S9S12DG12F1VFUE - 16-Bit 25MHz 128KB Flash MCU | NXP
MPN: S9S12DG12F1VFUE ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
S9S12DG12F1VFUE Overview
A microcontroller is a programmable integrated circuit that combines a processor core, memory, and peripherals in one device. The S12 core belongs to the HCS12 family of embedded processors, where the hierarchy is HCS12 microcontroller, embedded processor, semiconductor, and programmable control device. This part combines firmware-programmable logic with hardware peripherals for communications and control, reducing the component count required by a standalone processor design.
The verified device data identifies two asynchronous serial communications interfaces, CANbus, I²C, SPI, PWM, a watchdog timer, and two 8-channel 10-bit analog-to-digital converters. An 8-channel enhanced capture timer supports input capture and output compare functions. These peripherals allow the MCU to interface with sensors, actuators, transceivers, and human-machine interfaces while retaining deterministic embedded-control behavior.
The part is identified as an HCS12 device with 16-bit architecture, 25 MHz maximum speed, 128 KB flash, 8 KB RAM, 2 KB EEPROM, and 59 I/O according to the supplied technical listings. The listed connectivity includes CANbus, I²C, SCI, and SPI. These resources make the MCU suitable for automotive body and subsystem control, industrial equipment, motor-control adjuncts, communications gateways, and sensor-conditioning systems where a compact 80-QFP package is acceptable.
The principal design consideration is lifecycle planning: the NXP product page identifies the device as End of Life. Designs should therefore verify supply continuity, approved sourcing, and long-term obsolescence requirements before new production releases. For replacements, engineers must compare memory, peripheral mapping, package pins, clock requirements, and software compatibility rather than relying on a generic equivalent designation.
This page combines verified manufacturer and distributor information, package and interface data, application guidance, and replacement-risk notes. It distinguishes documented specifications from unavailable information so engineers can make a traceable sourcing decision.
Drop-in alternatives for S9S12DG12F1VFUE — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with S9S12DG12F1VFUE (same form factor and footprint) — differing in Core, Package, Mounting Type, ADC, Architecture.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
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S9S12G96F0MLF
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S9S12G128F0MLL
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MC9S12XEQ512CAA
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View Datasheet →MC9S12DG128CFUE
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S9S12DG12F1VFUE Maximum Ratings & Electrical Characteristics
| Core | HCS12 S12 core |
| Architecture | 16-bit |
| Maximum Clock Frequency | 25 MHz |
| Flash Program Memory | 128 KB (128K x 8) |
| RAM | 8 KB |
| EEPROM | 2 KB |
| Number of I/O | 59 |
| Connectivity | CANbus, I²C, SCI, SPI |
| Serial Communications Interfaces | 2 asynchronous SCI interfaces |
| Analog-to-Digital Converters | 2 converters, 8 channels each, 10-bit |
| Timer | 8-channel IC/OC enhanced capture timer |
| Peripherals | PWM and watchdog timer |
| Operating Temperature | -40°C to +105°C |
| Automotive Qualification | Automotive qualified |
| Package | 80-pin QFP, 14 mm x 14 mm |
| Package Code | HQFP |
| Mounting Type | Gull-wing surface mount |
| JESD-609 Code | e3 |
S9S12DG12F1VFUE hqfp Pin Configuration Guide
Pin configuration for S9S12DG12F1VFUE (hqfp package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for S9S12DG12F1VFUE.
Refer to the datasheet for full pin configuration.
Typical Applications
S9S12DG12F1VFUE is suitable for 6 applications: Automotive Body Control, CAN-Based Vehicle Network Node, Industrial Sensor and Actuator Controller, Automotive Sensor Hub, Motor and Relay Sequencer, Automotive Communication Gateway.
Automotive Body Control
The S9S12DG12F1VFUE fits an automotive body-control subsystem because it combines a 16-bit HCS12 core, 25 MHz operation, 128 KB flash, CANbus, SCI, I²C, SPI, watchdog, timer, PWM, and dual 8-channel 10-bit ADC resources in an 80-QFP package. Its listed -40°C to +105°C range and automotive qualification make it relevant to vehicle electronics. The MCU can supervise switches, relay drivers, sensors, and communication gateways while deterministic timers and watchdog functions support fault monitoring. The primary design caution is lifecycle status: because NXP identifies the device as End of Life, production programs should verify authorized supply, traceability, and any approved replacement plan.
Recommended
CAN-Based Vehicle Network Node
The S9S12DG12F1VFUE is suitable for a CAN network node where a controller must combine protocol handling with local I/O and analog supervision. Its verified connectivity includes CANbus, two asynchronous SCI interfaces, I²C, and SPI, while the two 8-channel 10-bit ADCs can monitor resistive or sensor inputs. A 25 MHz HCS12 core provides deterministic control for gateway, switch-bank, or actuator logic. The 80-QFP footprint also provides a substantial lead-count package for external transceivers, sensors, and protection circuits. Since the device is End of Life, any new CAN-node design should include lifecycle review, software-portability planning, and a controlled replacement qualification plan.
