STM32MP157FAC1 - Dual Cortex-A7 + M4 MPU | STMicroelectronics
MPN: STM32MP157FAC1 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.8 | $168.00 |
| 100 | $14.2 | $1,420.00 |
| 500 | $12.9 | $6,450.00 |
| 1,000 | $11.5 | $11,500.00 |
Drop-in alternatives for STM32MP157FAC1 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
STM32MP157DAC1
β Drop-Inπ Reference alternative (not in catalog)
STM32MP157FAC1-Q
β Drop-Inπ Reference alternative (not in catalog)
STM32MP157CAC1
β Drop-Inπ Reference alternative (not in catalog)
STM32MP157FAC1
β Drop-Inβ 99,999 In Stock
$11.5 / Unit
View Datasheet βSTM32MP157FAC1 Maximum Ratings & Electrical Characteristics
| Core Processor | ARM Cortex-A7 (dual) + Cortex-M4 |
| Core Frequency | 650 MHz (A7) / 209 MHz (M4) |
| Number of Cores | 3 (2x A7 + 1x M4) |
| RAM Size | 708 KB (internal SRAM) |
| Program Memory Type | External (DDR3/DDR3L/LPDDR2/LPDDR3) |
| Program Memory Size | Up to 1 GB (external) |
| Connectivity | 2x Ethernet, 2x USB 2.0 OTG, 8x UART, 5x I2C, 5x SPI, 2x CAN FD |
| Graphics | 3D GPU (OpenGL ES 2.0), 2D accelerator, MIPI-DSI |
| Package | TFBGA361 (18x18 mm, 0.8 mm pitch) |
| Operating Temperature | -40Β°C to +125Β°C |
| Supply Voltage | 1.8V to 3.3V (I/O), 1.2V (core) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Security | Cryptographic acceleration, secure boot |
| DMA Channels | 44 |
STM32MP157FAC1 Pin Configuration
| Pin A1 | VDD_3V3 β 3.3V I/O power supply |
| Pin A2 | VSS β Ground |
| Pin B1 | VDD_1V8 β 1.8V I/O power supply |
| Pin B2 | VDD_CORE β Core logic power supply (1.2V) |
| Pin C1 | PA0 β GPIO / ADC input |
| Pin C2 | PA1 β GPIO / ADC input |
| Pin D1 | PA2 β GPIO / USART2_TX |
| Pin D2 | PA3 β GPIO / USART2_RX |
| Pin E1 | PA4 β GPIO / SPI1_NSS |
| Pin E2 | PA5 β GPIO / SPI1_SCK |
| Pin F1 | PA6 β GPIO / SPI1_MISO |
| Pin F2 | PA7 β GPIO / SPI1_MOSI |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
STM32MP157FAC1 is suitable for 6 applications: Industrial HMI Panels, Smart Home Gateway, Medical Monitoring Device, Edge AI Inference Node, Automotive Infotainment, Networking Equipment.
Industrial HMI Panels
The STM32MP157FAC1 is ideal for industrial human-machine interfaces (HMI) due to its dual-core Cortex-A7 for running Linux-based GUI frameworks and the Cortex-M4 for real-time control of touch input and display backlight. The integrated 3D GPU and MIPI-DSI interface enable rich graphical user interfaces with smooth animations. In a typical HMI panel, the A7 cores run an embedded Linux distribution with Qt or GTK, while the M4 core handles capacitive touch sensing and communicates with the A7 via shared memory. The device's Ethernet and CAN FD interfaces allow seamless integration with industrial networks. Performance-wise, the 650 MHz A7 cores provide ample processing power for complex UI rendering, while the M4 ensures deterministic response to user inputs. Designers should ensure proper power sequencing and use a PMIC like the STPMIC1 to manage the multiple voltage rails.
Recommended
Smart Home Gateway
The STM32MP157FAC1 serves as a powerful smart home gateway, connecting various IoT devices via Ethernet, Wi-Fi (through external modules), and Zigbee. The dual Cortex-A7 cores run a Linux-based gateway software stack, handling protocol translation, data aggregation, and cloud connectivity. The Cortex-M4 core can manage time-critical tasks like Zigbee protocol handling or sensor polling. The device's rich connectivity options (2x Ethernet, USB, UART, SPI, I2C) allow interfacing with multiple wireless modules. The security features (cryptographic acceleration, secure boot) ensure secure communication with cloud services. In a typical gateway, the A7 cores run applications like Home Assistant or custom middleware, while the M4 handles real-time sensor data acquisition. The low-power modes help reduce energy consumption in always-on devices. Designers should consider using the STM32MP157FAC1's hardware crypto engine to offload TLS/DTLS encryption, improving throughput and reducing CPU load.
Recommended
Medical Monitoring Device
The STM32MP157FAC1 is well-suited for medical monitoring devices such as patient vital signs monitors and portable diagnostic equipment. The dual-core architecture allows the A7 cores to run a graphical user interface for displaying waveforms and trends, while the M4 core handles real-time acquisition of biosignals (ECG, SpO2, etc.) with precise timing. The device's high processing power enables advanced signal processing algorithms, such as digital filtering and arrhythmia detection, to run on the A7 cores. The M4 core can interface with analog front-end ICs via SPI or I2C, ensuring low-latency data acquisition. The wide operating temperature range (-40Β°C to +125Β°C) and long-term availability make it suitable for medical devices that require reliability. Designers must ensure compliance with medical standards (IEC 60601) and implement proper isolation and safety measures. The STM32MP157FAC1's security features help protect patient data.
