10AS032H4F35I3LG - Arria 10 SX 320 SoC FPGA, 1152-FBGA | Intel
MPN: 10AS032H4F35I3LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1735.28 | $1,735.28 |
| 10 | $1614.1 | $16,141.00 |
| 100 | $1498.5 | $149,850.00 |
| 500 | $1395.2 | $697,600.00 |
| 1,000 | $1320.75 | $1,320,750.00 |
Drop-in alternatives for 10AS032H4F35I3LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS032H4F35E3LG
✅ Drop-In✓ In Stock
$1195 / Unit
View Datasheet →10AS032H4F35I3SG
✅ Drop-In✓ In Stock
$1080 / Unit
View Datasheet →10AS032H4F35E3SG
✅ Drop-In✓ In Stock
$3750 / Unit
View Datasheet →10AS032H3F35I2LG
✅ Drop-In✓ In Stock
$1590 / Unit
View Datasheet →10AS032H3F35I2SG
✅ Drop-In✓ In Stock
$2120 / Unit
View Datasheet →10AS032H2F35I2LG
✅ Drop-In✓ In Stock
$1295 / Unit
View Datasheet →10AS032H4F35I3LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX SoC FPGA |
| Device Variant | 10AS032 (Logic Density 320K LE) |
| Logic Elements | 320,000 |
| Hard Processor System (HPS) | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz |
| Package | 1152-pin FC-FBGA (F35, 35x35 mm) |
| Process Technology | 20 nm |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Transceivers | Multi-protocol, up to 12.5 Gbps |
| Memory Controller | Hard DDR3/DDR4 controller in HPS and fabric |
| DSP Blocks | Hard floating-point capable |
| Configuration | Through HPS or FPGA fabric |
| Mounting Type | Surface Mount (flip-chip BGA) |
| RoHS Status | Compliant (per Altera product page) |
| Speed Grade | 3 (per device suffix) |
10AS032H4F35I3LG 1152-pin fc-fbga (f35, 35x35 mm) Pin Configuration Guide
Complete pinout information for 10AS032H4F35I3LG (1152-pin fc-fbga (f35, 35x35 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS032H4F35I3LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS032H4F35I3LG is suitable for 6 applications: Wireless Baseband Processing, Military and Aerospace Secure Communications, Broadcast Video Encoding and Processing, Industrial Machine Vision and Imaging, Test and Measurement Instrumentation, High-Performance Embedded Compute (HPC) Edge Nodes.
Wireless Baseband Processing
The 10AS032H4F35I3LG's 320K logic elements combined with the dual ARM Cortex-A9 HPS running at 1.5 GHz make it a strong fit for 4G/5G small-cell and macro baseband processing. The FPGA fabric handles high-throughput signal processing such as FFT/IFFT, channel estimation, FEC decoding, and beamforming weight calculation, while the HPS runs the L2/L3 stack and protocol stack. The multi-protocol transceivers up to 12.5 Gbps support CPRI and JESD204B interfaces to RFICs, and the industrial temperature grade supports outdoor macro deployments. Compared with discrete CPU+FPGA designs, the SoC FPGA approach reduces latency between HPS and fabric via the AXI coherent bridge and lowers BOM cost.
Recommended
Military and Aerospace Secure Communications
The Arria 10 SX SoC FPGA is widely used in tactical radio, SIGINT, and secure communications systems. The hard Cortex-A9 cores run cryptographic libraries and key management, while the FPGA fabric handles bulk encryption/decryption (AES, ChaCha20) and waveform processing. The 1152-FBGA F35 package is robust against shock and vibration typical of military platforms, and the industrial temperature grade meets MIL-STD-810G requirements for many deployed scenarios. Hardware floating-point DSP blocks accelerate FFTs in electronic-warfare receivers. Pair with external radiation-tolerant memory when the application requires space-grade hardening.
Recommended
Broadcast Video Encoding and Processing
Broadcast encoders and video processing engines benefit from the 10AS032H4F35I3LG's parallel fabric for HEVC/H.264 motion estimation, deinterlacing, and color-space conversion. The 320K logic elements hold multi-channel 1080p60 pipelines, and the integrated transceivers drive SDI (SMPTE 2022-6/2110) at 12 Gbps. The Cortex-A9 HPS handles codec configuration, network control, and ancillary data injection. The SoC integration removes the latency of PCIe transfers between CPU and FPGA, enabling sub-frame pipeline latency for live broadcast production workflows.
Recommended
Industrial Machine Vision and Imaging
Multi-camera machine vision systems use the 10AS032H4F35I3LG to aggregate and pre-process image data from MIPI-CSI-2 or GigE Vision sources. The FPGA fabric handles Bayer demosaic, lens distortion correction, and feature extraction at line rate, while the HPS runs inference pipelines or forwards pre-processed frames over Ethernet. Hard PCIe Gen3 IP allows direct connection to host CPUs for applications that need additional compute. The industrial temperature grade and 35x35 mm BGA package suit DIN-rail-mounted industrial PCs and vision appliances operating in factory-floor environments.
Recommended
Test and Measurement Instrumentation
High-end oscilloscopes, protocol analyzers, and arbitrary waveform generators leverage the 10AS032H4F35I3LG to combine real-time DSP with user interfaces. The FPGA fabric implements waveform synthesis, real-time triggering, and signal-conditioning paths at sample rates into the GS/s range, while the Cortex-A9 cores run the user interface stack, communication protocols, and disk storage. The multi-protocol transceivers support protocols such as PCIe, USB 3.1, and 10 GbE backhaul to instrument host software. The SoC integration simplifies thermal design versus a two-chip solution.
