SAL-TC298TP-128F300N - AURIX TC2 300MHz TriCore MCU | Infineon
MPN: SAL-TC298TP-128F300N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $35.2 | $352.00 |
| 100 | $31.8 | $3,180.00 |
| 500 | $28.4 | $14,200.00 |
| 1,000 | $25.1 | $25,100.00 |
SAL-TC298TP-128F300N Overview
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory, and programmable peripherals. TriCore is a hybrid RISC/DSP/VLIW architecture designed by Infineon specifically for embedded real-time workloads that require both control-loop determinism and DSP-grade signal processing. Within the AURIX family hierarchy (TC2xx -> TC3xx), the TC298TP belongs to the TC29xT sub-family that delivers 'extreme-throughput' performance for vehicle body, chassis, and powertrain ECUs that must meet ASIL-D functional-safety requirements.
Key features of the SAL-TC298TP-128F300N include its multi-core TriCore CPU cluster with lockstep support for safety, hardware security module (HSM) for secure boot and cryptographic acceleration, integrated 100 Mbit/s Ethernet MAC for in-vehicle networking, and a dedicated GTM (Generic Timer Module) that offloads complex PWM generation for motor-control and power-conversion tasks. The 8 MB Flash with ECC and the 728 KB SRAM provide ample headroom for AUTOSAR stacks plus application code, while the rich connectivity (CAN-FD, FlexRay, LIN, SPI, QSPI) suits it to gateway and domain-controller roles.
Typical applications include automotive body-control modules, gateway ECUs, electric power-steering controllers, battery-management system (BMS) slaves, and industrial automation PLCs requiring functional-safety compliance. The combination of 300 MHz TriCore performance, Ethernet, and ASIL-D capability also makes it a fit for zonal architectures transitioning to service-oriented vehicle networks.
When designing with this part, allocate PCB real-estate for the 416-BGA land pattern with laser-via or via-in-pad for reliable BGA attachment, and provide a clean 1.25 V core supply with adequate decoupling per Infineon's TC29xT hardware design guide. Plan unused pins per the pinout configurator; misconfigured EVR pins can prevent boot.
This page synthesizes distributor stock, same-family Infineon drop-in options, and practical BGA-layout guidance not consolidated in the standalone manufacturer datasheet.
Drop-in alternatives for SAL-TC298TP-128F300N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
TC298TP128F300NBCLXUMA1
✅ Drop-In📋 Reference alternative (not in catalog)
TC298TP128F300NBCLXUMA2
✅ Drop-In📋 Reference alternative (not in catalog)
SAK-TC298TP-128F300N
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
SAL-TC299TP-128F300N
✅ Drop-In📋 Reference alternative (not in catalog)
SAL-TC298TP-128F300N Maximum Ratings & Electrical Characteristics
| Manufacturer | Infineon Technologies |
| Series | AURIX TC2xx (TC29xT) |
| Core Architecture | TriCore (32-bit RISC/DSP/VLIW hybrid) |
| Maximum Clock Frequency | 300 MHz |
| Program Memory (Flash) | 8 MB |
| SRAM (incl. Cache) | 728 KB |
| CAN Nodes | 6 |
| FlexRay | Yes |
| Ethernet | 100 Mbit/s MAC |
| ADC Modules | 21 |
| Package | 416-ball BGA |
| Functional Safety | ISO 26262 (ASIL-D capable) |
| Mounting Type | Surface Mount (BGA) |
SAL-TC298TP-128F300N 416-ball bga Pin Configuration Guide
Pin configuration for SAL-TC298TP-128F300N (416-ball bga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for SAL-TC298TP-128F300N.
Refer to the datasheet for full pin configuration.
Typical Applications
SAL-TC298TP-128F300N is suitable for 6 applications: Automotive Body Control Module (BCM), Vehicle Gateway / Zonal ECU, Electric Power Steering (EPS) Controller, Battery Management System (BMS) Slave Controller, Industrial Servo Drive / Motion Controller, Domain Controller / Cockpit Host.
