MC9S08DV60AMLH vs MC9S08DN32ACLC Comparação

Comparação detalhada lado a lado de MC9S08DV60AMLH por NXP Semiconductors e MC9S08DN32ACLC por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MC9S08DV60AMLH MC9S08DV60AMLH - 8-bit MCU 60KB Flash 40MHz CAN LIN | NXP

MC9S08DV60AMLH - 8-bit MCU 60KB Flash 40MHz CAN LIN | NXP

MC9S08DV60AMLH ✓ Ativo
NXP Semiconductors
MC9S08DN32ACLC MC9S08DN32ACLC - 8-Bit 40MHz HCS08 MCU 32KB Flash | NXP LQFP-32

MC9S08DN32ACLC - 8-Bit 40MHz HCS08 MCU 32KB Flash | NXP LQFP-32

MC9S08DN32ACLC Obsolete

Comparação de especificações

Parâmetro MC9S08DV60AMLH MC9S08DN32ACLC
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida Ativo Obsolete
Status do estoque In Stock In Stock
Preço unitário (USD) $3,85 $4,35
Core Processor S08 (HCS08), 8-bit S08 (HCS08)
Core Size 8-Bit 8-Bit
Speed 40MHz CPU (20MHz bus) —
Program Memory Size 60KB (60K x 8) 32 KB (32K x 8)
Program Memory Type FLASH FLASH
RAM Size 3K x 8 2 KB
Number of I/O 53 25
Input-Only Pins 1 —
ADC Resolution 12-bit —
ADC Channels 16 —
ADC Conversion Time 2.5 us —
Connectivity CAN (MSCAN), LIN master I2C, LINbus, SCI, SPI
Oscillator Type External —
Interrupt/Reset Sources Up to 32 —
Tensão de alimentação 3.3V/5V 2.7 V to 5.5 V
Encapsulamento / Caixa 64-LQFP (10x10 mm) —
Tipo de montagem Surface Mount Surface Mount
Packaging Tray —
Instruction Set HC08 with added BGND instruction HC08 with added BGND
Series — S08DN
CPU Speed — 40 MHz (20 MHz bus)
EEPROM Size — 1 KB (1K x 8)
Peripherals — LVD, POR, PWM, WDT
Number of Interrupt Sources — Up to 32
Encapsulamento — 32-LQFP (7x7 mm)
Temperatura de operação — -40C to +85C
Part Status — Obsolete

Fichas técnicas e recursos

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