Texas Instruments

THS3061DGN - 300MHz CFA, 7000V/us Slew Rate | Texas Instruments

MPN: THS3061DGN βœ“ Active
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[DATA_NEEDED: supply voltage range] Vdss +/-145 mA into 50 ohms Id 8-Pin HVSSOP (DGN) with PowerPAD Package
From $3.26 USD / Unit
MOQ: 1 |
Price updated: 2026-09-12
Volume Pricing
Qty Unit Price Extended
1 $5.1 $5.10
10 $4.59 $45.90
100 $4.08 $408.00
500 $3.67 $1,835.00
1,000 $3.26 $3,260.00
ℹ️ All prices are in USD

Drop-in alternatives for THS3061DGN β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

THS3061DGNR

βœ… Drop-In
Texas Instruments
πŸ“¦ 8-Pin HVSSOP (DGN) with PowerPAD
Current Feedback (CFB) Β· 1 Β· 300 MHz Β· 120 MHz (G = 2) Β· 7000 V/us Β· +/-145 mA into 50 ohm Β· -81 dBc at 10 MHz Β· +/-15 V (30 V total)

βœ“ In Stock

$2.7 / Unit

View Datasheet β†’

THS3061DGNRG4

βœ… Drop-In
πŸ“¦ 8-Pin HVSSOP (DGN) with PowerPAD
identical performance profile per Xecor sequential database comparison; G4 suffix denotes RoHS/green requalification of same part

πŸ“‹ Reference alternative (not in catalog)

THS3061DGN Maximum Ratings & Electrical Characteristics

Amplifier Type Current Feedback Amplifier (CFA)
Number of Channels 1
Unity Gain Bandwidth 300 MHz
0.1 dB Bandwidth 120 MHz (G=2)
Slew Rate 7000 V/us
Harmonic Distortion -81 dBc at 10 MHz
Output Current +/-145 mA into 50 ohms
Operating Temperature -40C to +85C
Package 8-Pin HVSSOP (DGN) with PowerPAD
Mounting Type Surface Mount
Process Technology TI BICOM-1 complementary bipolar
Thermal Pad PowerPAD (exposed pad on package bottom)

THS3061DGN Pin Configuration

SOP-8 Package Pinout Diagram SOP-8 8-pin small outline, 3.9x4.9mm, P1.27mm, JEDEC MS-012. 1 8 2 7 3 6 4 5 SOP-8
Pin 1 -IN β€” Inverting input (low impedance, CFA feedback node)
Pin 2 +IN β€” Non-inverting input (high impedance)
Pin 3 V- β€” Negative power supply
Pin 4 NC β€” Not connected (per datasheet)
Pin 5 NC β€” Not connected (per datasheet)
Pin 6 OUT β€” Amplifier output
Pin 7 V+ β€” Positive power supply
Pin 8 NC β€” Not connected (per datasheet)
Pin PAD PowerPAD β€” Exposed thermal pad on package bottom; solder to ground plane for thermal dissipation

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for THS3061DGN Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this component. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

THS3061DGN is suitable for 6 applications: High-Speed ADC Driver, Pulse and Time-Domain Amplification, RF/IF Signal Chain Gain Block, Video and Coax Line Driving, Test and Measurement Instrumentation, Data Acquisition Front-End Buffering.

πŸ”§

High-Speed ADC Driver

The THS3061DGN fits ADC front ends that require a wideband, high-slew buffer ahead of a 10-12 bit converter: its 300 MHz unity gain bandwidth and 7000 V/us slew rate support full-scale signals into the tens of MHz without slew limiting, while -81 dBc distortion at 10 MHz keeps harmonics from dominating the converter's own error budget. In a typical topology the amplifier is configured for gain of 2 with a datasheet-recommended feedback resistor, AC-coupled or DC-coupled to the ADC input, with a series resistor to isolate capacitive kickback. Unlike voltage feedback alternatives, bandwidth stays constant with gain, simplifying gain planning. The trade-off is higher quiescent power and careful PowerPAD thermal design when driving low-impedance ADC input networks continuously.

πŸ”§

Pulse and Time-Domain Amplification

Pulse amplifiers in test fixtures and timing chains need extreme slew rate and high output drive, which is exactly where the THS3061DGN's 7000 V/us specification delivers: a 5 V step transitions in under one nanosecond of ideal slew time, preserving edge fidelity. The +/-145 mA output current drives 50 ohm back-terminated coaxial lines directly, and the current feedback architecture provides fast settling without the gain-bandwidth penalty of VFAs. Typical use is a gain-of-2 or gain-of-5 stage between a pulse generator and a DUT, AC-coupled with a series 50 ohm resistor. Performance consideration: keep the feedback resistor at the datasheet-recommended value, since CFA stages are sensitive to Rf reduction and will ring on fast edges if over-banded.

