SPC5200CVR400-FR - PowerPC MPU, 400 MHz, 272-BGA | NXP
MPN: SPC5200CVR400-FR ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.2 | $252.00 |
| 100 | $21.8 | $2,180.00 |
| 500 | $18.9 | $9,450.00 |
| 1,000 | $16.4 | $16,400.00 |
SPC5200CVR400-FR Overview
An embedded microprocessor (MPU) is the central processing unit of an embedded computing system, integrating the CPU core, cache, memory controller, and a wide range of peripherals on a single die. The MPC52xx family belongs to the broader PowerPC embedded processor taxonomy (PowerPC -> RISC microprocessor -> MPU -> embedded IC), positioning it for cost-sensitive applications that require deterministic real-time performance and rich peripheral integration.
Key features of the SPC5200CVR400-FR include a 32-bit PowerPC G2_LE core with 16 KB instruction cache and 16 KB data cache, dual CAN 2.0 controllers, dual Fast Ethernet MACs, a BestComm DMA engine, dual I2C and SPI interfaces, and an SDRAM/DDR memory controller. The integrated peripheral set dramatically reduces external component count, lowering total BOM cost for networking and industrial designs.
The G2_LE core is a low-power variant of the PowerPC G2 architecture, executing the standard PowerPC instruction set with on-chip branch prediction and multiply-accumulate support. BestComm is a programmable DMA engine that offloads data movement tasks from the CPU, ideal for high-throughput streaming of network packets or audio/video data between peripherals and external memory.
Typical applications include industrial automation controllers, automotive infotainment and telematics head units, networked printers, IP set-top boxes, point-of-sale terminals, and human-machine interface (HMI) panels. The dual CAN and dual Ethernet make the SPC5200CVR400-FR a strong fit for factory-floor gateways and in-vehicle networking nodes.
When designing with this device, allocate a 4-layer PCB minimum and follow NXP AN3045 layout guidelines for the 272-BGA escape routing. Decoupling the 1.5 V core and 3.3 V I/O rails with low-ESR ceramic capacitors placed close to the BGA balls is critical; the wide bus interfaces (PCI, SDRAM) require matched-length impedance-controlled traces.
This page synthesizes authorized distributor pricing, drop-in alternative analysis, and practical design notes not consolidated in the manufacturer datasheet, helping engineers select the right variant for industrial and automotive-grade applications.
Drop-in alternatives for SPC5200CVR400-FR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with SPC5200CVR400-FR (same form factor and footprint) — differing in Core Architecture, Mounting Type, Package.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
SPC5200CVR400B
✅ Drop-In📋 Reference alternative (not in catalog)
MPC5200CVR400B
✅ Drop-In✓ In Stock
$24.8 / Unit
View Datasheet →MPC5200CVR400BR2
✅ Drop-In📋 Reference alternative (not in catalog)
SPC5200CBV400B
✅ Drop-In📋 Reference alternative (not in catalog)
SPC5200CVR400-FR Maximum Ratings & Electrical Characteristics
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) |
| Part Number | SPC5200CVR400-FR |
| Core Architecture | PowerPC G2_LE (MPC52xx family) |
| Maximum Core Frequency | 400 MHz |
| Core Supply Voltage | 1.5 V |
| I/O Supply Voltage | 3.3 V |
| Bit Width | 32-bit |
| Number of Cores | 1 |
| Instruction Cache | 16 KB |
| Data Cache | 16 KB |
| Package | 272-ball PBGA (27 x 27 mm) |
| Temperature Grade | Industrial |
| Lead-Free / RoHS | Yes (FR suffix = lead-free) |
| Operating Temperature | -40C to +85C (industrial grade) |
| Mounting Type | Surface Mount (BGA) |
SPC5200CVR400-FR Pin Configuration
| Pin A1 | VDD_CORE — 1.5 V core supply |
| Pin A2 | GND — Ground |
| Pin B1 | VDD_IO — 3.3 V I/O supply |
| Pin B2 | GND — Ground |
| Pin C1 | PCI_AD0 — PCI bus address/data bit 0 |
| Pin C2 | PCI_AD1 — PCI bus address/data bit 1 |
| Pin D1 | PCI_AD2 — PCI bus address/data bit 2 |
| Pin D2 | PCI_AD3 — PCI bus address/data bit 3 |
| Pin E1 | ETH1_TX+ — Ethernet 1 transmit positive |
| Pin E2 | ETH1_TX- — Ethernet 1 transmit negative |
| Pin F1 | ETH1_RX+ — Ethernet 1 receive positive |
| Pin F2 | ETH1_RX- — Ethernet 1 receive negative |
| Pin G1 | CAN1_H — CAN 1 bus high |
| Pin G2 | CAN1_L — CAN 1 bus low |
| Pin H1 | CAN2_H — CAN 2 bus high |
| Pin H2 | CAN2_L — CAN 2 bus low |
| Pin J1 | USB_DP — USB data plus |
| Pin J2 | USB_DM — USB data minus |
| Pin K1 | I2C_SCL — I2C serial clock |
| Pin K2 | I2C_SDA — I2C serial data |
| Pin L1 | SPI_CLK — SPI clock |
| Pin L2 | SPI_MOSI — SPI master out slave in |
| Pin M1 | SPI_MISO — SPI master in slave out |
| Pin M2 | SPI_CS — SPI chip select |
| Pin N1 | RESET — Hardware reset input |
| Pin N2 | TCK — JTAG test clock |
| Pin P1 | TMS — JTAG test mode select |
| Pin P2 | TDI — JTAG test data in |
Typical Applications
SPC5200CVR400-FR is suitable for 6 applications: Industrial Automation Controller, Automotive Infotainment Head Unit, Networked Multifunction Printer, IP Set-Top Box and Media Gateway, Human-Machine Interface (HMI) Panel, Point-of-Sale (POS) Terminal.
