XCZU4EV-2SFVC784I - Zynq UltraScale+ MPSoC EV | AMD
MPN: XCZU4EV-2SFVC784I β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $350 | $350.00 |
| 10 | $320 | $3,200.00 |
| 100 | $290 | $29,000.00 |
| 500 | $260 | $130,000.00 |
| 1,000 | $240 | $240,000.00 |
Drop-in alternatives for XCZU4EV-2SFVC784I β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XCZU4EV-1SFVC784I
β Drop-Inπ Reference alternative (not in catalog)
XCZU4EV-2SFVC784E
β Drop-Inπ Reference alternative (not in catalog)
XCZU4EG-1SFVC784I
β Drop-Inπ Reference alternative (not in catalog)
XCZU4EG-2SFVC784I
β Drop-Inπ Reference alternative (not in catalog)
XCZU5EV-2SFVC784I
β Drop-Inβ In Stock
$2300 / Unit
View Datasheet βXCZU4EV-2SFVC784I Maximum Ratings & Electrical Characteristics
| Core Processor | Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight |
| Primary Clock Speed | 1.3 GHz (Cortex-A53) |
| Secondary Clock Speed | 600 MHz (Mali-400 MP2) |
| Real-Time Clock Speed | 533 MHz (Cortex-R5) |
| Logic Cells | 192K+ |
| Package | 784-FCBGA (23x23 mm) |
| Number of I/O | 252 |
| Mounting Type | Surface Mount |
| Operating Temperature | [DATA_NEEDED: Operating temperature range] |
| Supply Voltage | 0.85V |
| Technology | 20nm |
| RoHS Status | Compliant |
| Series | Zynq UltraScale+ MPSoC EV |
| Graphics Processor | ARM Mali-400 MP2 |
| FPGA Family | Zynq UltraScale+ |
XCZU4EV-2SFVC784I Pin Configuration
| Pin A1 | GND β Ground |
| Pin A2 | VCCO_0 β I/O bank 0 supply voltage |
| Pin B1 | IO_L1P_T0_0 β User I/O, bank 0 |
| Pin B2 | IO_L1N_T0_0 β User I/O, bank 0 |
| Pin C1 | IO_L2P_T0_0 β User I/O, bank 0 |
| Pin C2 | IO_L2N_T0_0 β User I/O, bank 0 |
| Pin D1 | VCCINT β Internal core supply voltage |
| Pin D2 | VCCAUX β Auxiliary supply voltage |
| Pin E1 | IO_L3P_T0_0 β User I/O, bank 0 |
| Pin E2 | IO_L3N_T0_0 β User I/O, bank 0 |
| Pin F1 | IO_L4P_T0_0 β User I/O, bank 0 |
| Pin F2 | IO_L4N_T0_0 β User I/O, bank 0 |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XCZU4EV-2SFVC784I is suitable for 6 applications: Software-Defined Radio, Video Processing, Industrial Automation, Aerospace and Defense, Medical Imaging, Data Center Acceleration.
Software-Defined Radio
The XCZU4EV-2SFVC784I is ideal for software-defined radio (SDR) systems due to its combination of high-performance ARM cores and reconfigurable FPGA fabric. The quad-core Cortex-A53 can handle complex signal processing algorithms, while the FPGA logic can implement custom digital down/up converters and filters. The Mali-400 GPU can assist with spectrum visualization. The device's 192K+ logic cells provide ample resources for multiple channels, and the 1.3GHz processor speed ensures real-time processing. The 784-FCBGA package supports high-density PCB designs, and the 252 I/O pins allow for flexible connectivity to RF front-ends and data converters.
Recommended
Video Processing
The XCZU4EV-2SFVC784I excels in video processing applications, leveraging its Mali-400 MP2 GPU for graphics acceleration and the FPGA fabric for real-time video pipelines. The quad-core Cortex-A53 can run video codecs and analytics, while the programmable logic can implement custom video interfaces like MIPI or DisplayPort. The 600MHz GPU clock and 1.3GHz CPU clock provide sufficient processing power for 4K video streams. The device's 192K+ logic cells can accommodate multiple video processing blocks, and the 252 I/O pins support various camera and display interfaces. This makes it suitable for surveillance systems, medical imaging, and broadcast equipment.