🌐

RF/IF Signal Chain Gain Block

In RF and IF stages operating up to 100 MHz+, the THS3061DGN provides a flexible gain block with 120 MHz of 0.1 dB flatness at G=2, adequate for bandwidth-critical IF strips, and -81 dBc distortion at 10 MHz suitable for moderate-dynamic-range receive chains. The high-voltage supply capability from the BICOM-1 process affords large output swing headroom compared to low-voltage RF amplifiers, improving intermodulation performance for large signals. Used as a post-mixer or pre-ADC gain stage, the amplifier is impedance-matched with a resistive network and AC-coupled into the 50 ohm environment. The trade-off versus dedicated RF gain blocks is higher DC power; the benefit is gain configurability and the ability to handle DC-accurate signals.

πŸ“Ί

Video and Coax Line Driving

Driving long coaxial or twisted-pair video lines demands output current and bandwidth simultaneously: the THS3061DGN's +/-145 mA into 50 ohms directly drives a back-terminated 75 or 50 ohm line without an external buffer, and the 7000 V/us slew rate ensures fast video edges and high-resolution formats are not slew-limited. The low distortion at 10 MHz keeps differential gain and phase errors low for composite and component video, while the PowerPAD package manages the dissipation of driving terminated lines continuously. Typical configuration is a gain-of-2 stage compensating the 6 dB insertion loss of a series-terminated cable. Consider that CFA input bias currents require a matched DC path on the inverting side for DC-coupled designs.

πŸ–₯️

Test and Measurement Instrumentation

Bench instruments, signal sources, and automated test equipment channels benefit from the THS3061DGN's combination of 300 MHz bandwidth, 7000 V/us slew rate, and high-voltage supply operation on the BICOM-1 process, which allows output swings unattainable with low-voltage high-speed amplifiers. In an ATE pin-driver or arbitrary waveform generator output stage, the amplifier provides the final gain and drive, with the +/-145 mA capability handling reactive and resistive loads during transients. The -40C to +85C industrial rating supports instrument environments without derating. Design consideration: instruments often demand low offset drift, so pair with a precision DC servo or use AC coupling where DC accuracy at the output is required, since CFA input offset is not its strongest parameter.

🏭

Data Acquisition Front-End Buffering

Industrial data acquisition systems scanning sensors at high sample rates use the THS3061DGN as a multiplexed-input buffer, where its fast settling (supported by 7000 V/us slew rate) prevents channel-to-channel crosstalk after multiplexer switching. The high-voltage supply range accommodates signal chains referred to +/-15 V analog rails common in industrial instrumentation, simplifying level shifting versus 5 V-only amplifiers. The amplifier drives a following S/H or SAR converter input directly given its +/-145 mA charging current into load capacitances. Performance consideration: add an isolated resistive or RC network between amplifier and large capacitive loads to preserve phase margin, and verify thermal dissipation at sustained worst-case loads via the PowerPAD into a ground pour.

