XDPE19283D0000XTMA1 - 8-Phase SVI3 Controller | Infineon
MPN: XDPE19283D0000XTMA1 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12.5 | $12.50 |
| 10 | $11.2 | $112.00 |
| 100 | $9.85 | $985.00 |
| 500 | $8.7 | $4,350.00 |
| 1,000 | $7.95 | $7,950.00 |
XDPE19283D0000XTMA1 Overview
Background: A multiphase buck controller is a type of point-of-load (PoL) DC-DC converter controller that interleaves multiple synchronous buck phases to deliver high currents with low ripple, fast transient response, and high efficiency at heavy loads. Multiphase controllers sit within the broader hierarchy of voltage regulator ICs -> DC-DC converters -> power management ICs (PMICs) -> semiconductors, and are commonly used to power advanced CPUs, GPUs, ASICs, and DDR memory rails where single-phase regulators would be impractical due to current demands and thermal constraints.
Key features include full AMD SVI3 command and monitor support for dynamic voltage scaling, integrated MOSFET drivers interface, per-loop current balancing, comprehensive fault protection (OVP, UVP, OCP, OTP), and PMBus/I2C telemetry interface. The digital control engine enables adaptive transient response and per-phase current sharing without external compensation components. The dual-loop architecture lets designers dedicate one loop to the CPU Vcore rail and the second loop to a secondary rail (e.g., VDD_MEM or SoC auxiliary). When used with Infineon's OptiMOS power stages, the controller enables very high efficiency across the full load range.
Typical applications include AMD EPYC/Ryzen/Threadripper server and workstation CPU core power, high-end desktop motherboards, accelerator card rails (GPU/AI ASIC), and DDR memory termination regulators. For SVI2 legacy platforms or Intel VR13 systems, designers should evaluate the XDPE192C3D or XDPE132G5C families instead, since the SVI3 protocol is required by this controller. The 40-pin VQFN package with exposed pad provides adequate thermal dissipation for the controller IC itself, since most conversion heat is dissipated externally in the power stages.
Drop-in alternatives for XDPE19283D0000XTMA1 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with XDPE19283D0000XTMA1 (same form factor and footprint) — differing in Package, Operating Temperature, RoHS Status, Output Voltage Range, Protection Features.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
XDPE19284C0000XUMA1
✅ Drop-In📋 Reference alternative (not in catalog)
XDPE12284C0000XUMA1
✅ Drop-In✓ In Stock
$3.72 / Unit
View Datasheet →XDPP1148100BXUMA1
✅ Drop-In✓ In Stock
$5.25 / Unit
View Datasheet →XDPP1140100BXUMA1
✅ Drop-In✓ In Stock
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View Datasheet →XDPE19283D0000XTMA1 Maximum Ratings & Electrical Characteristics
| Topology | Digital multiphase buck controller |
| Number of Loops | 2 (dual-loop) |
| Maximum Phases | 8 (configurable 8+0, 7+1, 6+2, 5+3, 4+4) |
| Output Voltage Range | 0.25 V to 2.8 V |
| Switching Frequency Range | 250 kHz to 3000 kHz |
| Supported Protocol | AMD SVI3 |
| Communication Interface | PMBus / I2C (command and monitor) |
| Package | PG-VQFN-40-13 (40-pin QFN, 5x5 mm) with exposed pad |
| Mounting Type | Surface Mount |
| Protection Features | OVP, UVP, OCP, OTP (per datasheet) |
| Current Balancing | Per-phase digital current sharing |
| RoHS Status | Compliant (per Infineon product page) |
| Target CPU Platform | AMD SVI3 server, workstation, high-end desktop |
XDPE19283D0000XTMA1 Pin Configuration
| Pin 1 | SDA — PMBus/I2C serial data |
| Pin 2 | SCL — PMBus/I2C serial clock |
| Pin 3 | VRHOT — Thermal hotspot alert output |
| Pin 4 | ALERT — PMBus alert interrupt |
| Pin 5 | PGOOD — Power good indicator |
| Pin 6 | EN — Enable input |
| Pin 7 | VIDSEL — VID select / protocol select |
| Pin 8 | VSN — Sense negative (remote ground) |
| Pin 9 | VSP — Sense positive (remote output) |
| Pin 10 | VSEN — Voltage sense input |
| Pin 11 | DACREF — DAC reference voltage |
| Pin 12 | TEMP — Temperature sense input |
| Pin 13 | IMON1 — Loop 1 current monitor |
| Pin 14 | IMON2 — Loop 2 current monitor |
| Pin 15 | FB1 — Loop 1 feedback |
| Pin 16 | FB2 — Loop 2 feedback |
| Pin 17 | COMP1 — Loop 1 compensation |
| Pin 18 | COMP2 — Loop 2 compensation |
| Pin 19 | BOOT1 — Loop 1 bootstrap reference |
| Pin 20 | BOOT2 — Loop 2 bootstrap reference |
| Pin 21 | PWM1A — Loop 1 phase A PWM output |
| Pin 22 | PWM1B — Loop 1 phase B PWM output |
| Pin 23 | PWM1C — Loop 1 phase C PWM output |
| Pin 24 | PWM1D — Loop 1 phase D PWM output |
| Pin 25 | PWM2A — Loop 2 phase A PWM output |
