XC7A100T-2CSG324I - Artix-7 FPGA, 101K Logic Cells | AMD Xilinx
MPN: XC7A100T-2CSG324I β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $89.5 | $89.50 |
| 10 | $82 | $820.00 |
| 100 | $74.5 | $7,450.00 |
| 500 | $68 | $34,000.00 |
| 1,000 | $62 | $62,000.00 |
Drop-in alternatives for XC7A100T-2CSG324I β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XC7A100T-2CSG324C
β 99,999 In Stock
$59.5 / Unit
View Datasheet βXC7A100T-1CSG324I
β 99,999 In Stock
$59.9 / Unit
View Datasheet βXC7A100T-3CSG324I
π Reference alternative (not in catalog)
XC7A100T-2CSG324I Maximum Ratings & Electrical Characteristics
| Family | Artix-7 |
| Logic Cells | 101,440 |
| Block RAM | 4,860 Kb |
| DSP Slices | 240 |
| Flip-Flops | 285,120 |
| User I/O | 300 |
| Package | CSG324 (324-ball BGA) |
| Speed Grade | -2 |
| Temperature Range | -40Β°C to +100Β°C (industrial) |
| Configuration | JTAG, SelectMAP, Quad-SPI |
| Transceivers | 16 GTP (up to 6.6 Gbps) |
| PCIe | Gen2 x1 |
| Ethernet | 10/100/1000 MAC |
| XADC | 12-bit, 1 MSPS |
| Process Technology | 28 nm HKMG |
| RoHS | Compliant |
XC7A100T-2CSG324I Pin Configuration
| Pin A1 | IO_L1P_T0 β User I/O bank 0, differential pair P |
| Pin A2 | IO_L1N_T0 β User I/O bank 0, differential pair N |
| Pin B1 | IO_L2P_T0 β User I/O bank 0, differential pair P |
| Pin B2 | IO_L2N_T0 β User I/O bank 0, differential pair N |
| Pin C1 | VCCINT β Internal core supply voltage (1.0V) |
| Pin C2 | GND β Ground |
| Pin D1 | IO_L3P_T0 β User I/O bank 0, differential pair P |
| Pin D2 | IO_L3N_T0 β User I/O bank 0, differential pair N |
| Pin E1 | VCCAUX β Auxiliary supply voltage (1.8V) |
| Pin E2 | GND β Ground |
| Pin F1 | IO_L4P_T0 β User I/O bank 0, differential pair P |
| Pin F2 | IO_L4N_T0 β User I/O bank 0, differential pair N |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XC7A100T-2CSG324I is suitable for 6 applications: Software-Defined Radio (SDR), Medical Imaging, Industrial Motor Control, Video Processing and Machine Vision, Wired and Wireless Networking, Aerospace and Defense.
Software-Defined Radio (SDR)
The XC7A100T-2CSG324I is ideal for SDR platforms due to its 240 DSP slices for digital down/up conversion, 16 GTP transceivers for high-speed ADC/DAC interfaces, and 4,860 Kb of block RAM for buffering. In a typical SDR, the FPGA connects to RF front-ends via JESD204B or LVDS, performs channelization, filtering, and modulation/demodulation in real-time. The -2 speed grade ensures sufficient timing margin for wideband signals. Compared to using a DSP processor, the FPGA offers parallel processing and reconfigurability, enabling multi-standard support (e.g., LTE, Wi-Fi, GNSS) with the same hardware. Power consumption is optimized by clock gating and partial reconfiguration, making it suitable for portable and battery-operated SDRs.
Recommended
Medical Imaging
The XC7A100T-2CSG324I is well-suited for medical imaging systems such as ultrasound and CT scanners, where high-speed data acquisition and image processing are required. Its 101K logic cells and 240 DSP slices enable real-time beamforming, filtering, and image enhancement algorithms. The 16 GTP transceivers support high-speed data links to sensors and host processors. The industrial temperature range ensures reliable operation in clinical environments. The FPGA's reconfigurability allows firmware updates for new imaging modes without hardware changes. Power efficiency is critical in portable ultrasound devices, and the Artix-7's 28 nm process minimizes static power, extending battery life.
Recommended
Industrial Motor Control
The XC7A100T-2CSG324I is used in advanced motor control systems for robotics, CNC machines, and industrial automation. Its 240 DSP slices can implement complex field-oriented control (FOC) algorithms with high precision, while the 300 user I/O pins interface with encoders, current sensors, and gate drivers. The FPGA's deterministic timing ensures precise PWM generation and real-time fault handling. The -2 speed grade provides sufficient performance for high-frequency switching (up to 100 kHz). Compared to MCU-based solutions, the FPGA offers lower latency and higher reliability. The industrial temperature range (-40Β°C to +100Β°C) makes it suitable for factory floors and outdoor equipment.