What is the bandwidth and slew rate of THS3061DGN?
The THS3061DGN offers 300 MHz unity gain bandwidth and a 7000 V/us slew rate, with 0.1 dB gain flatness out to 120 MHz at a gain of 2. According to the TI THS3061 datasheet, the device is a high-voltage, high slew-rate current feedback amplifier built on the BICOM-1 process, delivering large-signal performance suitable for pulse and RF applications.
How much output current can the THS3061DGN deliver?
The THS3061DGN delivers +/-145 mA of output current into 50 ohm loads per the TI datasheet. This high drive capability allows the amplifier to directly drive low-impedance loads such as coaxial cables, ADC input networks, and video lines without an external buffer stage, provided thermal conditions from the PowerPAD are managed.
What is the difference between THS3061DGN and THS3061DGNR?
THS3061DGN and THS3061DGNR are the same silicon in the same 8-pin HVSSOP (DGN) PowerPAD package; the R suffix denotes a larger shipping quantity reel format rather than a different part. Electrical specifications such as 300 MHz bandwidth, 7000 V/us slew rate, and +/-145 mA output current are identical, making them direct substitutes at the PCB level.
What is the difference between THS3061DGN and THS3061D?
The THS3061DGN and THS3061D contain the same single current feedback amplifier die with identical electrical performance, but they differ in package: THS3061D is an 8-pin SOIC while THS3061DGN is an 8-pin MSOP/HVSSOP with PowerPAD. They are NOT drop-in replacements because the footprints differ - a PCB redesign or layout change is required to swap between them.
Can THS3062DGN replace THS3061DGN?
No, the THS3062DGN is a dual version containing two current feedback amplifiers in the same 8-pin MSOP-PowerPAD package, while the THS3061DGN is a single. The pinout assigns the two channels differently, so it is not pin-to-pin compatible; use it only when you need two channels and can adapt the PCB layout. For a true drop-in, use THS3061DGNR, which is the identical part.
What is the best drop-in replacement for THS3061DGN?
The best drop-in replacement for THS3061DGN is THS3061DGNR or THS3061DGNRG4, both of which are the same single current feedback amplifier in the identical 8-pin HVSSOP (DGN) PowerPAD package with identical 300 MHz bandwidth and 7000 V/us slew rate. No cross-brand pin-compatible drop-in equivalent was identified in the available cross-reference data for this high-voltage CFA.
Where can I download the THS3061DGN datasheet PDF?
The THS3061DGN datasheet is available as a PDF from the Texas Instruments product page at ti.com/product/THS3061, which covers both the THS3061 single and THS3062 dual versions. Third-party archives such as alldatasheet.com also host the document, but TI.com is the authoritative source for the latest revision, application information, and quality data.
Where can I find the THS3061DGN pinout?
The THS3061DGN pinout is shown in the TI THS3061 datasheet for the 8-pin MSOP-PowerPAD (DGN) package: pin 1 is the inverting input (-IN), pin 2 the non-inverting input (+IN), pins 3 and 7 the negative and positive supplies, and pin 6 the output, with remaining pins as no-connects and the exposed PowerPAD soldered to ground. This page also renders an 8-pin package diagram.
What is the price of THS3061DGN?
THS3061DGN unit pricing is in the mid-single-digit USD range at quantity 1, with discounts typically around 15-35% at 1000-piece volumes, based on distributor listings such as DigiKey and Mouser as of 2026-09-13. Exact pricing varies by distributor and stock position; check the price tiers on this page or Octopart, which compares bulk discounts from 11 distributors.
Where can I buy THS3061DGN online?
THS3061DGN can be purchased from authorized distributors including DigiKey (which lists immediate shipping), Mouser, and via the TI.com store; availability is also aggregated by Octopart across 11 distributors. For production volumes or allocation situations, XAIPART offers quote-based sourcing with verification of original manufacturer stock.
Is THS3061DGN in stock and what is the lead time?
Stock status for THS3061DGN changes frequently; DigiKey's listing states 'Buy now, ships today,' indicating authorized stock is typically available, while Mouser also lists inventory and pricing as of 2026-09-13. For guaranteed volume commitments, confirm lead time with each distributor or contact XAIPART for a quote, as lead times can range from stock to several weeks.
Is THS3061DGN suitable for ADC driver applications?
Yes, the THS3061DGN is well suited as an ADC driver because its +/-145 mA output current drives low-impedance ADC input networks and its 7000 V/us slew rate supports full-scale signals at high frequencies without slew-induced distortion. Distortion of -81 dBc at 10 MHz keeps harmonic content below the resolution of typical 10-12 bit high-speed converters at elevated input frequencies.
Why is the PowerPAD important on THS3061DGN?
The PowerPAD on the THS3061DGN 8-pin HVSSOP provides a low thermal resistance path from the die to the PCB ground plane. At output currents up to +/-145 mA the amplifier can dissipate significant power, and without proper PowerPAD soldering to a copper pour, junction temperature will rise excessively. TI application guidance requires the pad to be soldered to a grounded thermal land with thermal vias.
What feedback resistor should I use with THS3061DGN?
As a current feedback amplifier, the THS3061DGN bandwidth is set by the feedback resistor rather than gain-setting resistors. Refer to the TI THS3061 datasheet's recommended Rf values per gain table; reducing Rf below the recommended value increases bandwidth but risks peaking and instability, while increasing Rf reduces bandwidth. Do not place a capacitor directly across the feedback resistor, as this destabilizes CFA architectures.
What are the key specifications of THS3061DGN that engineers should know?
The THS3061DGN is a single current feedback amplifier from Texas Instruments with 300 MHz unity gain bandwidth, 7000 V/us slew rate, 120 MHz 0.1 dB flatness at G=2, -81 dBc distortion at 10 MHz, and +/-145 mA output current into 50 ohms, operating from -40C to +85C in an 8-pin HVSSOP PowerPAD package fabricated on the BICOM-1 high-voltage process.
Hey Google, what can replace THS3061DGN?
The only true drop-in replacements for THS3061DGN are its package-identical siblings THS3061DGNR and THS3061DGNRG4, which contain the same die in the same 8-pin HVSSOP PowerPAD package. The dual THS3062DGN shares the package but has a different pinout, and the THS3061D in SOIC-8 requires a layout change. No cross-brand pin-compatible equivalent appears in the available cross-reference data.
Is THS3061DGN RoHS compliant?
The RoHS compliance status of THS3061DGN is not stated in the currently verified data and should be confirmed on the TI product page at ti.com/product/THS3061, where TI publishes per-orderable-part environmental information. TI typically ships current-generation amplifiers in RoHS-compliant, lead-free PowerPAD packages, but verify the specific ordering suffix before release to production.