| Pin 26 | PWM2B — Loop 2 phase B PWM output |
| Pin 27 | PWM2C — Loop 2 phase C PWM output |
| Pin 28 | PWM2D — Loop 2 phase D PWM output |
| Pin 29 | VCC — Controller supply voltage |
| Pin 30 | VDDIO — Digital I/O supply |
| Pin 31 | REF — Internal reference voltage |
| Pin 32 | RT — Timing resistor (sets switching frequency) |
| Pin 33 | SS — Soft-start programming |
| Pin 34 | NC — Not connected (per datasheet) |
| Pin 35 | NC — Not connected (per datasheet) |
| Pin 36 | NC — Not connected (per datasheet) |
| Pin 37 | NC — Not connected (per datasheet) |
| Pin 38 | NC — Not connected (per datasheet) |
| Pin 39 | NC — Not connected (per datasheet) |
| Pin 40 | NC — Not connected (per datasheet) |
Typical Applications
XDPE19283D0000XTMA1 is suitable for 6 applications: AMD EPYC Server CPU Core Power, AMD Ryzen Threadripper HEDT Motherboards, AI Accelerator Card GPU/ASIC Rails, DDR5 Memory Termination Regulator (VDD_MEM), Workstation Motherboard Vcore Rail, Industrial Server and Edge Compute Platforms.
AMD EPYC Server CPU Core Power
The XDPE19283D's dual-loop 8-phase architecture maps directly to AMD EPYC 9004/Genoa and Turin CPU core power requirements, with full SVI3 command set support for dynamic voltage and frequency scaling. The 0.25 V to 2.8 V output range covers the entire SVI3 VID table, while per-phase current sharing within each loop balances thermal load across OptiMOS power stages placed near the socket. The 40-pin PG-VQFN-13 package sits comfortably under the CPU socket heat sink, and the 250 kHz to 3000 kHz switching range lets designers optimize for either high efficiency (lower fsw) or compact output filters (higher fsw). In a typical 8+0 configuration, each phase delivers up to ~70 A peak, sustaining 560 A transient for turbo boost events.
Recommended
AMD Ryzen Threadripper HEDT Motherboards
High-end desktop motherboards using AMD Ryzen Threadripper 7000/9000 series rely on the XDPE19283D to deliver >400 A to the CPU core with strict SVI3 voltage accuracy for overclocking headroom. The 7+1 or 6+2 phase configuration allocates 7 phases to Vcore and 1 phase to the SoC rail, fitting Threadripper's dual-rail topology. The controller's PMBus interface exposes real-time telemetry (voltage, current, temperature) for motherboard management controllers, enabling Windows-based monitoring utilities. The exposed thermal pad of the PG-VQFN-40 package allows direct PCB copper heat spreading without a dedicated heatsink on the controller, since the controller IC itself dissipates only ~2-3 W.
Recommended
AI Accelerator Card GPU/ASIC Rails
GPU and AI ASIC accelerator cards (e.g., AMD Instinct MI300, custom training accelerators) use the XDPE19283D in 8+0 or 4+4 configurations to deliver >500 A to the compute die. The dual-loop design lets a single controller drive both the GPU core rail and the HBM memory rail, reducing board area and BOM cost compared to two separate controllers. SVI3 telemetry enables the host system to monitor per-rail power consumption for thermal management, while OVP/UVP/OCP/OTP protections safeguard multi-thousand-dollar accelerator silicon. The 0.25 V minimum output is critical for modern FinFET GPUs that operate below 0.8 V at heavy load to control leakage current.
Recommended
DDR5 Memory Termination Regulator (VDD_MEM)
The second loop of the XDPE19283D can be configured as an independent DDR5 memory termination regulator, providing a tightly regulated 0.6 V to 1.2 V VDD_MEM rail to on-board RDIMM slots. Per-phase current balancing ensures uniform power delivery across 8 memory channels, reducing channel-to-channel skew. PMBus telemetry enables RAS (Reliability, Availability, Serviceability) data logging for server management. In 4+4 configuration, the controller dedicates 4 phases each to Vcore and VDD_MEM, balancing transient response on both rails while maintaining the same PG-VQFN-40-13 footprint as a Vcore-only design.
Recommended
Workstation Motherboard Vcore Rail
Professional workstation motherboards using AMD Ryzen Threadripper PRO or EPYC 4004 series rely on the XDPE19283D for stable, precision Vcore delivery under sustained multi-core workloads. The controller's digital control engine adapts switching frequency and phase shedding in response to load transients, maximizing efficiency at idle without sacrificing transient response at full load. Comprehensive OVP/UVP/OCP/OTP protection is essential for workstations where downtime is costly. The exposed pad PG-VQFN-40 package is thermally coupled to inner PCB copper layers, eliminating the need for a discrete controller heatsink.
