STM32F407IGH6 - 168MHz 1MB Cortex-M4 MCU | STMicroelectronics
MPN: STM32F407IGH6 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7.241 | $7.24 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
STM32F407IGH6 Overview
A microcontroller is a semiconductor device that integrates a processor core, memory, peripherals, and communication interfaces into one compact component. The STM32F4 series belongs to the MCU hierarchy and uses the ARM Cortex-M4 core with floating-point and DSP capabilities. Its architecture is suited to industrial, communications, consumer, and embedded-control systems where deterministic control and multiple peripheral functions are required.
Key verified features include an ARM Cortex-M4 processor, 168 MHz maximum frequency, 1 MB Flash, and 192 KB SRAM. The manufacturer family information also identifies an FPU, ART Accelerator, memory protection unit, DSP instructions, and up to 210 DMIPS. These features support responsive control loops, signal processing, and code execution from Flash memory.
The STM32F407IGH6 is designed for applications requiring a high-performance 32-bit MCU and substantial embedded memory. Its integrated MCU architecture can consolidate control logic and peripheral functions while reducing the number of discrete components in a design. Exact peripheral counts, voltage limits, temperature ranges, and package pin assignments should be confirmed against the manufacturer datasheet for the selected variant.
Typical applications include industrial automation, communications equipment, audio and signal-processing systems, motor-control platforms, and connected embedded devices. The 1 MB Flash capacity provides room for larger firmware, while the 192 KB SRAM supports buffering and real-time workloads. The 168 MHz operating frequency provides additional processing headroom for multitasking and control algorithms.
When designing a board around the STM32F407IGH6, verify power sequencing, decoupling, clock configuration, exposed-pad or thermal requirements, and the exact UFBGA land pattern before layout release. Because this is a high-pin-count ball-grid package, careful BGA routing, via-in-pad strategy, and assembly process selection are important. Do not infer pin compatibility from the family name alone; use the manufacturer pinout and package drawing.
This page summarizes verified distributor and manufacturer information, including the Cortex-M4 core, 168 MHz frequency, 1 MB Flash, 192 KB SRAM, UFBGA package information, pricing references, and application guidance. It is intended to support component identification, engineering selection, and informed sourcing of the STM32F407IGH6.
Drop-in alternatives for STM32F407IGH6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with STM32F407IGH6 (same form factor and footprint) — differing in Package, Mounting Type, SRAM, ART Accelerator, Camera Interface.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
STM32F407IGT7
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →STM32F407IGH6J
✅ Drop-In✓ In Stock
$9.95 / Unit
View Datasheet →APM32F407ZGT6
✅ Drop-In📋 Reference alternative (not in catalog)
STM32F417IEH6
✅ Drop-In📋 Reference alternative (not in catalog)
STM32F469IEH6
✅ Drop-In📋 Reference alternative (not in catalog)
STM32F407VET6
✅ Drop-In✓ In Stock
$3.6094 / Unit
View Datasheet →STM32F407IGH6 Maximum Ratings & Electrical Characteristics
| Product Type | 32-bit ARM Cortex-M4 microcontroller |
| Maximum CPU Frequency | 168 MHz |
| Flash Memory | 1 MB |
| SRAM | Up to 192 KB |
| Core | ARM Cortex-M4 |
| Instruction Set | ARM 32-bit RISC |
| FPU | Yes |
| DSP Support | Yes |
| ART Accelerator | Yes |
| Memory Protection Unit | Yes |
| Maximum Performance | 210 DMIPS |
| Package | 176+25 UFBGA, 10 mm x 10 mm |
| Mounting Type | Surface Mount |
STM32F407IGH6 176+25 ufbga, 10 mm x 10 mm Pin Configuration Guide
Pin configuration for STM32F407IGH6 (176+25 ufbga, 10 mm x 10 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for STM32F407IGH6.
Refer to the datasheet for full pin configuration.
Typical Applications
STM32F407IGH6 is suitable for 6 applications: Industrial Automation Controller, Communications Equipment, Audio and Digital Signal Processing, Motor Control Platform, Connected Embedded Device, Test and Measurement Front End.
Industrial Automation Controller
STM32F407IGH6 fits industrial automation controllers that need deterministic real-time processing, local memory, and communication capability in one MCU. Its 168 MHz ARM Cortex-M4 core can execute control loops and protocol tasks, while 1 MB Flash provides space for application firmware, configuration data, and update logic. The 192 KB SRAM maximum supports buffering, state machines, and communication work queues. A practical design would use the manufacturer clock configuration, dedicated decoupling, robust power sequencing, and peripheral assignments selected for the target PLC or automation module. The supplied sources verify the MCU core, frequency, Flash, SRAM, and package, but not the complete peripheral set or industrial temperature grade.
Recommended
Communications Equipment
The STM32F407IGH6 is suitable for communications equipment requiring a fast control MCU with substantial firmware and data memory. At 168 MHz, the Cortex-M4 core can service protocol stacks, framing logic, buffering, and supervisory tasks, while 1 MB Flash reduces pressure when integrating application code. The 192 KB SRAM maximum can support packet buffers and queue management. A board-level design should verify the required UART, USB, Ethernet, CAN, or other interface assignments against the exact package pinout because those details are not included in the supplied verified snippets. Clocking, impedance-controlled interfaces, grounding, and EMI filtering remain system-level requirements.
