FPGA & CPLD
Produtos (6666)
XC3090L-8PCG84I - XC3000L FPGA 6K Gates 84-PLCC | Xilinx
The Xilinx XC3090L-8PCG84I is a member of the XC3000L Low-Voltage Field Programmable Gate Array family, delivering 6,000 usable gates, 320 configurable logic blocks (CLBs), and 70 user I/O pins in a 3.3 V, 84-pin PLCC package. It operates with a maximum toggle rate of approximately 80 MHz and is offered in an industrial-grade temperature rating (the 'I' suffix) for designs that must survive -40 °C to +85 °C ambient conditions. The '8' speed grade places it in the higher-performance segment of the XC3000L family, while the 'L' designation identifies it as the low-voltage 3.3 V variant rather than the 5 V XC3000/XC3100 line. The 84-pin PLCC footprint (package code PCG84) uses a J-leaded ceramic-compatible plastic carrier suitable for through-hole PCB assembly, and the device is supported by the legacy Xilinx XC3000 design flow including the XACT development system. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit containing an array of configurable logic blocks, programmable interconnect, and configurable I/O cells that the user programs after manufacture to implement custom VLSI design tasks. Within the power management and digital logic hierarchy, an FPGA sits above fixed-function Application-Specific Integrated Circuits (ASICs) and below software-defined processors; it offers hardware-level parallelism, hardware-timed determinism, and reconfigurability that distinguishes it from microcontrollers. The XC3000 generation represents one of the earliest commercially successful SRAM-based FPGA architectures, forming the foundation from which later Xilinx families (XC4000, Spartan, Virtex, and 7-series) were developed. The 'L' low-voltage variant extends that legacy into battery-powered and 3.3 V-only systems where the original XC3000A 5 V supply could not be tolerated. Key features include 6,000 usable gates, 320 CLBs, 70 user I/Os, an 80 MHz toggle rate, and 3.3 V single-supply operation. A perimeter of user-programmable I/O blocks (IOBs) supports TTL and CMOS signalling levels, while the on-chip configuration memory retains the user's bitstream in SRAM that is reloaded at every power-up. The architecture is built around three types of configurable elements: IOBs, CLBs, and the programmable interconnect matrix that joins them. Typical applications include custom VLSI prototyping, TTL and MSI logic replacement, glue-logic consolidation on legacy 5 V/3.3 V mixed boards, industrial control glue logic, telecommunications interface adaptation, and educational FPGA lab kits that still depend on the XC3000 development flow. The industrial temperature grade makes it acceptable for factory-floor controllers, outdoor telecom line cards, and ruggedised test fixtures where commercial-grade parts would fail. When designing with the XC3090L-8PCG84I, remember that the configuration bitstream is volatile: the device must be reconfigured from an external EPROM or microcontroller at every power-up. The 84-pin PLCC package leaves only 70 pins available as user I/O, so pin budgeting must account for the dedicated clock, configuration, and boundary-scan pins before committing a logic design. Designers migrating from this part should evaluate modern Xilinx 7-series or Spartan-6 drop-in equivalents, but be aware that the footprint, configuration interface, and tool flow are not bitstream-compatible. This page synthesises distributor pricing, drop-in 84-pin PLCC alternatives within the XC3000L family, comparison data, and practical design notes that are not collated in any single manufacturer datasheet.
XC3090L-8TQ144C - 320 CLB FPGA, 80MHz, TQFP-144 | Xilinx
The Xilinx XC3090L-8TQ144C is a CMOS Field Programmable Gate Array from the legacy XC3000 family, offering 320 Configurable Logic Blocks (CLBs) and approximately 5000 equivalent gates with a maximum usable gate count of 6000. Housed in a 144-pin Thin Quad Flat Pack (TQFP) package, it operates at system clock rates up to 80 MHz with combinatorial CLB delays as fast as 6.7 ns and guaranteed flip-flop toggle rates between 190 and 370 MHz. The device is rated for a 3.0 V to 3.6 V supply, with 8 mA sink and 8 mA source output drive and quiescent current limited to 5 mA in power-down mode. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of programmable logic blocks interconnected by a configurable routing matrix. Within the broader taxonomy, an FPGA sits as a subclass of programmable logic devices alongside CPLDs and falls under the digital IC hierarchy in power management and logic categories. The XC3000 series pioneered SRAM-based configuration and is positioned as the ancestor of all modern Xilinx FPGA families such as Spartan and Virtex. The "L" suffix designates the low-power CMOS process node, while the "-8" speed grade places this die at the high end of the XC3090's 1.55 to 4.1 ns logic-delay range. Key architectural features include 100% pin-out and architecture compatibility across the XC3000A/L and XC3100A/L families, allowing designers to migrate between density points without re-laying-out the board. The device supports JTAG-style boundary-scan testing and uses a distributed RAM/ROM programming model that loads the bitstream from external PROM at power-up. The TQFP-144 footprint exposes roughly 96 to 108 user I/O pins depending on bank configuration, with eight global clock buffers for high-fanout nets. Typical applications include glue-logic replacement in legacy industrial controllers, prototyping platforms for ASIC emulation, and digital signal pre-processing in telecom backplanes. The combination of 5000 gates and 80 MHz system clock is well-suited to state-machine controllers, UART bridges, FIFO address generators, and parallel-to-serial converters that were popular in 1990s-era designs still in long-life service today. When designing with this part, note that configuration requires a serial or parallel EPROM and at least four configuration mode pins. The 5 mA quiescent current makes it acceptable for battery-backed applications, but designers must respect the 3.6 V absolute-maximum supply rating to avoid latch-up. JTAG boundary scan is supported, but in-system reconfiguration requires careful handling of the DONE and INIT pins. This page synthesizes distributor stock and pricing snapshots from DigiKey, Mouser, Octopart and the Xilinx product archive, plus drop-in same-family variants from the XC3000A/L and XC3100A/L families — practical sourcing context not consolidated on any single manufacturer page.
XC3090L-8TQ144I - 6K-Gate CMOS FPGA, 80 MHz, 144-TQFP | Xilinx
The Xilinx XC3090L-8TQ144I is a CMOS Field Programmable Gate Array from the XC3000L family, delivering 320 Configurable Logic Blocks (CLBs), 6000 maximum usable gates, and a 5000-gate nominal equivalent count in a 144-pin TQFP (TQ144) surface-mount package. The device operates from a 3.3 V supply, supports system clock rates of 50 to 85 MHz, and provides guaranteed flip-flop toggle rates from 190 to 370 MHz with logic delays between 1.55 and 4.1 ns. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of an array of programmable logic blocks interconnected by a configurable routing matrix. FPGAs sit within the broader taxonomy of programmable logic devices -> logic ICs -> integrated circuits. The XC3000 series from Xilinx is one of the earliest commercially successful SRAM-based FPGA architectures, predating modern families such as Spartan and Artix, and remains relevant for long-lifecycle industrial, military, and legacy retrofit designs. Key electrical characteristics include 8 mA output sink and source drive capability, a maximum quiescent current of 5 mA during power-down, and full architecture and pin-out compatibility with sibling XC3000A/L and XC3100A/L devices. The 'L' suffix denotes a low-voltage 3.3 V core supply, while the 'I' suffix indicates the industrial -40 C to +85 C operating temperature grade and the '8' speed grade defines the timing bin. Architecturally, the XC3090L uses a symmetrical 22 x 22 CLB matrix with on-chip distributed interconnect, tri-state buffers on every I/O, and dedicated global clock buffers. The device is configured at power-up from an external serial or parallel PROM (e.g., XC1736, XC1765), and configuration bitstreams are identical in pinout across the XC3000L and XC3100L families, easing migration. Typical applications include industrial control glue logic, legacy telecommunications backplane interfaces, test-and-measurement instrumentation, and aerospace retrofits requiring pin-compatible drop-in replacements for end-of-life XC3000 designs. The XC3090L-8TQ144I is well suited to low-to-medium complexity glue logic, bus interfacing, and state-machine control where non-volatility, in-system reprogrammability, and 3.3 V operation are required. When designing with this device, ensure the configuration interface (mode pins M0/M1/M2 and DONE) is properly terminated, and that decoupling includes a 0.1 uF and 10 uF capacitor pair adjacent to every VCC/ground pair. Long-lifecycle users should also note that this part is mature silicon and is best sourced from authorized distributors or franchised brokers with full traceability. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on the manufacturer datasheet alone.
