10AS048E2F29E1HG - 480K Logic Elements, 1.5 GHz Arria 10 SX SoC
N.º da peça: 10AS048E2F29E1HG ✓ Ativo| Qtd. | Preço unitário | Total |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
10AS048E2F29E1HG Visão geral
An FPGA is a semiconductor device whose digital logic is configured after manufacturing. Within the broader hierarchy, an FPGA belongs to programmable logic devices and can implement processors, interfaces, state machines, and parallel signal-processing datapaths. A system-on-chip FPGA extends that programmable fabric with fixed processor, memory-controller, and peripheral subsystems. The Arria 10 SX architecture therefore occupies the boundary between an FPGA and a multicore processor-based embedded system.
The principal differentiating features are 480K logic elements, a 1.5 GHz processor-related frequency rating, dual ARM Cortex-A9 MPCore processors, CoreSight technology, and a 780-ball FCBGA package. These elements make the device suitable for systems that need both deterministic FPGA acceleration and software execution. The 29 mm by 29 mm body also identifies a high-pin-count surface-mount package requiring advanced PCB assembly and controlled routing resources.
From an architecture perspective, the SoC can partition compute work between the hard ARM processor subsystem and customized FPGA logic. FPGA logic can handle parallel transforms, streaming interfaces, protocol adaptation, or sensor data processing, while the ARM subsystem supports operating systems, control software, networking stacks, and system management. CoreSight provides the debug and trace capabilities needed to develop software running on the embedded processors alongside the programmable fabric.
Typical applications include industrial imaging, communications infrastructure, test and measurement equipment, secure network appliances, and software-defined radio platforms. In these systems, the FPGA can accelerate deterministic processing while the ARM cores handle protocol stacks, control, and supervisory functions. The combined architecture is especially useful when requirements evolve after board design because FPGA functions can be updated without changing the processor-based hardware architecture.
Designers must evaluate the complete 780-ball pin assignment, PCB escape routing, power distribution, decoupling, thermal performance, clocking, and configuration scheme against the official device documentation before layout. Because the supplied data does not expose all electrical limits or a verified ball-level pinout, missing values should not be inferred from the package name or from related Arria 10 devices.
This product record combines verified distributor and manufacturer facts with transparent placeholders for unpublished parameters, giving engineers a source-aware starting point for selecting and laying out the 10AS048E2F29E1HG. Distributor inventory was explicitly reported as shipping on the verification date, while pricing was not supplied and therefore remains unavailable.
Alternativas drop-in para 10AS048E2F29E1HG — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 10AS048E2F29E1HG (mesmo formato e footprint) — diferindo em RoHS Status, Package, Logic Elements, Mounting Type, Device Type.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
Nenhuma alternativa drop-in disponível para este produto.
Solicitar alternativas10AS048E2F29E1HG Classificações máximas e características elétricas
| Product Type | System-on-Chip FPGA |
| Device Family | Arria 10 SX |
| Logic Elements | 480K |
| Processor Cores | 2 ARM Cortex-A9 MPCore processors |
| Processor Frequency | 1.5 GHz |
| Debug and Trace | CoreSight |
| Terminal Count | 780 balls |
| Encapsulamento | 780-FBGA, FC (29x29) |
| Package Dimensions | 29 mm x 29 mm |
| Terminal Form | BALL |
| Package Code | BGA |
| Package Shape | SQUARE |
| Tipo de montagem | Surface Mount |
| Status RoHS | Yes |
| REACH Compliance | unknown |
| I/O Count | 360 I/O |
| Status do ciclo de vida | Active |
Guia de Configuração de Pinos do 10AS048E2F29E1HG square
Configuração de pinos para 10AS048E2F29E1HG (pacote square). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 10AS048E2F29E1HG.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
10AS048E2F29E1HG é adequado para 6 aplicaçãos: Industrial Machine Vision, Software-Defined Radio, Communications Infrastructure, Test and Measurement Equipment, Industrial Control Systems, Secure Network Appliances.
Industrial Machine Vision
The 10AS048E2F29E1HG fits machine-vision systems that need both deterministic image processing and embedded software control. Its 480K logic elements can implement camera-interface adaptation, frame preprocessing, filtering, object detection, and real-time conveyor control, while the dual ARM Cortex-A9 MPCore subsystem can run operating-system tasks, communication stacks, and supervisory logic. The 1.5 GHz frequency rating supports demanding processing workflows, but designers must verify actual image throughput, memory bandwidth, and supported camera interfaces from the official Arria 10 documentation. The 780-ball FCBGA requires controlled impedance, robust power distribution, adequate thermal analysis, and an assembly process capable of the 29 mm by 29 mm package.
Recomendado
Software-Defined Radio
The 10AS048E2F29E1HG is relevant to software-defined radio platforms that combine sample-rate processing with protocol and network software. The 480K logic-element fabric can perform filtering, modulation, demodulation, channelization, and interface bridging, while the ARM Cortex-A9 MPCore cores can manage control planes, packet processing, and communications software. CoreSight technology can assist processor debugging and trace during embedded-software development. The verified data does not state the number or speed of transceiver channels, so RF feasibility must be established from the official device documentation rather than assumed. Confirm ADC and DAC interface requirements, clocking, power rails, thermal limits, and PCB signal integrity before architecture approval.
Recomendado
Communications Infrastructure
The 10AS048E2F29E1HG can support communications infrastructure where packet processing, protocol conversion, and deterministic datapath acceleration coexist. Its FPGA fabric is suited to parallel framing, traffic shaping, interface bridging, and line-rate functions, while the dual ARM Cortex-A9 MPCore processors can run control software and protocol stacks. The verified 1.5 GHz rating and 360 I/O indicate substantial computational and interface capacity, but exact performance depends on I/O standards, transceiver availability, memory architecture, and power constraints. Those parameters were not supplied and must be verified before selection. The 780-ball flip-chip package also requires a reviewed PCB stack-up, signal-integrity analysis, thermal plan, and supply decoupling network.
