XMC4400F64F512BAXQMA1 - 120MHz Cortex-M4 MCU | Infineon
MPN: XMC4400F64F512BAXQMA1 ✓ ActiveXMC4400F64F512BAXQMA1 Overview
An MCU is a programmable semiconductor that integrates a CPU core, memory, and peripherals on one die. The ARM Cortex-M4 is a 32-bit processor architecture within the broader microcontroller and embedded-semiconductor hierarchy. It supports real-time control tasks that require deterministic peripheral access, while the XMC family adds Ethernet and CAN connectivity commonly used in industrial automation, networking, motor-control, and communications equipment.
Key verified features include a 120 MHz operating frequency, 512 KB of flash, and a 64-pin PG-TQFP-64-19 surface-mount package. The device also includes a 150 ps high-resolution PWM capability, an Ethernet MAC, CAN interfaces, an FPU, DSP instructions, and a common-ground architecture. In packages with an exposed die pad, Infineon requires the pad to be connected to the common ground alongside the VSS, VSSA, and VSSO pins.
The Cortex-M4 architecture is suitable for floating-point control algorithms and fixed-point signal processing, while the XMC peripheral set reduces the need for external interface devices. Ethernet MAC support can simplify industrial Ethernet connectivity, and CAN provides a robust option for distributed automation and vehicle or industrial control networks. The high-resolution PWM unit is especially relevant to precise timing, digital-to-analog conversion, and motor-control applications.
Typical uses include industrial Ethernet controllers, factory automation nodes, CAN-connected motor systems, power-conversion equipment, and embedded communications platforms. At 120 MHz, the MCU has sufficient processing capacity for protocol handling and real-time control, but designers should evaluate interrupt latency, peripheral timing, memory bandwidth, and thermal conditions for each system.
The exposed pad requires careful PCB layout and an adequate ground plane. The package must be soldered according to Infineon's land-pattern and reflow guidance, while the exposed die pad and all ground pins must be tied to the common ground. The 150 ps PWM resolution should also be checked against the timer clock and required output timing rather than treated as a universal system timing guarantee.
This page consolidates verified distributor and manufacturer information, package characteristics, functional applications, and cross-reference candidates. The available data identifies only a limited number of same-package alternatives; their temperature-grade, ordering-code, and detailed electrical differences should be confirmed against the Infineon ordering information before production substitution.
Drop-in alternatives for XMC4400F64F512BAXQMA1 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
XMC4400F64K512BAXQMA1
✅ Drop-InContact for price
View Datasheet →XMC4400F64F512ABXQMA1
✅ Drop-In📋 Reference alternative (not in catalog)
XMC4400-F64K512-BA
✅ Drop-In📋 Reference alternative (not in catalog)
XMC4400F64F512BAXQMA1 Maximum Ratings & Electrical Characteristics
| Product Type | 32-bit ARM Cortex-M4 microcontroller |
| Series | XMC4000 |
| CPU Core | ARM Cortex-M4 |
| Processor Architecture | 32-bit RISC |
| Maximum CPU Frequency | 120 MHz |
| Flash Memory | 512 KB (512K x 8) |
| Supply Voltage | 3.3 V |
| High-Resolution PWM Resolution | 150 ps |
| Ethernet Interface | Ethernet MAC |
| CAN Interface | CAN |
| Floating-Point Unit | Integrated FPU |
| DSP Instruction Support | DSP instructions |
| Package | 64-pin PG-TQFP-64-19 with exposed pad |
| Mounting Type | Surface mount |
| Shipping Format | Tray |
| Ground Architecture | Common ground for VSS, VSSA, and VSSO |
XMC4400F64F512BAXQMA1 64-pin pg-tqfp-64-19 with exposed pad Pin Configuration Guide
Pin configuration for XMC4400F64F512BAXQMA1 (64-pin pg-tqfp-64-19 with exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for XMC4400F64F512BAXQMA1.
