MC9S08SH4MPJ vs MC9S08SH4MFK Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng MC9S08SH4MPJ sa pamamagitan ng NXP Semiconductors at MC9S08SH4MFK sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

NXP Semiconductors
MC9S08SH4MPJ MC9S08SH4MPJ - 8-bit S08 MCU, 4KB Flash, 40MHz | NXP DIP-20

MC9S08SH4MPJ - 8-bit S08 MCU, 4KB Flash, 40MHz | NXP DIP-20

MC9S08SH4MPJ ✗ Tapus ng Buhay
NXP Semiconductors
MC9S08SH4MFK MC9S08SH4MFK - 8-bit HCS08 MCU 4KB Flash 40MHz QFN-24 | NXP

MC9S08SH4MFK - 8-bit HCS08 MCU 4KB Flash 40MHz QFN-24 | NXP

MC9S08SH4MFK ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro MC9S08SH4MPJ MC9S08SH4MFK
Brand NXP Semiconductors NXP Semiconductors
Kategorya Microcontrollers Microcontrollers
Katayuan ng Lifecycle Tapus ng Buhay Aktibo
Core HCS08 (enhanced 8-bit) HCS08 (8-bit)
CPU Architecture CISC, HC08 instruction set with BGND —
Maximum Bus Frequency 40 MHz —
Program Flash Memory 4 KB —
RAM 256 B —
Volte ng Pagbibigay 2.7 V to 5.5 V —
Temperature na Operasyon -40C to +125C (automotive grade) -40 C to +85 C (industrial, [DATA_NEEDED: confirm exact grade])
ADC 12-channel, 10-bit, 2.5 us conversion time 12-channel, 10-bit, 2.5 us conversion
Panloob na Sensor ng Temperatura Yes —
Communication Interfaces SCI (UART), SPI, I2C —
Interrupt Sources Up to 32 —
Packhaging 20-pin PDIP (DIP-20, 0.300 inch / 7.62 mm) —
Uri ng Pagpapasok Through-Hole (THT) Surface Mount
Temperature Grade Automotive —
Compatibility Family S08SH, software/tool compatible with S08SG —
Debug Background Debug Mode (BGND) —
Tindminan RoHS [DATA_NEEDED: RoHS status] —
Program Memory Size — 4 KB (4K x 8) Flash
RAM Size — 256 B
Maximum CPU Clock — 40 MHz
Number of I/O Pins — 17
Packhaging / Kaso — 24-VFQFN Exposed Pad (4x4 mm)
Supply Voltage Range — 2.7 V to 5.5 V
Oscillator Type — Internal
Interrupt/Reset Sources — Up to 32
Instruction Set — HC08 with BGND instruction
Packaging — Tray
Compliance — RoHS compliant ([DATA_NEEDED: confirm exact status])

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