STM32WB55VCQ6 - Dual-Core 64MHz Wireless MCU | STMicroelectronics
MPN: STM32WB55VCQ6 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $10.1951 | $10.20 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
STM32WB55VCQ6 Overview
A wireless system-on-chip combines a microcontroller, radio, memory, and security-related peripherals on one integrated device. In the STM32WB family, the Cortex-M4 executes application software while the Cortex-M0+ handles real-time low-level radio operations. This architecture is intended for low-power Bluetooth and IEEE 802.15.4 products, including sensor nodes, industrial wireless devices, connected controls, and energy-conscious portable equipment.
The verified data identifies a 256 Kbyte memory configuration, a 64 MHz Cortex-M4 operating frequency, a 32 MHz Cortex-M0+ frequency, a 2405 MHz to 2480 MHz operating band, and a maximum data rate of 2000 kbps. The radio specification includes -100 dBm sensitivity and 6 dBm output power. These figures make the device suitable for short-range wireless links where compactness, low power, and integrated protocol support matter.
The STM32WB55VCQ6 is identified as an ultra-low-power dual-core MCU with Bluetooth LE capability and RF functionality. Its wireless feature set combines Bluetooth Low Energy and 802.15.4 radio support in one package, reducing the need for separate radio components in compatible designs. Protocol availability and exact feature activation must still be checked against the manufacturer datasheet and product documentation for the selected firmware configuration.
Typical applications include Bluetooth Low Energy wearables, industrial sensor networks, smart-building controls, wireless remote devices, Thread-connected equipment, and Zigbee products. The integrated dual-core design can help separate real-time radio tasks from application processing, while the 2.4 GHz radio supports common short-range wireless standards.
Designers should pay attention to the 129-UFBGA package, required power-supply decoupling, RF layout practices, antenna implementation, and the device's specified operating temperature range of -40 C to +85 C. Verify all pin assignments and exposed-pad connections against the official datasheet before layout or production substitution.
This page consolidates the verified manufacturer and distributor references, exact available pricing information, package and pinout requirements, protocol capabilities, and engineering-oriented selection guidance for STM32WB55VCQ6.
Drop-in alternatives for STM32WB55VCQ6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with STM32WB55VCQ6 (same form factor and footprint) — differing in Package.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
STM32WB55CGU7
✅ Drop-In📋 Reference alternative (not in catalog)
STM32WB55CCU7
✅ Drop-In📋 Reference alternative (not in catalog)
STM32WB55RGV6
✅ Drop-In✓ In Stock
$4.7 / Unit
View Datasheet →STM32WB55RGV7
✅ Drop-In📋 Reference alternative (not in catalog)
STM32WB35CEU6ATR
✅ Drop-In📋 Reference alternative (not in catalog)
STM32WB55VCQ6 Maximum Ratings & Electrical Characteristics
| Product Type | Multiprotocol wireless 32-bit MCU |
| Main Core | Arm Cortex-M4 with FPU, 64 MHz |
| Radio Core | Arm Cortex-M0+, 32 MHz |
| Memory | 256 Kbyte |
| Wireless Frequency | 2405 MHz to 2480 MHz |
| Data Rate | 2000 kbps |
| Receiver Sensitivity | -100 dBm |
| Radio Output Power | 6 dBm |
| Bluetooth Support | Bluetooth Low Energy 5.3 |
| IEEE 802.15.4 Support | IEEE 802.15.4-2011 |
| Additional Protocol Support | Thread and Zigbee |
| Supply Voltage | 1.71 V to 3.6 V |
| Supply Current | 4.5 mA to 7.9 mA |
| Operating Temperature | -40 C to +85 C |
| Package | 129-UFBGA |
| Mounting Type | Surface Mount |
| Radio Compliance | Bluetooth Low Energy SIG specification 5.4 and IEEE 802.15.4-2011 |
| Manufacturer | STMicroelectronics |
STM32WB55VCQ6 129-ufbga Pin Configuration Guide
Pin configuration for STM32WB55VCQ6 (129-ufbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for STM32WB55VCQ6.
Refer to the datasheet for full pin configuration.
Typical Applications
STM32WB55VCQ6 is suitable for 6 applications: Bluetooth Low Energy Sensor Nodes, Industrial Wireless Monitoring, Smart Building Controls, Thread and Zigbee Connectivity, Portable Health and Wearable Devices, Wireless Remote Controls.
Bluetooth Low Energy Sensor Nodes
STM32WB55VCQ6 fits Bluetooth Low Energy sensor nodes because it combines a 64 MHz Cortex-M4 application core with a dedicated 32 MHz Cortex-M0+ core for real-time low-layer radio operation. Its verified 2.405 GHz to 2.48 GHz radio band and -100 dBm sensitivity support short-range sensor links, while the 2000 kbps listed data rate accommodates compact telemetry streams. Use the MCU between the sensor interface and an optimized 2.4 GHz antenna network, and validate current consumption in the intended sleep and radio duty-cycle states.