Recommended
Audio and Digital Signal Processing
STM32F407IGH6 can serve as the control and signal-processing core in audio or digital signal-processing equipment because the manufacturer family information identifies an ARM Cortex-M4 core with FPU and DSP support. The 168 MHz operating frequency provides processing headroom for sampling control, filtering, mixing, and communication tasks. With 1 MB Flash and up to 192 KB SRAM, the device can support moderate local buffering without relying entirely on external memory. Designers should still verify the exact audio peripherals, sample-rate requirements, DMA behavior, clock sources, and pin multiplexing in the package-specific datasheet. Analog signal conditioning and low-noise power design remain external to the MCU.
Recommended
Motor Control Platform
STM32F407IGH6 is applicable to motor-control platforms where fast computation, control-loop execution, and embedded memory are important. The 168 MHz Cortex-M4 core can execute PWM-related control software, position or speed algorithms, and supervisory logic, while DSP instructions can assist selected fixed-point processing tasks. The 1 MB Flash provides room for control algorithms and diagnostics, and the 192 KB SRAM maximum can accommodate state variables and control buffers. Exact PWM channels, timer synchronization, analog interfaces, and pin assignments must be confirmed for the specific ordering code and board. Power-stage layout, current sensing, gate-driver timing, and thermal design must be validated separately.
Recommended
Connected Embedded Device
STM32F407IGH6 fits connected embedded products that combine local control with network-facing firmware. Its 1 MB Flash can hold application logic, communication services, and configuration, while up to 192 KB SRAM supports protocol state, queues, and diagnostic buffers. The high-performance Cortex-M4 core can manage multiple tasks and event-driven control loops without relying on a separate high-level processor. For an actual connected product, verify the required wireless or wired companion device, RF layout, antenna interface, and communication protocol support; those system-level items are not fully specified in the verified source snippets. Firmware should include secure update and brownout-handling mechanisms.
Recommended
Test and Measurement Front End
STM32F407IGH6 can be used in test and measurement front ends where a microcontroller must acquire data, perform control sequencing, and communicate with a host. The 168 MHz processing rate supports real-time sampling and filtering tasks, and the 1 MB Flash capacity is useful for calibration tables, test sequences, and embedded software. The 192 KB SRAM maximum provides room for sample buffers and working state. The exact ADC, timer, USB, and communications resources must be verified against the package-specific documentation before selecting the MCU for a precision measurement design. Analog front-end design, reference accuracy, calibration, input protection, and isolation are separate design requirements.
Recommended
Recommended Products Summary
Engineering reference data for STM32F407IGH6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | STM32F407IGT7 | STM32F407IGH6J | APM32F407ZGT6 | STM32F417IEH6 | STM32F469IEH6 | STM32F407VET6 |
|---|---|---|---|---|---|---|---|
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | Geehy | STMicroelectronics | STMicroelectronics | STMicroelectronics |
Key Differentiators
- Higher verified Flash capacity than the compared STM32F417IEH6 candidate (vs STM32F417IEH6)
- Direct verified identification of the target package and memory configuration (vs STM32F407VET6)
- Arm Cortex-M4 performance positioning for embedded control (vs STM32F407IGH6J)
- Verified family positioning with DSP and floating-point support (vs APM32F407ZGT6)
Design Notes
Use the exact manufacturer UFBGA land pattern for STM32F407IGH6 and do not substitute a generic BGA footprint based only on the 10 mm x 10 mm body size. Confirm ball assignments, solder-mask definition, paste stencil apertures, via-in-pad policy, and assembly tolerances with the package drawing. The supplied verified data confirms a 176+25 UFBGA package but does not provide the complete ball map, so the PCB layout cannot be safely finalized from the supplied snippets alone.
Plan the MCU power rails with separate local decoupling and verify the exact operating-voltage limits from the manufacturer datasheet before selecting regulators or capacitor voltage ratings. Keep the main digital supply path short and provide adequate bulk capacitance near the device supply balls. The verified data identifies 1 MB Flash and up to 192 KB SRAM but does not state the voltage range, so rail tolerances, sequencing, and brownout behavior remain data-needed design inputs.
Treat the UFBGA package as a thermal design problem, not only an electrical routing problem. Follow the manufacturer land pattern for exposed thermal connectivity where applicable, distribute ground and power vias according to the assembly process, and model the actual board stackup and enclosure temperature. Do not estimate junction temperature from the verified 168 MHz CPU frequency alone; compute losses from the final clock rate, active duty cycle, peripherals, supply voltage, and thermal boundary conditions.
Route high-speed clocks, external-memory interfaces, communication signals, and debug signals with continuous reference planes where possible. Avoid long stubs and unnecessary vias, especially around the UFBGA escape region. Keep sensitive analog and communication routes away from noisy switching nodes, and validate the final stackup with the design-rule constraints of the selected fabrication and assembly process. The supplied source snippets do not specify the complete high-speed interface set.
Compliance Information
The supplied verified snippets identify the MCU and package but do not provide manufacturer compliance statements for RoHS, REACH, AEC-Q100, lead-free status, halogen-free status, or conflict minerals.
