10AS048E3F29I2LG - Arria 10 SX SoC FPGA, 480K LE, Dual A9, 780-FBGA | Intel
N.º da peça: 10AS048E3F29I2LG ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $1850 | $1.850,00 |
| 10 | $1720 | $17.200,00 |
| 100 | $1580 | $158.000,00 |
| 500 | $1450 | $725.000,00 |
| 1.000 | $1320 | $1.320.000,00 |
10AS048E3F29I2LG Visão geral
An SoC FPGA is a heterogeneous device that combines a programmable FPGA fabric with one or more hard processor cores on a single die, eliminating the need for a separate processor chip and enabling tighter CPU-to-FPGA coupling, lower latency, lower power, and smaller board area than a two-chip CPU+FPGA solution. Within Intel's portfolio, Arria 10 SX sits in the mid-range between Cyclone (low-cost) and Stratix (high-performance), with SoC variants specifically targeted at applications requiring both custom hardware acceleration and software-driven control planes, such as industrial motor control, broadcast equipment, military radios, and medical imaging.
Key specifications include 480K logic elements, 1.5 GHz Cortex-A9 MPCore CPU subsystem, 0.9 V core voltage, 20 nm TSMC process, industrial temperature range, and 780-ball flip-chip BGA. The Arria 10 SX family also integrates hardened memory controllers, PCI Express Gen3 x8, 10 Gbps transceivers, and dedicated DSP blocks with floating-point support, making it suitable for high-throughput signal processing pipelines alongside embedded software stacks.
Architecturally, the SoC integrates the FPGA fabric with the Hard Processor System (HPS) through a high-bandwidth multi-port SDRAM controller and a wide set of FPGA-to-HPS bridges, allowing zero-copy shared memory between the ARM cores and FPGA accelerators. The Cortex-A9 cores include NEON SIMD engines, single/double-precision floating-point units, L1 caches per core, and a shared L2 cache, while CoreSight provides trace, debug, and cross-triggering across the HPS and FPGA domains.
Typical applications include industrial motor drives and machine vision, military and aerospace signal processing, software-defined radio baseband, broadcast video processing, medical imaging accelerators, and high-performance embedded computing platforms that need Linux-capable processors tightly coupled to custom logic. The industrial temperature grade supports harsh-environment deployments.
When designing with this part, pay close attention to multi-rail power sequencing (1.0 V core, 1.8 V HPS, transceiver and I/O voltages), DDR3/DDR4 memory topology rules from the Arria 10 External Memory Interface Handbook, and the HPS pin multiplexing configuration. The high transceiver count and 20 nm process make thermal management of the FC-FBGA critical; a multi-layer PCB with stitched thermal vias and a properly sized heatsink is required for sustained full-throughput operation.
This page synthesizes distributor pricing, F29-footprint drop-in alternatives across the Arria 10 SX speed/le grades, and practical HPS+FPGA integration design notes that go beyond what is found in the manufacturer datasheet alone.
Alternativas drop-in para 10AS048E3F29I2LG — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 10AS048E3F29I2LG (mesmo formato e footprint) — diferindo em Package, Mounting Type, Process Technology, RoHS Status, Package Code.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
10AS048E3F29E2LG
✅ Drop-In✓ Em estoque
$7100 / unidade
Ver ficha técnica →10AS048E2F29I2LG
✅ Drop-In✓ Em estoque
$2295 / unidade
Ver ficha técnica →10AS048E2F29I2SG
✅ Drop-In✓ Em estoque
$1980 / unidade
Ver ficha técnica →10AS048E2F29E2LG
✅ Drop-In✓ Em estoque
$1995 / unidade
Ver ficha técnica →10AS048E2F29E2SG
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →10AS048E1F29I1HG
✅ Drop-In✓ Em estoque
$1920 / unidade
Ver ficha técnica →10AS048E2F29I1HG
✅ Drop-In✓ Em estoque
$2120 / unidade
Ver ficha técnica →10AS048E3F29I2LG Classificações máximas e características elétricas
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 480000 |
| Process Technology | 20 nm (TSMC) |
| Core Voltage | 0.9 V |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS CPU Frequency | 1.5 GHz |
| Encapsulamento | 780-FBGA, FC (29x29 mm) |
| Package Code | F29 |
| Speed Grade | 3 |
| Temperature Grade | Industrial (-40C to +100C TJ) |
| Status RoHS | Compliant |
| Tipo de montagem | Surface Mount (Flip-Chip BGA) |
| Faixa de temperatura de operação | -40C to +100C |
Guia de Configuração de Pinos do 10AS048E3F29I2LG f29
Configuração de pinos para 10AS048E3F29I2LG (pacote f29). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 10AS048E3F29I2LG.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
10AS048E3F29I2LG é adequado para 6 aplicaçãos: Industrial Motor Drive & Motion Control, Software-Defined Radio & Wireless Baseband, Medical Imaging & Diagnostic Equipment, Broadcast Video Processing & Studio Equipment, Military & Aerospace Signal Processing, High-Performance Embedded Computing Platforms.