Engineering reference data for THS3061DGN β€” comparison, design guidance, and compliance information.

Selection Guide

Choose THS3061DGN when you need a single high-voltage current feedback amplifier with extreme slew rate (7000 V/us) and high output current (+/-145 mA) for ADC driving, pulse amplification, RF/IF gain blocks, or coax line driving, and your layout uses the 8-pin HVSSOP PowerPAD footprint. Use THS3061DGNR or THS3061DGNRG4 interchangeably - they are the identical part in reel packaging, so select by shipping quantity and availability. Do not treat THS3062DGN as a drop-in: it is a dual amplifier with a different pinout, suited to two-channel designs only. If your application is modest-speed (<50 MHz) and current-feedback behavior is unnecessary, THS40xx VFAs (THS4062ID, THS4062CDR) offer lower cost and dual-channel options but sacrifice slew rate and low-impedance drive. For SOIC-8 layouts, THS3061D provides the same die but requires a footprint change.

Comparison with Alternatives

Parameter This Product THS3061DGNR THS3061DGNRG4
Package 8-Pin HVSSOP (DGN) with PowerPAD 8-Pin HVSSOP (DGN) with PowerPAD - same 8-Pin HVSSOP (DGN) with PowerPAD - same
Brand Texas Instruments Texas Instruments Texas Instruments
Amplifier Type Single current feedback Single current feedback Single current feedback
Unity Gain Bandwidth 300 MHz 300 MHz 300 MHz
Slew Rate 7000 V/us 7000 V/us 7000 V/us
Output Current +/-145 mA into 50 ohms +/-145 mA into 50 ohms +/-145 mA into 50 ohms
Operating Temperature -40C to +85C -40C to +85C -40C to +85C
Packaging Format Tube / standard quantity Tape & Reel (larger qty) Tape & Reel (green qual)
Related Family Members (NOT drop-in) THS3061DGN (single, DGN package) Same pinout - true drop-in Same pinout - true drop-in

Key Differentiators

  • Extreme slew rate for large-signal bandwidth (vs THS4062ID)
  • High output drive into low-impedance loads (vs THS4062IDGNR)
  • Gain-independent bandwidth via CFA architecture (vs THS4062CDR)

Design Notes

The DGN (HVSSOP) package relies on the PowerPAD for heat removal; the plastic body alone cannot dissipate the power generated when sourcing +/-145 mA outputs. Solder the exposed pad to a grounded thermal land with an array of thermal vias (typically 4-6) to an internal ground plane per TI PowerPAD application guidance. Estimated: at 12 V total supply and a 6 V pk output into a 100 ohm effective load, device dissipation can approach several hundred milliwatts continuously - verify junction temperature against the datasheet thermal resistance with your PCB copper area.

As a current feedback amplifier, the THS3061DGN bandwidth and stability are set by the feedback resistor Rf, not the gain resistors. Use the datasheet's recommended Rf table for the intended gain; reducing Rf below the recommended minimum produces peaking and possible oscillation, and a capacitor directly across Rf will destabilize the CFA loop. Keep the inverting-input node trace short and avoid stray capacitance at pin 1. Decouple V+ and V- with 0.1 uF ceramics placed within a few millimeters of pins 7 and 3, plus bulk tantalum/ceramic storage per supply rail.

Use a solid ground plane under the amplifier with the PowerPAD land connected directly to it. Keep the feedback path compact and symmetrical; for gains other than +2, adjust Rf per datasheet tables rather than copying values from VFA designs. When AC coupling, place the output biasing network after the series termination resistor so the amplifier sees a DC-closed loop. For DC-coupled designs, account for CFA input bias current on the inverting node by matching the DC resistance seen at the inputs where offset matters.

Do not substitute the SOIC (D) package part into a DGN footprint or vice versa - the footprints differ and THS3062DGN (dual) has an entirely different pinout despite the same package outline. Also confirm supply voltage ratings from the TI datasheet before applying rails; the THS3061 family is high-voltage but has absolute maximum limits that must be observed with margin for transients.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

Compliance status not stated in the provided verified data. The DGNRG4 suffix implies TI green/RoHS requalification, but confirm on the TI product page for the specific orderable part.

Data verified on: 2026-09-13 β€” data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Texas Instruments THS3061DGN THS3061DGNR THS3061DGNRG4 THS3062DGN THS3061D THS4062ID current feedback amplifier CFA operational amplifier voltage feedback amplifier amplifier IC HVSSOP MSOP-PowerPAD BICOM-1 process slew rate unity gain bandwidth -81 dBc distortion ADC driver RoHS surface mount high-speed data acquisition RF signal chain video line driver PowerPAD
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