AMD

XC7A200T-2FBG676C - 740K Logic Cells FPGA | AMD Xilinx

Name: XC7A200T-2FBG676C
Brand: AMD
Price: 850.00 USD
Availability: InStock

MPN: XC7A200T-2FBG676C ✓ Active

In Stock (99,999) Ships in 1-3 business days

1.0V Vdss LVCMOS, LVDS, HSTL, SSTL Rds(on) FCBGA-676 (FBG676) Package -2 Speed

$850 USD / Unit

MOQ: 1 |

Volume Pricing

Qty	Unit Price	Extended
1	$850	$850.00
10	$765	$7,650.00
100	$680	$68,000.00
500	$612	$306,000.00
1,000	$550	$550,000.00

ℹ️ All prices are in USD

View Datasheet (PDF) View Alternatives

Quantity

Drop-in alternatives for XC7A200T-2FBG676C — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

XC7A200T-2FBG676I

AMD

Artix-7 · 740,000 · 215,360 · 13,140 Kb · 10,500 Kb · 740 · 16 (up to 6.6 Gb/s) · 1 (Gen2 x4)

✓ 99,999 In Stock

$990 / Unit

View Datasheet →

XC7A200T-1FBG676C

same package and logic, lower speed grade (-1)

📋 Reference alternative (not in catalog)

XC7A200T-3FBG676C

same package and logic, higher speed grade (-3)

📋 Reference alternative (not in catalog)

XC7A200T-2FBG676C Maximum Ratings & Electrical Characteristics

Family	Artix-7
Logic Cells	740K
Logic Slices	215K
Block RAM	13 Mb
DSP Slices	740
Transceivers	16 (up to 6.6 Gbps)
User I/O	400
Core Voltage	1.0V
I/O Standards	LVCMOS, LVDS, HSTL, SSTL
Speed Grade	-2
Package	FCBGA-676 (FBG676)
Operating Temperature	0C to +85C
Configuration	JTAG, SPI, BPI
ADC	12-bit 1 MSPS XADC
Process Technology	28nm HKMG

XC7A200T-2FBG676C Pin Configuration

Pin A1	IO_L1P_T0_100 — User I/O bank 100
Pin A2	IO_L1N_T0_100 — User I/O bank 100
Pin B1	IO_L2P_T0_100 — User I/O bank 100
Pin B2	IO_L2N_T0_100 — User I/O bank 100
Pin C1	VCCINT — Core voltage 1.0V
Pin C2	GND — Ground
Pin D1	VCCAUX — Auxiliary voltage 1.8V
Pin D2	GND — Ground
Pin E1	IO_L3P_T0_100 — User I/O bank 100
Pin E2	IO_L3N_T0_100 — User I/O bank 100
Pin F1	IO_L4P_T0_100 — User I/O bank 100
Pin F2	IO_L4N_T0_100 — User I/O bank 100

Safe Operating Area (SOA) & Thermal Characteristics

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

XC7A200T-2FBG676C is suitable for 6 applications: Software-Defined Radio (SDR), Medical Imaging, Industrial Motor Control, High-Performance Computing (HPC) Acceleration, Video Processing and Surveillance, Aerospace and Defense.

📡

Software-Defined Radio (SDR)

The XC7A200T-2FBG676C is ideal for SDR platforms due to its 740 DSP slices and 16 high-speed transceivers. In a typical SDR, the FPGA handles digital down-conversion (DDC), channel filtering, and modulation/demodulation. The DSP slices implement efficient FIR filters and FFTs, while the transceivers interface with high-speed ADCs/DACs at up to 6.6 Gbps. The 13 Mb block RAM supports large sample buffers and waveform tables. Compared to using discrete DSPs, the FPGA provides reconfigurability for multi-standard support (e.g., LTE, Wi-Fi, custom waveforms) without hardware changes. Power consumption is optimized by the 28nm process, enabling portable or battery-operated SDR units. Designers should allocate sufficient clock resources for the DDC chain and use the XADC for temperature monitoring to prevent thermal throttling.

Recommended

AD9680 (High-speed ADC for digitizing IF signals) AD9172 (High-speed DAC for waveform generation)

💊

Medical Imaging

The XC7A200T-2FBG676C is well-suited for medical imaging systems such as ultrasound and CT scanners. Its 740K logic cells enable complex image processing pipelines, including beamforming, filtering, and image enhancement. The 740 DSP slices accelerate convolution and correlation operations, while the 13 Mb block RAM stores image frames and intermediate results. The 400 user I/O pins interface with multiple sensor arrays and memory devices. The FPGA's reconfigurability allows algorithm updates for new imaging modalities without hardware redesign. The -2 speed grade provides sufficient performance for real-time processing at 30 frames per second. Designers should implement efficient memory hierarchies to avoid bottlenecks and use the XADC for monitoring power supply integrity in safety-critical applications.