Automotive Body Control Module (BCM)
The SAL-TC298TP-128F300N suits body-control modules that drive lighting, wipers, mirrors, and door-lock actuators because it combines 300 MHz TriCore performance with 6 CAN-FD nodes and ASIL-D capability for safety-relevant body functions like indicator lamps. The 21 ADC channels digitize ambient-light, battery-sense, and motor-current signals directly without an external ADC. Per Infineon's AURIX BCM reference designs, the part's lockstep core plus HSM satisfies the OEM's secure-boot mandate while the 100 Mbit Ethernet MAC feeds diagnostic data over DoIP.
Recommended
Vehicle Gateway / Zonal ECU
The SAL-TC298TP-128F300N's 100 Mbit/s Ethernet MAC, FlexRay, and 6 CAN-FD nodes allow it to bridge legacy in-vehicle networks (CAN, LIN, FlexRay) with automotive Ethernet backbones in a zonal or central gateway ECU. The 728 KB SRAM buffers routing tables and security keys, while the 8 MB Flash holds the full AUTOSAR RTE plus communication stacks. Compared with a TC3xx part, the TC298TP trades raw headroom for cost-effectiveness in mid-complexity gateways.
Recommended
Electric Power Steering (EPS) Controller
EPS controllers need deterministic torque-loop execution and ASIL-D capability, both delivered by the SAL-TC298TP-128F300N's lockstep TriCore cores running at 300 MHz. The GTM (Generic Timer Module) generates the PWM signals for the three-phase BLDC torque motor with sub-microsecond resolution, and the 21 ADC channels sample phase currents, rotor position, and torque-sensor signals simultaneously. Infineon AURIX TC2xx is the de-facto standard for EPS, so a wealth of validated AUTOSAR software components is available.
Recommended
Battery Management System (BMS) Slave Controller
In a distributed BMS, each slave module monitors cell voltages and temperatures and reports over CAN-FD or isolated SPI to the master; the SAL-TC298TP-128F300N handles 12-18 cells with its 21 ADC inputs and provides the ASIL-D diagnostic coverage mandated for traction batteries. The 8 MB Flash holds cell-balancing firmware plus the BMS state-machine, and the Ethernet MAC enables faster daisy-chained BMS topologies. The lockstep CPU catches faults in the measurement path before they affect SoC calculations.
Recommended
Industrial Servo Drive / Motion Controller
Industrial servo drives require deterministic PWM generation, fast current-sense sampling, and EtherCAT or CANopen connectivity - all delivered by the SAL-TC298TP-128F300N's TriCore, GTM, and rich communication peripherals. The 300 MHz headroom runs the control loop, the trajectory planner, and the safety stop function in parallel cores. Compared with a generic ARM Cortex-M4 MCU, the TC298TP offers the lockstep dual-core for SIL-2/SIL-3 industrial safety, removing the need for an external safety MCU.
Recommended
Domain Controller / Cockpit Host
Higher-end cockpit and ADAS domain controllers may use the SAL-TC298TP-128F300N as a sensor-fusion preprocessor or as a secure gateway to higher-power SoCs. The 8 MB Flash and 728 KB SRAM fit lightweight RTOS plus driver-assistance algorithms (sensor clustering, object pre-filtering), while the HSM secures the boot chain and OTA updates. Although not as compute-dense as the TC3xx or AURIX TC4xx families, the TC298TP delivers a cost-effective compute tier for entry-level domain controllers.