Recommended
Industrial Automation
In industrial automation, the XCZU4EV-2SFVC784I provides a powerful platform for motor control, robotics, and machine vision. The dual-core Cortex-R5 real-time processor ensures deterministic response for critical control loops, while the Cortex-A53 handles HMI and communication protocols. The FPGA fabric can implement custom encoder interfaces and high-speed I/O. The device's 533MHz R5 clock and 1.3GHz A53 clock offer a balance of real-time and application processing. The 784-FCBGA package is suitable for industrial-grade PCBs, and the 252 I/O pins allow for extensive sensor and actuator connectivity. This enables advanced automation systems with integrated safety and diagnostics.
Recommended
Aerospace and Defense
The XCZU4EV-2SFVC784I is well-suited for aerospace and defense applications, offering high-performance processing in a rugged package. The combination of ARM cores and FPGA logic enables secure, reconfigurable systems for radar, communication, and electronic warfare. The device's 1.3GHz Cortex-A53 can run complex algorithms, while the FPGA provides hardware acceleration for signal processing. The 192K+ logic cells support large-scale parallel processing, and the 252 I/O pins allow for integration with various sensors and communication interfaces. The 784-FCBGA package is designed for reliable operation in harsh environments, making it suitable for avionics and military systems.
Recommended
Medical Imaging
The XCZU4EV-2SFVC784I is an excellent choice for medical imaging systems, such as ultrasound and CT scanners. The Mali-400 GPU accelerates image rendering, while the FPGA fabric implements real-time signal processing for image reconstruction. The quad-core Cortex-A53 can run image analysis algorithms and user interfaces. The device's 600MHz GPU and 1.3GHz CPU provide the necessary performance for high-resolution imaging. The 192K+ logic cells enable complex processing pipelines, and the 252 I/O pins support high-speed data acquisition from sensors. This makes it ideal for portable and stationary medical imaging equipment.
Recommended
Data Center Acceleration
The XCZU4EV-2SFVC784I can be used in data center applications for workload acceleration, such as network processing and storage controllers. The FPGA fabric allows for custom packet processing and data compression, while the ARM cores handle control plane tasks. The device's 1.3GHz Cortex-A53 and 192K+ logic cells provide a balance of software and hardware processing. The 252 I/O pins support high-speed SerDes and memory interfaces, enabling high-throughput data paths. The 784-FCBGA package is suitable for standard server PCBs, and the device's power efficiency makes it attractive for large-scale deployments.
Recommended
Recommended Products Summary
Engineering reference data for XCZU4EV-2SFVC784I β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XCZU4EV-1SFVC784I | XCZU4EV-2SFVC784E | XCZU4EG-1SFVC784I |
|---|---|---|---|---|
| Package | 784-FCBGA (23x23) | 784-FCBGA (23x23) | 784-FCBGA (23x23) | 784-FCBGA (23x23) |
| Brand | AMD | AMD | AMD | AMD |
| Core Processor | Quad ARM Cortex-A53, Dual ARM Cortex-R5 | Quad ARM Cortex-A53, Dual ARM Cortex-R5 | Quad ARM Cortex-A53, Dual ARM Cortex-R5 | Quad ARM Cortex-A53, Dual ARM Cortex-R5 |
| Graphics Processor | ARM Mali-400 MP2 | ARM Mali-400 MP2 | ARM Mali-400 MP2 | None |
| Logic Cells | 192K+ | 192K+ | 192K+ | 192K+ |
| Max CPU Clock | 1.3 GHz | 1.2 GHz | 1.3 GHz | 1.2 GHz |
| Number of I/O | 252 | 252 | 252 | 252 |
| Temperature Grade | I (Industrial) | I (Industrial) | E (Extended) | I (Industrial) |
Key Differentiators
- Integrated Mali-400 GPU (vs XCZU4EG-1SFVC784I)
- Higher speed grade (vs XCZU4EV-1SFVC784I)
- Industrial temperature grade (vs XCZU4EV-2SFVC784E)
Design Notes
The XCZU4EV-2SFVC784I requires multiple power rails (VCCINT, VCCAUX, VCCO) with proper sequencing. Use a power management IC to ensure correct power-up order. Decouple each rail with 100nF and 10uF capacitors close to the pins.
The 784-FCBGA package can dissipate significant heat at high clock speeds. Use a heatsink and ensure adequate airflow. Consider thermal vias under the package to improve heat transfer to the PCB. Monitor junction temperature to prevent overheating.
For high-speed signals, maintain controlled impedance and minimize trace lengths. Use ground planes to reduce noise. Follow AMD's layout guidelines for the Zynq UltraScale+ family to ensure signal integrity.
Compliance Information
RoHS compliant per distributor data. Other compliance details not specified in the provided data.