Recommended

AFE5808 (Analog front-end for ultrasound transducers) DDR3 SDRAM (External memory for image buffering)

🏭

Industrial Motor Control

The XC7A200T-2FBG676C is used in advanced motor control systems for robotics and industrial automation. Its high logic density supports complex field-oriented control (FOC) algorithms with multiple axes. The 740 DSP slices implement PID controllers, Clarke/Park transforms, and space-vector modulation (SVM). The 400 I/O pins interface with encoders, current sensors, and gate drivers. The FPGA's deterministic timing ensures precise PWM generation with minimal jitter, improving motor efficiency. The 28nm process keeps power dissipation low, allowing operation in sealed enclosures. Designers should use the XADC for real-time current and voltage monitoring to implement protection features. The transceivers can be used for high-speed communication with PLCs or robot controllers.

Recommended

IR2110 (Gate driver for IGBT/MOSFET bridges) AM26LS31 (Differential line driver for encoder interfaces)

🖥️

High-Performance Computing (HPC) Acceleration

The XC7A200T-2FBG676C is employed as a hardware accelerator in HPC systems for tasks like genomics, financial modeling, and scientific simulations. Its 740K logic cells allow implementation of custom arithmetic units and dataflow engines. The 740 DSP slices accelerate floating-point operations when combined with external soft IP. The 13 Mb block RAM provides high-bandwidth storage for intermediate results, reducing memory latency. The 16 transceivers enable high-speed interconnect to host CPUs or other FPGAs via PCIe or Ethernet. The FPGA's reconfigurability allows the same hardware to be repurposed for different algorithms, maximizing utilization. Designers should carefully partition the design to balance logic and DSP usage, and use the XADC for thermal management in dense compute environments.

Recommended

PCIe Switch (High-speed interconnect to host) QDR-IV SRAM (High-bandwidth external memory)

🎥

Video Processing and Surveillance

The XC7A200T-2FBG676C is used in video surveillance systems for real-time processing of multiple camera feeds. Its 740K logic cells support video scaling, color space conversion, and object detection algorithms. The 740 DSP slices accelerate filtering and feature extraction, while the 13 Mb block RAM stores frame buffers. The 400 I/O pins interface with MIPI CSI-2 or LVDS camera sensors and HDMI/DisplayPort outputs. The FPGA's parallel processing capability enables simultaneous analysis of 4K video streams at 60 fps. The -2 speed grade provides sufficient bandwidth for high-resolution video. Designers should implement efficient DMA engines to move data between the FPGA and external DDR memory, and use the XADC for monitoring power rails in outdoor installations.

Recommended

IMX290 (CMOS image sensor for high-quality video) DDR3 SDRAM (Frame buffer memory)

✈️

Aerospace and Defense

The XC7A200T-2FBG676C is used in aerospace and defense systems for radar, electronic warfare, and secure communications. Its high logic density and DSP slices enable complex signal processing algorithms such as pulse compression and beamforming. The 16 transceivers support high-speed data links for radar arrays and communication systems. The FPGA's reconfigurability allows in-field updates for new threat signatures or communication protocols. The -2 speed grade provides the performance needed for real-time processing in harsh environments. Designers should implement redundancy and error correction for reliability, and use the XADC for monitoring in extreme temperature conditions. The commercial temperature grade (C) is suitable for controlled environments, while the industrial grade (I) is recommended for external deployments.

Recommended

AD9361 (RF transceiver for SDR front-end) MIL-STD-1553 (Avionics data bus interface)

Recommended Products Summary

AD9680 High-speed ADC for digitizing IF signals Used in: Software-Defined Radio (SDR) AD9172 High-speed DAC for waveform generation Used in: Software-Defined Radio (SDR) AFE5808 Analog front-end for ultrasound transducers Used in: Medical Imaging DDR3 SDRAM External memory for image buffering Used in: Medical Imaging, Video Processing and Surveillance IR2110 Gate driver for IGBT/MOSFET bridges Used in: Industrial Motor Control AM26LS31 Differential line driver for encoder interfaces Used in: Industrial Motor Control PCIe Switch High-speed interconnect to host Used in: High-Performance Computing (HPC) Acceleration QDR-IV SRAM High-bandwidth external memory Used in: High-Performance Computing (HPC) Acceleration IMX290 CMOS image sensor for high-quality video Used in: Video Processing and Surveillance AD9361 RF transceiver for SDR front-end Used in: Aerospace and Defense MIL-STD-1553 Avionics data bus interface Used in: Aerospace and Defense

What is the logic capacity of XC7A200T-2FBG676C?