Recommended
Recommended Products Summary
Engineering reference data for SAL-TC298TP-128F300N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | TC298TP128F300NBCLXUMA1 | TC298TP128F300NBCLXUMA2 | SAK-TC298TP-128F300N | SAL-TC299TP-128F300N |
|---|---|---|---|---|---|
| Package | 416-ball BGA | 416-ball BGA - same | 416-ball BGA - same | 416-ball BGA - same | 516-ball LFBGA - different |
| Brand | Infineon | Infineon - same | Infineon - same | Infineon - same | Infineon - same |
| Clock Frequency | 300 MHz | 300 MHz | 300 MHz | 300 MHz | 300 MHz |
| Program Flash | 8 MB | 8 MB | 8 MB | 8 MB | 8 MB |
| SRAM | 728 KB | 728 KB | 728 KB | 728 KB | 728 KB |
| TriCore Cores | 2 (with lockstep) | 2 (with lockstep) | 2 (with lockstep) | 2 (with lockstep) | 3 (with lockstep) |
| Ethernet | 100 Mbit/s MAC | 100 Mbit/s MAC | 100 Mbit/s MAC | 100 Mbit/s MAC | 100 Mbit/s MAC |
| Functional Safety | ISO 26262 ASIL-D | ISO 26262 ASIL-D | ISO 26262 ASIL-D | ISO 26262 ASIL-D | ISO 26262 ASIL-D |
| ADC Modules | 21 | 21 | 21 | 21 | 21 |
Key Differentiators
- TriCore architecture with lockstep core for ASIL-D (vs ARM Cortex-M4F automotive MCUs (e.g., SPC58, S32K3))
- Integrated 100 Mbit Ethernet MAC vs. external PHY-only on TC2xx lower-tier (vs Infineon TC27x TP family (e.g., TC275TP))
- Hardware Security Module (HSM) with EVITA-Full support (vs SAF-XC2000 family (older C166-based MCUs))
Design Notes
The 416-ball BGA of the SAL-TC298TP-128F300N typically uses a 0.8 mm pitch. For reliable attachment use laser-via or via-in-pad technology with filled-and-capped vias under the BGA. Provide a 4-layer PCB minimum with continuous GND planes on layers 2 and 4 to give the EVR and ADC references a low-impedance return path. Recommended: per-pin decoupling 100 nF X7R + 4.7 uF X5R within 2 mm of each power/ground ball pair, and one 10 uF bulk per power domain. Follow Infineon's TC29xT HW Design Guide for ball-specific supply sequencing.
Estimated: at 300 MHz across both TriCore cores with peripherals active, the SAL-TC298TP-128F300N dissipates approximately 1.5-2.5 W typical. The 416-BGA exposed-die package relies on PCB copper for cooling - provide at least 25 x 25 mm of unbroken copper on the top layer plus thermal vias to inner GND planes. For under-hood or EPS applications where ambient can exceed 85 C, simulate junction temperature with the Infineon thermal model before committing to PCB stack-up. Thermal derating above 105 C junction follows the datasheet curve.
Common pitfalls when bringing up the SAL-TC298TP-128F300N: (1) Confusing the SAL- prefix with the SAK- prefix - both refer to the same silicon but different distribution channels; SAK is sample-tier and SAL is commercial-volume. (2) Forgetting to configure the EVR (Embedded Voltage Regulator) mode in the boot pins - a wrong mode prevents core voltage ramp. (3) Mixing TC298TP and TC299TP datasheets; pinout of the 416-BGA (TC298TP) is NOT compatible with the 516-LFBGA (TC299TP). (4) Not enabling the HSM before secure boot will silently fail in production but pass on the bench.
For the 100 Mbit/s Ethernet MAC routing, use 50 ohm single-ended controlled-impedance traces (100 ohm differential) on the MII/RMII/RGMII bus to the external PHY. Keep trace lengths matched within 50 mil on the parallel interface and isolate the analog PHY clocks from switching DC-DC nodes. The FlexRay signals are differential and require 100 ohm termination at both ends; route them on a stripline layer with continuous GND reference. Use IBIS-AMI simulation for the Ethernet MAC-PHY channel before committing to PCB layout.
Compliance Information
ISO 26262 ASIL-D capable per Infineon TC29xT documentation. RoHS compliant; AEC-Q100 qualified for automotive. Conflict-minerals compliant per Infineon supply-chain policy.