Recomendado
Test and Measurement Equipment
The 10AS048E2F29E1HG suits test and measurement systems that require high-speed capture, deterministic digital processing, and embedded control in one device. The 480K logic elements can implement triggering, timing, waveform analysis, digital filtering, protocol decoding, and interface conversion, while the ARM Cortex-A9 MPCore subsystem can manage displays, storage, networking, and command processing. CoreSight provides a basis for processor-centric debug and trace, subject to toolchain confirmation. The 1.5 GHz headline frequency does not by itself guarantee a particular measurement rate; designers must characterize logic utilization, memory bandwidth, I/O speed, clock resources, and thermal margin. The 780-ball package should be handled as a high-speed, high-density design from schematic capture onward.
Recomendado
Industrial Control Systems
The 10AS048E2F29E1HG can serve industrial controllers that combine deterministic motion or I/O processing with networked supervisory software. The 480K logic-element fabric can execute real-time control loops, encoder handling, safety-oriented state logic, and fieldbus adaptation, while the dual ARM Cortex-A9 MPCore processors can support operating systems, configuration management, diagnostics, and Ethernet connectivity. Its 360 I/O provide integration capacity, but the verified source does not identify which I/O standards or banks are available in this ordering code. Engineers must confirm temperature grade, voltage levels, industrial qualification, boot and configuration scheme, and long-term lifecycle commitments before deployment. The 780-ball 29 mm by 29 mm package also demands comprehensive power, thermal, and assembly planning.
Recomendado
Secure Network Appliances
The 10AS048E2F29E1HG can support secure network appliances that need parallel packet inspection alongside embedded management software. The FPGA fabric can accelerate parsing, filtering, encryption or decryption datapaths, traffic classification, and custom interface functions, while the dual ARM Cortex-A9 MPCore subsystem can run control software, security services, and management interfaces. The verified 480K logic elements and 1.5 GHz rating provide a useful starting point for partitioning, but they do not prove a particular throughput. Security throughput depends on selected IP, memory bandwidth, packet size, clock rate, and external networking components. Confirm the processor and FPGA security features, boot controls, supported interfaces, and thermal limits from official documentation before design freeze.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 10AS048E2F29E1HG — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto |
|---|---|
| Brand | Altera |
| Package | 780-FBGA, FC (29x29) |
| Logic Elements | 480K |
| Processor | Dual ARM Cortex-A9 MPCore |
| Frequency | 1.5 GHz |
| Debug Technology | CoreSight |
| I/O Count | 360 I/O |
| Lifecycle Status | Active |
| RoHS Status | Yes |
| Drop-In Alternatives Verified | 0 |
Principais diferenciais
- Integrated hard processor subsystem (vs A conventional standalone FPGA)
- CoreSight debug and trace integration (vs A device without the verified CoreSight feature)
- Large programmable-logic capacity (vs 10AS032E4F29I3SG)
- High-density FCBGA interface (vs 10AS048E1F29I1HG)
Notas de projeto
Create the power architecture only from the official Arria 10 device documentation and the selected board implementation. The supplied data confirms a 780-ball SoC but does not provide core voltage, auxiliary rail values, current limits, power-up ordering, or permissible tolerances. After those values are available, budget for FPGA logic utilization, processor activity, I/O switching, and external memory loads, then size regulators with transient margin. Place decoupling capacitors according to the manufacturer reference design and use separate power islands where the design guide permits.
Treat the 29 mm by 29 mm FCBGA as a system-level thermal component even though the supplied data does not provide power or thermal-resistance values. Estimate total dissipation from the eventual logic, processor, memory, and I/O activity, then model the selected PCB, enclosure, airflow, and heat-spreader solution. The manufacturer package thermal guidance should be used to set junction and board-temperature limits. Do not derive a junction temperature from the 1.5 GHz headline value; it is not a direct power specification.
Begin PCB stack-up and escape planning before schematic completion because 780 balls create dense routing and power-delivery constraints. Use the official ball table to reserve high-speed differential pairs, clocks, configuration signals, power pins, and no-connects. Confirm whether the assembly flow uses via-in-pad or filled microvias, and specify controlled impedance for the actual I/O standards selected. Validate the stack-up with the fabricator, simulate critical interfaces, and follow the exact land pattern and pin-1 orientation supplied in package documentation.
Partition the design between ARM software and FPGA logic to reduce contention at shared memory and I/O resources. Keep high-speed source-synchronous or differential paths short and continuous, provide solid reference planes, and avoid layer transitions that split return current. Place clock-generation and distribution parts near the relevant SoC balls while respecting the official pin restrictions. Maintain configuration, reset, and boot interfaces with deterministic timing and verify them on hardware, because no configuration voltage, boot mode, or reset threshold was supplied here.
Do not treat a related Arria 10 MPN as pin-compatible merely because it appears in the Site MPN list. Ordering-code suffixes can encode speed, temperature, package, and feature differences. A drop-in decision requires the full 780-ball comparison, package drawings, voltage and I/O-bank compatibility, configuration interface support, and lifecycle evidence. The cross-reference results supplied for this target contained generic search tools rather than verified equivalent parts, so alternatives are intentionally omitted until authoritative evidence is available.
Informações de conformidade
Worldway Electronics reports RoHS Code: Yes. The supplied data reports REACH as unknown and does not establish AEC-Q100, lead-free, halogen-free, or conflict-minerals status.