XC3090L-8TQ176C - 6K-Gate 80MHz CMOS FPGA | Xilinx TQFP-176
The Xilinx XC3090L-8TQ176C is a 5,000-gate (6,000-gate maximum) CMOS Field Programmable Gate Array from the legacy XC3000A/L family, supplied in a 176-pin TQFP package. It features 320 Configurable Logic Blocks (CLBs), operates at a maximum clock frequency of 80 MHz, and is rated for 3.3 V core operation. The 'L' suffix denotes the low-voltage variant; the '8' speed grade corresponds to the slowest timing bin, and '176C' identifies the commercial-temperature TQFP-176 package option. A Field Programmable Gate Array (FPGA) is a semiconductor IC whose logic function and interconnects are defined by configuration data loaded into on-chip static memory. FPGAs sit within the broader hierarchy programmable logic device -> programmable logic -> logic IC -> integrated circuit, and historically served as the fastest path to custom digital logic before modern HDL-based ASIC flows became mainstream. The XC3000 family pioneered SRAM-based configuration, allowing infinite reconfiguration and rapid prototyping cycles that defined early-1990s digital design. Key specifications include 5,000 usable gates (6,000 max), 320 CLBs, 80 MHz maximum toggle frequency, 3.3 V VCC, SRAM-based configuration, JTAG boundary-scan support, and a 0.500 mm pitch TQFP-176 footprint. The device exposes dedicated I/O blocks with programmable pull-ups and output slew-rate control, and it supports multiple configuration modes including master serial, slave serial, and peripheral modes for flexible system boot. Technically, the XC3090L uses a 5 V-tolerant I/O architecture on a 3.3 V core, with CMOS process geometry typical of mid-1990s Xilinx silicon. Each CLB contains a configurable combinatorial logic section plus two flip-flops, with local interconnect feeding the general-purpose routing matrix. The 80 MHz grade represents worst-case pin-to-pin combinatorial delay across the slowest paths, adequate for glue logic, bus interfacing, and state-machine replacement rather than high-throughput DSP. Typical applications include legacy glue-logic replacement, bus-bridge adapters (e.g., ISA-to-local-bus converters), industrial controller front-ends, and educational FPGA platforms where the TQFP-176 footprint is already laid out. The XC3090L is widely used as a pin-compatible replacement target for systems designed around the XC3000 family pinout. When designing, verify that the configuration memory source (EPROM, EEPROM, or microcontroller) matches the selected configuration mode and that the readback/special I/O voltage levels do not exceed the absolute-maximum ratings. Always reference the Xilinx XC3000 family datasheet for full timing parameters. This page consolidates distributor availability, parametric data, drop-in alternatives, and practical design notes that supplement the original Xilinx XC3090L datasheet.
XC3090L-8TQ176I - 5000 Gates FPGA, 320 CLBs, 80 MHz | Xilinx
The Xilinx XC3090L-8TQ176I is a CMOS Field-Programmable Gate Array from the legacy XC3000 series offering 320 Configurable Logic Blocks (CLBs), a maximum of 5000 equivalent gates, and up to 6000 usable gates, housed in a 176-pin TQFP (TQ176) surface-mount package with industrial temperature grading. The device is built on a 0.6 um CMOS process and operates from a single 5V supply with a maximum clock frequency of 80 MHz and a combinatorial CLB delay of 6.7 ns at the -8 speed grade. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines a perimeter of user-configurable I/O Blocks (IOBs) with a core array of Configurable Logic Blocks (CLBs) and programmable interconnect, all controlled by an SRAM-based configuration program store. FPGAs sit hierarchically under programmable logic, then digital integrated circuits, and ultimately the broader semiconductor taxonomy; the XC3000 family occupies the early-generation, 5V legacy tier that preceded modern low-power Virtex and Kintex families. Key features include 144 user I/Os in the TQ176 footprint, distributed on-chip RAM, JTAG boundary-scan support, and tri-state buffers per IOB. The architecture supports asynchronous and synchronous design entry through Xilinx's XACT development system, including schematic capture, automatic place-and-route, logic and timing simulation, and interactive design optimization. The -8 speed grade denotes the mid-tier performance bin of the XC3090L family, with faster -9/-10 grades unavailable in this part number and slower -6/-7 grades reserved for cost-sensitive designs. Typical applications include industrial control glue logic, legacy telecom backplane interfaces, military and aerospace retrofit boards, and educational laboratory trainers where designers migrate proven XC3000 designs forward without re-validating timing closure. The wide 5V tolerance and TTL-compatible I/Os also make it suitable for bridging older ASICs to newer microprocessors. When designing with this part, treat the 6.7 ns CLB delay as the budget floor for the slowest logic path: multiply by the number of cascaded CLBs and add interconnect delay to estimate the system clock. Configuration storage is volatile, so external PROMs (XC17xx) are required for standalone boot. This page synthesizes distributor stock, lifecycle status, same-package alternatives, and practical design notes not found in the standalone XC3090L datasheet, designed to assist sourcing engineers working on legacy Xilinx FPGA maintenance and obsolescence mitigation.
XC3090L-8TQG176C - 320 CLB FPGA, 6K Gates, 80MHz, TQFP-176 | Xilinx
The Xilinx XC3090L-8TQG176C is a 3.3 V, low-voltage CMOS Field Programmable Gate Array from the Xilinx XC3000L Logic Cell Array family, packaged in a 176-pin Thin Quad Flat Pack (TQFP). It contains 320 Configurable Logic Blocks (CLBs), delivers approximately 5,000 equivalent gates (with up to 6,000 usable gates), and supports system clock rates up to 80 MHz. What is an FPGA? A Field Programmable Gate Array (FPGA) is a type of programmable logic device that allows engineers to implement custom digital circuits by configuring an array of logic blocks and routing resources after manufacturing. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) within the semiconductor category, alongside Complex PLDs (CPLDs). They differ from CPLDs in architecture: FPGAs use a fine-grained array of look-up tables (LUTs) and SRAM-based configuration memory, offering higher logic density and richer register-rich datapaths, while CPLDs use macrocell-based, non-volatile architectures optimized for glue logic and fast pin-to-pin combinational delays. The Xilinx XC3000L family specifically targets low-voltage (3.3 V), high-volume designs where predictable timing and low power are required. Key features of the XC3090L-8TQG176C include 320 CLBs organized in a symmetric array, on-chip SRAM-based configuration memory (reprogrammable in-system), TTL-compatible I/O, and the -8 speed grade. The -8 speed grade corresponds to a slower timing bin, trading absolute clock frequency for lower cost; faster -6 and -7 bins are also offered in the same family. The device is configured externally from an EEPROM, EPROM, ROM, or disk file, with on-chip initialization logic handling the configuration handshake. Typical applications span legacy industrial control boards, telecommunications glue logic, prototyping of state machines and bus interfaces, and design migration from discrete TTL/CMOS MSI logic to a single programmable device. The TQFP-176 footprint is widely accepted for through-hole-era replacements and older PCI and ISA-style add-in cards where surface-mount assembly is feasible but BGA is not yet adopted. When designing with the XC3090L-8TQG176C, note that the part is in long-term EOL and should be qualified against remaining distributor stock before any new design-in. Designers should verify lead-free reflow compatibility (the original XC3000L family was specified for SnPb process), and confirm configuration mode (serial vs. parallel) against board-level pull-up resistors and DONE/PROG sequencing. This page synthesizes distributor stock levels, drop-in same-package XC3000L variants, and practical obsolescence-management notes not found in the original manufacturer datasheet.