Refer to the datasheet for full pin configuration.
Typical Applications
XMC4400F64F512BAXQMA1 is suitable for 6 applications: Industrial Ethernet Control Node, CAN-Based Factory Automation, Precision Motor Control, Power Conversion Controller, Real-Time Signal Processing, Embedded Communications Gateway.
Industrial Ethernet Control Node
The XMC4400F64F512BAXQMA1 fits industrial Ethernet control nodes because it combines a 120 MHz ARM Cortex-M4 core with an Ethernet MAC and 512 KB of flash in a 64-pin exposed-pad package. The processor can execute communications tasks while the Ethernet interface handles network traffic, reducing the need for a separate protocol controller. Its integrated FPU and DSP instructions also support filtering, control calculations, and signal conditioning. A practical implementation should pair the MCU with a suitable Ethernet PHY, preserve controlled impedance on differential pairs, provide appropriate isolation or coupling for the target network, and connect the exposed pad to the common ground. The 150 ps high-resolution PWM capability may also support precise timing functions alongside the network workload.
Recommended
CAN-Based Factory Automation
The XMC4400F64F512BAXQMA1 is appropriate for CAN-connected factory automation because it integrates CAN and runs at 120 MHz, allowing protocol handling and real-time control to share one microcontroller. Its 512 KB flash provides room for an embedded protocol stack, diagnostics, application logic, and configuration data. Engineers can use the Cortex-M4 DSP capability for signal processing and the FPU for control calculations without adding a separate processor. The PCB should provide a clean CAN transceiver interface, controlled differential routing, appropriate termination, and separated return paths for high-current switching. Because the 64-pin exposed-pad package concentrates thermal and electrical requirements at the center of the device, a continuous ground plane and thermal-via array should be used under the pad.
Recommended
Precision Motor Control
The XMC4400F64F512BAXQMA1 supports precision motor-control designs because its 120 MHz Cortex-M4 core can execute current-control and commutation algorithms while the high-resolution PWM unit provides a verified resolution of 150 ps. The integrated FPU and DSP instructions are useful for transforms, filtering, and real-time control mathematics. In an industrial servo or inverter, the MCU can coordinate PWM generation, position sensing, fault handling, and communications while keeping the control loop deterministic. Gate drivers should be placed close to the power stage, and high-current switching paths must be kept away from sensitive analog inputs. The exposed die pad must be soldered to a robust common-ground plane with adequate thermal-via coverage so processing and switching performance remain stable.
Recommended
Power Conversion Controller
The XMC4400F64F512BAXQMA1 can serve as the supervisory controller in a digital power-conversion system because its 120 MHz Cortex-M4 core executes control and supervisory algorithms while its high-resolution PWM supports fine-grained timing. The 512 KB flash is sufficient for control code, fault handling, communications, and calibration data, while Ethernet or CAN can expose telemetry and configuration functions. In implementation, the MCU should remain separated from high-dv/dt switching nodes, analog sensing paths should be grounded carefully, and exposed-pad thermal vias should not interrupt sensitive current loops. The exact timer settings and achievable control bandwidth must be verified from the device clock configuration and power-stage characteristics rather than inferred from PWM resolution alone.
Recommended
Real-Time Signal Processing
The XMC4400F64F512BAXQMA1 is suitable for real-time signal-processing tasks because its ARM Cortex-M4 core runs at 120 MHz and includes an FPU and DSP instructions. These capabilities can accelerate filtering, measurement, compensation, and control calculations without an external digital signal processor. The 512 KB flash supports firmware and lookup data, while the XMC4000 peripheral integration can reduce system complexity. Designers should account for deterministic execution, RAM availability, and interrupt latency; the provided data does not state the RAM capacity. Analog signals will require suitable front-end conditioning, and high-speed or high-energy switching should be isolated from the MCU's supply and ground paths. The exposed pad must be tied to the common ground as specified by Infineon.