Recommended
Industrial Sensor and Actuator Controller
The S9S12DG12F1VFUE can serve as an industrial embedded controller for sensor acquisition and actuator sequencing because it provides two 8-channel 10-bit ADCs, enhanced capture and output-compare timing, PWM, watchdog, and multiple serial interfaces. The 16-bit HCS12 architecture at 25 MHz is useful for deterministic control loops that must coordinate analog measurements with digital outputs. An 80-QFP package supports external signal conditioning, transceiver, and power circuitry. The device is not presented as an active lifecycle choice, so industrial equipment programs should assess availability and validate the replacement MCU against ADC timing, pin mapping, communications drivers, and safety or environmental requirements.
Recommended
Automotive Sensor Hub
The S9S12DG12F1VFUE is a candidate for an automotive sensor hub because its dual 8-channel, 10-bit ADC resources provide analog input capacity, while SCI, I²C, and SPI interfaces support external sensors and digital devices. The 128 KB flash store can hold application firmware, calibration tables, and diagnostic logic, and the 8 KB RAM supports short-term control and data buffering. Its listed automotive qualification and -40°C to +105°C specification align with vehicle environments. Engineers must preserve ADC calibration, timing, and bus-driver behavior during any lifecycle substitution, particularly because the manufacturer lists the part as End of Life.
Recommended
Motor and Relay Sequencer
The S9S12DG12F1VFUE can control relay, solenoid, and actuator sequencing where deterministic timing and fault monitoring are important. Its enhanced capture and output-compare timer, PWM capability, watchdog timer, and 59 listed I/O provide resources for edge detection, timing intervals, output control, and system supervision. The two 10-bit ADCs can monitor feedback or supply-related analog conditions, while CANbus and serial interfaces connect the controller to higher-level vehicle or industrial networks. The 80-QFP package offers enough external connectivity for driver and protection stages. Validate timing margins, output-driver electrical limits, and watchdog behavior before production use.
Recommended
Automotive Communication Gateway
The S9S12DG12F1VFUE is relevant to a communication gateway because it lists CANbus, two asynchronous serial communications interfaces, I²C, and SPI connectivity alongside 128 KB flash and 8 KB RAM. A gateway can use the MCU to bridge vehicle networks, manage diagnostic messaging, supervise transceivers, and coordinate local I/O. The 25 MHz HCS12 core and timer resources support protocol timing and scheduled tasks, while the ADC channels provide monitoring inputs for the gateway hardware. The 80-QFP package simplifies access to external communication and protection components. Because the MCU is End of Life, maintain a documented firmware abstraction and verify any replacement against protocol timing and transceiver pin assignments.
Recommended
Recommended Products Summary
Engineering reference data for S9S12DG12F1VFUE — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | S9S12G192F0VLL | S9S12G96F0MLF | S9S12G128F0MLL | MC9S12XEQ512CAA | MC9S12DG128CFUE |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | Freescale Semiconductor | Freescale Semiconductor |
Key Differentiators
- Documented automotive qualification and temperature range (vs S9S12G128F0MLL)
- Verified connectivity set (vs S9S12G96F0MLF)
- Known 128 KB flash allocation (vs MC9S12DG128CFUE)
- Traceable product identity (vs MC9S12XEQ512CAA)
Design Notes
Do not treat a comparison-page candidate as a drop-in replacement without checking the complete NXP pinout and board schematic. The supplied data confirms that the target is an 80-QFP device, but it does not verify that any listed candidate has identical pin assignments, peripheral multiplexing, clock requirements, or package tolerances. Review reset, power, ground, debug, communication, and analog pins first, then rebuild and regression-test the firmware.
Follow the manufacturer’s recommended decoupling and pin-specific power requirements from the official datasheet. The verified data identifies CANbus, SCI, I²C, SPI, ADC, timer, PWM, and watchdog resources but does not provide operating-voltage or decoupling values, so those values must not be guessed. Keep analog and communication return paths controlled, place bypass capacitors close to the relevant supply pins, and validate transients for automotive or industrial environments.
Reserve routing for the 80-QFP package according to the verified manufacturer land pattern rather than generic QFP dimensions. Separate sensitive analog inputs associated with the two 10-bit ADCs from switching and high-current digital paths, and keep communication lines away from noisy power inductors where applicable. The supplied data does not provide exact pin numbers, so final pad assignment and net escaping must be completed from the official package drawing.
Thermal design should begin with the verified operating-temperature range of -40°C to +105°C and the package’s 14 mm x 14 mm 80-QFP outline. The available data does not include thermal resistance, maximum power dissipation, or exact supply limits, so those figures are [DATA_NEEDED: thermal resistance] and [DATA_NEEDED: maximum power dissipation]. Use manufacturer thermal data and application-board measurements rather than estimating production limits.
Compliance Information
The verified data explicitly states automotive qualified and lists a JESD-609 code of e3. RoHS, REACH, lead-free, halogen-free, and conflict-minerals statuses are not supplied and therefore remain unknown. AEC-Q100 is represented as qualified only because automotive qualification is explicitly stated; the supplied data does not provide a separate AEC-Q100 certificate or grade.