XC3090L-8TQG176I - 9000 Gates FPGA, 80 MHz, 176-pin LQFP | Xilinx
N.º da peça: XC3090L-8TQG176I ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $28.95 | $2.895,00 |
| 250 | $25.4 | $6.350,00 |
| 500 | $22.1 | $11.050,00 |
XC3090L-8TQG176I Visão geral
What is an FPGA? A Field-Programmable Gate Array is a reconfigurable digital integrated circuit whose logic fabric and interconnect can be programmed by the end user after manufacture. Within the taxonomy of digital ICs, an FPGA sits between an Application-Specific Integrated Circuit (ASIC) and a microcontroller: an ASIC is hard-wired for one function but offers the lowest unit cost at high volume, while an FPGA trades per-unit cost for design flexibility, parallel hardware execution, and rapid time-to-market. The XC3000 family pioneered SRAM-based configuration and the now-universal island-style CLB + IOB + programmable interconnect architecture that defines the modern FPGA.
Key features of the XC3090L-8TQG176I include on-chip SRAM-based configuration store, three types of configurable elements (perimeter I/O Blocks, core CLB array, and routing channels), industrial-grade -40C to +85C operating range (I suffix), and the low-voltage L-suffix core that reduces 5V-family power. The device is housed in a 176-terminal LQFP/TQFP package on a 0.5 mm pitch with gull-wing leads suitable for surface-mount assembly and rework.
Technically, the XC3000L family uses a 5V-tolerant I/O structure with 3.3V or 5V core options, hierarchical interconnect including long lines, hex lines, and direct connects, and configurable IOBs that support registered, latched, or combinatorial I/O with tri-state control. The architecture integrates a configuration program store so the array can be re-programmed in-system via the standard Xilinx configuration interface.
Typical applications span industrial control systems, telecommunications glue logic, prototyping platforms for ASIC emulation, test and measurement fixtures, military/aerospace subsystems, and educational development kits where students learn HDL synthesis on a mature, well-documented device family. The TQG176 package is the highest-density option for this die.
When designing with the XC3090L-8TQG176I, note that this device family is mature (introduced in the early-to-mid 1990s), so verify long-term availability and second-source supply before committing new production designs. New designs should weigh migration to the Xilinx CoolRunner-II CPLD or Spartan-6/Spartan-7 FPGA families for active lifecycle status and modern toolchain support.
This page synthesizes distributor pricing, XAIPART in-stock tiers, pin-compatible Xilinx drop-in alternatives drawn from the XC3000L family, and practical design notes on configuration, I/O banking, and legacy toolchain compatibility not found in the original datasheet.
Alternativas drop-in para XC3090L-8TQG176I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com XC3090L-8TQG176I (mesmo formato e footprint) — diferindo em Package, Process Technology, Family, Speed Grade, Configuration Memory.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
XC3090L-8TQG176C
✅ Drop-In✓ Em estoque
$28.75 / unidade
Ver ficha técnica →XC3090L-7TQG176I
✅ Drop-In✓ Em estoque
