10AS032H1F35I1HG - Arria 10 SX SoC FPGA 320K LE | Intel
N.º da peça: 10AS032H1F35I1HG ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $2850 | $2.850,00 |
| 10 | $2735 | $27.350,00 |
| 100 | $2580 | $258.000,00 |
| 500 | $2410 | $1.205.000,00 |
| 1.000 | $2265 | $2.265.000,00 |
10AS032H1F35I1HG Visão geral
A System-on-Chip FPGA is a heterogeneous compute device that merges a general-purpose processor subsystem with reconfigurable logic on one silicon die. Within the taxonomy, it sits between standard microcontrollers and pure FPGAs: microcontrollers execute sequential software, FPGAs implement parallel hardware, and SoC FPGAs enable hybrid architectures where each task runs on the substrate best suited to it. The Arria 10 SX family specifically targets mid-range applications balancing DSP throughput, transceiver bandwidth, and ARM Cortex-A9 software flexibility.
Key features of the 10AS032H1F35I1HG include 384 general-purpose I/Os, up to 1.5 GHz processor subsystem clock, integrated CoreSight debug, low-power 20 nm process technology, hardened floating-point DSP blocks, and up to 24 transceivers supporting multi-gigabit serial protocols. The H1 device-density suffix denotes a specific logic-element count and transceiver configuration tier within the Arria 10 SX family. The package operates across industrial temperature ranges suitable for ruggedized deployment.
Architecturally, the device partitions workloads between the dual-core ARM Cortex-A9 hard processor system for operating-system and control-plane tasks, and the FPGA fabric for data-plane acceleration including DSP, packet processing, and custom interfaces. This division delivers higher performance-per-watt than discrete CPU-plus-FPGA solutions because the interconnect bandwidth between hard CPU and soft logic avoids board-level serializer-deserializer overhead.
Typical applications include industrial machine vision, military radar and electronic warfare, medical imaging systems, test and measurement equipment, and 5G wireless baseband processing. The integration of ARM cores with FPGA fabric reduces bill-of-materials count and PCB complexity while enabling software-defined customization of hardware accelerators.
When designing with this device, allocate thermal budget to the FC-FBGA package's exposed-die land pattern and use a multilayer PCB stackup with embedded thermal vias to manage junction temperature. Always consult the Arria 10 SX device datasheet for transceiver channel placement and pinout assignments before committing to a PCB layout.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para 10AS032H1F35I1HG — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 10AS032H1F35I1HG (mesmo formato e footprint) — diferindo em Package, Mounting Type, Package Code, Process Technology, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
10AS032H1F35E1HG
✅ Drop-In✓ Em estoque
$2540 / unidade
Ver ficha técnica →10AS032H1F34I1HG
✅ Drop-In✓ Em estoque
$2077.26 / unidade
Ver ficha técnica →10AS032H1F34E1HG
✅ Drop-In✓ Em estoque
$1755 / unidade
Ver ficha técnica →10AS032H2F35I1HG
✅ Drop-In✓ Em estoque
$2890 / unidade
Ver ficha técnica →10AS032H1F35I1HG Classificações máximas e características elétricas
| Device Family | Arria 10 SX |
| Device Sub-Family | SoC FPGA |
| Logic Elements | 320K |
| Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Processor Frequency | 1.5 GHz |
| General Purpose I/Os | 384 |
| Encapsulamento | 1152-FBGA, FC (35x35 mm) |
| Terminal Pitch | 1.0 mm |
| Terminal Form | Ball |
| Process Technology | 20 nm |
| Temperatura de operação | -40C to +100C (Industrial) |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| Lead-Free | Yes |
Guia de Configuração de Pinos do 10AS032H1F35I1HG 1152-fbga, fc (35x35 mm)
Configuração de pinos para 10AS032H1F35I1HG (pacote 1152-fbga, fc (35x35 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 10AS032H1F35I1HG.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
10AS032H1F35I1HG é adequado para 6 aplicaçãos: Industrial Machine Vision Systems, Military Radar and Electronic Warfare, Medical Imaging Equipment, Test and Measurement Instrumentation, 5G Wireless Baseband Processing, High-Performance Embedded Computing.
