MC9S12DJ256MPVE vs MC9S12DT256MPVE Comparação

Comparação detalhada lado a lado de MC9S12DJ256MPVE por NXP Semiconductors e MC9S12DT256MPVE por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MC9S12DT256MPVE MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DT256MPVE Nrnd

Comparação de especificações

Parâmetro MC9S12DJ256MPVE MC9S12DT256MPVE
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida NRND NRND
Status do estoque In Stock In Stock
Preço unitário (USD) $17,95 $14,36
Core Architecture HCS12 (16-bit CISC) —
CPU Bit Width 16-bit —
Maximum CPU Frequency 25 MHz (some sources cite 50 MHz bus) 25 MHz
Program Flash 256 KB (256K x 8) —
RAM 12 KB 12 KB
EEPROM 4 KB 4 KB
Tensão de alimentação 2.35 V to 2.75 V core; 5 V typical with on-chip regulator 2.35 V to 2.75 V (regulated core)
I/O Pins 59 (some package variants expose 91) 91
ADC Two 8-channel, 10-bit 2 x 10-bit, 8 channels each (16 channels total)
PWM Channels 8-channel —
Enhanced Capture Timer 8-channel IC/OC —
SCI (UART) Modules 2 asynchronous —
CAN Module 1 x CAN 2.0 (per family datasheet) —
SPI Module 1 synchronous serial (per family) —
Temperatura de operação -40C to +125C (automotive AEC-Q100 grade) -40C to +125C (automotive grade)
Encapsulamento 112-LQFP (20x20 mm), gull-wing 112-LQFP (20x20 mm)
Tipo de montagem Surface Mount Surface Mount
Status RoHS Compliant (lead-free matte-tin finish) Compliant
Moisture Sensitivity Level MSL 3 (per JEDEC J-STD-020) —
Background Debug Mode Yes (BDM) —
Status do ciclo de vida NRND (Not Recommended for New Designs) NRND (Not Recommended for New Designs)
Core — HCS12 (16-bit CISC)
Program Memory (Flash) — 256 KB
Largura do barramento de dados — 16-bit
Timers — 8-channel Enhanced Capture Timer (ECT)
Communication Interfaces — 2 x SCI (UART), 2 x SPI, 1 x I2C, 1 x CAN (MSCAN 2.0A/B)
Debug Interface — Background Debug Mode (BDM) + JTAG

Fichas técnicas e recursos

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