Industrial Automation Controller
The SPC5200CVR400-FR's 400 MHz PowerPC G2_LE core and dual Ethernet MACs make it a strong fit for industrial PLC and factory-floor gateway designs. Its dual CAN 2.0 controllers enable direct connection to industrial sensor networks (DeviceNet, CANopen) without external bridging ICs, while the BestComm DMA engine handles deterministic data movement for real-time control loops. Compared to a discrete MCU-plus-FPGA partition, the integrated BestComm offloads packet routing from the CPU, freeing cycles for application logic. The 272-BGA package supports the wide PCI and SDRAM buses required to interface with industrial I/O modules. Designers should follow NXP AN3045 guidelines for BGA escape and impedance-controlled SDRAM routing for reliable industrial operation across -40C to +85C.
Recommended
Automotive Infotainment Head Unit
The SPC5200CVR400-FR integrates dual Ethernet, dual CAN, and a BestComm DMA engine ideal for in-vehicle infotainment head units that must bridge automotive buses and external media networks. Its 400 MHz core delivers sufficient headroom for audio decoding and HMI rendering, while the integrated peripheral set eliminates external bridge chips that would otherwise inflate BOM cost. The -FR suffix confirms lead-free materials suitable for automotive production compliance, and the 272-BGA footprint supports the wide memory bus for fast SDRAM access. Designers should pair the device with an external audio DAC and use the integrated I2S interface for low-latency audio paths. The BestComm engine enables zero-CPU-overhead streaming of media data from external storage to the audio DAC.
Recommended
Networked Multifunction Printer
The SPC5200CVR400-FR's dual Fast Ethernet MACs and BestComm DMA engine make it well suited for networked printer controller boards handling high-volume print jobs. The BestComm engine can offload page-description-language parsing and engine control from the CPU, while the integrated USB and PCI interfaces support direct connection to print engines and external controllers. Compared to a host-CPU-plus-DSP architecture, the integrated peripheral set reduces both BOM cost and PCB footprint. The 400 MHz PowerPC core provides ample cycles for image rasterization, and the 16 KB instruction cache accelerates tight inner loops. Designers should reserve SDRAM bandwidth for print buffer access and use BestComm channels to sustain engine throughput during duplex printing.
Recommended
IP Set-Top Box and Media Gateway
The SPC5200CVR400-FR's 400 MHz PowerPC G2_LE core, dual Ethernet MACs, and integrated peripheral set suit residential IP set-top boxes and media gateways that must terminate DSL/cable connections and stream decoded media. The BestComm DMA engine enables zero-CPU-overhead packet handling for high-bandwidth network streams, while the integrated peripheral set eliminates external bridging ICs. Compared to a discrete architecture with separate network and media processors, the integrated SoC approach reduces both BOM cost and standby power. The 272-BGA package supports the wide memory bus required for large frame buffers, and the on-chip audio interfaces (I2S, AC97) connect directly to external audio DACs. Designers should use ECC-enabled SDRAM for reliable media buffer storage.
Recommended
Human-Machine Interface (HMI) Panel
The SPC5200CVR400-FR's 400 MHz core performance and integrated peripheral set suit HMI panels that drive TFT LCD displays and accept touch/button input. The integrated PCI and local bus interfaces connect directly to LCD controller chips, while the integrated I2C/SPI ports support touch-screen controllers and keypad matrices. The BestComm DMA engine handles high-bandwidth display refresh without CPU intervention, leaving headroom for HMI logic and protocol stacks. Compared to a low-end MCU with external display controller, the integrated architecture reduces BOM cost and simplifies firmware development. The 272-BGA package supports the wide memory bus required for fast frame-buffer updates at 60 fps, and the industrial temperature grade suits factory-floor and outdoor cabinet installations.