Recommended
High-Performance Embedded Compute (HPC) Edge Nodes
Edge-compute nodes for industrial IoT or predictive maintenance combine the 10AS032H4F35I3LG's dual ARM Cortex-A9 cores for container orchestration and MQTT/OPC-UA protocol handling with FPGA-accelerated DSP for vibration analysis, anomaly detection, and time-series aggregation. The hard DDR3/DDR4 controller supports large in-memory datasets, and the integrated PCIe enables NVMe storage. The SoC architecture reduces power versus CPU+GPU combinations, and the F35 industrial temperature grade supports deployment in unshielded enclosures. This combination suits Industry 4.0 gateways and edge AI pre-processing.
Recommended
Recommended Products Summary
Engineering reference data for 10AS032H4F35I3LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS032H4F35E3LG | 10AS032H4F35I3SG | 10AS032H4F35E3SG | 10AS032H3F35I2LG | 10AS032H3F35I2SG | 10AS032H2F35I2LG |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FCBGA F35 (35x35 mm) | 1152-FCBGA F35 (35x35 mm) - same | 1152-FCBGA F35 (35x35 mm) - same | 1152-FCBGA F35 (35x35 mm) - same | 1152-FCBGA F35 (35x35 mm) - same | 1152-FCBGA F35 (35x35 mm) - same | 1152-FCBGA F35 (35x35 mm) - same |
| Logic Elements | 320K | 320K | 320K | 320K | 320K | 320K | 320K |
| HPS Cores | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Speed Grade | H4 (3) | H4 (3) | H4 (3) | H4 (3) | H3 (2) - slower | H3 (2) - slower | H2 (2) - slowest |
| Temperature Grade | Industrial (-40C to +100C) | Enhanced industrial | Industrial | Enhanced industrial | Industrial | Industrial | Industrial |
| Process Node | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Transceiver Rate | Up to 12.5 Gbps | Up to 12.5 Gbps | Up to 12.5 Gbps | Up to 12.5 Gbps | Up to 12.5 Gbps | Up to 12.5 Gbps | Up to 12.5 Gbps |
Key Differentiators
- Highest speed grade H4 within the F35 package variant (vs 10AS032H3F35I2LG)
- Industrial temperature grade for harsh environments (vs 10AS032H4F35E3LG)
- Hard ARM Cortex-A9 SoC integration eliminates CPU-FPGA latency (vs Disparate CPU+FPGA (e.g., Microchip PolarFire + external CPU))
Design Notes
The 10AS032H4F35I3LG requires multiple power rails (VCC, VCCL, VCCP, VCCPT, VCCBAT, transceiver supplies, HPS supplies) that must be sequenced per Intel's Arria 10 SX power management guidelines. Use the Intel Enpirion or compatible power solution with the Arria 10 SX power sequencer reference design to ensure correct startup order. Provide at least 20 bulk decoupling capacitors distributed across the PCB area beneath the BGA, plus high-frequency 0.1 uF and 1 nF decoupling at every power pin pair. A high-performance SoC FPGA can draw peak currents exceeding 30 A at 0.85 V core, so use a 6+ layer PCB with dedicated power and ground planes.
The 1152-FBGA F35 package has a junction-to-ambient thermal resistance (theta_JA) typically around 7-10 C/W with sufficient forced airflow and PCB copper, but can exceed 15 C/W in still air. Use a heatsink with thermal interface material (TIM) and 200-400 LFM airflow for continuous high-utilization workloads. Industrial temperature grade means the junction must stay below 100C; refer to the Arria 10 SX thermal modeling file for power estimation versus junction temperature. Avoid placing the device near PCB edges where airflow is restricted and where the thermal edge effect raises theta_JA significantly.
The 1152-FCBGA package has 1 mm pitch (typical for F35), which requires laser-drilled micro-vias, via-in-pad, and high-density interconnect (HDI) PCB fabrication. Plan stack-up with at least 6 layers: signal-ground-signal-power-signal-ground-signal or similar. Use 50 ohm controlled impedance for high-speed transceiver channels and 90 ohm differential for transceivers. Assign transceiver channels on the package periphery (per Intel pin-out file) to avoid via stubs on the high-speed nets. Verify all signal-integrity simulations in HyperLynx or ANSYS SIwave before fabrication.
Common mistakes when designing with the 10AS032H4F35I3LG include: (1) using the wrong pin-out file - the F35 package has a different ball map than F27 or F29 variants; (2) omitting the configuration flash and JTAG header, which prevents recovery from failed HPS boot; (3) failing to meet DDR3/DDR4 trace-length matching requirements, which causes intermittent memory errors at high speed; (4) not accounting for the high inrush current during configuration, which can cause power-supply collapse; (5) selecting a heatsink that does not match the 35x35 mm BGA footprint, leading to inadequate thermal contact. Always use the latest Quartus Prime pin-out file for the F35 variant and validate with the Arria 10 SX development kit before custom PCB layout.
Compliance Information
RoHS and lead-free confirmed per Altera/Intel product page material declaration. REACH compliance confirmed by Intel. Halogen-free status not explicitly stated in verified data. AEC-Q100 is not applicable - this is an industrial-grade SoC FPGA, not an automotive-qualified part.