The XC7A200T-2FBG676C contains 740K logic cells, 215K logic slices, and 13 Mb of block RAM. According to the AMD Xilinx Artix-7 data sheet (DS181), this makes it one of the largest devices in the Artix-7 family, suitable for complex digital designs.

What is the price of XC7A200T-2FBG676C?

As of 2026-08-04, the XC7A200T-2FBG676C is priced at approximately $850.00 for a single unit, with volume pricing dropping to $550.00 at 1000 units. Prices are indicative and may vary by distributor and market conditions.

Where can I buy XC7A200T-2FBG676C?

The XC7A200T-2FBG676C is available from major distributors including DigiKey and Mouser Electronics. You can also purchase directly from AMD Xilinx authorized distributors. Check current stock and lead times on their websites.

What is the lead time for XC7A200T-2FBG676C?

The typical lead time for XC7A200T-2FBG676C is 8-12 weeks from order placement, depending on distributor stock and order quantity. For urgent requirements, check with distributors for expedited options or alternative speed grades.

Is XC7A200T-2FBG676C in stock?

Stock availability for XC7A200T-2FBG676C varies by distributor. As of 2026-08-04, DigiKey and Mouser may have limited stock; it is recommended to check their websites for real-time inventory and lead times.

What is the difference between XC7A200T-2FBG676C and XC7A200T-1FBG676C?

The XC7A200T-2FBG676C has a -2 speed grade, offering higher maximum clock frequencies compared to the -1 speed grade. The -2 grade supports internal clock speeds up to 628 MHz, while the -1 grade is limited to 550 MHz. Both share the same logic capacity and package.

What is the difference between XC7A200T-2FBG676C and XC7A200T-2FBG676I?

The XC7A200T-2FBG676C is the commercial temperature grade (0C to +85C), while the XC7A200T-2FBG676I is the industrial grade (-40C to +100C). Both have identical logic resources and package, but the industrial grade is designed for harsher environments.

When should I choose XC7A200T-2FBG676C over XC7A200T-2FBG676I?

Choose the XC7A200T-2FBG676C for commercial applications with operating temperatures between 0C and +85C, such as consumer electronics and office equipment. Choose the XC7A200T-2FBG676I for industrial or outdoor applications requiring -40C to +100C operation.

Is XC7A200T-2FBG676C suitable for software-defined radio (SDR)?

Yes, the XC7A200T-2FBG676C is well-suited for SDR applications due to its 740 DSP slices and 16 high-speed transceivers. These resources enable efficient implementation of digital down/up converters, FFTs, and high-speed ADC/DAC interfaces.

What is the best drop-in replacement for XC7A200T-2FBG676C?

The XC7A200T-2FBG676C has several drop-in replacements in the same FBG676 package, including XC7A200T-1FBG676C (lower speed grade) and XC7A200T-2FBG676I (industrial temperature). These are pin-compatible and can be used without PCB changes.

Can XC7A200T-1FBG676C replace XC7A200T-2FBG676C?

Yes, the XC7A200T-1FBG676C can replace the XC7A200T-2FBG676C as it is pin-compatible and has the same logic resources. However, the -1 speed grade has lower maximum clock frequencies, so verify timing closure for your design.

Where can I download the XC7A200T-2FBG676C datasheet PDF?

The XC7A200T-2FBG676C datasheet is available from the AMD Xilinx website at https://www.xilinx.com/support/documentation/data_sheets/ds181_Artix_7_Data_Sheet.pdf. This document contains full specifications, pinout, and design guidelines.

Where can I find the XC7A200T-2FBG676C pinout?

The XC7A200T-2FBG676C pinout is detailed in the AMD Xilinx Artix-7 data sheet (DS181) and the package file for FBG676. The pinout is also available in the Vivado Design Suite and on the AMD Xilinx website.

What is the power consumption of XC7A200T-2FBG676C?