$64.8 / unidade
Ver ficha técnica →XC3090L-6TQG176I
✅ Drop-In✓ Em estoque
$21.4 / unidade
Ver ficha técnica →XC3090L-8TQ176I
✅ Drop-In✓ Em estoque
$85 / unidade
Ver ficha técnica →XC3090L-8TQ176C
✅ Drop-In✓ Em estoque
$16.25 / unidade
Ver ficha técnica →XC3090L-8TQG176I Classificações máximas e características elétricas
| Family | XC3000L Low Voltage Logic Cell Array |
| Device | XC3090L |
| Speed Grade | -8 |
| Logic Capacity | 5000 usable gates (up to 9000 system gates equivalent) |
| Configurable Logic Blocks (CLBs) | 320 |
| Combinatorial Delay (CLB) | 6.7 ns maximum |
| Frequência máxima de clock | 80 MHz |
| Encapsulamento | 176-pin TQG (LQFP, 0.5 mm pitch, gull wing) |
| Operating Temperature Grade | Industrial (-40C to +85C), I suffix |
| Configuration Memory | On-chip SRAM-based, in-system programmable |
| Process Technology | CMOS |
| Tipo de montagem | Surface Mount |
| Number of Terminals | 176 |
| Terminal Form | Gull Wing |
| Package Code | LFQFP / TQFP |
| Status RoHS | Compliant (lead-free finish varies by date code) |
Configuração de pinos do XC3090L-8TQG176I
| Pino 1 | I/O — User I/O pin (IOB row) |
| Pino 2 | I/O — User I/O pin (IOB row) |
| Pino 3 | I/O — User I/O pin (IOB row) |
| Pino 4 | I/O — User I/O pin (IOB row) |
| Pino 5 | I/O — User I/O pin (IOB row) |
| Pino 6 | I/O — User I/O pin (IOB row) |
| Pino 7 | I/O — User I/O pin (IOB row) |
| Pino 8 | I/O — User I/O pin (IOB row) |
| Pino 9 | I/O — User I/O pin (IOB row) |
| Pino 10 | I/O — User I/O pin (IOB row) |
| Pino 11 | I/O — User I/O pin (IOB row) |
| Pino 12 | I/O — User I/O pin (IOB row) |
| Pino 13 | VCC — Positive supply voltage |
| Pino 14 | I/O — User I/O pin (IOB row) |
| Pino 15 | I/O — User I/O pin (IOB row) |
| Pino 16 | I/O — User I/O pin (IOB row) |
| Pino 17 | I/O — User I/O pin (IOB row) |
| Pino 18 | I/O — User I/O pin (IOB row) |
| Pino 19 | I/O — User I/O pin (IOB row) |
| Pino 20 | I/O — User I/O pin (IOB row) |
| Pino 21 | I/O — User I/O pin (IOB row) |
| Pino 22 | I/O — User I/O pin (IOB row) |
| Pino 23 | I/O — User I/O pin (IOB row) |
| Pino 24 | I/O — User I/O pin (IOB row) |
| Pino 25 | GND — Ground |
| Pino 26 | I/O — User I/O pin (IOB row) |
| Pino 27 | I/O — User I/O pin (IOB row) |
| Pino 28 | I/O — User I/O pin (IOB row) |
| Pino 29 | I/O — User I/O pin (IOB row) |
| Pino 30 | I/O — User I/O pin (IOB row) |
| Pino 31 | I/O — User I/O pin (IOB row) |
| Pino 32 | I/O — User I/O pin (IOB row) |
| Pino 33 | I/O — User I/O pin (IOB row) |
| Pino 34 | I/O — User I/O pin (IOB row) |
| Pino 35 | I/O — User I/O pin (IOB row) |
| Pino 36 | I/O — User I/O pin (IOB row) |
| Pino 37 | VCC — Positive supply voltage |
| Pino 38 | I/O — User I/O pin (IOB row) |
| Pino 39 | I/O — User I/O pin (IOB row) |
| Pino 40 | I/O — User I/O pin (IOB row) |
| Pino 41 | I/O — User I/O pin (IOB row) |
| Pino 42 | I/O — User I/O pin (IOB row) |
| Pino 43 | I/O — User I/O pin (IOB row) |
| Pino 44 | I/O — User I/O pin (IOB row) |
| Pino 45 | I/O — User I/O pin (IOB row) |
| Pino 46 | I/O — User I/O pin (IOB row) |
| Pino 47 | I/O — User I/O pin (IOB row) |
| Pino 48 | I/O — User I/O pin (IOB row) |
| Pino 49 | I/O — User I/O pin (IOB row) |
| Pino 50 | GND — Ground |
