SPC5748GK1MMJ6 - 160MHz Triple-Core Automotive MCU | NXP
MPN: SPC5748GK1MMJ6 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $14.1121 | $14.11 |
| 10 | $14.1121 | $141.12 |
| 100 | $14.1121 | $1,411.21 |
| 500 | $14.1121 | $7,056.05 |
| 1,000 | $14.1121 | $14,112.10 |
SPC5748GK1MMJ6 Overview
A microcontroller is a programmable semiconductor that integrates a processor core, memory, peripherals, and communication interfaces into one device. Automotive microcontrollers add temperature-grade, safety, and security capabilities for electronic control units. The SPC5748GK1MMJ6 belongs to NXP's MPC57xx family and targets applications requiring several processors to coordinate real-time control, communications, and security tasks.
The verified device data identifies 10-bit and 12-bit ADC resolution, a 32-bit data bus, and operating frequencies of 80 MHz and 160 MHz. Its 6 M x 8 flash provides embedded program storage, while 768 kB of data RAM supports working data and time-sensitive processing. The operating-temperature range is -40°C to +125°C, matching demanding automotive and industrial environments.
NXP describes the MPC574xB/C/G family as an integrated, safe, and secure single-chip platform for next-generation central body control, gateway, and industrial applications. The family includes a hardware security module, functional-safety support, and enhanced low-power capabilities. Those characteristics make the device suitable where security, deterministic control, and consolidated electronic architecture matter more than minimum component cost.
Typical implementations include body-control modules, automotive gateways, powertrain-adjacent controllers, industrial controllers, communication nodes, and secure embedded systems. At 160 MHz, the processor performance supports concurrent software tasks, while the three-core organization can isolate real-time workloads from supervisory or communication functions.
PCB design must follow the manufacturer's 256-ball land pattern, power, decoupling, clock, and routing guidance. Because the supplied sources do not expose the complete pin mapping, engineers must verify every ball assignment against the NXP datasheet before schematic capture or layout release.
This page combines verified manufacturer and distributor attributes, lifecycle information, sourcing context, and practical design cautions. It separates published facts from unavailable electrical details so engineers can assess fit, procurement, and implementation risk without relying on unverified assumptions.
Drop-in alternatives for SPC5748GK1MMJ6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with SPC5748GK1MMJ6 (same form factor and footprint) — differing in Data Bus Width, Maximum Clock Frequency, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
SPC5748GGK1MMJ6
✅ Drop-In✓ In Stock
$31.95 / Unit
View Datasheet →SPC5748GK1VM
✅ Drop-In📋 Reference alternative (not in catalog)
SPC5748GK1MMJ6 Maximum Ratings & Electrical Characteristics
| Product Type | 32-bit automotive microcontroller |
| Processor Cores | Triple-core: 2 x e200z4 and 1 x e200z2 |
| Maximum Clock Frequency | 160 MHz |
| Additional Clock Frequency | 80 MHz |
| Flash Memory | 6 MB (6 M x 8) |
| Data RAM | 768 kB |
| Data Bus Width | 32 bit |
| ADC Resolution | 10 bit and 12 bit |
| Minimum Operating Temperature | -40 °C |
| Maximum Operating Temperature | +125 °C |
| Core Supply Voltage | 1.2 V to 1.32 V |
| Package | 256-MAPBGA, 17 x 17 mm |
| Package Code | LBGA |
| Terminal Count | 256 balls |
| Mounting Type | SMD/SMT |
| Terminal Form | Ball |
| Package Shape | Square |
| Temperature Grade | Automotive |
| Lifecycle Status | Active |
SPC5748GK1MMJ6 square Pin Configuration Guide
Pin configuration for SPC5748GK1MMJ6 (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for SPC5748GK1MMJ6.
Refer to the datasheet for full pin configuration.
Typical Applications
SPC5748GK1MMJ6 is suitable for 6 applications: Automotive Body-Control Module, Automotive Communication Gateway, Industrial Control and Automation, Secure Embedded ECU, High-Speed Data Acquisition Controller, Real-Time Diagnostic Controller.
Automotive Body-Control Module
The SPC5748GK1MMJ6 fits a central body-control module that must coordinate lighting, locks, doors, wipers, and diagnostic I/O within one ECU. Its two e200z4 cores and one e200z2 core provide processing capacity up to 160 MHz for concurrent real-time control and supervisory tasks, while 6 MB of flash stores application code and 768 kB of RAM supports active control data. The -40°C to +125°C range suits automotive environmental demands. Final suitability depends on matching the exact body-control peripherals, voltage domains, safety requirements, and NXP reference-manual guidance to the selected vehicle platform.
Recommended
Automotive Communication Gateway
The SPC5748GK1MMJ6 is suitable for a gateway that translates or aggregates vehicle-network traffic and supervises communication between body, powertrain, and external systems. Its triple-core organization can partition protocol handling, diagnostics, and security services, while the 160 MHz maximum frequency supports computationally intensive control functions. The 256-ball MAPBGA offers many external connections for high-speed interfaces and mixed I/O. Designers must verify the exact transceiver interfaces, pin multiplexing, termination requirements, and network timing against NXP documentation; comparable speed alone does not establish gateway compatibility.