XC3090L-8TQG176I - 9000 Gates FPGA, 80 MHz, 176-pin LQFP | Xilinx
The Xilinx XC3090L-8TQG176I is a CMOS Field Programmable Gate Array from the legacy XC3000L low-voltage family, offering approximately 5000 usable gates (up to 9000 equivalent system gates) implemented across 320 Configurable Logic Blocks (CLBs) in a 176-pin TQG/LQFP package. It supports a maximum clock frequency of 80 MHz with a CLB combinatorial delay of 6.7 ns at the -8 speed grade, targeting high-density glue-logic, prototyping, and industrial control applications where ASIC-class integration is not yet justified. What is an FPGA? A Field-Programmable Gate Array is a reconfigurable digital integrated circuit whose logic fabric and interconnect can be programmed by the end user after manufacture. Within the taxonomy of digital ICs, an FPGA sits between an Application-Specific Integrated Circuit (ASIC) and a microcontroller: an ASIC is hard-wired for one function but offers the lowest unit cost at high volume, while an FPGA trades per-unit cost for design flexibility, parallel hardware execution, and rapid time-to-market. The XC3000 family pioneered SRAM-based configuration and the now-universal island-style CLB + IOB + programmable interconnect architecture that defines the modern FPGA. Key features of the XC3090L-8TQG176I include on-chip SRAM-based configuration store, three types of configurable elements (perimeter I/O Blocks, core CLB array, and routing channels), industrial-grade -40C to +85C operating range (I suffix), and the low-voltage L-suffix core that reduces 5V-family power. The device is housed in a 176-terminal LQFP/TQFP package on a 0.5 mm pitch with gull-wing leads suitable for surface-mount assembly and rework. Technically, the XC3000L family uses a 5V-tolerant I/O structure with 3.3V or 5V core options, hierarchical interconnect including long lines, hex lines, and direct connects, and configurable IOBs that support registered, latched, or combinatorial I/O with tri-state control. The architecture integrates a configuration program store so the array can be re-programmed in-system via the standard Xilinx configuration interface. Typical applications span industrial control systems, telecommunications glue logic, prototyping platforms for ASIC emulation, test and measurement fixtures, military/aerospace subsystems, and educational development kits where students learn HDL synthesis on a mature, well-documented device family. The TQG176 package is the highest-density option for this die. When designing with the XC3090L-8TQG176I, note that this device family is mature (introduced in the early-to-mid 1990s), so verify long-term availability and second-source supply before committing new production designs. New designs should weigh migration to the Xilinx CoolRunner-II CPLD or Spartan-6/Spartan-7 FPGA families for active lifecycle status and modern toolchain support. This page synthesizes distributor pricing, XAIPART in-stock tiers, pin-compatible Xilinx drop-in alternatives drawn from the XC3000L family, and practical design notes on configuration, I/O banking, and legacy toolchain compatibility not found in the original datasheet.
XC3090LTM-100PC84C - 6K Gate, 320-Cell FPGA 5V 84-PLCC | Xilinx
The Xilinx XC3090LTM-100PC84C is a CMOS Field Programmable Gate Array (FPGA) from the legacy XC3000 Logic Cell Array family, delivering approximately 6,000 usable gates and 320 Configurable Logic Blocks (CLBs) in an 84-pin Plastic Leaded Chip Carrier (PLCC) package. Operating at 5V CMOS technology with a 100 MHz internal performance grade, the device is rated for commercial temperature conditions and targets low-voltage logic integration where fine-grained parallel logic is required. A Field Programmable Gate Array (FPGA) is a type of programmable logic device that combines the density of gate arrays with the design flexibility of in-system programmability. FPGAs sit at the top of the programmable logic hierarchy (PLD -> CPLD -> FPGA -> SoC FPGA) and are widely used to implement custom digital logic, glue logic, bus interfaces, and parallel datapaths without committing to a masked ASIC. The XC3000 family is the third-generation Xilinx architecture that introduced distributed Configurable Logic Blocks with look-up table-based logic, complemented by a programmable interconnect matrix and I/O blocks. Key features of the XC3090LTM-100PC84C include 320 CLBs, a typical gate count range of 5,000 to 6,000 gates, 100 MHz system performance, and 5V CMOS core technology. The PLCC-84 (PC84) package uses J-lead surface-mount terminals in a square ceramic/plastic body, supporting legacy through-hole-style PCB assembly processes. The XC3000 family pioneered SRAM-based configuration, allowing infinite re-programmability via an external configuration PROM or microcontroller bitstream load. From an architecture perspective, the XC3000L family uses 5V-tolerant I/O buffers, distributed RAM capability in select CLB modes, and a hierarchical interconnect that routes signals between logic blocks with predictable delay. The 'LTM' suffix designates the low-voltage / commercial temperature variant in the XC3000 family. Compared with modern 28nm or 16nm FPGAs, the XC3090LTM-100PC84C delivers modest logic density but remains useful for legacy board retrofits, education platforms, and industrial systems where proven long-life silicon is required. Typical applications include industrial control glue logic, legacy telecommunications interfaces, military and aerospace retrofits (through QML equivalents), educational FPGA training platforms, and digital signal preprocessing where low-cost parallel logic suffices. The 84-pin PLCC footprint is socket-compatible with the broader XC3000/XC3100/XC3300 84-pin PLCC family, simplifying board reuse across multiple design generations. When designing with this device, ensure proper configuration circuitry is included - the SRAM-based XC3000 family requires a configuration bitstream at every power-up. Plan for 5V supply decoupling, and verify I/O voltage compatibility with downstream CMOS or TTL peripherals. Engineers targeting new designs should consider the device's NRND/EOL status and confirm lifetime-buy availability for production runs. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, providing a single reference for engineers evaluating the XC3090LTM-100PC84C for both new designs and legacy support scenarios.
