Xilinx

XC3090L-8TQG176C - 320 CLB FPGA, 6K Gates, 80MHz, TQFP-176 | Xilinx

N.º da peça: XC3090L-8TQG176C ✗ Fim de vida

Em estoque Enviado em 1 a 3 dias úteis

3.3 V Vdss TQFP-176 (TQG176) Package 80 MHz Speed Internal SRAM (reprogrammable) Memory

A partir de $28.75 USD / unidade

MOQ: 1 |

Preço atualizado: 2026-09-13

Preços por volume

Qtd.	Preço unitário	Total
1	$45	$45,00
10	$41	$410,00
100	$36.5	$3.650,00
500	$32	$16.000,00
1.000	$28.75	$28.750,00

ℹ️ Todos os preços estão em USD

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XC3090L-8TQG176C Visão geral

The Xilinx XC3090L-8TQG176C is a 3.3 V, low-voltage CMOS Field Programmable Gate Array from the Xilinx XC3000L Logic Cell Array family, packaged in a 176-pin Thin Quad Flat Pack (TQFP). It contains 320 Configurable Logic Blocks (CLBs), delivers approximately 5,000 equivalent gates (with up to 6,000 usable gates), and supports system clock rates up to 80 MHz.

What is an FPGA? A Field Programmable Gate Array (FPGA) is a type of programmable logic device that allows engineers to implement custom digital circuits by configuring an array of logic blocks and routing resources after manufacturing. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) within the semiconductor category, alongside Complex PLDs (CPLDs). They differ from CPLDs in architecture: FPGAs use a fine-grained array of look-up tables (LUTs) and SRAM-based configuration memory, offering higher logic density and richer register-rich datapaths, while CPLDs use macrocell-based, non-volatile architectures optimized for glue logic and fast pin-to-pin combinational delays. The Xilinx XC3000L family specifically targets low-voltage (3.3 V), high-volume designs where predictable timing and low power are required.

Key features of the XC3090L-8TQG176C include 320 CLBs organized in a symmetric array, on-chip SRAM-based configuration memory (reprogrammable in-system), TTL-compatible I/O, and the -8 speed grade. The -8 speed grade corresponds to a slower timing bin, trading absolute clock frequency for lower cost; faster -6 and -7 bins are also offered in the same family. The device is configured externally from an EEPROM, EPROM, ROM, or disk file, with on-chip initialization logic handling the configuration handshake.

Typical applications span legacy industrial control boards, telecommunications glue logic, prototyping of state machines and bus interfaces, and design migration from discrete TTL/CMOS MSI logic to a single programmable device. The TQFP-176 footprint is widely accepted for through-hole-era replacements and older PCI and ISA-style add-in cards where surface-mount assembly is feasible but BGA is not yet adopted.

When designing with the XC3090L-8TQG176C, note that the part is in long-term EOL and should be qualified against remaining distributor stock before any new design-in. Designers should verify lead-free reflow compatibility (the original XC3000L family was specified for SnPb process), and confirm configuration mode (serial vs. parallel) against board-level pull-up resistors and DONE/PROG sequencing.

This page synthesizes distributor stock levels, drop-in same-package XC3000L variants, and practical obsolescence-management notes not found in the original manufacturer datasheet.

Alternativas drop-in para XC3090L-8TQG176C — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com XC3090L-8TQG176C (mesmo formato e footprint) — diferindo em Package, Family, Configuration Memory, Process Technology, Speed Grade.

XC3090L-6TQG176C

Xilinx

Package: TQG176 (Thin Quad Gull-Wing, 176 pins)

Family: XC3000L Low-Voltage Logic Cell Array

Configuration Memory: SRAM (volatile, in-system programmable)