Industrial Motor Drive & Motion Control
The 10AS048E3F29I2LG fits industrial motor drives because the Arria 10 SX SoC combines a hard dual-core ARM Cortex-A9 HPS for control-loop software (PID, commutation, field-oriented control) with 480K logic elements that can implement multi-axis PWM generation, encoder decoding, and field-weakening algorithms in custom logic. The industrial temperature grade supports factory-floor deployment, while the integrated DDR3/DDR4 controllers feed the deterministic data paths needed for real-time torque control. The 1.5 GHz Cortex-A9 pair handles Linux or RTOS supervisory stacks alongside the FPGA fabric's hardware-accelerated current/voltage loops, reducing bill-of-materials cost versus a discrete MCU+FPGA architecture.
Recomendado
Software-Defined Radio & Wireless Baseband
For software-defined radio and wireless baseband, the 10AS048E3F29I2LG delivers up to 28.05 Gbps transceivers alongside 480K logic elements and dedicated DSP blocks with single/double-precision floating point. The hard dual Cortex-A9 HPS runs the MAC layer and protocol stacks under Linux while the FPGA fabric implements channelization, FFT/iFFT, modulation/demodulation, and crest-factor reduction. The 20 nm process and integrated PCIe Gen3 x8 enable high-throughput data offload to a host CPU or DSP co-processor, which is essential for multi-antenna MIMO and small-cell 4G/5G baseband cards.
Recomendado
Medical Imaging & Diagnostic Equipment
The 10AS048E3F29I2LG suits medical imaging systems such as ultrasound beamformers, CT reconstruction pipelines, and MRI receivers because the 480K logic elements implement parallel beamforming and back-projection kernels while the dual ARM Cortex-A9 HPS runs the user interface, DICOM stack, and image post-processing. Hardware floating-point DSP blocks accelerate tomographic reconstruction algorithms in real time, and the industrial temperature range supports the controlled thermal environment of medical carts and stationary imaging suites. The integrated PCIe Gen3 endpoint interfaces directly to host workstations or storage arrays for raw image data ingest.
Recomendado
Broadcast Video Processing & Studio Equipment
In broadcast video processing, the 10AS048E3F29I2LG handles 4K/UHD HEVC encoding assist, multi-stream SDI interfacing, and real-time color-space conversion using its 480K logic elements and DSP blocks. The hard ARM Cortex-A9 HPS runs control-plane software such as SMPTE 2110 IP stacks, while the FPGA fabric implements low-latency video pipelines. Transceiver rates up to 28.05 Gbps support 12G-SDI and 25G Ethernet for studio backbone connectivity, and the 20 nm process provides the throughput-per-watt required for in-rack broadcast appliances.
Recomendado
Military & Aerospace Signal Processing
For military and aerospace signal processing - including radar, electronic warfare, and avionics - the 10AS048E3F29I2LG provides high DSP throughput with floating-point support for FFT-based algorithms, plus hardened memory controllers and SERDES for secure sensor data links. The industrial temperature grade supports ruggedized enclosures. The hard ARM cores run secure boot, RTOS, and mission software while the FPGA fabric implements signal detection and tracking pipelines. For full MIL-PRF-grade screened variants, customers should consult Intel's military/aerospace part-number families separately.
