XC7VX485T-1FFG1157C - Virtex-7 XT FPGA 485K Logic Cells | AMD
MPN: XC7VX485T-1FFG1157C β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4895 | $4,895.00 |
| 10 | $4520 | $45,200.00 |
| 100 | $4150 | $415,000.00 |
| 500 | $3890 | $1,945,000.00 |
| 1,000 | $3650 | $3,650,000.00 |
Drop-in alternatives for XC7VX485T-1FFG1157C β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XC7VX485T-1FFG1157I
β Drop-Inπ Reference alternative (not in catalog)
XC7V585T-1FFG1157C
β Drop-Inπ Reference alternative (not in catalog)
XC7VX485T-2FFG1157C
β Drop-Inπ Reference alternative (not in catalog)
XC7VX485T-1FFG1157I
β Drop-Inπ Reference alternative (not in catalog)
XC7VX485T-1FFG1157C
β Drop-Inβ In Stock
$3650 / Unit
View Datasheet βXC7VX485T-1FFG1157I
β Drop-Inπ Reference alternative (not in catalog)
XC7VX485T-1FFG1157C Maximum Ratings & Electrical Characteristics
| Family | Virtex-7 XT |
| Logic Cells | 485760 |
| Block RAM Bits | 37969920 |
| Number of I/Os | 600 |
| Number of Terminals | 1157 |
| Package Code | BGA (FCBGA) |
| Package Shape | SQUARE |
| Supply Voltage | 0.97 V to 1.03 V |
| Technology | 28nm |
| Operating Temperature Min | 0C |
| Operating Temperature Max | 85C |
| JEDEC Package Code | S-PBGA-B1157 |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Speed Grade | -1 |
XC7VX485T-1FFG1157C Pin Configuration
| Pin A1 | IO_L1P_T0 β User I/O bank 0 |
| Pin A2 | IO_L1N_T0 β User I/O bank 0 |
| Pin B1 | VCCINT β Core supply 1.0V |
| Pin B2 | GND β Ground |
| Pin C1 | IO_L2P_T0 β User I/O bank 0 |
| Pin C2 | IO_L2N_T0 β User I/O bank 0 |
| Pin D1 | VCCAUX β Auxiliary supply 1.8V |
| Pin D2 | GND β Ground |
| Pin E1 | IO_L3P_T0 β User I/O bank 0 |
| Pin E2 | IO_L3N_T0 β User I/O bank 0 |
| Pin F1 | VCCINT β Core supply 1.0V |
| Pin F2 | GND β Ground |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XC7VX485T-1FFG1157C is suitable for 6 applications: Wired Communications Infrastructure, Data Center Acceleration, Aerospace and Defense, High-Performance Computing, Medical Imaging, Test and Measurement.
Wired Communications Infrastructure
The XC7VX485T-1FFG1157C is ideal for wired communications infrastructure such as core routers and switches. Its 600 I/Os and high-speed serial transceivers enable 100G+ line card designs. The 485,760 logic cells provide ample resources for packet processing, traffic management, and protocol bridging. The 37.9 Mb of block RAM supports large lookup tables and buffering. The 28nm process balances performance and power, critical for dense line cards. Designers can implement flexible MAC/PCS layers and custom packet parsers, offloading the host CPU. The commercial temperature grade suits controlled telecom environments.
Recommended
Data Center Acceleration
In data center acceleration, the XC7VX485T-1FFG1157C provides high logic density and DSP capabilities for workloads like network function virtualization (NFV) and storage acceleration. The 485,760 logic cells can implement complex data path functions, while the 600 I/Os connect to high-bandwidth memory and network interfaces. The device supports partial reconfiguration, enabling dynamic workload updates. Its 28nm technology offers a balance of performance and power efficiency for rack-scale deployments. The FCBGA package ensures reliable operation in high-density server environments. Engineers can use it for smart NICs, compression engines, and encryption offload.
Recommended
Aerospace and Defense
The XC7VX485T-1FFG1157C is suitable for aerospace and defense applications like radar processing and secure communications. Its large logic capacity supports complex signal processing algorithms, and the 600 I/Os interface with high-speed ADCs/DACs. The device's 37.9 Mb block RAM is ideal for data buffering in real-time systems. While the commercial grade is limited to 0C to 85C, the industrial variant (XC7VX485T-1FFG1157I) is available for harsher environments. The 28nm process provides radiation-tolerant options for space applications. Designers can implement beamforming, pulse compression, and encryption in a single device.