Recommended
Embedded Communications Gateway
The XMC4400F64F512BAXQMA1 fits an embedded communications gateway that must combine Ethernet and CAN connectivity with deterministic application processing. Its 120 MHz Cortex-M4 core can manage protocol conversion, routing, supervisory logic, and local control, while the 512 KB flash holds application firmware and protocol components. The Ethernet MAC permits a dedicated network path, and CAN supports industrial fieldbus or vehicle-style distributed networks. Implementation should include protected communication transceivers, disciplined clocking, robust power supplies, and a ground architecture that prevents high-current outputs from disturbing communications. Firmware should include watchdog recovery, validated configuration storage, and fault containment. Before production, verify all peripheral availability and pin multiplexing for the selected 64-pin ordering code against the official datasheet.
Recommended
Recommended Products Summary
Engineering reference data for XMC4400F64F512BAXQMA1 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XMC4400F64K512BAXQMA1 | XMC4400F64F512ABXQMA1 | XMC4400-F64K512-BA |
|---|---|---|---|---|
| Package | PG-TQFP-64-19 with exposed pad | PG-LQFP-64-19 - same exposed-pad footprint | PG-LQFP-64-19 - same exposed-pad footprint | PG-LQFP-64 - same exposed-pad footprint |
| Brand | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies |
| Flash Memory | 512 KB | 512 KB | 512 KB | 512 KB |
Key Differentiators
- Integrated industrial communications peripherals (vs XMC4400F64K512BAXQMA1)
- High-resolution timing for precise control (vs XMC4400F64F512ABXQMA1)
- Exact industrial ordering option (vs XMC4400-F64K512-BA)
Design Notes
Connect the exposed die pad to the common ground using the manufacturer's land pattern, and place a dense thermal-via array beneath the pad where the PCB design rules permit. Infineon states that all VSS, VSSA, and VSSO pins share the same ground potential and that the exposed pad in exposed-pad packages must also be connected to that common ground. Avoid splitting the ground plane beneath the package, because an interrupted return path can increase radiated noise and reduce thermal performance.
Place input, output, and local bypass capacitors close to their associated supply pins according to the Infineon reference layout and device electrical-characteristic requirements. Keep high-current switching paths and motor-drive return currents away from the MCU and sensitive analog sections. Because the supplied extract does not provide the full decoupling table, output-voltage tolerance, or maximum input-voltage range, use the official XMC4400 datasheet for capacitor values and voltage ratings rather than carrying assumptions over from another XMC device.
Do not assume that the F in F512 and the K in K512 are interchangeable ordering suffixes. Confirm the complete ordering-code interpretation, temperature grade, package, flash configuration, qualification status, and lifecycle status for the exact manufacturer part number. Also verify that all required Ethernet, CAN, timer, and analog signals are available and multiplexed as expected on the selected 64-pin package before treating a family member as a drop-in replacement.
Route Ethernet and CAN differential pairs as controlled-impedance, tightly coupled traces with continuous reference planes and appropriate via transitions. Keep clocks away from switching nodes and high-current power loops, and place PHY or transceiver interfaces near their corresponding connector or isolation barrier. The MCU's 120 MHz processing capability does not by itself guarantee signal integrity; timing margins must be evaluated for the complete clock tree, transceiver propagation delay, PCB loss, and selected Ethernet or CAN physical layer.
Evaluate the exposed pad as the primary heat-spreading path rather than treating the 64-pin package as an air-cooled leaded package. Use the package drawing to determine the pad dimensions and copper area available on the PCB. For thermally demanding industrial equipment, calculate worst-case junction temperature using the actual ambient temperature, internal dissipation, and board-specific thermal resistance. The supplied data does not provide junction-temperature or thermal-resistance values, so those limits must come from the official datasheet rather than estimation.
Compliance Information
The supplied verified extracts do not state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. The listing identifies an industrial XMC4000 microcontroller but does not provide a formal compliance declaration.
