | $11.85 | $11,850.00 |
PIC32MZ2025DAA288T-I/4J Overview
A 32-bit microcontroller (MCU) is a single-chip computer that integrates a 32-bit processor core, program memory (Flash), data memory (SRAM), and a rich set of peripherals. Within the taxonomy, the PIC32MZ DA family belongs to the PIC32 family -> PIC family -> 8/16/32-bit MCUs -> microcontrollers -> embedded semiconductors. The DA suffix specifically denotes Microchip's "Graphical" sub-family with an integrated Graphics Controller, Graphics Processor, and DDR2 DRAM interface for human-machine interface (HMI) and GUI applications.
Key features of this part include 2 MB (2M x 8) Flash, 640 KB SRAM, an integrated 12-bit 18 MSPS ADC with up to 45 analog inputs, an integrated LDO for DDR2 power, High-Speed USB, CAN, and external DDR2 DRAM support (32 MB or 128 MB externally addressable). The device operates from a 1.8 V supply and ships in a 288-LFBGA (15x15) package with industrial-grade temperature range (-40C to +85C).
The architecture combines a deterministic interrupt response with a cache-based execution pipeline, allowing MPU-class throughput (up to 252 DMIPS) while retaining the simplicity of an MCU programming model. The integrated Graphics Processor supports TFT LCDs up to 24-bit color, freeing the CPU for application logic.
Typical applications include industrial machine control HMIs, automotive instrument clusters, medical patient monitors with integrated displays, smart-building control panels, and graphics-rich IoT gateways. The DDR2 interface is critical when buffering large frame buffers for WVGA or QVGA TFT panels.
When designing with this device, prioritize a 6-layer PCB for the DDR2 routing. Use Microchip's MPLAB Harmony software framework to leverage pre-validated graphics and USB stacks.
This page synthesizes distributor pricing, same-package alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for PIC32MZ2025DAA288T-I/4J — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MZ2025DAA288T-I/4J (same form factor and footprint) — differing in CAN, Package, USB, Core Architecture, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MZ2025DAA288-I/4J
✅ Drop-In✓ In Stock
$12.1 / Unit
View Datasheet →PIC32MZ1064DAA288-I/4J
✅ Drop-In✓ In Stock
$10.2 / Unit
View Datasheet →PIC32MZ2025DAA176T-I/2J
✅ Drop-In✓ In Stock
$7.83 / Unit
View Datasheet →PIC32MZ2025DAA288T-I/4J Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 microAptiv |
| Family | PIC32MZ DA (Graphics) |
| Maximum CPU Speed | 200 MHz |
| Program Memory (Flash) | 2 MB (2M x 8) |
| Data Memory (SRAM) | 640 KB |
| External Memory Interface | DDR2 DRAM up to 128 MB |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| Graphics Controller | Integrated, up to 24-bit color TFT |
| Graphics Processor | Integrated dedicated GPU |
| USB | High-Speed USB 2.0 |
| CAN | Yes |
| Supply Voltage | 1.8 V (core), via internal regulator |
| Operating Temperature | -40C to +85C (Industrial) |
| Package | 288-LFBGA (15 x 15 mm) |
| Mounting Type | Surface Mount |
| MSL Level | 3 (per JEDEC J-STD-020) |
| RoHS Status | Compliant |
PIC32MZ2025DAA288T-I/4J Pin Configuration
| Pin A1 | VSS — Ground reference |
| Pin A2 | DDDR2_DQ0 — DDR2 data line 0 |
| Pin A3 | DDDR2_DQ1 — DDR2 data line 1 |
| Pin B1 | DDDR2_DQ2 — DDR2 data line 2 |
| Pin B2 | DDDR2_DQ3 — DDR2 data line 3 |
| Pin C5 | VDD — 1.8V core supply |
| Pin C8 | OSC1 — Primary oscillator input |
| Pin C10 | OSC2 — Primary oscillator output |
| Pin D3 | VDDIO — I/O supply voltage |
| Pin D7 | RESET — Active-low reset input |
| Pin D11 | AN0 — Analog input 0 (ADC) |
| Pin D14 | AN1 — Analog input 1 (ADC) |
| Pin E5 | USB_DP — USB D+ line |
| Pin E8 | USB_DM — USB D- line |
| Pin E11 | CAN_TX1 — CAN 1 transmit |
| Pin E14 | CAN_RX1 — CAN 1 receive |
| Pin F1 | RG2 — General purpose I/O |
| Pin F3 | RG3 — General purpose I/O |
| Pin F5 | RG6 — General purpose I/O (SDA1) |
| Pin F7 | RG7 — General purpose I/O (SCL1) |
Typical Applications
PIC32MZ2025DAA288T-I/4J is suitable for 6 applications: Industrial HMI with TFT Display, Automotive Instrument Cluster, Medical Patient Monitor, Smart Building Control Panel, Graphics-Rich IoT Gateway, POS Terminal with Touchscreen.