Industrial Machine Vision Systems
The 10AS032H1F35I1HG's 320K logic elements and dual ARM Cortex-A9 cores make it well suited for multi-camera industrial machine vision systems running real-time image processing pipelines. The hard processor system handles camera control, network protocol stacks (GigE Vision, USB3 Vision), and user-interface rendering, while the FPGA fabric implements parallel pixel processing including Bayer demosaicing, lens distortion correction, and object-detection inference. With 384 GPIOs and integrated transceivers, the device connects directly to high-resolution CMOS image sensors via LVDS or MIPI CSI-2 interfaces without intermediate bridge chips. The industrial -40C to +100C temperature range supports deployment in factory-floor enclosures without active cooling. Unlike discrete CPU+FPGA solutions, the HPS-to-Fabric bridge delivers sustained bandwidth exceeding 100 Gbps for line-scan camera streams.
Recomendado
Military Radar and Electronic Warfare
The 10AS032H1F35I1HG serves radar and electronic-warfare subsystems where the ARM Cortex-A9 HPS runs waveform scheduling, beam-steering control, and threat-library databases while the FPGA fabric implements matched filters, FFT pipelines, and digital down-conversion. The hardened floating-point DSP blocks accelerate radar-processing algorithms while 20 nm process geometry balances performance against the size, weight, and power envelope required for unmanned-vehicle and dismounted-soldier platforms. Multi-gigabit transceivers connect directly to RF front-end ADCs and DACs via JESD204B/C serial interfaces, eliminating external serializer-deserializer overhead. The industrial temperature grade supports deployment in outdoor and avionics-grade enclosures without thermal management redesign. The integrated architecture reduces board area by approximately 40% versus equivalent discrete solutions.
Recomendado
Medical Imaging Equipment
The 10AS032H1F35I1HG's combination of deterministic FPGA fabric and ARM Cortex-A9 software flexibility suits CT, MRI, and ultrasound imaging systems where parallel signal-processing pipelines must coexist with regulatory-compliant user-interface software. The HPS runs FDA-certified imaging software stacks and DICOM network protocol handling, while FPGA logic implements real-time beamforming, image reconstruction, and noise-reduction algorithms. The 20 nm process delivers high logic density at modest power consumption, critical for cart-mounted or bedside imaging equipment. Integrated transceivers interface directly to high-channel-count analog front-ends via JESD204B, reducing connector count and improving signal integrity. The industrial temperature range supports continuous operation in climate-controlled hospital environments while extending to mobile diagnostic platforms.
Recomendado
Test and Measurement Instrumentation
The 10AS032H1F35I1HG enables high-end oscilloscopes, spectrum analyzers, and protocol analyzers where the FPGA fabric implements real-time acquisition and triggering while the ARM Cortex-A9 HPS runs display rendering, measurement analysis, and remote-interface firmware. The 384 GPIOs accept multiple parallel ADC channels at GSPS sample rates, with hardened DSP blocks accelerating FFT and digital-down-conversion computations. Multi-gigabit transceivers support USB 3.0, 10 Gigabit Ethernet, and PCIe Gen2 host interfaces for instrument connectivity. The integrated architecture eliminates the latency and synchronization challenges inherent in multi-chip instrument designs. Industrial temperature qualification supports laboratory-to-field portable instrument deployment.
Recomendado
5G Wireless Baseband Processing
The 10AS032H1F35I1HG addresses 5G small-cell and remote-radio-unit baseband processing where the FPGA fabric implements LDPC channel coding, massive-MIMO precoding, and CPRI/eCPRI fronthaul interfaces while the ARM HPS runs the radio-resource-control stack and OAM protocol processing. Multi-gigabit transceivers handle 9.8 Gbps CPRI and 25 Gbps eCPRI links to remote radio heads, while the 384 GPIOs connect to RF front-end converters via JESD204B/C. The 20 nm geometry balances the high logic-element count needed for baseband algorithms against the power envelope required for outdoor pole-mount deployment. Industrial temperature qualification supports outdoor radio-unit operation across seasonal thermal extremes.
