XCZU11EG-3FFVF1517E - Zynq UltraScale+ MPSoC EG | AMD
MPN: XCZU11EG-3FFVF1517E β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1250 | $1,250.00 |
| 10 | $1180 | $11,800.00 |
| 100 | $1100 | $110,000.00 |
| 500 | $1050 | $525,000.00 |
| 1,000 | $990 | $990,000.00 |
Drop-in alternatives for XCZU11EG-3FFVF1517E β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XCZU11EG-2FFVF1517E
β Drop-Inπ Reference alternative (not in catalog)
XCZU11EG-1FFVF1517E
β Drop-Inπ Reference alternative (not in catalog)
XCZU11EG-3FFVF1517I
β Drop-Inπ Reference alternative (not in catalog)
XCZU11EG-2FFVF1517I
β Drop-Inβ In Stock
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View Datasheet βXCZU11EG-L2FFVF1517E
β Drop-Inπ Reference alternative (not in catalog)
XCZU11EG-3FFVF1517E Maximum Ratings & Electrical Characteristics
| Product Type | Zynq UltraScale+ MPSoC EG |
| Processor Cores | Quad ARM Cortex-A53, Dual ARM Cortex-R5, ARM Mali-400 MP2 |
| Logic Cells | 653K+ |
| I/O Pins | 464 |
| Package | 1517-FCBGA (40x40 mm) |
| Speed Grade | -3 |
| Cortex-A53 Max Frequency | 1.5 GHz |
| Cortex-R5 Max Frequency | 600 MHz |
| Mali-400 Max Frequency | 667 MHz |
| Operating Temperature | 0Β°C to 100Β°C (TJ) |
| Process Technology | 16nm FinFET |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount |
| Supply Voltage | [DATA_NEEDED: VCCINT voltage] |
| Block RAM | [DATA_NEEDED: Block RAM size] |
| DSP Slices | [DATA_NEEDED: DSP slice count] |
XCZU11EG-3FFVF1517E Pin Configuration
| Pin A1 | GND β Ground |
| Pin A2 | VCCO_0 β I/O bank 0 supply voltage |
| Pin A3 | IO_L1P_T0_0 β User I/O, bank 0 |
| Pin B1 | VCCINT β Internal core supply voltage |
| Pin B2 | IO_L1N_T0_0 β User I/O, bank 0 |
| Pin C1 | VCCAUX β Auxiliary supply voltage |
| Pin C2 | IO_L2P_T0_0 β User I/O, bank 0 |
| Pin D1 | GND β Ground |
| Pin D2 | IO_L2N_T0_0 β User I/O, bank 0 |
| Pin E1 | VCCO_0 β I/O bank 0 supply voltage |
| Pin E2 | IO_L3P_T0_0 β User I/O, bank 0 |
| Pin F1 | VCCINT β Internal core supply voltage |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XCZU11EG-3FFVF1517E is suitable for 6 applications: Software-Defined Radio, Medical Imaging, Aerospace and Defense, High-End Industrial Automation, Edge AI and Vision Systems, 5G and Wireless Infrastructure.
Software-Defined Radio
The XCZU11EG-3FFVF1517E excels in software-defined radio (SDR) systems due to its 653K+ logic cells and 1.5 GHz Cortex-A53 cluster. The programmable logic implements high-speed digital down/up conversion, filtering, and FFT processing, while the ARM cores run protocol stacks and control software. The 464 I/O pins support multiple ADC/DAC interfaces, and the high-speed transceivers handle RF data streams. This SoC enables a compact, single-chip SDR platform for military and commercial communications, reducing board space and power compared to discrete FPGA and processor solutions.
Recommended
Medical Imaging
In medical imaging systems like ultrasound and CT scanners, the XCZU11EG-3FFVF1517E provides the computational horsepower for real-time image processing. The programmable logic accelerates beamforming, filtering, and image enhancement algorithms, while the Cortex-A53 cores handle system control and user interface. The Mali-400 GPU supports 2D/3D visualization. The device's high-speed transceivers interface with imaging sensors and display controllers. Its 16nm FinFET process ensures low power consumption, critical for portable and battery-operated medical devices, and the 0Β°C to 100Β°C operating range suits clinical environments.
Recommended
Aerospace and Defense
The XCZU11EG-3FFVF1517E is ideal for aerospace and defense applications such as radar, electronic warfare, and secure communications. Its 653K+ logic cells implement complex signal processing and encryption algorithms, while the dual-core Cortex-R5 provides deterministic real-time control. The device supports secure boot and bitstream encryption for anti-tamper requirements. The 1517-FCBGA package is rugged and suitable for harsh environments, with the -I variant offering extended temperature range. The high-speed transceivers enable radar data aggregation and high-throughput sensor fusion, making it a trusted platform for mission-critical systems.