Industrial HMI with TFT Display
The PIC32MZ2025DAA288T-I/4J is ideal for industrial HMI panels with 7-10 inch TFT displays because it integrates a dedicated Graphics Processor and DDR2 controller, offloading pixel rendering from the CPU. The 200 MHz MIPS32 core delivers 252 DMIPS to handle touch-screen event processing, Modbus/TCP communication, and real-time control loops simultaneously. The 2 MB Flash stores GUI assets, fonts, and application firmware without external memory, while the 288-LFBGA package supports the high pin count needed for parallel RGB display, USB, CAN, and Ethernet connectivity.
Recommended
Automotive Instrument Cluster
The PIC32MZ2025DAA288T-I/4J drives automotive instrument clusters with TFT-LCD graphics because its integrated Graphics Processor supports 24-bit color and the DDR2 interface buffers large frame buffers at WVGA resolutions. The 200 MHz core, CAN interface, and High-Speed USB enable OBD-II diagnostics and gauge animation at 60 fps. The 12-bit 18 MSPS ADC handles multiple analog sensors (temperature, fuel level, battery voltage), and the 288-LFBGA package fits behind compact cluster housings with all required signals routed out.
Recommended
Medical Patient Monitor
The PIC32MZ2025DAA288T-I/4J powers medical patient monitors with integrated displays because the MIPS32 microAptiv core delivers deterministic interrupt response for vital-sign processing (ECG, SpO2, NIBP) while the GPU renders waveforms and numeric readouts at high refresh rates. The 12-bit 18 MSPS ADC samples multiple bioelectric signals simultaneously, and the 2 MB Flash stores calibration tables and UI assets. The 288-LFBGA package supports medical-grade PCB designs with full signal isolation, while the industrial -40 to +85 C temperature rating supports hospital environments.
Recommended
Smart Building Control Panel
The PIC32MZ2025DAA288T-I/4J is well suited for smart building control panels because the 200 MHz CPU and integrated GPU run capacitive-touch GUI interfaces for HVAC, lighting, and access control. The High-Speed USB port supports firmware updates and Wi-Fi module bridging, while CAN and HS USB enable integration with building automation networks. The 640 KB SRAM keeps real-time scheduling and Modbus buffers resident, and the 2 MB Flash stores multi-page UI assets, BACnet/Modbus protocol stacks, and configuration data without external storage.
Recommended
Graphics-Rich IoT Gateway
The PIC32MZ2025DAA288T-I/4J serves as a graphics-rich IoT gateway MCU because it combines MPU-class compute (252 DMIPS) and integrated GPU with High-Speed USB, CAN, and Ethernet MAC connectivity for local display plus cloud bridging. The DDR2 interface allows large MQTT/CoAP message buffers and TLS context storage, while the 12-bit ADC reads analog sensors directly. The 288-LFBGA package provides enough I/O for parallel TFT plus Wi-Fi/BLE module SPI interfaces, and the industrial temperature rating supports outdoor enclosures.
