MC9S12DJ256MPVE vs MC9S12DT256MPVE 비교

다음의 상세 나란히 비교: MC9S12DJ256MPVE 제조: NXP Semiconductors 및 MC9S12DT256MPVE 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

NXP Semiconductors
MC9S12DT256MPVE MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DT256MPVE Nrnd

사양 비교

파라미터 MC9S12DJ256MPVE MC9S12DT256MPVE
브랜드 NXP Semiconductors NXP Semiconductors
카테고리 Microcontrollers Microcontrollers
수명 주기 상태 NRND NRND
재고 상태 In Stock In Stock
단가 (USD) $17.95 $14.36
Core Architecture HCS12 (16-bit CISC) —
CPU Bit Width 16-bit —
Maximum CPU Frequency 25 MHz (some sources cite 50 MHz bus) 25 MHz
Program Flash 256 KB (256K x 8) —
RAM 12 KB 12 KB
EEPROM 4 KB 4 KB
공급 전압 2.35 V to 2.75 V core; 5 V typical with on-chip regulator 2.35 V to 2.75 V (regulated core)
I/O Pins 59 (some package variants expose 91) 91
ADC Two 8-channel, 10-bit 2 x 10-bit, 8 channels each (16 channels total)
PWM Channels 8-channel —
Enhanced Capture Timer 8-channel IC/OC —
SCI (UART) Modules 2 asynchronous —
CAN Module 1 x CAN 2.0 (per family datasheet) —
SPI Module 1 synchronous serial (per family) —
동작 온도 -40C to +125C (automotive AEC-Q100 grade) -40C to +125C (automotive grade)
패키지 112-LQFP (20x20 mm), gull-wing 112-LQFP (20x20 mm)
실장 유형 Surface Mount Surface Mount
RoHS 상태 Compliant (lead-free matte-tin finish) Compliant
Moisture Sensitivity Level MSL 3 (per JEDEC J-STD-020) —
Background Debug Mode Yes (BDM) —
수명 주기 상태 NRND (Not Recommended for New Designs) NRND (Not Recommended for New Designs)
Core — HCS12 (16-bit CISC)
Program Memory (Flash) — 256 KB
데이터 버스 폭 — 16-bit
Timers — 8-channel Enhanced Capture Timer (ECT)
Communication Interfaces — 2 x SCI (UART), 2 x SPI, 1 x I2C, 1 x CAN (MSCAN 2.0A/B)
Debug Interface — Background Debug Mode (BDM) + JTAG

데이터시트 & 자료

모든 제품 보기 BOM 생성 견적 요청