XC3090LTM-125PC84C - 5000 Gates XC3000L FPGA, 125MHz, PLCC-84 | Xilinx
The Xilinx XC3090LTM-125PC84C is a 5000-gate, 125 MHz Field Programmable Gate Array (FPGA) from the legacy XC3000L Low-Voltage Logic Cell Array family, housed in an 84-pin Plastic Leaded Chip Carrier (PLCC-84) package. It delivers approximately 5000 equivalent gates, 320 Configurable Logic Blocks (CLBs), and 928 flip-flops, with a maximum clock frequency of 125 MHz. The 'L' suffix denotes the low-voltage 3.3 V core variant, and 'TM' indicates the commercial plastic-leaded chip carrier package grade. An FPGA (Field Programmable Gate Array) is a programmable logic device that lets engineers implement arbitrary digital logic functions using an array of configurable logic blocks (CLBs) interconnected by a programmable routing matrix. Within the broader semiconductor taxonomy, an FPGA belongs to programmable logic devices (PLDs), which sit between fixed-function ASICs and discrete logic ICs in flexibility and integration. The XC3000L family was Xilinx's third-generation low-voltage FPGA line, succeeding the original XC3000 by operating from 3.0 V to 3.6 V supplies instead of 5 V, enabling lower power consumption for portable and battery-powered designs of the 1990s. Key features include 320 CLBs, 928 flip-flops, 138 user I/Os, 4.75 V to 5.25 V supply range for the I/O bank, an internal 3.3 V core, and a 125 MHz maximum toggle/clock frequency. The device supports JTAG-based boundary-scan testing, on-chip configuration memory, and tri-state output buffers per I/O. The PLCC-84 through-hole package provides robust mechanical mounting suitable for industrial and legacy equipment designs. Technically, the XC3090LTM-125PC84C uses SRAM-based configuration cells, meaning the bitstream must be loaded from an external ROM or microcontroller at every power-up. This volatile configuration enables unlimited re-programming cycles in the field, but requires a separate configuration PROM such as the XC1736 or compatible serial-loader device. The architecture implements a symmetrical array of CLBs surrounded by perimeter I/O blocks (IOBs), which was the industry-standard FPGA floorplan of that era. Typical applications include industrial control logic, telecom interface glue logic, legacy peripheral adapters, and test-and-measurement custom instrumentation. The wide I/O count (138) supports parallel buses and high-pin-count glue-logic designs. When designing with this FPGA, allocate at least 4 clock-pad pins for global clock distribution and ensure the configuration PROM timing aligns with the XC3090LTM power-on reset sequence. For new designs, consider migrating to a modern Xilinx 7-series or Spartan-6 device, since the XC3000L family is no longer recommended for new designs. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
XC3090LTM-8PC84C - XC3000L FPGA, 6K Gates, 84-PLCC | Xilinx
The Xilinx XC3090LTM-8PC84C is a member of the legacy XC3000L Low Voltage Logic Cell Array family, delivering approximately 6,000 usable gates in an 84-pin Plastic Leaded Chip Carrier (PLCC) package. The device is built on a 0.8-micron CMOS SRAM-based architecture and operates from a 3.0 V to 3.6 V core supply, with the "L" suffix designating low-voltage operation relative to the original 5 V XC3000 series. The "TM" suffix indicates a specific speed/grade combination within the XC3000L family. A Field Programmable Gate Array (FPGA) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnects, and programmable I/O cells. The user-defined logic function is loaded into on-chip static memory cells from an external boot source such as an EEPROM, EPROM, ROM, or microprocessor. Once configured, the FPGA behaves as a dedicated custom digital circuit. The XC3000 family was Xilinx's pioneering commercial FPGA line, establishing the FPGA architecture still dominant in the industry today, and the XC3000L variant extends that architecture to lower-voltage 3.3 V systems where power dissipation is a primary concern. Key features of the XC3090LTM-8PC84C include approximately 320 Configurable Logic Blocks (CLBs), 64,160 bits of distributed configuration memory, and an 84-pin PLCC package with J-lead surface-mount terminations. The device supports in-system configuration via the Xilinx XC3000 configuration bitstream and is footprint-compatible with other XC3090L members that share the PC84 pinout. Logic delays are typically in the 5-10 ns range, sufficient for moderate-speed glue logic, bus interfacing, state-machine implementation, and small processor prototyping on 3.3 V rails. Typical applications include legacy 3.3 V digital glue logic replacement, prototype ASIC emulation, custom peripheral interfacing for microcontrollers, parallel bus arbitration, and industrial control subsystems where 5 V FPGAs are no longer acceptable. The 84-PLCC package also supports through-hole and socket-based prototyping, which is convenient for engineering development and low-volume production. Designers should note that the XC3000L family is legacy silicon - the Xilinx WebPACK and modern Vivado tools do not support these devices. Programming requires the legacy XACT or older Foundation toolchains, and configuration bitstreams generated for XC4000, Spartan, or 7-series FPGAs are incompatible. Engineers maintaining legacy systems should verify the configuration PROM and toolchain availability before committing to new designs.
XC3S1600E-4FG484I - 1.6M Gate Spartan-3E FPGA | AMD Xilinx
The AMD Xilinx XC3S1600E-4FG484I is a Spartan-3E family Field Programmable Gate Array (FPGA) delivering 1.6 million system gates, 33,192 logic cells, and 376 user I/Os in a 484-ball Fine-Pitch Ball Grid Array (FBGA) package. Fabricated on a 90nm CMOS process with a 1.2V core supply, this industrial-temperature device (I suffix, -40C to +100C) runs at speed grade -4 and integrates 29,504 registers and 648 Kbits (663,552 bits) of distributed and block RAM. An FPGA (Field Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks (CLBs) and programmable interconnects that the designer configures in the field via HDL (VHDL/Verilog). Within the programmable logic hierarchy, the FPGA sits above CPLDs in capacity and sits alongside ASSPs as a core digital logic implementation platform for system-on-chip prototyping and production designs. Key features of the XC3S1600E include 3,688 CLBs/LABs providing high logic density, 572MHz maximum toggle capability supported by dedicated digital clock managers (DCMs), and abundant block RAM for FIFOs and dual-port memories. The 376 I/Os support multiple I/O standards with configurable banks, enabling wide data-path interfaces. Architecturally, the Spartan-3E platform uses a 4-input look-up table (LUT) based fabric with dedicated carry logic, multiplier blocks, and DCMs for clock conditioning - well suited to cost-sensitive control, glue logic, and DSP-lite tasks. The 90nm process keeps core power low at 1.2V while retaining robust routing flexibility. Typical applications include industrial control and automation, embedded system prototyping, data acquisition glue logic, motor control interfaces, and communications line cards. The wide 376-I/O budget makes it a natural fit for bus bridging and parallel-to-serial adaptation. A key design consideration: the Spartan-3E family is mature, so plan configuration via a platform Flash PROM (such as XCF-series) and verify 1.2V core, 3.3V auxiliary, and I/O bank rails meet sequencing guidance in the datasheet. This page synthesizes distributor pricing, drop-in alternatives, comparison tables, and practical design notes not found in the manufacturer datasheet.
