10AS048E2F29E1HG - 480K Logic Elements, 1.5 GHz Arria 10 SX SoC
부품 번호: 10AS048E2F29E1HG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
10AS048E2F29E1HG 개요
An FPGA is a semiconductor device whose digital logic is configured after manufacturing. Within the broader hierarchy, an FPGA belongs to programmable logic devices and can implement processors, interfaces, state machines, and parallel signal-processing datapaths. A system-on-chip FPGA extends that programmable fabric with fixed processor, memory-controller, and peripheral subsystems. The Arria 10 SX architecture therefore occupies the boundary between an FPGA and a multicore processor-based embedded system.
The principal differentiating features are 480K logic elements, a 1.5 GHz processor-related frequency rating, dual ARM Cortex-A9 MPCore processors, CoreSight technology, and a 780-ball FCBGA package. These elements make the device suitable for systems that need both deterministic FPGA acceleration and software execution. The 29 mm by 29 mm body also identifies a high-pin-count surface-mount package requiring advanced PCB assembly and controlled routing resources.
From an architecture perspective, the SoC can partition compute work between the hard ARM processor subsystem and customized FPGA logic. FPGA logic can handle parallel transforms, streaming interfaces, protocol adaptation, or sensor data processing, while the ARM subsystem supports operating systems, control software, networking stacks, and system management. CoreSight provides the debug and trace capabilities needed to develop software running on the embedded processors alongside the programmable fabric.
Typical applications include industrial imaging, communications infrastructure, test and measurement equipment, secure network appliances, and software-defined radio platforms. In these systems, the FPGA can accelerate deterministic processing while the ARM cores handle protocol stacks, control, and supervisory functions. The combined architecture is especially useful when requirements evolve after board design because FPGA functions can be updated without changing the processor-based hardware architecture.
Designers must evaluate the complete 780-ball pin assignment, PCB escape routing, power distribution, decoupling, thermal performance, clocking, and configuration scheme against the official device documentation before layout. Because the supplied data does not expose all electrical limits or a verified ball-level pinout, missing values should not be inferred from the package name or from related Arria 10 devices.
This product record combines verified distributor and manufacturer facts with transparent placeholders for unpublished parameters, giving engineers a source-aware starting point for selecting and laying out the 10AS048E2F29E1HG. Distributor inventory was explicitly reported as shipping on the verification date, while pricing was not supplied and therefore remains unavailable.
드롭인 대체품: 10AS048E2F29E1HG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AS048E2F29E1HG (동일 폼 팩터 및 풋프린트) — 차이점: RoHS Status, Package, Logic Elements, Mounting Type, Device Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
이 제품에는 사용 가능한 드롭인 대체품이 없습니다.
대체품 요청10AS048E2F29E1HG 최대 정격 & 전기적 특성
| Product Type | System-on-Chip FPGA |
| Device Family | Arria 10 SX |
| Logic Elements | 480K |
| Processor Cores | 2 ARM Cortex-A9 MPCore processors |
| Processor Frequency | 1.5 GHz |
| Debug and Trace | CoreSight |
| Terminal Count | 780 balls |
| 패키지 | 780-FBGA, FC (29x29) |
| Package Dimensions | 29 mm x 29 mm |
| Terminal Form | BALL |
| Package Code | BGA |
| Package Shape | SQUARE |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Yes |
| REACH Compliance | unknown |
| I/O Count | 360 I/O |
| 수명 주기 상태 | Active |
10AS048E2F29E1HG square 핀 구성 가이드
10AS048E2F29E1HG(square 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AS048E2F29E1HG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AS048E2F29E1HG 적합 용도: 6 애플리케이션s: Industrial Machine Vision, Software-Defined Radio, Communications Infrastructure, Test and Measurement Equipment, Industrial Control Systems, Secure Network Appliances.
Industrial Machine Vision
The 10AS048E2F29E1HG fits machine-vision systems that need both deterministic image processing and embedded software control. Its 480K logic elements can implement camera-interface adaptation, frame preprocessing, filtering, object detection, and real-time conveyor control, while the dual ARM Cortex-A9 MPCore subsystem can run operating-system tasks, communication stacks, and supervisory logic. The 1.5 GHz frequency rating supports demanding processing workflows, but designers must verify actual image throughput, memory bandwidth, and supported camera interfaces from the official Arria 10 documentation. The 780-ball FCBGA requires controlled impedance, robust power distribution, adequate thermal analysis, and an assembly process capable of the 29 mm by 29 mm package.
추천
Software-Defined Radio
The 10AS048E2F29E1HG is relevant to software-defined radio platforms that combine sample-rate processing with protocol and network software. The 480K logic-element fabric can perform filtering, modulation, demodulation, channelization, and interface bridging, while the ARM Cortex-A9 MPCore cores can manage control planes, packet processing, and communications software. CoreSight technology can assist processor debugging and trace during embedded-software development. The verified data does not state the number or speed of transceiver channels, so RF feasibility must be established from the official device documentation rather than assumed. Confirm ADC and DAC interface requirements, clocking, power rails, thermal limits, and PCB signal integrity before architecture approval.
추천
Communications Infrastructure
The 10AS048E2F29E1HG can support communications infrastructure where packet processing, protocol conversion, and deterministic datapath acceleration coexist. Its FPGA fabric is suited to parallel framing, traffic shaping, interface bridging, and line-rate functions, while the dual ARM Cortex-A9 MPCore processors can run control software and protocol stacks. The verified 1.5 GHz rating and 360 I/O indicate substantial computational and interface capacity, but exact performance depends on I/O standards, transceiver availability, memory architecture, and power constraints. Those parameters were not supplied and must be verified before selection. The 780-ball flip-chip package also requires a reviewed PCB stack-up, signal-integrity analysis, thermal plan, and supply decoupling network.