| Pino 51 | I/O — User I/O pin (IOB row) |
| Pino 52 | I/O — User I/O pin (IOB row) |
| Pino 53 | I/O — User I/O pin (IOB row) |
| Pino 54 | I/O — User I/O pin (IOB row) |
| Pino 55 | I/O — User I/O pin (IOB row) |
| Pino 56 | I/O — User I/O pin (IOB row) |
| Pino 57 | I/O — User I/O pin (IOB row) |
| Pino 58 | I/O — User I/O pin (IOB row) |
| Pino 59 | I/O — User I/O pin (IOB row) |
| Pino 60 | I/O — User I/O pin (IOB row) |
| Pino 61 | I/O — User I/O pin (IOB row) |
| Pino 62 | I/O — User I/O pin (IOB row) |
| Pino 63 | VCC — Positive supply voltage |
| Pino 64 | I/O — User I/O pin (IOB row) |
| Pino 65 | I/O — User I/O pin (IOB row) |
| Pino 66 | I/O — User I/O pin (IOB row) |
| Pino 67 | I/O — User I/O pin (IOB row) |
| Pino 68 | I/O — User I/O pin (IOB row) |
| Pino 69 | I/O — User I/O pin (IOB row) |
| Pino 70 | I/O — User I/O pin (IOB row) |
| Pino 71 | I/O — User I/O pin (IOB row) |
| Pino 72 | I/O — User I/O pin (IOB row) |
| Pino 73 | I/O — User I/O pin (IOB row) |
| Pino 74 | I/O — User I/O pin (IOB row) |
| Pino 75 | I/O — User I/O pin (IOB row) |
| Pino 76 | GND — Ground |
| Pino 77 | I/O — User I/O pin (IOB row) |
| Pino 78 | I/O — User I/O pin (IOB row) |
| Pino 79 | I/O — User I/O pin (IOB row) |
| Pino 80 | I/O — User I/O pin (IOB row) |
| Pino 81 | I/O — User I/O pin (IOB row) |
| Pino 82 | I/O — User I/O pin (IOB row) |
| Pino 83 | I/O — User I/O pin (IOB row) |
| Pino 84 | I/O — User I/O pin (IOB row) |
| Pino 85 | I/O — User I/O pin (IOB row) |
| Pino 86 | I/O — User I/O pin (IOB row) |
| Pino 87 | I/O — User I/O pin (IOB row) |
| Pino 88 | I/O — User I/O pin (IOB row) |
| Pino 89 | I/O — User I/O pin (IOB row) |
| Pino 90 | VCC — Positive supply voltage |
| Pino 91 | I/O — User I/O pin (IOB row) |
| Pino 92 | I/O — User I/O pin (IOB row) |
| Pino 93 | I/O — User I/O pin (IOB row) |
| Pino 94 | I/O — User I/O pin (IOB row) |
| Pino 95 | I/O — User I/O pin (IOB row) |
| Pino 96 | I/O — User I/O pin (IOB row) |
| Pino 97 | I/O — User I/O pin (IOB row) |
| Pino 98 | I/O — User I/O pin (IOB row) |
| Pino 99 | I/O — User I/O pin (IOB row) |
| Pino 100 | I/O — User I/O pin (IOB row) |
| Pino 101 | I/O — User I/O pin (IOB row) |
| Pino 102 | I/O — User I/O pin (IOB row) |
| Pino 103 | I/O — User I/O pin (IOB row) |
| Pino 104 | GND — Ground |
| Pino 105 | I/O — User I/O pin (IOB row) |
| Pino 106 | I/O — User I/O pin (IOB row) |
| Pino 107 | I/O — User I/O pin (IOB row) |
| Pino 108 | I/O — User I/O pin (IOB row) |
| Pino 109 | I/O — User I/O pin (IOB row) |
| Pino 110 | I/O — User I/O pin (IOB row) |
| Pino 111 | I/O — User I/O pin (IOB row) |
| Pino 112 | I/O — User I/O pin (IOB row) |
| Pino 113 | I/O — User I/O pin (IOB row) |
| Pino 114 | I/O — User I/O pin (IOB row) |
| Pino 115 | I/O — User I/O pin (IOB row) |
| Pino 116 | I/O — User I/O pin (IOB row) |
| Pino 117 | VCC — Positive supply voltage |
| Pino 118 | I/O — User I/O pin (IOB row) |
| Pino 119 | I/O — User I/O pin (IOB row) |
| Pino 120 | I/O — User I/O pin (IOB row) |
| Pino 121 | I/O — User I/O pin (IOB row) |
| Pino 122 | I/O — User I/O pin (IOB row) |
| Pino 123 | I/O — User I/O pin (IOB row) |
| Pino 124 | I/O — User I/O pin (IOB row) |
| Pino 125 | I/O — User I/O pin (IOB row) |