XC3S1600E-5FGG320C - Spartan-3E FPGA 1.6M Gates | AMD/Xilinx
The AMD (Xilinx) XC3S1600E-5FGG320C is a Spartan-3E family FPGA with 1.6 million system gates, 33,192 logic cells, and 250 user I/Os, fabricated on 90nm CMOS process technology and housed in a 320-ball fine-pitch BGA (FGG320, 19x19 mm) package. It operates from a 1.2V core supply (1.14V to 1.26V) with a commercial temperature range of 0C to 85C junction, and speed grade -5. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks (CLBs), embedded memory, and programmable interconnects that designers configure via a hardware description language such as Verilog or VHDL. Within the semiconductor hierarchy, an FPGA sits under programmable logic devices, alongside CPLDs and ASICs, and is used to implement custom digital logic without fabricating a custom chip. Key features of the XC3S1600E include a large 1.6M-gate fabric for mid-density designs, 250 user I/Os supporting multiple I/O standards, Spartan-3E cost-optimized architecture, and availability of configuration via platform flash devices such as the XCF32P. The Spartan-3E family was widely adopted in telecommunications, industrial control, and consumer electronics, per Microchip USA product data. Architecturally, the Spartan-3E fabric uses 4-input look-up tables (LUTs), dedicated carry logic, block RAM, and embedded multipliers, enabling DSP datapaths, glue logic consolidation, bus interfaces, and control sequencing on a single chip. Typical applications include industrial control systems, telecommunications line cards, test equipment, motor control interfaces, and legacy system sustenance where a proven mid-density FPGA is already designed in. Design consideration: this part is officially obsolete and no longer manufactured, per DigiKey lifecycle data, so new designs should evaluate AMD 7-series (Spartan-7, Artix-7) or cross-brand alternatives; existing designs should secure stock or a qualified migration path. This page synthesizes distributor pricing, drop-in alternatives, lifecycle status, and practical design notes not consolidated in the manufacturer datasheet.
XC3S1600EFG400 - Spartan-3E FPGA 1.6M Gates | AMD/Xilinx
The AMD/Xilinx XC3S1600EFG400 is a member of the Spartan-3E family of Field Programmable Gate Arrays (FPGAs), offering a high-density programmable logic solution with 33,192 logic cells and an equivalent gate count of 1,600,000. Housed in a 400-ball FBGA package (FG400), this device provides 304 user I/O pins and 663,552 bits of block RAM, making it suitable for a wide range of digital designs. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing—hence 'field-programmable'. FPGAs consist of an array of programmable logic blocks, interconnects, and I/O blocks, allowing the implementation of complex digital circuits without the need for custom fabrication. They are a subset of programmable logic devices (PLDs) and are widely used in prototyping, low-to-medium volume production, and applications requiring reconfigurability. Key features of the XC3S1600EFG400 include 33,192 logic cells, 663,552 bits of block RAM, and support for a maximum clock frequency of 572 MHz. The device operates from a 1.2V core voltage and is manufactured using advanced CMOS technology. The FG400 package offers 400 balls with a 1.00 mm pitch, providing a compact footprint for space-constrained designs. The Spartan-3E architecture is optimized for high performance and low cost, featuring dedicated multipliers, digital clock managers (DCMs), and support for various I/O standards including LVCMOS, LVTTL, and differential standards. The device also includes configuration support via JTAG, SPI, and SelectMAP interfaces, enabling flexible system integration. Typical applications for the XC3S1600EFG400 include industrial control, automotive infotainment, consumer electronics, and communication systems. Its balance of logic density, I/O count, and cost makes it ideal for bridging ASIC prototyping and production. When designing with this FPGA, careful attention must be paid to power supply decoupling and configuration bitstream storage. The 1.2V core requires stable power, and the configuration data is typically stored in an external SPI flash, which must be selected for compatibility.
XC3S200-4FTG256I - Spartan-3 FPGA 200K Gates | Xilinx
The Xilinx XC3S200-4FTG256I is a Spartan-3 family field programmable gate array (FPGA) offering 200,000 system gates and 4,320 logic cells in a 256-ball FineLine BGA (FTG256) package, with a 1.2V core voltage, industrial temperature rating of -40C to +100C, and a -4 speed grade supporting internal performance up to approximately 630 MHz. A field programmable gate array is a semiconductor device containing a fabric of configurable logic blocks (CLBs), programmable interconnects, and I/O blocks that the designer configures after manufacturing. FPGAs sit within the broader programmable logic hierarchy: CLB -> FPGA -> programmable logic device -> digital IC. Unlike fixed-function ASICs, FPGAs allow field reprogramming, making them ideal for prototyping, low-to-medium volume production, and designs requiring in-service updates. Key features of the XC3S200 include 2,160 slices built on a 90nm process technology, 12 blocks of 18Kbit block RAM totaling 216 Kbits of embedded dual-port memory, four 18x18 hardware multipliers for DSP operations, a Digital Clock Manager (DCM) for clock deskew and frequency synthesis, and up to 173 user I/Os supporting multiple I/O standards such as LVTTL, LVCMOS, SSTL, and LVDS on bank-selectable VCCO rails. Technically, the Spartan-3 fabric uses a four-input lookup table (LUT) per slice logic cell with dedicated fast carry logic for arithmetic chains. The -4 speed grade denotes the fastest standard commercial/industrial timing bin of the Spartan-3 family. Configuration is performed via serial or parallel PROMs (Xilinx Platform Flash) in Master/Slave Serial or SelectMAP modes with JTAG boundary-scan support per IEEE 1149.1. Typical applications include industrial control and motor drive logic, communication protocol bridging, test and measurement instrumentation, and embedded coprocessing with the hardware multipliers for modest DSP tasks. The 17x17mm FTBGA footprint suits space-constrained boards requiring high I/O density. A key design consideration is power: the 1.2V core requires a dedicated regulator, and I/O bank VCCO supplies must match the connected logic standards; total power scales with clock frequency and toggle rates, so use the Xilinx power estimator early in design. This page synthesizes verified distributor data, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
XC3S200A-4FTG256I - 200K Gate Spartan-3A FPGA, 195 I/O | AMD/Xilinx
The AMD/Xilinx XC3S200A-4FTG256I is a Spartan-3A family Field Programmable Gate Array (FPGA) with 200,000 system gates, 4,032 logic cells, and 195 user I/Os in a 256-ball FineLine Thin-profile BGA (FTG256) package at industrial temperature grade (I suffix). Built on 90nm CMOS technology with a 1.2V core, the device targets cost-sensitive, high-volume digital logic applications. An FPGA (Field Programmable Gate Array) is a class of programmable logic device that allows engineers to implement arbitrary digital circuits using a matrix of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware blocks such as block RAM and multipliers. Within the broader semiconductor taxonomy, FPGAs sit alongside ASICs and CPLDs as reconfigurable logic; the Spartan-3A family is Xilinx's low-cost, high-volume segment designed for consumer, industrial, and communications glue-logic applications. Key specifications of the XC3S200A-4FTG256I include 448 Configurable Logic Blocks (CLBs), 288 Kbits of block RAM, up to 667 MHz maximum operating frequency (speed grade -4), dedicated 18x18 hardware multipliers for DSP, and a Digital Clock Manager (DCM) block for clock synthesis. The FTG256 package measures 17x17 mm and uses a 1.0 mm ball pitch. Architecturally, the Spartan-3A integrates CLBs arranged in rows and columns, surrounded by IOBs (I/O blocks), with block RAM columns interleaved, four DCMs, and dedicated multiplier blocks. The device supports multiple I/O standards including LVTTL, LVCMOS, LVDS, and differential HSTL/SSTL for direct interface to external memories and high-speed peripherals. Typical applications include industrial control and machine vision, consumer electronics display controllers, communications protocol bridges, low-cost video processing, motor control, and educational/hobbyist development boards. The wide operating temperature range (-40C to +100C industrial grade) also suits factory automation and outdoor equipment. Designers should pay attention to the FTG256 ball-pinout for PCB layout: a 256-ball BGA with 1.0 mm pitch requires 4-6 layer PCB design with microvia or via-in-pad technology for reliable assembly. Use Xilinx ISE WebPACK or the modern AMD Vivado/Vivado Lab Edition for configuration bitstream generation. Power estimation should be performed with the Xilinx Power Estimator (XPE) tool before finalizing thermal management. This page consolidates current distributor pricing, verified pin-compatible drop-in alternatives in the Spartan-3A family, and practical design notes - practical context not found in the bare manufacturer datasheet.
