TIOL221RGER - Dual IO-Link PHY with LDO & SPI | TI
MPN: TIOL221RGER ✓ Active| Qty | Unit Price | Extended |
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Drop-in alternatives for TIOL221RGER — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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TIOL221RGERT
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
TIOL221RGER Maximum Ratings & Electrical Characteristics
| Function | Dual Channel IO-Link Device PHY with Integrated LDO and SPI |
| Channels | 2 CQ channels + 1 auxiliary DI |
| Interface | SPI + IO-Link 3-wire (L+, L-, CQ) |
| Wake-up Pulse Current | >= 500 mA (sink or source) |
| Wake-up Duration | Typically 80 us |
| Wake-up Reporting | WU pin asserted low for tWUL |
| Protection Features | Undervoltage, overcurrent, overtemperature, reverse polarity (active) |
| Integrated LDO | Yes |
| Output Drivers | Dual low-power with active reverse polarity protection |
| IO-Link Mode | Device PHY; also configurable for IO-Link master wake-up generation |
| Package | 24-VQFN (4x4 mm), VQFN-24 (RGE) |
| Mounting Type | Surface Mount |
| Fault Reporting | Yes (UV, OC, OT) |
TIOL221RGER 24-vqfn (4x4 mm), vqfn-24 (rge) Pin Configuration Guide
Complete pinout information for TIOL221RGER (24-vqfn (4x4 mm), vqfn-24 (rge) package) with 24 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for TIOL221RGER.
Refer to the datasheet for full pin configuration.
Estimated pin count: 24 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
TIOL221RGER is suitable for 6 applications: IO-Link Sensor Hubs, Industrial Proximity Sensor Nodes, IO-Link Master Ports, Actuator Nodes and Valve Control, Factory Automation PLC I/O Modules, Prototyping and IO-Link Evaluation.
IO-Link Sensor Hubs
The TIOL221's dual CQ channels let one IC connect two IO-Link sensor ports, making it ideal for sensor hub nodes that aggregate multiple binary or analog sensors. Its integrated LDO and SPI reduce BOM count, while >= 500 mA wake-up pulse capability and WU pin reporting ensure full IO-Link wake-up compliance. Reverse polarity and overcurrent protection tolerate industrial field miswiring, and the auxiliary DI channel adds a bonus digital input without extra transceivers.
Recommended
Industrial Proximity Sensor Nodes
For IO-Link proximity and photoelectric sensors, the TIOL221 acts as the complete physical layer over the three-wire interface. The 80 us, >= 500 mA wake-up pulse handling meets IO-Link specification timing, and fault reporting for undervoltage, overcurrent, and overtemperature enables smart diagnostics demanded by IO-Link Class A ports. The 4x4 mm VQFN-24 fits the compact housings typical of modern industrial sensors.
Recommended
IO-Link Master Ports
The TIOL221 can be configured to generate wake-up pulses, per TI's product page, which is exactly what an IO-Link master port needs to activate sleeping device nodes. Dual channels allow one IC to serve two master ports or one port plus an auxiliary DI. Integrated drivers with active reverse polarity protection improve master port robustness against wiring faults, and SPI enables master-side configuration and diagnostics.
Recommended
Actuator Nodes and Valve Control
In IO-Link actuator nodes (solenoid valves, indicator drives), the TIOL221's dual CQ low-power drivers with active reverse polarity protection switch loads under host SPI control. Overcurrent and overtemperature protection guard against stalled loads and shorted wiring, while the auxiliary DI channel can read local feedback such as limit switches. The integrated LDO supplies local logic, simplifying compact actuator PCB designs.
Recommended
Factory Automation PLC I/O Modules
PLC remote I/O modules benefit from the TIOL221's channel density: two CQ ports plus a DI channel in a single 4x4 mm VQFN-24 reduces board area versus discrete transceivers. SPI-based configuration lets firmware adapt port behavior at runtime, and fault reporting supports predictive-maintenance diagnostics over the IO-Link backbone. Wake-up detection with WU pin signaling simplifies power-saving node designs.
Recommended
Prototyping and IO-Link Evaluation
The TI TIOL221EVM evaluation module lets engineers exercise device and master wake-up configurations, SPI register settings, and protection behaviors before committing to a PCB. Since the EVM ships from DigiKey as of 2026-08-30, teams can validate wake-up timing (80 us, >= 500 mA) and tWUL signaling against a master in days rather than weeks, de-risking the transition to production firmware.
Recommended
Recommended Products Summary
Engineering reference data for TIOL221RGER — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | TIOL1115DGQR | TIOL1113DMRR | L6360 |
|---|---|---|---|---|
| Package | 24-VQFN (4x4 mm, RGE) | VSSOP-10 | SOIC-8 | QFN-32 |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | STMicroelectronics |
| CQ Channels | 2 | 1 | 1 | 1 (plus DI/DO) |
| SPI Interface | Yes | No (pin-configurable) | No (pin-configurable) | Yes |
| Integrated LDO | Yes | Yes (LDO integrated) | Yes (LDO integrated) | Integrated DC-DC (buck) |
| Auxiliary DI Channel | Yes | [DATA_NEEDED] | [DATA_NEEDED] | Yes |
| Wake-up Pulse Capability | Generate and detect, >= 500 mA / 80 us | IO-Link device wake-up detect | IO-Link device wake-up detect | IO-Link wake-up detect |
| Protection | UV, OC, OT, reverse polarity (active) | UV, OC, OT, reverse polarity | UV, OC, OT, reverse polarity | UV, OC, OT, thermal |
Key Differentiators
- Dual CQ channels in one 4x4 mm package (vs TIOL1115DGQR)
- SPI-configurable operation (vs TIOL1113DMRR)
- Auxiliary DI channel (vs L6360)
Design Notes
The TIOL221 integrates an LDO, but the CQ drivers must sink or source >= 500 mA during each ~80 us wake-up pulse. Size the VQFN-24 exposed pad and PCB copper for these transient currents, and verify the upstream supply does not droop below undervoltage thresholds during wake-up, which could trigger false fault reporting.
Place the L+ and CQ line protection and bulk capacitance close to the IC and use short, wide traces for the CQ channels. Connect the thermal pad to a solid ground plane with multiple vias to dissipate wake-up pulse energy and improve overtemperature protection accuracy.
Wake-up timing is IO-Link-specified (typically 80 us at >= 500 mA) and the WU pin asserts low only for tWUL - ensure the MCU polls or uses an interrupt on WU rather than level-holding assumptions. When configuring via SPI, confirm register defaults match your CQ mode before enabling drivers to avoid unintended wake-up pulse generation.
Compliance Information
Compliance status not stated in verified web data; consult TI product page and datasheet for RoHS/REACH details.