Recommended
Industrial Wireless Monitoring
STM32WB55VCQ6 is suitable for industrial wireless monitoring systems that need local processing and protocol flexibility in a compact radio module. The Cortex-M4 core can handle application logic and communications while the Cortex-M0+ core is dedicated to real-time radio operations. The listed 6 dBm output power and -100 dBm sensitivity provide documented radio targets, but industrial range depends on antenna placement, enclosure material, interference, and regulatory limits. Use careful RF layout, filtering, and power decoupling in the final equipment.
Recommended
Smart Building Controls
STM32WB55VCQ6 can support smart-building endpoints such as wireless switches, occupancy controls, lighting modules, and environmental sensors. Its integrated 2.4 GHz radio and Bluetooth Low Energy capability reduce the need for a separate communications IC, while the dual-core architecture helps separate protocol timing from application tasks. The device is appropriate when the product needs low standby power, compact PCB area, and local control logic. Confirm coexistence behavior, antenna clearance, and the applicable wireless regulatory requirements before production release.
Recommended
Thread and Zigbee Connectivity
STM32WB55VCQ6 is relevant for Thread- and Zigbee-based connected products because the verified distributor data identifies both protocols alongside Bluetooth Low Energy and 802.15.4 support. The Cortex-M4 processor can support application workloads while the dedicated Cortex-M0+ core supports real-time radio processing. A product using these protocols must implement the appropriate certified stack, radio configuration, memory plan, and security provisioning. Verify the exact protocol version and stack support in STMicroelectronics documentation for the production firmware release.
Recommended
Portable Health and Wearable Devices
STM32WB55VCQ6 can be evaluated for wearable and portable health devices that combine wireless communication with local sensor processing. The ultra-low-power dual-core architecture allows the radio timing workload to remain separate from application processing, while the integrated 2.4 GHz radio supports compact wearable form factors. Battery life depends on the selected sensor, display, radio duty cycle, and firmware power modes; the verified 4.5 mA to 7.9 mA summary should not be treated as a complete average-current specification. Validate SAR, antenna coupling, and regulatory compliance for the complete product.
Recommended
Wireless Remote Controls
STM32WB55VCQ6 is appropriate for wireless remote controls and compact human-interface devices that need low-power radio connectivity with embedded application logic. The 64 MHz Cortex-M4 core can process button logic, display updates, and device state, while the Cortex-M0+ core handles real-time radio operations. Its listed 6 dBm output power is useful for close-range links, but final usability depends on antenna geometry and battery conditions. Keep the antenna area clear of metal or high-loss materials and follow the manufacturer's RF layout guidance.
Recommended
Recommended Products Summary
Engineering reference data for STM32WB55VCQ6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | STM32WB55CGU7 | STM32WB55CCU7 | STM32WB55RGV6 | STM32WB55RGV7 | STM32WB35CEU6ATR |
|---|---|---|---|---|---|---|
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
Key Differentiators
- Dedicated real-time radio core (vs Generic single-core wireless MCU)
- Integrated multiprotocol radio (vs Bluetooth-only MCU)
- 2.4 GHz radio performance figures (vs Lower-radio-performance wireless controller)
Design Notes
Place the RF input/output path and antenna connection according to the STMicroelectronics reference layout. Keep the antenna region free of ground copper, switching regulators, metal shields, and dense signal traces where practical. The verified 2.4 GHz radio performance depends not only on the IC but also on antenna matching, enclosure geometry, PCB stack-up, and controlled impedance implementation.
Use the manufacturer's recommended supply network and decoupling arrangement around the 129-UFBGA device. The verified operating-voltage summary is 1.71 V to 3.6 V, so validate startup sequencing, voltage tolerances, and load transients against the official datasheet. Do not infer average current from the listed 4.5 mA to 7.9 mA summary without checking the exact operating mode and test conditions.
Do not treat a related STM32WB55 or STM32WB35 MPN as a drop-in replacement solely from family similarity. Verify the exact package, ball map, exposed-pad requirements, memory configuration, RF calibration, protocol firmware, and operating limits before approving a substitution. The alternative list is based on the supplied web search results, which did not provide complete pin-level compatibility data for every candidate.
Validate junction temperature and RF performance in the final 129-UFBGA board layout. The package is small, and the thermal behavior depends on the PCB copper area, exposed-pad connection, enclosure, ambient temperature, and radio duty cycle. Use the manufacturer thermal and package guidance rather than estimating reliability from the distributor summary alone.
Compliance Information
The verified data identifies Bluetooth Low Energy SIG specification 5.4 and IEEE 802.15.4-2011 radio compliance. RoHS, REACH, AEC-Q100, lead-free, halogen-free, and conflict-minerals status were not provided in the supplied sources.