Recommended
High-Performance Computing
For high-performance computing (HPC), the XC7VX485T-1FFG1157C offers 485,760 logic cells and 600 I/Os to accelerate compute-intensive workloads. It can implement custom arithmetic units, FFT engines, and data compression. The 37.9 Mb of block RAM provides on-chip storage for intermediate results, reducing external memory traffic. The device supports multiple high-speed serial links for inter-FPGA communication in multi-FPGA systems. Its 28nm technology delivers high performance with manageable power, suitable for HPC clusters. Engineers can use it for scientific simulation acceleration, financial modeling, and genome sequencing.
Recommended
Medical Imaging
The XC7VX485T-1FFG1157C is well-suited for medical imaging systems like CT scanners and ultrasound machines. Its 485,760 logic cells can handle real-time image processing, filtering, and reconstruction. The 600 I/Os interface with high-speed image sensors and display controllers. The 37.9 Mb block RAM supports frame buffering and pipeline stages. The commercial temperature grade is adequate for controlled clinical environments. The 28nm process offers low power for portable devices. Designers can implement custom image enhancement algorithms and reduce system latency, improving diagnostic accuracy.
Recommended
Test and Measurement
In test and measurement equipment, the XC7VX485T-1FFG1157C provides the logic capacity and I/O count for high-speed data acquisition and signal generation. Its 600 I/Os connect to high-speed ADCs and DACs, while the 485,760 logic cells implement triggering, averaging, and analysis. The 37.9 Mb block RAM supports deep acquisition buffers. The device's high-speed transceivers enable fast data transfer to host systems. The commercial temperature grade is suitable for benchtop instruments. Engineers can use it for oscilloscopes, logic analyzers, and spectrum analyzers, offering flexibility and reconfigurability.
Recommended
Engineering reference data for XC7VX485T-1FFG1157C β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC7VX485T-1FFG1157I | XC7V585T-1FFG1157C | XC7VX485T-2FFG1157C |
|---|---|---|---|---|
| Package | 1156-BBGA, FCBGA | 1156-BBGA, FCBGA | 1156-BBGA, FCBGA | 1156-BBGA, FCBGA |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 485760 | 485760 | 582660 | 485760 |
| Block RAM Bits | 37969920 | 37969920 | 52992000 | 37969920 |
| Number of I/Os | 600 | 600 | 600 | 600 |
| Supply Voltage | 0.97V to 1.03V | 0.97V to 1.03V | 0.97V to 1.03V | 0.97V to 1.03V |
| Temperature Grade | Commercial (0C to 85C) | Industrial (-40C to 100C) | Commercial (0C to 85C) | Commercial (0C to 85C) |
| Speed Grade | -1 | -1 | -1 | -2 |
Key Differentiators
- Higher logic capacity than XC7VX485T-1FFG1157I (vs XC7VX485T-1FFG1157I)
- Commercial temperature grade for cost savings (vs XC7VX485T-1FFG1157I)
- Speed grade -1 balances performance and power (vs XC7VX485T-2FFG1157C)
Design Notes
The XC7VX485T-1FFG1157C requires a 1.0V core supply (VCCINT) with tight regulation (0.97V to 1.03V). Use a dedicated power module or LDO with adequate current capability, as the FPGA can draw several amps. Place decoupling capacitors (100nF and 10uF) close to each VCCINT pin. Follow AMD's power distribution network (PDN) guidelines in UG583 for optimal performance.
The Virtex-7 XT FPGA can dissipate significant power, especially with high logic utilization and transceiver activity. The 1156-ball FCBGA package requires a heatsink or active cooling for sustained operation. Calculate the junction temperature using the package thermal resistance (theta_JA) and ensure it stays below 85C for commercial grade. Use thermal vias under the package to improve heat transfer to the PCB.
For the 1156-ball FCBGA package, use a high-layer-count PCB (12+ layers) with controlled impedance for high-speed signals. Follow AMD's PCB design guidelines for transceiver routing, including differential pair spacing and ground vias. Ensure the BGA footprint matches the datasheet land pattern exactly. Use Xilinx's IBIS models for signal integrity simulation.
Compliance Information
RoHS compliant per distributor listings. AEC-Q100 not applicable for FPGA. Other compliance data not specified in provided sources.
