10AS032H4F35I3SG - Arria 10 SX 320K SoC FPGA, 1152-FBGA | Intel
MPN: 10AS032H4F35I3SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1394.91 | $1,394.91 |
| 10 | $1320.5 | $13,205.00 |
| 100 | $1180 | $118,000.00 |
| 250 | $1120 | $280,000.00 |
| 500 | $1080 | $540,000.00 |
Drop-in alternatives for 10AS032H4F35I3SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS032H4F35I3LG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1320.75 / Unit
View Datasheet →10AS032H4F35E3SG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3750 / Unit
View Datasheet →10AS032H4F34I3SG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3150 / Unit
View Datasheet →10AS032H4F35E3LG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1195 / Unit
View Datasheet →10AS032H4F34I3LG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →10AS032H4F35I3SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 320,000 |
| Adaptive Logic Modules (ALM) | 118,730 |
| Embedded Memory (Mbits) | 21.6 |
| DSP Blocks | 1,568 |
| DSP Format | Variable-precision with hard IEEE 754 single-precision FP |
| Transceivers | 24 (up to 17.4 Gbps) |
| HPS Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Clock Speed | 1.5 GHz |
| Hard Memory Controller | Yes (DDR3/DDR4, LPDDR2/3) |
| PCIe Hard IP | PCIe Gen3 x8 |
| Process Node | 20 nm |
| Package | 1152-ball Flip-Chip BGA (35x35 mm) |
| Operating Temperature | -40C to +100C (Industrial) |
| RoHS Status | Compliant |
10AS032H4F35I3SG 1152-ball flip-chip bga (35x35 mm) Pin Configuration Guide
Complete pinout information for 10AS032H4F35I3SG (1152-ball flip-chip bga (35x35 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS032H4F35I3SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS032H4F35I3SG is suitable for 6 applications: 5G Radio Baseband Processing, Radar and Electronic Warfare, Industrial Machine Vision, Military Secure Communications, Medical Imaging Accelerator, Video Broadcast Infrastructure.
5G Radio Baseband Processing
The 10AS032H4F35I3SG's 24 transceivers up to 17.4 Gbps and 1,568 DSP blocks with hard IEEE 754 single-precision floating point make it well-suited for 5G radio unit (RU) baseband processing. The device handles 4T4R or 8T8R CPRI/eCPRI fronthaul aggregation with sub-millisecond latency, while the dual 1.5 GHz ARM Cortex-A9 HPS runs MAC-layer scheduling and OAM software. Industrial -40C to +100C operation supports outdoor tower-mount and edge deployments.
Recommended
Radar and Electronic Warfare
The 10AS032H4F35I3SG excels in radar and electronic-warfare (EW) signal processing, with 24 transceivers supporting phased-array digitisation and 1,568 DSP blocks delivering 1.5 TFLOPs of single-precision throughput for pulse compression, MTI, and beamforming. The industrial temperature grade supports airborne and shipboard platforms, while the ARM HPS handles track-management software. PCIe Gen3 x8 enables tight coupling to FPGA co-processors.
Recommended
Industrial Machine Vision
The 10AS032H4F35I3SG powers multi-camera machine-vision systems, where its 1,568 DSP blocks run convolutional neural networks at 50-100 frames per second on 1080p streams. The dual ARM Cortex-A9 HPS runs Linux for camera-link protocol stacks, while the FPGA fabric interfaces with MIPI CSI-2, GigE Vision, and CoaXPress sensors. The 35x35 mm FCBGA supports fan-less industrial chassis with -40C to +100C operation for factory floor deployment.
Recommended
Military Secure Communications
The 10AS032H4F35I3SG supports tactical-radio and secure-communications platforms with 24 transceivers fed through the FPGA fabric to DSP blocks implementing AES-256, frequency hopping, and adaptive modems. The ARM HPS runs a Linux-based crypto stack, while the FPGA fabric accelerates bulk encryption at line rate. Industrial temperature operation and BGA packaging support ruggedised MIL-spec enclosures used in dismounted and vehicular applications.
Recommended
Medical Imaging Accelerator
The 10AS032H4F35I3SG powers CT, MRI, and ultrasound imaging systems where its 1,568 DSP blocks deliver 1.5 TFLOPs for back-projection, beamforming, and image reconstruction. The hard IEEE 754 single-precision floating point accelerates iterative reconstruction algorithms at sub-second latency. The dual ARM Cortex-A9 HPS runs the imaging GUI and DICOM stack, while the FPGA fabric interfaces with high-speed ADC channels and LVDS probe arrays.
