MC9S08DV60AMLH vs MC9S08DN32ACLC 对比

详细并排对比 MC9S08DV60AMLH 出自 NXP Semiconductors 和 MC9S08DN32ACLC 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MC9S08DV60AMLH MC9S08DV60AMLH - 8-bit MCU 60KB Flash 40MHz CAN LIN | NXP

MC9S08DV60AMLH - 8-bit MCU 60KB Flash 40MHz CAN LIN | NXP

MC9S08DV60AMLH ✓ 量产中
NXP Semiconductors
MC9S08DN32ACLC MC9S08DN32ACLC - 8-Bit 40MHz HCS08 MCU 32KB Flash | NXP LQFP-32

MC9S08DN32ACLC - 8-Bit 40MHz HCS08 MCU 32KB Flash | NXP LQFP-32

MC9S08DN32ACLC Obsolete

规格对比

参数 MC9S08DV60AMLH MC9S08DN32ACLC
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 有效 Obsolete
库存状态 有库存 有库存
单价(USD) $3.85 $4.35
Core Processor S08 (HCS08), 8-bit S08 (HCS08)
Core Size 8-Bit 8-Bit
Speed 40MHz CPU (20MHz bus) —
Program Memory Size 60KB (60K x 8) 32 KB (32K x 8)
Program Memory Type FLASH FLASH
RAM Size 3K x 8 2 KB
Number of I/O 53 25
Input-Only Pins 1 —
ADC Resolution 12-bit —
ADC Channels 16 —
ADC Conversion Time 2.5 us —
Connectivity CAN (MSCAN), LIN master I2C, LINbus, SCI, SPI
Oscillator Type External —
Interrupt/Reset Sources Up to 32 —
电源电压 3.3V/5V 2.7 V to 5.5 V
封装 / 外壳 64-LQFP (10x10 mm) —
安装类型 Surface Mount Surface Mount
Packaging Tray —
Instruction Set HC08 with added BGND instruction HC08 with added BGND
Series — S08DN
CPU Speed — 40 MHz (20 MHz bus)
EEPROM Size — 1 KB (1K x 8)
Peripherals — LVD, POR, PWM, WDT
Number of Interrupt Sources — Up to 32
封装 — 32-LQFP (7x7 mm)
工作温度 — -40C to +85C
Part Status — Obsolete

数据手册与资源

浏览全部产品 创建 BOM 获取报价