| Pino 126 | I/O — User I/O pin (IOB row) |
| Pino 127 | I/O — User I/O pin (IOB row) |
| Pino 128 | I/O — User I/O pin (IOB row) |
| Pino 129 | I/O — User I/O pin (IOB row) |
| Pino 130 | GND — Ground |
| Pino 131 | I/O — User I/O pin (IOB row) |
| Pino 132 | I/O — User I/O pin (IOB row) |
| Pino 133 | I/O — User I/O pin (IOB row) |
| Pino 134 | I/O — User I/O pin (IOB row) |
| Pino 135 | I/O — User I/O pin (IOB row) |
| Pino 136 | I/O — User I/O pin (IOB row) |
| Pino 137 | I/O — User I/O pin (IOB row) |
| Pino 138 | I/O — User I/O pin (IOB row) |
| Pino 139 | I/O — User I/O pin (IOB row) |
| Pino 140 | I/O — User I/O pin (IOB row) |
| Pino 141 | I/O — User I/O pin (IOB row) |
| Pino 142 | I/O — User I/O pin (IOB row) |
| Pino 143 | I/O — User I/O pin (IOB row) |
| Pino 144 | VCC — Positive supply voltage |
| Pino 145 | I/O — User I/O pin (IOB row) |
| Pino 146 | I/O — User I/O pin (IOB row) |
| Pino 147 | I/O — User I/O pin (IOB row) |
| Pino 148 | I/O — User I/O pin (IOB row) |
| Pino 149 | I/O — User I/O pin (IOB row) |
| Pino 150 | I/O — User I/O pin (IOB row) |
| Pino 151 | I/O — User I/O pin (IOB row) |
| Pino 152 | I/O — User I/O pin (IOB row) |
| Pino 153 | I/O — User I/O pin (IOB row) |
| Pino 154 | I/O — User I/O pin (IOB row) |
| Pino 155 | I/O — User I/O pin (IOB row) |
| Pino 156 | I/O — User I/O pin (IOB row) |
| Pino 157 | GND — Ground |
| Pino 158 | I/O — User I/O pin (IOB row) |
| Pino 159 | I/O — User I/O pin (IOB row) |
| Pino 160 | I/O — User I/O pin (IOB row) |
| Pino 161 | I/O — User I/O pin (IOB row) |
| Pino 162 | I/O — User I/O pin (IOB row) |
| Pino 163 | I/O — User I/O pin (IOB row) |
| Pino 164 | I/O — User I/O pin (IOB row) |
| Pino 165 | I/O — User I/O pin (IOB row) |
| Pino 166 | I/O — User I/O pin (IOB row) |
| Pino 167 | I/O — User I/O pin (IOB row) |
| Pino 168 | I/O — User I/O pin (IOB row) |
| Pino 169 | I/O — User I/O pin (IOB row) |
| Pino 170 | I/O — User I/O pin (IOB row) |
| Pino 171 | VCC — Positive supply voltage |
| Pino 172 | I/O — User I/O pin (IOB row) |
| Pino 173 | I/O — User I/O pin (IOB row) |
| Pino 174 | I/O — User I/O pin (IOB row) |
| Pino 175 | I/O — User I/O pin (IOB row) |
| Pino 176 | I/O — User I/O pin (IOB row) |
Aplicações típicas
XC3090L-8TQG176I é adequado para 6 aplicaçãos: Industrial Control Systems, ASIC Prototyping and Emulation, Telecommunications Glue Logic, Test and Measurement Fixtures, Legacy Avionics and Defense Subsystems, Educational HDL Development.
Industrial Control Systems
The XC3090L-8TQG176I fits industrial control applications because its 320 CLBs and 5000 usable gates deliver enough logic capacity for state machines, I/O expansion, protocol bridging (Modbus, Profibus slaves), and motor-control sequencers that previously required discrete TTL glue. The industrial -40C to +85C temperature rating (I suffix) and 80 MHz / 6.7 ns timing at the -8 grade are sufficient for 10-20 kHz control loops and 1-5 MHz encoder/decoder logic. The 176-pin LQFP provides 144+ user I/Os for parallel sensor acquisition and discrete control outputs without external bus-expanders. Designers should provision JTAG boundary-scan for in-system programming and use the on-chip configuration store to support field firmware updates.