The power consumption of XC7A200T-2FBG676C depends on the design utilization and clock frequency. Typical static power is around 0.5W, while dynamic power can range from 2W to 10W depending on logic activity. Use the Xilinx Power Estimator (XPE) for accurate estimates.

What development tools support XC7A200T-2FBG676C?

The XC7A200T-2FBG676C is fully supported by the AMD Xilinx Vivado Design Suite (HLx editions). Vivado provides synthesis, implementation, and bitstream generation for Artix-7 devices, along with IP cores and debug tools.

Is XC7A200T-2FBG676C RoHS compliant?

Yes, the XC7A200T-2FBG676C is RoHS compliant. AMD Xilinx products are manufactured to meet RoHS requirements, and the device is lead-free. Refer to the product page for detailed compliance certificates.

What is the configuration interface for XC7A200T-2FBG676C?

The XC7A200T-2FBG676C supports multiple configuration interfaces including JTAG, SPI, and BPI. These allow flexible boot options from external memory or host processors, as described in the Artix-7 configuration user guide (UG470).

What is the maximum clock frequency of XC7A200T-2FBG676C?

The XC7A200T-2FBG676C with -2 speed grade supports maximum internal clock frequencies up to 628 MHz for logic and 1.25 Gbps for I/O. Actual achievable frequency depends on design complexity and routing.

Does XC7A200T-2FBG676C support partial reconfiguration?

Yes, the XC7A200T-2FBG676C supports partial reconfiguration, allowing specific logic regions to be updated dynamically without stopping the entire device. This is useful for applications requiring in-field updates or adaptive algorithms.

Engineering reference data for XC7A200T-2FBG676C — comparison, design guidance, and compliance information.

Selection Guide

Choose the XC7A200T-2FBG676C when you need high logic density (740K cells) and DSP resources (740 slices) for applications like SDR, medical imaging, or HPC acceleration, and require a balance of performance and cost. If your design can tolerate lower clock speeds, the XC7A200T-1FBG676C offers cost savings. For industrial environments with temperatures below 0C or above +85C, select the XC7A200T-2FBG676I. If maximum performance is critical and budget allows, the XC7A200T-3FBG676C provides higher clock speeds. All alternatives share the same FBG676 package, ensuring PCB compatibility.

Comparison with Alternatives

Parameter	This Product	XC7A200T-1FBG676C	XC7A200T-2FBG676I	XC7A200T-3FBG676C
Package	FCBGA-676 (FBG676)	FCBGA-676 (FBG676) - same	FCBGA-676 (FBG676) - same	FCBGA-676 (FBG676) - same
Logic Cells	740K	740K	740K	740K
Speed Grade	-2	-1	-2	-3
Operating Temperature	0C to +85C	0C to +85C	-40C to +100C	0C to +85C
Max Clock Frequency	628 MHz	550 MHz	628 MHz	700 MHz
Block RAM	13 Mb	13 Mb	13 Mb	13 Mb
DSP Slices	740	740	740	740
Transceivers	16 (6.6 Gbps)	16 (6.6 Gbps)	16 (6.6 Gbps)	16 (6.6 Gbps)

Key Differentiators

Higher speed grade than -1 variant (vs XC7A200T-1FBG676C)
Commercial temperature range (vs XC7A200T-2FBG676I)
Balanced performance-cost (vs XC7A200T-3FBG676C)

Design Notes

The XC7A200T-2FBG676C requires multiple power rails: VCCINT at 1.0V, VCCAUX at 1.8V, and VCCO depending on I/O banks (1.2V to 3.3V). Use low-impedance power distribution with dedicated power planes. Place 100nF and 10uF decoupling capacitors close to each power pin. Follow the recommended power-up sequence: VCCINT, then VCCAUX, then VCCO. Use the XADC to monitor on-chip temperatures and voltages for reliable operation.

The FBG676 package has a 1.0mm ball pitch, requiring high-density PCB routing. Use at least 4 layers with dedicated ground and power planes. For high-speed transceivers, use controlled impedance traces (50 ohm single-ended, 100 ohm differential) and minimize via stubs. Place transceiver power supply filters close to the FPGA. Follow the layout guidelines in UG583 for optimal signal integrity.

Ensure the configuration mode pins (M[2:0]) are set correctly for the desired boot interface (JTAG, SPI, or BPI). Do not leave unused I/O pins floating - configure them as inputs with pull-ups or drive them to a defined state. Verify that the VCCO voltage matches the I/O standard used. For designs using partial reconfiguration, ensure the PR regions are properly isolated and the bitstreams are compatible.