XC3S400A-4FTG256C - Spartan-3A FPGA, 400K Gates, 256-FTBGA | AMD
The AMD (Xilinx) XC3S400A-4FTG256C is a Spartan-3A Field Programmable Gate Array (FPGA) with 400,000 system gates, 8,064 logic cells, and 195 user I/Os housed in a 256-ball Fine-Pitch Thin Ball Grid Array (FTBGA) measuring 17 × 17 mm. Built on a 90 nm CMOS process, the part operates across 0°C to +85°C commercial temperature range and supports up to 770 MHz internal clock performance per the Spartan-3A family datasheet. A Field Programmable Gate Array (FPGA) is a type of programmable logic device (semiconductor IC) that lets engineers configure digital logic, memory blocks, and I/O behavior after manufacture. Within the broader taxonomy, the Spartan-3A sits under FPGA -> programmable logic -> logic ICs -> integrated circuits -> semiconductor. FPGAs like the Spartan-3A family are used as flexible hardware platforms that replace large clusters of discrete glue logic, custom ASICs, and processor peripherals, enabling rapid design iteration without a fabrication spin. Key differentiating features of the XC3S400A include 368,640 bits of embedded Block RAM distributed across 20 dedicated blocks (each 18 Kbit), 4 dedicated silicon hardware multipliers (18 × 18-bit signed), 4 Digital Clock Managers (DCMs) for clock conditioning, and integrated configuration support for SPI, BPI, and JTAG modes. The 256-FTBGA package offers high board-density and a low-profile mounting footprint suitable for portable and embedded products, while the commercial speed/grade designation ("-4") reflects the timing/voltage balance selected for general-purpose logic systems. Architecturally, the Spartan-3A uses a structured ASIC-style fabric of Configurable Logic Blocks (CLBs), a hierarchical routing network, and a hardened set of I/O standards including LVCMOS, LVTTL, LVDS, and HSTL. The four silicon multipliers deliver deterministic DSP performance independent of slice utilization, while the four DCMs provide frequency synthesis, phase shifting, and jitter filtering on a per-clock-domain basis. Typical applications for the XC3S400A-4FTG256C include industrial control and factory automation backplanes, video/image processing front-ends, low-density DSP pipelines, embedded display controllers, automotive infotainment prototyping, communications glue logic, and legacy parallel-interface bridges between microcontrollers and high-speed peripherals. Its combination of moderate logic density and ample Block RAM makes it a strong fit for cost-sensitive designs that would otherwise require several smaller FPGAs. When designing with the 17 × 17 mm FTG256 package, allocate at least four PCB layers with a solid ground plane under the device to control simultaneous switching noise (SSN). All I/O banks must share a common Vcco reference per bank, and unused pins should be left floating per AMD/Xilinx guidelines to avoid leakage paths during configuration. This page synthesizes distributor pricing, drop-in same-package alternatives (XC3S400A-4FTG256I and XC3S400-4FTG256C), and practical design notes not consolidated in the manufacturer datasheet alone.
XC3S50-4CP132I - 50K-Gate Spartan-3 FPGA | Xilinx
The Xilinx XC3S50-4CP132I is a 50,000-system-gate Spartan-3 field-programmable gate array in a 132-terminal, approximately 8 mm square TFBGA package. Verified listings identify the device as a 192-CLB FPGA, while one comparison source states 630 MHz and 90 nm process technology. The “-4” ordering code identifies the performance grade, “CP” identifies the package family, “132” identifies the terminal count, and “I” identifies the industrial temperature grade. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic, interconnect, and programmable I/O resources can be configured after manufacture. Within the product hierarchy, an FPGA is a programmable logic device and a configurable semiconductor. Spartan-3 devices target cost-sensitive embedded systems where parallel logic, state machines, protocol handling, data acquisition, and modest control functions must fit into a compact board area. The verified sources report 50,000 system gates and 192 configurable logic blocks. The DigiKey result for the closely identified XC3S50-4CPG132I also reports 73,728 registers and 1,728 logic cells, but those figures were not explicitly supplied for XC3S50-4CP132I and therefore are not treated as target specifications here. The target belongs to the Spartan-3 family and is suitable for consumer, automotive, industrial, telecommunications, communications-hardware, and embedded-control applications. The CP132 package uses ball terminals and is identified by sources as TFBGA or CSPBGA. Because it is a fine-pitch, 132-terminal surface-mount package, PCB layout quality directly affects assembly yield and long-term reliability. Its approximately 8 mm square body demands exact land-pattern, solder-mask, stencil, and component-placement verification against the manufacturer package drawing before fabrication. Typical designs use configurable logic for acquisition control, sensor conditioning, digital filtering, communications, industrial interfaces, and compact embedded systems. Unlike a microcontroller, this FPGA performs parallel operations in hardware and can achieve deterministic latency after configuration. Designers must still supply configuration memory or another supported configuration source, clocking, decoupling, I/O standards, and a valid power-distribution network. The primary procurement caution is lifecycle and exact-ordering-code validation. Multiple distributors reported inventory in October 2026, but long-term availability should be confirmed for the production quantity rather than inferred from a single marketplace listing. Rochester Electronics reported 22.534 units and a starting unit price of $2.10, while another marketplace result reported 5,641 pieces; these figures are source-specific and should not be treated as guaranteed consolidated stock. This page consolidates verified package, capacity, market-availability, and cross-reference information with a strict analysis of whether any candidate is truly drop-in compatible. Unlike a generic distributor listing, it also distinguishes exact evidence from unavailable electrical, pin-level, lifecycle, and certification details so engineers can identify what still requires manufacturer-documentation review.
XC3S50-4CPG132C0974 - Spartan-3 FPGA, 50K Gates, 132-CSBGA | AMD
The AMD (formerly Xilinx) XC3S50-4CPG132C0974 is a Spartan-3 Field Programmable Gate Array offering 50,000 system gates, 1,728 logic cells, and 89 user I/Os in a 132-ball Chip-Scale BGA (CSBGA / TFBGA) package. The device is part of the lowest-density Spartan-3 family, designed for cost-sensitive, high-volume applications requiring programmable logic glue, custom bus interfaces, and low-cost DSP functions without the overhead of higher-density FPGAs. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that the designer configures after manufacture. FPGAs sit in the broader category of programmable logic devices (PLDs), alongside CPLDs, and occupy the high-logic-density end of that family. Within a digital system, an FPGA typically handles parallel processing, high-speed glue logic, custom peripheral bridging, and rapid-prototype ASIC replacement. Key differentiating features of the XC3S50 include 73,728 bits of distributed SelectRAM, 16 dedicated 18x18 hardware multipliers (DSP48-style slices for Spartan-3), four Digital Clock Managers (DCMs) for zero-delay clock alignment and frequency synthesis, and JTAG IEEE 1149.1/1532 boundary-scan support. The 132-ball CSBGA package supports up to 89 user I/Os at densities appropriate for industrial control, consumer, and communications glue logic. The speed grade -4 indicates a mid-range timing bin (faster than -5, slower than -3) optimized for design margin rather than peak performance. The Spartan-3 architecture combines a sea-of-CLBs fabric with block RAM tiles, multipliers, and DCMs stitched together by a hierarchical routing network. The 90 nm process node and 1.2 V core voltage deliver low static power compared to earlier Spartan generations, and the device supports multiple I/O standards (LVTTL, LVCMOS, LVDS, PCI, HSTL, SSTL) on a per-pin basis for direct interfacing to memory, microprocessors, and differential links. The -C suffix indicates a commercial temperature grade (0 C to +85 C). Typical applications include consumer electronics glue logic, industrial control and machine interfaces, low-cost DSP pre/post-processing, custom peripheral expansion for microcontrollers, and legacy ASIC replacement in production. Designers select the Spartan-3 family for non-volatile-free, lowest-cost FPGA deployment where the simplicity of SRAM configuration is acceptable. When designing with the XC3S50-4CPG132C0974, ensure that the configuration memory (typically an external SPI flash or Platform Flash) is sized appropriately for the bitstream and that the JTAG chain is accessible for in-system programming. Consider migrating to the pin-compatible Spartan-3AN or Spartan-6 family for new designs that require non-volatile configuration or lower power. This page synthesizes distributor pricing, drop-in Spartan-3 family alternatives, and practical design notes not found in the bare manufacturer datasheet front matter.