추천
Test and Measurement Equipment
The 10AS048E2F29E1HG suits test and measurement systems that require high-speed capture, deterministic digital processing, and embedded control in one device. The 480K logic elements can implement triggering, timing, waveform analysis, digital filtering, protocol decoding, and interface conversion, while the ARM Cortex-A9 MPCore subsystem can manage displays, storage, networking, and command processing. CoreSight provides a basis for processor-centric debug and trace, subject to toolchain confirmation. The 1.5 GHz headline frequency does not by itself guarantee a particular measurement rate; designers must characterize logic utilization, memory bandwidth, I/O speed, clock resources, and thermal margin. The 780-ball package should be handled as a high-speed, high-density design from schematic capture onward.
추천
Industrial Control Systems
The 10AS048E2F29E1HG can serve industrial controllers that combine deterministic motion or I/O processing with networked supervisory software. The 480K logic-element fabric can execute real-time control loops, encoder handling, safety-oriented state logic, and fieldbus adaptation, while the dual ARM Cortex-A9 MPCore processors can support operating systems, configuration management, diagnostics, and Ethernet connectivity. Its 360 I/O provide integration capacity, but the verified source does not identify which I/O standards or banks are available in this ordering code. Engineers must confirm temperature grade, voltage levels, industrial qualification, boot and configuration scheme, and long-term lifecycle commitments before deployment. The 780-ball 29 mm by 29 mm package also demands comprehensive power, thermal, and assembly planning.
추천
Secure Network Appliances
The 10AS048E2F29E1HG can support secure network appliances that need parallel packet inspection alongside embedded management software. The FPGA fabric can accelerate parsing, filtering, encryption or decryption datapaths, traffic classification, and custom interface functions, while the dual ARM Cortex-A9 MPCore subsystem can run control software, security services, and management interfaces. The verified 480K logic elements and 1.5 GHz rating provide a useful starting point for partitioning, but they do not prove a particular throughput. Security throughput depends on selected IP, memory bandwidth, packet size, clock rate, and external networking components. Confirm the processor and FPGA security features, boot controls, supported interfaces, and thermal limits from official documentation before design freeze.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AS048E2F29E1HG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 |
|---|---|
| Brand | Altera |
| Package | 780-FBGA, FC (29x29) |
| Logic Elements | 480K |
| Processor | Dual ARM Cortex-A9 MPCore |
| Frequency | 1.5 GHz |
| Debug Technology | CoreSight |
| I/O Count | 360 I/O |
| Lifecycle Status | Active |
| RoHS Status | Yes |
| Drop-In Alternatives Verified | 0 |
주요 차별점
- Integrated hard processor subsystem (vs A conventional standalone FPGA)
- CoreSight debug and trace integration (vs A device without the verified CoreSight feature)
- Large programmable-logic capacity (vs 10AS032E4F29I3SG)
- High-density FCBGA interface (vs 10AS048E1F29I1HG)
설계 노트
Create the power architecture only from the official Arria 10 device documentation and the selected board implementation. The supplied data confirms a 780-ball SoC but does not provide core voltage, auxiliary rail values, current limits, power-up ordering, or permissible tolerances. After those values are available, budget for FPGA logic utilization, processor activity, I/O switching, and external memory loads, then size regulators with transient margin. Place decoupling capacitors according to the manufacturer reference design and use separate power islands where the design guide permits.
Treat the 29 mm by 29 mm FCBGA as a system-level thermal component even though the supplied data does not provide power or thermal-resistance values. Estimate total dissipation from the eventual logic, processor, memory, and I/O activity, then model the selected PCB, enclosure, airflow, and heat-spreader solution. The manufacturer package thermal guidance should be used to set junction and board-temperature limits. Do not derive a junction temperature from the 1.5 GHz headline value; it is not a direct power specification.
Begin PCB stack-up and escape planning before schematic completion because 780 balls create dense routing and power-delivery constraints. Use the official ball table to reserve high-speed differential pairs, clocks, configuration signals, power pins, and no-connects. Confirm whether the assembly flow uses via-in-pad or filled microvias, and specify controlled impedance for the actual I/O standards selected. Validate the stack-up with the fabricator, simulate critical interfaces, and follow the exact land pattern and pin-1 orientation supplied in package documentation.
Partition the design between ARM software and FPGA logic to reduce contention at shared memory and I/O resources. Keep high-speed source-synchronous or differential paths short and continuous, provide solid reference planes, and avoid layer transitions that split return current. Place clock-generation and distribution parts near the relevant SoC balls while respecting the official pin restrictions. Maintain configuration, reset, and boot interfaces with deterministic timing and verify them on hardware, because no configuration voltage, boot mode, or reset threshold was supplied here.
Do not treat a related Arria 10 MPN as pin-compatible merely because it appears in the Site MPN list. Ordering-code suffixes can encode speed, temperature, package, and feature differences. A drop-in decision requires the full 780-ball comparison, package drawings, voltage and I/O-bank compatibility, configuration interface support, and lifecycle evidence. The cross-reference results supplied for this target contained generic search tools rather than verified equivalent parts, so alternatives are intentionally omitted until authoritative evidence is available.
규정 준수 정보
Worldway Electronics reports RoHS Code: Yes. The supplied data reports REACH as unknown and does not establish AEC-Q100, lead-free, halogen-free, or conflict-minerals status.