Recommended
Video Processing and Machine Vision
The XC7A100T-2CSG324I is ideal for video processing and machine vision systems, offering 101K logic cells for image filtering, feature extraction, and frame buffering. Its 4,860 Kb of block RAM can store multiple video lines for convolution operations. The 16 GTP transceivers support high-speed camera interfaces like CoaXPress and Camera Link. The FPGA's parallel architecture enables real-time processing of 1080p60 video streams with low latency. The -2 speed grade ensures sufficient bandwidth for multi-channel processing. In industrial inspection, the FPGA can implement custom algorithms for defect detection, achieving higher throughput than CPU-based systems. The industrial temperature range allows deployment in harsh manufacturing environments.
Recommended
Wired and Wireless Networking
The XC7A100T-2CSG324I is used in networking equipment such as switches, routers, and network interface cards. Its hardened 10/100/1000 Ethernet MAC and PCIe Gen2 x1 block reduce logic utilization and power. The 16 GTP transceivers enable 10GbE, CPRI, and other high-speed serial protocols. The FPGA can implement packet processing, traffic shaping, and protocol conversion with deterministic latency. The 300 user I/O pins interface with PHYs, memory, and control planes. The -2 speed grade supports line-rate processing at 1GbE and above. In software-defined networking (SDN), the FPGA allows dynamic reconfiguration of data paths, providing flexibility that fixed-function ASICs lack.
Recommended
Aerospace and Defense
The XC7A100T-2CSG324I is suitable for aerospace and defense applications such as radar, electronic warfare, and secure communications. Its industrial temperature range and 28 nm process ensure reliable operation in extreme environments. The 240 DSP slices enable complex signal processing for radar pulse compression and beamforming. The 16 GTP transceivers support high-speed data links to sensors and processors. The FPGA's reconfigurability allows in-field updates for new waveforms and security protocols. The -2 speed grade provides the performance needed for real-time processing. Radiation-tolerant variants are available for space applications, but the standard device is suitable for ground-based and airborne systems.
Recommended
Recommended Products Summary
Engineering reference data for XC7A100T-2CSG324I β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC7A100T-2CSG324C | XC7A100T-1CSG324I | XC7A100T-3CSG324I |
|---|---|---|---|---|
| Package | CSG324 | CSG324 - same | CSG324 - same | CSG324 - same |
| Logic Cells | 101,440 | 101,440 | 101,440 | 101,440 |
| Block RAM | 4,860 Kb | 4,860 Kb | 4,860 Kb | 4,860 Kb |
| DSP Slices | 240 | 240 | 240 | 240 |
| User I/O | 300 | 300 | 300 | 300 |
| Speed Grade | -2 | -2 | -1 | -3 |
| Temperature Range | -40Β°C to +100Β°C (I) | 0Β°C to +85Β°C (C) | -40Β°C to +100Β°C (I) | -40Β°C to +100Β°C (I) |
| Max Internal Clock | 628 MHz | 628 MHz | 500 MHz | 700 MHz |
Key Differentiators
- Industrial temperature range (vs XC7A100T-2CSG324C)
- Balanced -2 speed grade (vs XC7A100T-1CSG324I)
- Cost-effective performance (vs XC7A100T-3CSG324I)
Design Notes
The XC7A100T-2CSG324I requires multiple supply rails: VCCINT (1.0V), VCCAUX (1.8V), and VCCO (1.2V to 3.3V depending on I/O bank). Use a dedicated power management IC like the TI TPS54620 for VCCINT and a low-noise LDO for VCCAUX. Ensure proper decoupling with 100nF and 10uF capacitors per rail, placed close to the FPGA pins. The total power consumption can range from 1.5W to 3W, so design the power supply with adequate headroom.
The CSG324 package has a thermal resistance (theta_JA) of approximately 15Β°C/W without airflow. For industrial temperature operation up to 100Β°C junction, ensure adequate cooling. Use a heatsink or forced airflow if the power dissipation exceeds 2W. The XADC can monitor die temperature; implement a thermal management algorithm to throttle or shut down if temperature exceeds limits.
For high-speed signals (GTP transceivers, DDR3), follow Xilinx PCB design guidelines: controlled impedance traces (50 ohm single-ended, 100 ohm differential), minimal vias, and proper ground planes. Place decoupling capacitors within 2mm of the FPGA pins. For the 324-ball BGA, use a 4-layer or more PCB with dedicated power and ground planes. Refer to the Artix-7 PCB Design Guide (UG483) for detailed recommendations.
Compliance Information
RoHS compliant per AMD Xilinx product page. Not AEC-Q100 qualified (FPGA not typically automotive certified).