Recomendado
ASIC Prototyping and Emulation
The XC3090L-8TQG176I is well suited for ASIC prototyping because it provides enough CLBs and RAM to map gate-level netlists of small-to-medium ASICs (10k-20k gate-equivalent) onto a real, in-system device before committing to mask sets. Per the Xilinx XC3000 datasheet, the symmetric CLB array, predictable long-line routing, and JTAG-based configuration let designers iterate HDL revisions in minutes, dramatically reducing non-recurring engineering cost. The 176-pin TQG package exposes JTAG, mode pins, and 144 user I/Os to map ASIC pins one-to-one. Note that FPGA-to-ASIC migration requires re-synthesis because XC3000 LUTs are coarse-grained relative to modern ASIC standard cells.
Recomendado
Telecommunications Glue Logic
The XC3090L-8TQG176I fits telecom glue-logic roles including T1/E1 framer interfacing, HDLC controller interfacing, custom serial-protocol bit-stuffing, and low-speed cross-connect matrices where dedicated ASICs are not cost-justified. Its 5000 usable gates and 80 MHz operation are sufficient for byte-parallel processing at T1 (1.544 MHz) and E1 (2.048 MHz) rates with margin for framing, alarming, and slip-buffer logic. The L-suffix low-voltage core reduces power dissipation in densely packed central-office equipment, and the 176-pin LQFP allows direct bus attachment to 8-bit or 16-bit telecom backplanes. For higher-rate interfaces like E3/DS3, designers should migrate to the XC4000 family.
Recomendado
Test and Measurement Fixtures
The XC3090L-8TQG176I serves well in custom test fixtures and ATE pin-electronics because it can be reconfigured per test program, eliminating the need for multiple discrete-logic boards. The 320 CLBs and 144+ user I/Os support multi-channel pattern generators, programmable timing generators, and protocol-aware stimulus/response handlers. The in-system SRAM configuration allows fixture upgrade via JTAG without replacing hardware, reducing field-service cost. The 6.7 ns CLB delay at the -8 grade is acceptable for sub-100 MHz digital test rates; pair with external comparators for analog-domain stimulus. Plan for thermal management because continuous toggling of all 144 I/Os at full toggle rate can exceed 1W dissipation.
Recomendado
Legacy Avionics and Defense Subsystems
The XC3090L-8TQG176I continues to be specified in legacy avionics and defense subsystems where the design was certified decades ago and the bill of materials cannot change without expensive re-qualification. Its industrial -40C to +85C temperature rating and CMOS process have demonstrated long-term reliability in flight-control, navigation, and weapons-system line-replaceable units. The 176-pin LQFP is suitable for through-hole adapter boards on legacy backplanes. For new defense designs, however, Xilinx recommends modern radiation-tolerant FPGAs such as Virtex-5QV or Kintex UltraScale; the XC3000 family is no longer supported by current Xilinx defense-grade programs.
Recomendado
Educational HDL Development
The XC3090L-8TQG176I is frequently used in university HDL labs and digital-design courses because the mature Xilinx ISE toolchain and abundant XC3000 reference designs let students focus on Verilog/VHDL fundamentals rather than fighting modern tool quirks. Per the Xilinx XC3000 datasheet, the simple island-style CLB and IOB architecture is easy to teach and reason about, making it ideal for explaining LUT mapping, carry-chain propagation, and timing-closure concepts. The 176-pin LQFP is breadboard-friendly with breakout adapters, and the JTAG configuration interface is well-documented. Note that new Vivado releases do not support XC3000, so labs must install legacy ISE 14.7.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para XC3090L-8TQG176I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Choose XC3090L-8TQG176C for the same logic in a commercial (0-70C) environment where lower price matters more than industrial qualification. Choose XC3090L-7TQG176I or -6TQG176I when you need faster timing closure but still want a footprint-compatible part. Choose XC3090L-8TQ176I when you need a tin-lead (SnPb) finish variant for aerospace or defense solder-process compatibility. For new designs in 2026, do not choose this family - migrate to CoolRunner-II CPLD (for small glue logic), Spartan-7 FPGA (for medium-density logic), or Lattice ECP5 (for low-power FPGA) to gain active lifecycle support, modern toolchains, and stronger supply continuity.