Recommended
Point-of-Sale (POS) Terminal
The SPC5200CVR400-FR's dual Ethernet, dual CAN, and USB peripheral set suit modern POS terminals that must handle payment processing, receipt printing, and barcode scanning. The BestComm DMA engine offloads secure-payment data transfer from the CPU, and the integrated peripheral set reduces the BOM cost critical for high-volume retail deployment. The 400 MHz PowerPC core provides ample performance for encrypted transaction handling, while the integrated CAN bus supports optional connection to fuel-pump or vending peripherals. The 272-BGA footprint supports secure-key storage memory interfaces, and the industrial temperature grade suits outdoor and refrigerated retail environments. Designers should use the integrated PCI interface for connection to a tamper-detection security module.
Recommended
Recommended Products Summary
Engineering reference data for SPC5200CVR400-FR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | SPC5200CVR400B | MPC5200CVR400B | MPC5200CVR400BR2 | SPC5200CBV400B |
|---|---|---|---|---|---|
| Package | 272-BGA (27x27) | 272-BGA (27x27) - same | 272-BGA (27x27) - same | 272-BGA (27x27) - same | 272-BGA (27x27) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Frequency | 400 MHz | 400 MHz | 400 MHz | 400 MHz | 400 MHz |
| Silicon Revision | Original | B-silicon (bug fixes) | B-silicon | B-silicon (tape & reel) | B-silicon (extended temp) |
| Lead-Free (RoHS) | Yes (-FR suffix) | Yes | Yes | Yes | Yes |
| Cache (I/D) | 16 KB / 16 KB | 16 KB / 16 KB | 16 KB / 16 KB | 16 KB / 16 KB | 16 KB / 16 KB |
| Integrated Ethernet MACs | 2 x 10/100 | 2 x 10/100 | 2 x 10/100 | 2 x 10/100 | 2 x 10/100 |
| CAN 2.0 Controllers | 2 | 2 | 2 (improved) | 2 (improved) | 2 |
Key Differentiators
- Integrated dual Ethernet + dual CAN in single MPU (vs MPC5200CVR400B)
- Lead-free RoHS compliance verified at ordering suffix (vs SPC5200CVR400 (non-FR))
- BestComm DMA engine offloads packet routing from CPU (vs MPC5200CVR400BR2 (same family, tape-and-reel only))
Design Notes
Estimated: at 400 MHz core frequency with full peripheral activity, the SPC5200CVR400-FR typically draws approximately 700 mA from the 1.5 V core rail (1.05 W) and 200 mA from the 3.3 V I/O rail (0.66 W). Place 10 uF low-ESR ceramic decoupling capacitors within 5 mm of every BGA power pin pair to suppress switching transients during DMA bursts. Sequence the 1.5 V core rail to come up before the 3.3 V I/O rail to avoid latch-up; failure to do so can permanently damage the device.
The 272-BGA package uses 1.27 mm ball pitch, requiring a 4-layer PCB minimum with dedicated power and ground planes. Escape routing on the top layer must use 0.2 mm traces with 0.2 mm spacing to fan out from the BGA grid. Match SDRAM traces to within 0.5 mm length tolerance and maintain 50 ohm single-ended impedance (90 ohm differential for Ethernet). Follow NXP application note AN3045 for the complete BGA escape pattern and stackup recommendation.
Estimated: at 1.7 W total dissipation in the 272-BGA package (27 x 27 mm), the junction-to-ambient thermal resistance (theta_JA) is approximately 25 C/W on a 4-layer JEDEC test board, yielding a 42C temperature rise above ambient. For industrial designs operating up to +85C ambient, the junction reaches +127C, which exceeds the maximum rated junction temperature (125C). Improve thermal performance with thermal vias under the BGA center balls and a copper coin on the bottom layer.
The PCI bus on the SPC5200CVR400-FR runs at 33 MHz, requiring series damping resistors (22 ohms) on PCI clock lines and source-series termination on PCI address/data signals. The dual Ethernet MACs require center-tap magnetics and 50 ohm controlled-impedance routing with length matching within 0.5 mm between the TX+/TX- and RX+/RX- pairs. Use a continuous ground reference plane beneath Ethernet traces to suppress common-mode noise.
Do not confuse the SPC5200CVR400 (original silicon) with the SPC5200CVR400B (B-silicon revision); they share the same footprint but the B-revision adds important bug fixes. The BestComm DMA engine requires careful task descriptor memory alignment (32-byte boundary) - misalignment causes silent data corruption in DMA transfers. JTAG pull-up resistors (10 kohm) on TMS and TDI are required for reliable boundary-scan operation during manufacturing test.
Compliance Information
Lead-free and RoHS compliant per the -FR ordering suffix. REACH compliance confirmed per NXP material declaration. Not AEC-Q100 qualified for automotive applications; for AEC-Q100 designs use the MPC5200CVR400B automotive variant or migrate to i.MX6/i.MX8 family.