Recommended
Video Broadcast Infrastructure
The 10AS032H4F35I3SG handles UHD video processing in broadcast and Pro AV infrastructure, with 24 transceivers supporting 12G-SDI, SMPTE 2110 IP video, and HDMI 2.0 ingest. The 1,568 DSP blocks run real-time video codecs, color-space conversion, and overlay blending. The dual ARM Cortex-A9 HPS runs a Linux-based broadcast control plane, while the FPGA fabric delivers deterministic sub-frame latency required for live production switching.
Recommended
Recommended Products Summary
Engineering reference data for 10AS032H4F35I3SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS032H4F35I3LG | 10AS032H4F35E3SG | 10AS032H4F34I3SG | 10AS032H4F35E3LG | 10AS032H4F34I3LG |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1152-FCBGA (35x35 mm) | 1152-FCBGA (35x35 mm) - same | 1152-FCBGA (35x35 mm) - same | 1152-FCBGA (34x34 mm) | 1152-FCBGA (35x35 mm) - same | 1152-FCBGA (34x34 mm) |
| Logic Elements | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Enhanced (0C to +100C) | Industrial (-40C to +100C) | Enhanced (0C to +100C) | Industrial (-40C to +100C) |
| Lead Finish | SnPb (standard) | Pb-free (matte Sn) | SnPb (standard) | SnPb (standard) | Pb-free (matte Sn) | Pb-free (matte Sn) |
| DSP Blocks | 1,568 | 1,568 | 1,568 | 1,568 | 1,568 | 1,568 |
| Transceivers | 24 (17.4 Gbps) | 24 (17.4 Gbps) | 24 (17.4 Gbps) | Reduced (smaller BGA) | 24 (17.4 Gbps) | Reduced (smaller BGA) |
| HPS Processor | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz |
Key Differentiators
- Industrial-grade operation with full -40C to +100C junction temperature (vs 10AS032H4F35E3SG)
- Full 35x35 mm FCBGA with maximum transceiver count (vs 10AS032H4F34I3SG)
- Dual ARM Cortex-A9 at 1.5 GHz for embedded compute (vs Pure-FPGA Arria 10 GX family)
Design Notes
Estimated: at 100% utilisation of the 1,568 DSP blocks plus 24 transceivers at 17.4 Gbps, the 10AS032H4F35I3SG draws approximately 25-30 W from VCC, VCCP, VCCPT, and VCC_HPS rails. Designers should budget for the Intel SmartVID-controlled core voltage (typically 0.85-0.95 V) using the Arria 10 PowerPlay early-power-estimator spreadsheet before PCB layout. Use independent decoupling networks per rail with at least 10x 47 uF bulk capacitors and 0.1 uF/1 uF high-frequency ceramics placed within 5 mm of the BGA balls.
Estimated: at 25 W dissipation on a 35x35 mm 1152-ball FCBGA with typical junction-to-ambient theta_JA of 8-12 C/W (still air, JEDEC test board), the junction rises 200-300 C above ambient. Industrial-grade devices rated to +100C junction require a heatsink plus 200-400 LFM airflow or a cold-plate in a conduction-cooled chassis. Designers should always check the SmartVID thermal model in Quartus Prime and apply Arria 10 thermal-design guidelines to avoid thermal-shutdown at elevated ambient.
Route the 17.4 Gbps transceiver lanes with controlled impedance of 100 ohm differential (85 ohm for lower data rates) using 12-15 mil trace widths on Megtron-6 or equivalent low-loss dielectric stackup. Apply length-matching within 5 mils per transceiver channel and place AC-coupling capacitors within 200 mils of the device balls. For the HPS, route DDR3/DDR4 with 50 ohm single-ended trace impedance and within 25 ps of byte-level matching per Intel EMIF specification.
Ensure the HPS boot ROM is configured via the BSEL pins for the correct boot source (QSPI flash, NAND, SD/MMC, or eMMC) before POR. Failure to strap BSEL correctly results in no boot. Also verify the transceiver reference-clock jitter meets the Arria 10 SX PLL specification - a noisy reference clock causes link instability at 17.4 Gbps. Use a low-noise clock generator such as the Si5341 or equivalent.
Compliance Information
SnPb lead-finish standard; Pb-free variant is 10AS032H4F35I3LG. RoHS compliance depends on variant: the standard suffix is SnPb (non-RoHS), while the LG suffix is Pb-free matte Sn. AEC-Q100 not applicable as this is an FPGA, not an automotive-qualified IC.