Recommended
Industrial Control and Automation
SPC5748GK1MMJ6 can serve as the high-performance control core in an industrial automation controller that combines deterministic task execution, communications, data acquisition, and supervisory logic. Two e200z4 cores and one e200z2 core operate up to 160 MHz, allowing real-time work to be partitioned from communications or safety monitoring. Its 6 MB flash and 768 kB RAM provide substantial embedded resources, and the -40°C to +125°C range supports harsh industrial environments. Before selection, confirm that the required ADC channels, communication controllers, I/O levels, memory map, and qualification satisfy the specific machine standard.
Recommended
Secure Embedded ECU
The SPC5748GK1MMJ6 fits a secure embedded control unit because NXP describes its MPC574xB/C/G family as including a hardware security module and functional-safety support. The triple-core platform can segregate security-sensitive services from control workloads, and the available 6 MB flash accommodates a larger embedded application than many smaller automotive MCUs. Its -40°C to +125°C specification supports harsh installed environments. Design teams should still verify the exact cryptographic services, boot-security architecture, safety mechanisms, key-storage provisions, and certification evidence for this ordering code in the complete manufacturer documentation.
Recommended
High-Speed Data Acquisition Controller
SPC5748GK1MMJ6 is a candidate for data-acquisition and monitoring systems requiring more compute and memory than a small general-purpose MCU. Its verified 10-bit and 12-bit ADC resolution supports mixed-resolution sensing needs, while the triple-core design and 160 MHz clock can process acquired data, execute control logic, and manage communications concurrently. Six megabytes of flash and 768 kB of RAM provide meaningful application headroom. Actual signal-chain performance depends on the selected ADC channels, sample timing, reference voltage, input multiplexing, external analog circuitry, and calibration strategy, none of which can be confirmed from the supplied summary data.
Recommended
Real-Time Diagnostic Controller
The SPC5748GK1MMJ6 is appropriate for a diagnostic node that must run communications stacks, service routines, fault logging, and supervisory tasks concurrently. Its one e200z2 and two e200z4 cores offer a heterogeneous core mix for assigning real-time and higher-performance workloads, while the 6 MB flash supports a substantial diagnostic application and 768 kB RAM supports buffering. The -40°C to +125°C range accommodates demanding installations. Engineers must confirm supported diagnostic protocols, memory-mapped peripherals, security access controls, watchdog behavior, and exact timing guarantees before releasing the design.
Recommended
Engineering reference data for SPC5748GK1MMJ6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | SPC5748GGK1MMJ6 | SPC5748GK1VM |
|---|---|---|---|
| Package | 256-MAPBGA (17 x 17 mm) | 256-BGA automotive package; exact dimensions not independently stated | 256-MAPBGA; package assumed only for strict same-package candidate list and requires manufacturer confirmation |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
Key Differentiators
- Triple heterogeneous-core architecture (vs General single-core automotive microcontrollers)
- Substantial embedded memory for a complex control node (vs Lower-capacity general-purpose automotive MCUs)
- Harsh-environment operating range (vs Commercial-temperature gateway controllers)
- Family-level security and functional-safety integration (vs Basic general-purpose control MCUs)
Design Notes
Treat the 256-ball MAPBGA as a high-pin-count layout, not a generic BGA. Use the exact NXP land pattern, ball map, escape-routing examples, and recommended via-in-pad or fanout rules. Pay particular attention to the 1.2 V to 1.32 V core-supply requirement and separate decoupling networks specified by NXP. The supplied data does not identify individual supply balls, capacitor values, or stackup requirements, so do not infer them from distributor summaries; obtain the manufacturer package and hardware-design documentation before release.
Power-domain design requires the complete NXP electrical specification rather than the single 1.2 V to 1.32 V operating range in the supplied distributor data. Verify core, I/O, analog, flash, clock, and external interface rails, including sequencing, tolerance, inrush, and power-down behavior. Estimated thermal calculations are intentionally omitted because current, voltage rails, ambient conditions, and package thermal data were not provided. Use measured board losses and manufacturer thermal guidance for the final design instead of guessing resistance or junction temperature.
Preserve short return paths for every supply and ground connection and place decoupling adjacent to the associated balls. High-speed communication and debug routes must follow NXP's reference layouts, including controlled impedance, via symmetry, and return-path continuity where applicable. Isolate sensitive analog inputs from high-speed digital activity, and keep clock distribution clean. The verified ADC resolution of 10 bit and 12 bit does not establish achievable system accuracy; analog front-end design, reference quality, layout, and calibration determine final precision.
Do not select SPC5748GK1MMJ6 from core count, clock speed, or package name alone. Confirm the exact peripheral set, memory map, safety level, security configuration, package ballout, qualification, and software support for the ordering code. The related SPC5748GGK1MMJ6 is not proven interchangeable, and SPC5748GK1VM lacks supplied compatibility data. Firmware, bootloader, calibration data, and automotive traceability can prevent a seemingly identical part from serving as a drop-in production replacement.
Compliance Information
The verified sources identify the part as automotive and automotive-qualified and specify -40°C to +125°C operation, but they do not provide exact RoHS, REACH, AEC-Q100 qualification level, lead-free, halogen-free, or conflict-minerals declarations.