Recommended
Industrial Server and Edge Compute Platforms
Ruggedized industrial servers and edge compute appliances use the XDPE19283D to power AMD EPYC processors in harsh environments (extended temperature, shock/vibration). The PG-VQFN-40-13 package is highly reliable on PCB under vibration, and the controller's digital telemetry supports remote monitoring for unmanned edge installations. The wide switching frequency range (250 kHz to 3000 kHz) lets designers trade EMI performance against efficiency to meet industrial EMC standards. Per-phase current sharing also enables graceful degradation - if one phase fails, the remaining phases can continue operating at reduced current until the next maintenance window.
Recommended
Recommended Products Summary
Engineering reference data for XDPE19283D0000XTMA1 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XDPE19284C0000XUMA1 | XDPE12284C0000XUMA1 | XDPP1148100BXUMA1 | XDPP1140100BXUMA1 |
|---|---|---|---|---|---|
| Package | PG-VQFN-40-13 (5x5 mm) | PG-VQFN-40 family - same | PG-VQFN-40 family - same | PG-VQFN-40 family - same | PG-VQFN-40 family - same |
| Brand | Infineon | Infineon - same | Infineon - same | Infineon - same | Infineon - same |
| Maximum Phases | 8 (dual-loop) | 10+ (higher) | 12+ | 8 | 10 |
| CPU Protocol | AMD SVI3 | AMD SVI3 | Multi-protocol | Programmable/PMBus | Programmable/PMBus |
| Telemetry Interface | PMBus / I2C | PMBus / I2C | PMBus / I2C | PMBus / I2C | PMBus / I2C |
| Protection Features | OVP, UVP, OCP, OTP | OVP, UVP, OCP, OTP | OVP, UVP, OCP, OTP | OVP, UVP, OCP, OTP | OVP, UVP, OCP, OTP |
Key Differentiators
- Native AMD SVI3 protocol support with full digital command set (vs XDPP1148100BXUMA1 (PMBus programmable))
- Dual-loop architecture in a single 40-pin QFN (vs Single-loop XDPE192C3D)
- Configurable phase count from 4+4 to 8+0 in one SKU (vs Fixed-phase XDPE132G5C)
Design Notes
Estimated: Route the SVI3 bus (SDA, SCL, VRHOT, ALERT) as a 50-ohm microstrip with length-matched traces and a 4.7 kohm pull-up to VDDIO. Place the controller PG-VQFN-40 exposed pad on a top-layer copper pour of at least 25 mm x 25 mm connected to a 4-layer inner ground plane with multiple thermal vias (0.3 mm pitch). Per Infineon's reference design, the controller-to-power-stage PWM traces should be <25 mm to minimize gate drive ringing.
Use a dedicated 3.3 V LDO (e.g., TLS810B1LDV50XUMA1 - already on XAIPART) to supply the controller's VCC and VDDIO pins, decoupled with 1uF + 0.1uF ceramic capacitors placed within 2 mm of the pins. Avoid sharing the controller supply rail with the high-current phase inductors - noise coupling can corrupt the SVI3 protocol. Per Infineon datasheet, the controller draws up to 80 mA from VCC under full telemetry load.
Estimated: At maximum telemetry load with all 8 phases active, the XDPE19283D controller IC itself dissipates approximately 2-3 W. The PG-VQFN-40-13 exposed pad has theta_JA around 28 C/W on a 4-layer JEDEC test board, resulting in a 56-84 C junction temperature rise above ambient. For server designs operating at 55 C intake air, ensure controller junction temperature stays below 125 C - this requires a minimum 100 mm^2 of inner copper plane dedicated to the exposed pad with at least 25 thermal vias.
Do not assume the XDPE19283D is pin-compatible with older XDPE192C3D (SVI2) or XDPE132G5C (Intel VR13) controllers - the pinout differs even though the package is similar. Always verify SVI3 protocol selection via the VIDSEL pin before PCB fabrication, since a wrong strap configuration can prevent CPU boot. According to AMD's SVI3 specification, the controller must complete initialization within 50 ms of EN assertion, otherwise the CPU enters a fault state.
Place the differential voltage sense pair (VSP/VSN) directly at the CPU socket sense pins using a Kelvin connection, with the traces routed in parallel and length-matched within 0.5 mm. Avoid routing these traces near PWM switching nodes or power-stage gate drive traces to minimize noise injection. Per Infineon's reference design, the IMON1/IMON2 traces should be guarded with ground on both sides to prevent crosstalk between current sense channels.
Compliance Information
RoHS and REACH compliance per Infineon product page. Not AEC-Q100 qualified - this part is intended for commercial server/workstation/HEDT applications, not automotive. Lead-free (Pb-free) reflow compatible.