Recommended
High-End Industrial Automation
For advanced industrial automation and robotics, the XCZU11EG-3FFVF1517E combines real-time control with high-performance computing. The Cortex-R5 cores handle deterministic motor control and safety functions, while the Cortex-A53 runs Linux for HMI and networking. The programmable logic implements custom industrial protocols (EtherCAT, PROFINET) and high-speed vision processing. The 464 I/O pins connect to sensors, actuators, and fieldbuses. The device's reliability and long-term availability make it suitable for factory-floor equipment, and its performance enables AI-based predictive maintenance at the edge.
Recommended
Edge AI and Vision Systems
The XCZU11EG-3FFVF1517E is well-suited for edge AI and computer vision applications, such as smart cameras and autonomous vehicles. The programmable logic accelerates neural network inference with custom DSP and convolution engines, achieving low latency and high throughput. The Cortex-A53 cores run AI frameworks like TensorFlow Lite and OpenVINO. The Mali-400 GPU assists with image preprocessing. The device's high-speed transceivers connect to image sensors and display interfaces. Its power efficiency enables deployment in battery-powered devices, and the 653K+ logic cells provide ample resources for complex models.
Recommended
5G and Wireless Infrastructure
In 5G base stations and wireless infrastructure, the XCZU11EG-3FFVF1517E handles baseband processing and beamforming. The programmable logic implements PHY layer functions like channel coding and MIMO detection, while the Cortex-A53 cores run protocol stacks and network management. The high-speed transceivers interface with RF front-ends and backhaul links. The device's 653K+ logic cells and 1.5 GHz processing power meet the demanding throughput requirements of 5G NR. Its low power consumption and small footprint enable dense deployment in small cells and remote radio heads.
Recommended
Recommended Products Summary
Engineering reference data for XCZU11EG-3FFVF1517E β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XCZU11EG-2FFVF1517E | XCZU11EG-1FFVF1517E | XCZU11EG-3FFVF1517I |
|---|---|---|---|---|
| Package | 1517-FCBGA (40x40 mm) | 1517-FCBGA (40x40 mm) | 1517-FCBGA (40x40 mm) | 1517-FCBGA (40x40 mm) |
| Brand | AMD | AMD | AMD | AMD |
| Speed Grade | -3 | -2 | -1 | -3 |
| Cortex-A53 Max Frequency | 1.5 GHz | 1.3 GHz | 1.2 GHz | 1.5 GHz |
| Cortex-R5 Max Frequency | 600 MHz | 533 MHz | 500 MHz | 600 MHz |
| Mali-400 Max Frequency | 667 MHz | 600 MHz | 600 MHz | 667 MHz |
| Operating Temperature | 0Β°C to 100Β°C | 0Β°C to 100Β°C | 0Β°C to 100Β°C | -40Β°C to 100Β°C |
| Logic Cells | 653K+ | 653K+ | 653K+ | 653K+ |
Key Differentiators
- Highest speed grade (-3) in the XCZU11EG family (vs XCZU11EG-1FFVF1517E)
- Extended temperature range option (vs XCZU11EG-3FFVF1517E (standard))
- Pin-compatible with lower speed grades (vs XCZU11EG-2FFVF1517E)
Design Notes
The XCZU11EG-3FFVF1517E requires multiple power rails: VCCINT (internal core), VCCAUX (auxiliary), and VCCO (I/O banks). Use a dedicated power management IC (PMIC) like the TPS650864 or a discrete solution with proper sequencing. Ensure each rail has adequate decoupling capacitors (100nF and 10uF) placed close to the BGA balls. Follow AMD's power supply recommendations in UG583 for optimal performance.
With a 653K+ logic cell FPGA and 1.5 GHz processors, the XCZU11EG-3FFVF1517E can dissipate significant power (potentially 20-30W under full load). Use a heatsink with forced airflow or a liquid cooling solution for high-density designs. The 1517-FCBGA package has a thermal resistance that requires careful thermal management. Monitor junction temperature (TJ) to stay within the 0Β°C to 100Β°C range. Consider using the -I variant for industrial environments.
The 1517-FCBGA package requires a high-layer-count PCB (12-16 layers) for signal routing and power integrity. Use controlled impedance traces for high-speed serial transceivers and DDR4 interfaces. Place decoupling capacitors on the bottom side of the board, directly under the BGA. Follow AMD's PCB design guidelines in UG583 for stack-up and routing recommendations. Ensure adequate ground vias for return current paths.
Compliance Information
RoHS compliant per distributor listings. AEC-Q100 not applicable for this FPGA/SoC. Other compliance data not specified in verified sources.