Recomendado
High-Performance Embedded Computing
The 10AS032H1F35I1HG supports defense and aerospace embedded-computing platforms where the ARM Cortex-A9 HPS runs VxWorks or Linux real-time operating systems while the FPGA fabric implements custom sensor interfaces, cryptographic accelerators, and high-speed backplane connectivity. The integrated architecture reduces single-board-computer size while increasing deterministic response for mission-critical software tasks. Multi-gigabit transceivers support VPX, OpenVPX, and VITA 66 backplane fabrics at 10 Gbps and beyond. The 1152-FBGA package supports high-density interposer-based 3U VPX and 6U VPX board designs. Industrial temperature qualification supports avionics and vetronics deployments with extended thermal envelopes.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 10AS032H1F35I1HG — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 10AS032H1F35E1HG | 10AS032H1F34I1HG | 10AS032H1F34E1HG | 10AS032H2F35I1HG |
|---|---|---|---|---|---|
| Package | 1152-FBGA (35x35 mm) | 1152-FBGA (35x35 mm) - same | 1152-FBGA (31x31 mm) - smaller | 1152-FBGA (31x31 mm) - smaller | 1152-FBGA (35x35 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 320K | 320K | 320K | 320K | 320K |
| Processor Subsystem | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Speed Grade | H1 | H1 | H1 | H1 | H2 (faster) |
| General Purpose I/Os | 384 | 384 | 384 | 384 | 384 |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant |
| Unit Price (USD, qty 1) | 2850.00 | 2650.00 | 2920.00 | 2720.00 | 3050.00 |
Principais diferenciais
- Industrial temperature qualification with full -40C to +100C range (vs 10AS032H1F35E1HG)
- Smaller 31x31 mm package option for size-constrained designs (vs 10AS032H1F34I1HG)
- H1 speed grade balance between performance and power (vs 10AS032H2F35I1HG)
Notas de projeto
The 1152-FBGA flip-chip package has a theta_JA of approximately 8 C/W when mounted on a JEDEC JESD51-9 test board with thermal vias. Estimated: at 15 W total device dissipation, the junction-to-ambient rise equals 15 W x 8 C/W = 120 C above ambient. For industrial deployment at 70 C ambient, the device requires a heatsink with at least 1 C/W thermal resistance or forced-air cooling at 200 LFM to maintain the -40C to +100C junction operating range. PCB design should incorporate a thermal via array directly beneath the package BGA balls with 0.3 mm drill, 1.0 mm pitch, and copper-filled plating for optimum heat extraction.
Recommended: design the PCB with an 8-layer stackup using high-grade FR-4 or low-loss mid-loss materials such as Isola I-Speed or equivalent. The 1.0 mm BGA ball pitch requires laser-drilled microvias or sequential lamination with 0.4 mm via-pad capture. Match PCB coefficient of thermal expansion to the BGA substrate within 2 ppm/C differential to prevent solder-joint fatigue under industrial thermal-cycling stress. Place 0.1 uF decoupling capacitors within 5 mm of every power pin on inner routing layers with multiple vias to ground planes for clean FPGA power delivery.
Critical: never reuse Arria 10 GX or Arria 10 GT pinout assignments with the Arria 10 SX device - the SX family has different transceiver channel placement due to the integrated ARM Cortex-A9 hard processor system occupying dedicated die area. Verify every pin against the Arria 10 SX device pinout file using Intel Quartus Prime Pin Planner before PCB fabrication. Additionally, the HPS requires dedicated boot configuration including boot source selection, clock input routing, and DDR memory interface choice that must be designed into the PCB from initial schematic capture.
Recommended: multi-gigabit transceiver channels require 100-ohm differential impedance-controlled routing with length matching within 0.127 mm (5 mil) for adjacent lanes. Use stripline geometry with symmetric ground-reference planes on layers L2/L7 for L2 transmitter channels and L3/L6 for L4 receiver channels. AC-coupling capacitors of 100 nF must be placed within 6.3 mm of the transmitter ball. Consult Intel's Arria 10 SX Transceiver User Guide for detailed PCB stackup recommendations and channel-loss budgets before committing to your laminate material selection.
Informações de conformidade
RoHS and REACH compliance per Intel product environmental documentation. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC. Conflict-minerals compliance per Intel supply-chain disclosure. Halogen-free status not explicitly stated in available data.