XC3S50-4CPG132I - 1728-Logic-Cell Spartan-3 FPGA | AMD
AMD XC3S50-4CPG132I is a Spartan-3 field-programmable gate array with 1,728 logic cells, 89 user I/O, and 73,728 RAM bits in a 132-pin TFBGA/CSPBGA package. The device operates from a 1.14 V to 1.26 V supply and is specified for a -40°C to 100°C junction-temperature range. Its -4 speed designation identifies the performance grade used by the ordering code, while the I suffix identifies the industrial temperature option. A field-programmable gate array is a semiconductor device whose digital logic and interconnect structures are configured after manufacture. An FPGA sits above programmable logic within the broader semiconductor hierarchy and differs from a fixed-function application-specific integrated circuit because one package can implement many control, interface, datapath, or communication designs. This configurability is useful when product requirements evolve, production volumes warrant custom logic, or a system needs parallel processing beyond a simple microcontroller. The verified device data identifies 192 LABs or CLBs, 89 I/O, and 73,728 RAM bits. These resources support parallel state machines, control logic, data acquisition, communications, and embedded control functions. The Spartan-3 architecture is specifically associated with a 1.2 V-class supply in the supplied results, but individual bank requirements, configuration interfaces, AC/DC limits, and timing values must be checked in the official family documentation before implementation. Typical uses include industrial controllers, data-acquisition systems, communication peripherals, instrumentation, embedded processors, and compact control platforms. Its 89 available I/O provide external interfaces for clocks, serial links, digital buses, status indicators, and actuator controls. Designers should account for the 132-ball package when planning fanout and PCB escape routing, and must preserve the exact ball assignments used by the selected board design. For a new board, XC3S50-4CPG132I is appropriate when its 1,728 cells and 73,728 RAM bits satisfy the design and when an industrial-temperature, 1.2 V-class FPGA is required. For a direct replacement, compatibility must include the 132-ball footprint, exact ball map, supply rails, I/O standards, configuration interface, timing margin, and bitstream support rather than package count alone. This product record combines verified source specifications, procurement context, and engineering checks that should precede substitution. It distinguishes confirmed values such as cell count, RAM, I/O, voltage, package, and temperature from data that still requires the official pinout, price, lifecycle, and electrical-characteristic tables.
XC3S50-4PQ208C - 50K Gate Spartan-3 FPGA | AMD
The AMD XC3S50-4PQ208C is a 50,000-system-gate Spartan-3 field-programmable gate array with 1,728 logic cells, 124 user I/O pins, and a 208-pin PQFP package. The supplied data identifies a 1.2 V device and a maximum stated frequency of 630 MHz. Its architecture combines configurable logic, programmable I/O, and 73,728 total RAM bits in a cost-optimized device intended for logic-intensive embedded and control systems. A field-programmable gate array is a semiconductor device whose logic and interconnect resources are configured after fabrication. FPGAs sit above simple fixed-function logic devices in the hardware hierarchy because designers can implement counters, state machines, interfaces, control logic, and signal processing without manufacturing a custom integrated circuit. The Spartan-3 family targets applications where moderate logic density, flexible I/O, and economical implementation are more important than the very high capacity of larger FPGAs. The XC3S50-4PQ208C provides 50,000 system gates and 1,728 logic cells, while the supplied distributor information reports 124 user I/O pins. Its 73,728 RAM bits can support small internal buffers, lookup-table-based storage, counters, and communication state. The 208-pin PQFP package is a leaded surface-mount package that is easier to inspect and rework than a very fine-pitch BGA, although its 208 leads require a substantially larger board footprint. The device is associated with 90 nm technology and a 1.2 V supply in the supplied product references. The -4 designation is associated with the device’s speed grade, while the C suffix identifies the commercial temperature/grade coding used by the manufacturer’s ordering system. Exact timing constraints should be taken from the applicable Xilinx Spartan-3 datasheet and the selected design package. Typical uses include industrial control, instrumentation, communications, embedded systems, consumer electronics, and compact digital logic platforms. The 124 available I/O pins make the device useful when a design requires more external connectivity than a small FPGA package provides. The internal RAM can support protocol state, data buffering, and lookup functions without using external memory when the required storage is small. Designers should verify the exact pinout, power rails, decoupling requirements, configuration interface, I/O standards, and timing constraints against the official Spartan-3 documentation before layout. The PQFP footprint requires adequate solder mask and paste design around 208 leads, while the FPGA’s configuration pins, clock inputs, and I/O buffers must be planned during schematic capture. This page consolidates distributor and manufacturer-linked reference information, including logic density, RAM, I/O count, package, voltage, and stated frequency, and provides engineering guidance for selecting and integrating the XC3S50-4PQ208C. Availability, pricing, lifecycle status, and exact electrical limits should be confirmed against the current authorized source data.
XC3S50-4PQ208I - 50K Spartan-3 FPGA, 208-Pin | Xilinx
The Xilinx XC3S50-4PQ208I is a Spartan-3 field-programmable gate array with 50,000 system gates, 1,728 logic elements, 124 user I/O pins, and a 208-pin BFQFP package. According to the verified product data, it uses 1.2 V core technology, offers 73,728 RAM bits, and is rated for an operating temperature range of 0°C to 85°C. The device is designed for programmable logic, embedded control, communications, and cost-sensitive digital systems. A field-programmable gate array is a semiconductor device whose digital logic is configured after manufacture. An FPGA combines programmable logic blocks, programmable interconnect, input/output blocks, and memory resources into a flexible parallel-processing platform. The Spartan-3 family targets designs that need more capability than simple fixed-function logic while retaining cost, power, and design-entry advantages appropriate to compact embedded systems. The XC3S50-4PQ208I provides 50,000 system gates, 1,728 logic cells, 124 user I/O pins, and 73,728 RAM bits. Its -4 speed designation identifies the verified performance grade, while the I suffix denotes the specified industrial temperature class. The 208-BFQFP package provides 208 physical terminals for PCB integration, with gull-wing leads and a square package format. The verified distributor listing also identifies 1.2 V FPGA operation and 90 nm technology. Because the device is programmable, engineers can implement parallel datapaths, control logic, interfaces, state machines, and signal-processing functions in one integrated device. The Spartan-3 architecture is useful when deterministic hardware timing and flexible post-build updates are more valuable than the simplicity of a fixed-function microcontroller or small PLD. Resource counts should be checked against the complete Xilinx datasheet before assigning a large design, especially when block RAM, DSP, clocking, or high-speed I/O requirements are substantial. Typical uses include industrial control, communications interfaces, test equipment, instrumentation, embedded gateways, and compact control systems. The 124 user I/O pins are useful for parallel buses, status LEDs, capture logic, and external interfaces. Designers must also budget pin multiplexing, clocking, configuration memory or configuration sources, I/O standards, power rails, and board-level signal integrity; those details are not fully specified in the supplied search data and must be verified against the manufacturer datasheet. A key design consideration is that an FPGA replacement must match the physical package, pinout, electrical limits, configuration method, memory resources, and timing requirements. The verified search results identify no pin-compatible substitute in the supplied cross-reference data, so a footprint-compatible replacement should not be assumed. This page consolidates verified specifications, sourcing links, application guidance, and the limitations of the available replacement data.