Recomendado
High-Performance Embedded Computing Platforms
The 10AS048E3F29I2LG serves as the compute heart of high-performance embedded systems such as test and measurement instruments, industrial PCs, and edge AI acceleration cards, where the dual Cortex-A9 HPS runs a Linux or RTOS supervisory stack and the FPGA fabric implements custom data acquisition, protocol bridging, or ML inference pipelines. The integrated PCIe Gen3 x8 endpoint allows direct insertion into host systems as a co-processor card. With 480K logic elements, ample DSP, and 20 nm performance, the device delivers a compelling compute density for space- and power-constrained embedded deployments.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 10AS048E3F29I2LG — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 10AS048E3F29E2LG | 10AS048E2F29I2LG | 10AS048E2F29I2SG | 10AS048E2F29E2LG | 10AS048E2F29E2SG | 10AS048E1F29I1HG | 10AS048E2F29I1HG |
|---|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FBGA F29 (29x29 mm) | 780-FBGA F29 (29x29 mm) - same | 780-FBGA F29 (29x29 mm) - same | 780-FBGA F29 (29x29 mm) - same | 780-FBGA F29 (29x29 mm) - same | 780-FBGA F29 (29x29 mm) - same | 780-FBGA F29 (29x29 mm) - same | 780-FBGA F29 (29x29 mm) - same |
| Logic Elements | 480K | 480K | 480K | 480K | 480K | 480K | 480K | 480K |
| Speed Grade | 3 | 3 | 2 | 2 | 2 | 2 | 1 | 1 |
| Temperature Grade | Industrial (I) | Extended (E) | Industrial (I) | Industrial (I) | Extended (E) | Extended (E) | Industrial (I) | Industrial (I) |
| HPS CPU | Dual Cortex-A9 1.5 GHz | Dual Cortex-A9 1.5 GHz | Dual Cortex-A9 1.5 GHz | Dual Cortex-A9 1.5 GHz | Dual Cortex-A9 1.5 GHz | Dual Cortex-A9 1.5 GHz | Dual Cortex-A9 1.5 GHz | Dual Cortex-A9 1.5 GHz |
| Process Technology | 20 nm TSMC | 20 nm TSMC | 20 nm TSMC | 20 nm TSMC | 20 nm TSMC | 20 nm TSMC | 20 nm TSMC | 20 nm TSMC |
| Drop-in Compatibility | Reference | Yes - same die, different temp grade | Yes - same die, slower speed grade | Yes - same die, packaging suffix variant | Yes - same die, slower speed + extended temp | Yes - same die, slower speed + extended temp + suffix | Yes - same die, slowest speed grade | Yes - same die, slowest speed grade + suffix |
Principais diferenciais
- Hard ARM Cortex-A9 dual-core HPS integrated on-die (vs Pure FPGA (non-SoC) Arria 10 GX 10AX048E3F29I2LG)
- Higher transceiver bandwidth than Cyclone V SoC family (vs Cyclone V SoC 5CSEBA6U23I7 (Cyclone V SE/SoC))
- Mid-range cost-vs-performance vs Stratix 10 SoC (vs Stratix 10 SX 1SX280HN3F43E3VG)
Notas de projeto
Estimated: The Arria 10 SX 480K-LE SoC FPGA requires at least six separate power rails - core (~0.9 V, up to several amps), HPS core (~0.9 V), HPS I/O, FPGA I/O banks (1.2 V-3.0 V depending on standard), transceiver supplies, and auxiliary. Power sequencing must follow Intel's Arria 10 Power Management User Guide to avoid latch-up during ramp. A multi-phase digital controller such as the Intel Enpirion EM12x030 or similar is recommended for the core rail. Add bulk decoupling of 10x22uF MLCC plus 0.1uF per rail pin near the BGA; place a 1 mF tantalum or polymer cap on the input side to absorb inrush.
Estimated: At sustained full utilization (480K LE at 400 MHz, 28 Gbps transceivers active, HPS at 1.5 GHz with both cores loaded), the F29 FC-FBGA dissipates approximately 15-20 W. The package thermal resistance (theta_JA) is in the low single-digit C/W range when the PCB lands properly expose the die through the BGA thermal lands. Required: a thermal via array stitched directly under the BGA's thermal balls, connected to inner-layer copper planes, plus a top-side heatsink with thermal interface material. Without adequate thermal design, the device will throttle or trip thermal shutdown well before industrial -40C to +100C TJ limits are reached.
The 780-FBGA F29 package (29x29 mm) requires a high-density interconnect PCB with at least 12 layers (signal/ground/power) to route memory, transceivers, and PCIe signals at target impedance. Use 0.4 mm ball pitch escape rules with microvia stacks and stagger the breakout so that any single layer's fanout fits within the 0.4 mm grid. Reference Intel's Arria 10 GX/GT/SX PCB Design Guidelines for stackup recommendations. The DDR3/DDR4 memory interface must be routed with matched-length groups to within 25 ps skew per byte lane to meet 1600 MT/s operation.
Do not confuse the Arria 10 SX (10AS048) with the Arria 10 GX (10AX048) - the SX integrates the hard processor system while the GX does not. Board designs that mistakenly swap SX and GX parts will lose the entire HPS subsystem. Also note that the 'I' in 10AS048E3F29I2LG denotes industrial temperature grade; using an industrial part in an extended-temperature chassis design is fine, but using an extended-grade part where industrial is required (e.g., for warranty) is not. Always validate the Ordering Part Number suffix against Intel's Arria 10 Ordering Information table before PCB assembly.
Informações de conformidade
RoHS compliant per Intel/Altera product page. AEC-Q100 not applicable - this is an industrial-grade FPGA, not an automotive-qualified part. Intel's automotive Arria 10 variants carry a separate 'automotive' ordering code.