Recommended
Edge AI Inference Node
The STM32MP157FAC1 can be used as an edge AI inference node for applications like predictive maintenance, quality inspection, and smart surveillance. The dual Cortex-A7 cores can run lightweight neural network inference frameworks such as TensorFlow Lite or ST's STM32Cube.AI, enabling on-device AI without cloud latency. The Cortex-M4 core can handle sensor data preprocessing and trigger inference tasks. The device's GPU can accelerate certain image processing tasks, while the M4 ensures real-time response. In a typical edge AI node, the A7 cores run the inference engine on camera or sensor data, and the results are communicated via Ethernet or USB. The device's security features protect the AI models and data. Designers should optimize memory bandwidth for AI workloads and consider using external DDR3 for larger models. The STM32MP157FAC1's heterogeneous architecture allows partitioning of tasks: A7 for AI, M4 for real-time control.
Recommended
Automotive Infotainment
The STM32MP157FAC1 is suitable for automotive infotainment systems, such as head units and digital instrument clusters. The dual Cortex-A7 cores can run a Linux-based infotainment platform (e.g., Android Automotive), while the Cortex-M4 core handles real-time tasks like CAN bus communication and display control. The integrated 3D GPU and MIPI-DSI interface enable high-resolution displays with smooth graphics. The device's automotive-grade variant (STM32MP157FAC1-Q) is AEC-Q100 qualified, ensuring reliability in harsh automotive environments. The rich connectivity (Ethernet, CAN FD, USB) supports vehicle networking and smartphone integration. In a typical head unit, the A7 cores run navigation, media playback, and voice recognition, while the M4 manages the CAN interface for vehicle data. Designers must ensure compliance with automotive standards (AEC-Q100, ISO 26262) and implement proper power management for battery operation.
Recommended
Networking Equipment
The STM32MP157FAC1 can be used in networking equipment such as industrial routers, gateways, and network-attached storage (NAS) devices. The dual Cortex-A7 cores provide ample processing power for routing, firewall, and VPN applications, while the Cortex-M4 core can handle packet processing or management tasks. The device's dual Gigabit Ethernet interfaces enable high-throughput networking, and the USB 2.0 OTG ports support external storage or cellular modems. The security features (crypto acceleration) accelerate IPsec and TLS, improving VPN performance. In a typical router, the A7 cores run a Linux-based routing stack (e.g., OpenWrt), while the M4 handles low-level packet filtering or hardware interrupts. The device's low-power modes help reduce energy consumption in always-on networking devices. Designers should optimize memory bandwidth for high packet rates and consider using external DDR3 for larger routing tables.
Recommended
Recommended Products Summary
Engineering reference data for STM32MP157FAC1 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | STM32MP157DAC1 | STM32MP157FAC1-Q | STM32MP157CAC1 |
|---|---|---|---|---|
| Package | TFBGA361 | TFBGA361 - same | TFBGA361 - same | TFBGA361 - same |
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Core Frequency (A7) | 650 MHz | 650 MHz | 650 MHz | 650 MHz |
| Core Frequency (M4) | 209 MHz | 209 MHz | 209 MHz | 209 MHz |
| 3D GPU | Yes | Yes | Yes | No |
| MIPI-DSI | Yes | Yes | Yes | No |
| Automotive Grade | No | No | Yes (AEC-Q100) | No |
| Price (1pc) | $18.50 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Heterogeneous dual-core A7 + M4 architecture (vs STM32MP157CAC1)
- Automotive-grade option available (vs STM32MP157FAC1-Q)
- Rich connectivity and security features (vs STM32MP157DAC1)
Design Notes
The STM32MP157FAC1 requires multiple power rails: VDD_CORE (1.2V), VDD_1V8 (1.8V), and VDD_3V3 (3.3V). Proper power sequencing is critical to avoid latch-up. ST recommends using the STPMIC1 PMIC, which provides the correct sequencing and voltage levels. Ensure each rail has adequate decoupling capacitors (100nF and 10uF) placed close to the power pins.
The TFBGA361 package requires careful PCB layout. For the DDR memory interface, use impedance-controlled traces (50 ohm single-ended, 100 ohm differential) and maintain proper length matching. Place the DDR memory close to the MPU to minimize trace lengths. Use a 4-layer or more PCB with solid ground and power planes.
The STM32MP157FAC1 can dissipate significant power under full load. The TFBGA361 package has a thermal resistance (theta_JA) of approximately 20Β°C/W. For high-performance applications, ensure adequate airflow or a heatsink. Use thermal vias under the exposed pad to improve heat transfer to the PCB ground plane.
Compliance Information
RoHS compliant per STMicroelectronics product page. Not AEC-Q100 qualified for standard version; choose -Q variant for automotive.