XC3S50-4PQG208I - Spartan-3 FPGA, 50K Gates, PQFP-208 | AMD/Xilinx
The AMD/Xilinx XC3S50-4PQG208I is a Spartan-3 family field-programmable gate array (FPGA) delivering 50,000 system gates, 1,728 logic cells, and 124 user I/O pins in a 208-pin plastic quad flat pack (PQFP / BFQFP) surface-mount package. The device operates from a 1.14V to 1.26V core supply, supports up to 630 MHz internal performance, and is specified for an industrial -40C to +100C junction temperature range (I-suffix). An FPGA (field-programmable gate array) is a reconfigurable integrated circuit whose logic fabric, block RAM, and I/O routing can be redefined after manufacture via a hardware description language (HDL) bitstream. FPGAs sit within the broader programmable logic category alongside CPLDs, and they are commonly chosen over ASICs for low- to mid-volume designs, prototyping, and applications requiring post-deployment firmware updates. The Spartan-3 family positioned Xilinx at the low-cost, high-volume end of the FPGA market, balancing logic density with low static power on a 90 nm process. Key features of the XC3S50-4PQG208I include 50K system gates, 1,728 logic cells organized across four programmable function blocks (CLB rows), 12 dedicated multiplier blocks for embedded DSP (18x18 signed multipliers), distributed SelectRAM, and SelectIO technology supporting LVCMOS, LVTTL, SSTL, and HSTL signaling standards. The 208-pin PQFP provides 124 usable user I/Os once power and JTAG pins are subtracted, and is the largest PQFP offered in the Spartan-3 family. Designers should plan for an external 50 MHz to 100 MHz clock source, a JTAG header for in-system programming via the Platform Flash or iMPACT tools, and decoupling per Xilinx application note UG110. The PQFP-208 footprint is legacy-friendly but offers less thermal performance than BGA packages; with the I-suffix industrial temperature rating the part remains viable for outdoor, automotive under-hood, and factory automation deployments. Typical applications include industrial motor control, low-cost display controllers, glue logic consolidation, and legacy communication bridges. This page synthesizes distributor pricing, drop-in alternative MPNs, and practical PCB-layout design notes not found in the manufacturer datasheet alone.
XC3S50-4TQ144C - 50K-Gate Spartan-3 FPGA | AMD
The AMD XC3S50-4TQ144C is a Spartan-3 field-programmable gate array with 50,000 system gates, 1,728 logic cells, 97 user I/Os and 73,728 RAM bits in a 144-LQFP package. It operates from a 1.2 V supply and belongs to the Spartan-3 FPGA family. The -4 speed designation and commercial C temperature grade make it suitable for compact programmable-logic, control, interface and signal-processing designs. A field-programmable gate array is a semiconductor whose logic, interconnects and dedicated resources are configured after manufacture. The FPGA product hierarchy places the XC3S50-4TQ144C among FPGAs, programmable-logic devices and digital semiconductors. Unlike a fixed-function application-specific integrated circuit, an FPGA can implement parallel control logic, state machines, protocol interfaces and data-processing pipelines in one configurable device. The verified listing identifies 192 logic array blocks, 97 user I/O pins, 73,728 RAM bits and 1,728 logic cells. These resources support concurrent datapaths and moderate control complexity. The 1.2 V core supply can simplify power architecture when paired with appropriate I/O voltage selection, although the complete board design must follow the manufacturer’s bank-specific voltage and decoupling guidance. Architecturally, the Spartan-3 device combines configurable logic blocks, programmable routing, dedicated block RAM and hard input/output resources. This allows designers to balance parallel logic against memory-based pipelines. Compared with larger members of the Spartan-3 family, the XC3S50 emphasizes compact capacity and cost rather than maximum logic density. Typical uses include industrial control, embedded instrumentation, communication-interface bridges, low-pin-count peripheral expansion, digital signal-processing front ends and general embedded control. A 144-LQFP package also provides a familiar gull-wing footprint for conventional multilayer PCB assembly, although its fine pitch requires controlled soldering and inspection. Designers should verify the complete pinout, supported I/O standards, configuration interface and unused-pin requirements against the manufacturer datasheet before layout release. The sparse verified data does not expose a manufacturer part page or complete electrical table, so power, timing and pin details must not be inferred. This page consolidates verified distributor specifications, package evidence, sourcing links and candid data-gap notes. It also separates exact published facts from unavailable electrical, pricing, lifecycle and pin-level information so engineers can make a safer FPGA selection.
XC3S50-4TQ144I - 50K Spartan-3 FPGA, 144-LQFP | AMD
AMD XC3S50-4TQ144I is a Spartan-3 field-programmable gate array (FPGA) with 50,000 system gates, 1,728 logic cells, 90 nm CMOS technology, and a 1.2 V supply in a 144-pin LQFP package. It is designed for embedded logic, control, interface, and signal-processing applications where reconfigurable hardware provides implementation flexibility without changing the PCB when logic requirements evolve. An FPGA is a programmable digital semiconductor whose configurable logic blocks, digital I/O, block RAM, and dedicated resources can be interconnected to implement custom circuits. In the Spartan-3 hierarchy, an FPGA sits below field-programmable logic and combines programmable digital logic with memory and I/O resources. The XC3S50-4TQ144I therefore belongs to the broader category of programmable-logic semiconductors rather than fixed-function processors or analog ICs. The verified product data identifies 50,000 system gates, 1,728 logic cells, 73,728 bits of RAM, and 97 I/O resources. The part is offered in a surface-mount 144-pin LQFP package and uses a 1.2 V FPGA supply as identified by distributor data. Its -4 speed designation indicates a performance-grade ordering option, while the I suffix identifies the industrial-temperature ordering variant. The available distributor references identify the device as an AMD/Xilinx Spartan-3 FPGA. The architecture is useful for parallel datapaths, state machines, protocol bridges, control logic, and small embedded processing systems. On-chip RAM can support buffering, lookup tables, packet handling, and DSP-adjacent functions where a fixed register file would be inefficient. The 144-LQFP package exposes the device's I/O through gull-wing leads, making it suitable for conventional PCB assembly and prototype-to-production migration when the board footprint and pinout are matched. Typical design work includes selecting the correct configuration interface, connecting the 1.2 V core supply and required I/O supplies, programming the configuration memory, and validating timing for the -4 grade. Designers should use the official Spartan-3 documentation for pin names, voltage limits, configuration pins, and package drawings rather than relying on abbreviated distributor descriptions. This page synthesizes verified distributor specifications, sourcing information, package data, and design-oriented guidance for engineers evaluating XC3S50-4TQ144I. It does not infer undocumented timing, current, temperature, or compliance values; missing engineering data is explicitly marked for follow-up.