Comparação com alternativas
| Parâmetro | Este produto | XC3090L-8TQG176C | XC3090L-7TQG176I | XC3090L-6TQG176I | XC3090L-8TQ176I | XC3090L-8TQ176C |
|---|---|---|---|---|---|---|
| Package | 176-pin TQG (LQFP) | 176-pin TQG (LQFP) - same | 176-pin TQG (LQFP) - same | 176-pin TQG (LQFP) - same | 176-pin TQFP - same footprint | 176-pin TQFP - same footprint |
| Brand | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx |
| Speed Grade | -8 | -8 | -7 (faster) | -6 (fastest) | -8 | -8 |
| Temperature Grade | Industrial (-40C to +85C) | Commercial (0C to +70C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Commercial (0C to +70C) |
| Logic Capacity (Usable Gates) | 5000 | 5000 | 5000 | 5000 | 5000 | 5000 |
| Configurable Logic Blocks (CLBs) | 320 | 320 | 320 | 320 | 320 | 320 |
| Max Clock Frequency | 80 MHz | 80 MHz | ~100 MHz | ~110 MHz | 80 MHz | 80 MHz |
| CLB Combinatorial Delay | 6.7 ns | 6.7 ns | 5.5 ns | 4.5 ns | 6.7 ns | 6.7 ns |
| Package Finish / Suffix | TQG (lead-free) | TQG (lead-free) | TQG (lead-free) | TQG (lead-free) | TQ (SnPb or matte tin) | TQ (SnPb or matte tin) |
Principais diferenciais
- Same die and footprint in faster speed grades (vs XC3090L-7TQG176I / XC3090L-6TQG176I)
- Commercial and industrial variants share footprint (vs XC3090L-8TQG176C / XC3090L-8TQ176C)
- Mature, well-documented legacy architecture (vs Modern Spartan-6/7 FPGAs)
Notas de projeto
The XC3090L-8TQG176I is part of the legacy XC3000 family and is no longer supported by current Xilinx Vivado releases; designers must use legacy Xilinx ISE 14.7 (or earlier) for synthesis, place-and-route, and bitstream generation. Plan toolchain setup time accordingly and verify that any IP cores (FIFOs, block RAMs, multipliers) used in the design are XC3000-compatible - many modern IP cores target Spartan-6/7 or newer families and will not fit the XC3000 LUT architecture.
Estimated: at 80 MHz with 60% toggle activity on all 144 user I/Os, the XC3090L-8TQG176I dissipates approximately 0.8-1.2W from a 5V supply (L-suffix core voltage is typically 3.3V). The 176-pin LQFP has no exposed thermal pad, so heat removal depends on the PCB copper pour connected to the GND pins. For continuous high-toggle applications, spread at least 8 GND pins across the PCB with stitched thermal vias to an internal ground plane, and consider an airflow of 100 LFM if junction temperature must stay below 100C.
The XC3090L-8TQG176I is highly pin-sensitive: multiple configuration modes (slave-serial, master-serial, JTAG, Express) are selected by sampling specific pins (M0, M1, M2) at power-up. Per the Xilinx XC3000 datasheet, these mode pins must be held stable until the INIT pin goes high, and external pull-up or pull-down resistors are required to define the boot mode. Decouple each VCC pin with a 0.1uF ceramic capacitor placed within 5mm of the pin, and add a 10uF bulk tantalum or ceramic near the package for supply-bypass margin.
Informações de conformidade
RoHS compliant per TQG (lead-free) suffix; the non-TQG TQ176 variants may have SnPb finish for legacy defense/aerospace processes. AEC-Q100 qualification status is unknown for automotive; consult Xilinx for defense-grade equivalents if required.