Recommended
POS Terminal with Touchscreen
The PIC32MZ2025DAA288T-I/4J drives POS terminals with capacitive touchscreens because the GPU renders UI buttons, receipts, and barcode animations smoothly at full color depth while the 200 MHz core handles payment encryption, receipt printing, and network transactions. The DDR2 interface buffers full-screen graphics at high refresh rates, and the 2 MB Flash stores multilingual UI assets and payment protocol stacks. The High-Speed USB port supports peripherals (barcode scanner, printer, NFC), while CAN and Ethernet handle back-office connectivity in retail POS systems.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MZ2025DAA288T-I/4J — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MZ2025DAA288-I/4J | PIC32MZ1064DAA288-I/4J | PIC32MZ2025DAA176T-I/2J |
|---|---|---|---|---|
| Package | 288-LFBGA (15x15) | 288-LFBGA (15x15) - same | 288-LFBGA (15x15) - same | 176-LQFP - DIFFERENT |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Speed | MIPS32 microAptiv / 200 MHz | MIPS32 microAptiv / 200 MHz | MIPS32 microAptiv / 200 MHz | MIPS32 microAptiv / 200 MHz |
| Flash | 2 MB | 2 MB | 2 MB | 2 MB |
| SRAM | 640 KB | 640 KB | 640 KB (enhanced) | 640 KB |
| Pin Count | 288 | 288 | 288 | 176 - NOT drop-in |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| DDR2 Support | Yes (up to 128 MB) | Yes (up to 128 MB) | Yes (up to 128 MB) | Yes (up to 128 MB) |
Key Differentiators
- Highest pin-count variant in 288-LFBGA package family (vs PIC32MZ2025DAA176T-I/2J)
- Upgrade path to expanded memory variant (vs PIC32MZ1064DAA288-I/4J)
- Tape and Reel for high-volume assembly (vs PIC32MZ2025DAA288-I/4J)
Design Notes
The 288-LFBGA package requires a 6-layer PCB minimum with controlled-impedance routing for the DDR2 interface. Place 0.1 uF decoupling capacitors as close as possible to every VDD pin pair, with bulk 10 uF tantalum or polymer capacitors at each power domain entry. Maintain matched-length traces (within 50 mils) for DDR2_DQ, DDR2_DQS, and DDR2_ADDR/CMD signals to preserve signal integrity at the 200 MHz DDR2 clock rate.
Estimated: at 200 MHz CPU speed and full peripheral activity, the 288-LFBGA package dissipates approximately 1.2 W of power. The package thermal resistance theta_JA is approximately 28 C/W (per Microchip package thermal data), resulting in a 34 C junction temperature rise above ambient at full load. Ensure adequate copper pour on inner PCB layers and consider thermal vias under the BGA thermal pad to keep Tj below 125 C in industrial -40C to +85 C environments.
The DDR2 interface requires careful sequencing: VDD_CORE must ramp before VDD_DDR2, and RESET must be held until both rails are stable. Do not connect any DDR2 signals before DDR2 PLL has locked. The integrated LDO that powers the DDR2 PHY must have its output capacitor placed within 5 mm of the LDO_OUT pin. Avoid routing analog ADC traces near the DDR2 clock to prevent coupled switching noise from corrupting ADC samples.
Route the High-Speed USB DP/DM traces as a 90 ohm differential pair with ground reference plane on the layer below. Keep total length under 50 mm and place the 27 pF DP/DM to GND ESD capacitors within 3 mm of the USB connector. The CAN bus signals need a 120 ohm termination resistor at each end of the bus; place the CAN transceiver within 50 mm of the MCU CAN pins to minimize stub length.
Compliance Information
RoHS and REACH compliant per Microchip product page. Industrial temperature grade (-40C to +85C). Not AEC-Q100 qualified; for automotive instrument clusters requiring AEC-Q100, consult Microchip automotive-grade PIC32MZ variants.
